polarons may limit transistor performance: electronic materials
TRANSCRIPT
RESEARCH NEWS
DECEMBER 2007 | VOLUME 10 | NUMBER 1210
Organic thin-film transistors are attracting
considerable attention as the key components of
printed electronics, one the chief benefits of which
would be fast and low-cost manufacturing. Ironically,
their manufacturing could prove to be a lot trickier
than previously thought.
Researchers at Northwestern University have
discovered that the fabrication temperature for
pentacene transistors has a significant effect on their
performance [Kim et al., Science (2007) 318, 76].
Above a certain temperature for the deposition of
pentacene, the carrier mobility in the transistor falls by
a factor of ten or more, rendering it useless.
“This fact alone would not be surprising, if we did not
discover that these temperatures are far lower than
commonly thought,” explains Antonio Facchetti.
To fabricate the transistors, a layer of pentacene
is deposited on top of a polymeric dielectric layer,
such as polystyrene, poly(methylmethacrylate),
or poly(t-butylstyrene). The group finds that at
low deposition temperatures, pentacene growth
takes place in a layer-by-layer fashion, giving a
smooth surface and high carrier mobility. At higher
temperatures, the polymer dielectric becomes viscous,
which dramatically changes the way the pentacene
molecules attach and move on the surface. The result
is a lumpy morphology that is not good for transistor
performance.
It is well known that confined thin films exhibit
depressed glass transition temperatures (Tg) compared
with bulk material. The surprise is that the decline in
carrier mobility occurs at a temperature below Tg of
both the bulk polymer and that expected for a thin
film. For instance, a polystyrene sample has a bulk Tg
of 103˚C, while that of the thin film should be ~9˚C
lower, but the decline in mobility is seen at 59˚C. The
team surmises that this effect arises from a change in
the viscoelastic properties of the dielectric surface.
“When polymeric materials are involved, we need
to worry about material selection, device processing
conditions, and device thermal stability even more
than before,” concludes Facchetti.
Pauline Rigby
US scientists have observed negative
refraction in semiconductors for the
first time [Hoffman et al., Nat. Mater.
(2007) doi:10.1038/nmat2033].
Metamaterials are artificially
engineered materials in which
subwavelength-size features control
the response to electromagnetic
waves. Negative-index metamaterials
require both the electric permittivity
and magnetic permeability to be
negative, which occurs when electric
and magnetic resonances overlap.
The new semiconductor structure
sidesteps this issue by requiring a
single electric resonance.
According to the team from Princeton
University, Oregon State University,
and Alcatel-Lucent, the metamaterial
design is unique in that it relies on an
anisotropic dielectric function, instead
of overlapping electric and magnetic
resonances.
The structure comprises 100 layers
of undoped AlInAs alternating with
highly-doped InGaAs. Each layer is
~80 nm thick, much smaller than the
wavelength of light being refracted.
“They have made a very high-quality
anisotropic material, but it is not a
negative-index material in the strictest
sense,” John B. Pendry of Imperial
College London told Materials Today.
“It is true that when you send light
into the material, it bends backwards
on itself. But in a material with
negative refractive index, waves go in
one direction, while energy flows in
the opposite direction.”
Claire Gmachl of Princeton University
broadly agrees. “We were careful not
to call it a negative refractive index.
In any case, the refractive index is not
well defined in anisotropic materials
because it varies with direction. But we
have observed negative refraction.”
Pauline Rigby
Semiconductors bend light the wrong wayOPTICAL MATERIALS
Polarons may limit transistor performance
HfO2 is one of the leading candidates to replace the SiO2 gate
oxide in field-effect transistors. Thanks to its high dielectric
constant, k, it is possible to use thicker layers of HfO2 for the
gate insulator and avoid the problem of gate current leakage
as conventional transistors are scaled down.
But new research from University College London, Accelrys,
and SEMATECH has identified a mechanism that could cause
unstable operation in transistors containing this material
[Muñoz Ramo et al., Phys. Rev. Lett. (2007) 99, 155504].
The team performed ab initio calculations of the charge-
trapping of polaron states in monoclinic HfO2. A polaron is
an electron or a hole that has polarized the lattice around
it to create a potential energy well in which it is trapped.
The calculations show that polarons occur even in a perfect
lattice. In fact, it is the very property that makes the material
desirable as a gate insulator – its high k value – that makes it
prone to the formation of polarons: high-k materials are easily
polarizable.
These findings turn previous ideas about charge trapping
in high-k dielectrics on their head. “People believed that
in order to trap charges, you needed to have structural
imperfections, so there was considerable effort to form very
good structures,” says SEMATECH Fellow Gennadi Bersuker.
“But our result shows that charge trapping may happen even
in an absolutely perfect structure.”
Polarons could cause a real problem for transistor performance
and reliability. To have a good quality device, the transistor’s
threshold voltage must be very stable. The formation and
hopping of polarons between different lattice sites is likely to
affect the threshold voltage and lead to unstable devices.
But forewarned is forearmed. Even though polaron formation
is an intrinsic property of the material, there may be ways
to ameliorate its effects. “It’s fixable, but I cannot go into
details,” says Bersuker, because of the commercially sensitive
nature of the information.
Pauline Rigby
ELECTRONIC MATERIALS
Rubbery polymers can ruin transistorsELECTRONIC MATERIALS
Schematic of a top-contact, bottom-gate pentacene
transistor highlighting the semiconductor film
morphology after layer-by-layer growth. (Courtesy of
Antonio Facchetti.)
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