Power Electronics Technologies for

Greener Driving

Ahad Ahmed Buksh, Manuel Gärtner, Maurizio Ferrara, Mario Giuseppe Saggio, Michele Macauda, Jochen Langheim

Solihull UK, February 27th 2019

Future Powertrain Conference 2019

Agenda 2

Introduction

Greener driving challenges, opportunities and key applications

Power semiconductors technologies for xEV

SiC advantages and challenges

SiC technology and package roadmap

Conclusion and takeaways

Who We Are 3

Front-End

Back-End

Research & Development

Main Sales & Marketing

As of December 31, 2018

• Approximately 46,000 employees worldwide

• Approximately 7,400 people working in R&D

• 11 manufacturing sites

• Over 80 sales & marketing offices

• A global semiconductor leader

• 2018 revenues of $9.66B with year-

on-year growth of 15.8%

• Listed: NYSE, Euronext Paris and

Borsa Italiana, Milan

Industry Challenge: Making Driving GreenerST Addresses all Segments with a Complete Range of Solutions

4

Battery Electric VehicleHigh-end battery-based full electric car

~15% less CO2

Reducing emissions International CO2 target Moving towards electric vehicles

Mild Hybrid 48VLow-end entry level electrification

Internal Combustion Engine

Euro4 vs. Euro6

Zero CO2 Emissions~65% less NOx(*)

Euro4, Euro6 : European Emission standards for passenger cars and light commercial vehicles

(*) European emission standards referred to diesel passenger car (Euro4 vs. Euro6)

Lower Emissions and Increasing Semiconductor Content

2018 ~1.8M vehicles ~4.2M vehicles ~1.2M vehicles

2021 ~6.1M vehicles ~7.2M vehicles ~3.3M vehicles

2025 ~13.1M vehicles ~11M vehicles ~7.2M vehicles

ST well positioned to Benefit from Incremental Demand 5

Battery Electric VehicleFull & Plug-in HybridMild Hybrid / 48V

Automotive semiconductor demand for engine control by degree of electrification

Mild Hybrid 48V Mild Hybrid 48V Mild Hybrid 48V0

1,000

2,000

3,000

4,000

2018 2025

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f U

S$

0

1,000

2,000

3,000

4,000

2018 2025M

illi

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2,000

3,000

4,000

2018 2025

Milli

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S$

Source: Strategy Analytics: Automotive Semiconductor Demand Forecast

October 2018

Key Applications and Solutions for xEVDisrupting the Market

6

Innovation Enabler Semiconductor

Courtesy of Audi

AudiVorsprung durch Technik

Focus on Traction Inverter, Onboard Charging

Hybrid/ Electric Vehicle

Power Semiconductors for Electric VehiclesFigure of Merit

7

0

1

2

3

4

5

Electric Field[MV/cm]

Thermal Conductivity[W/ (cm * K)]

Melting Point[* 1000°C]

Electron Velocity[* 107cm/s]

Energy Gap[eV]

Figure of Merit: Si, SiC & GaN

Si GaN SiC

Electron Velocity

[ * 107 cm/s ]

Energy Gap

[ eV ]

Electric Field

[ MV/cm ]

Thermal Conductivity

[ W / (cm *K) ]

Melting Point

[ * 1000 C ]

High Switching

Frequency

High

Temperature

Application

High Voltage

Operation

SiCHexagonal

SiCubic

GaNHexagonal (cubic)

GaN Gallium Nitride SiC Silicon CarbideSi Silicon

Si IGBT

Si MOSFET

SiC

Power Semiconductors Fit for Key Applications 8

Si MOSFET GaN (Gallium Nitride)Si IGBT

1M1k 10k 100k fSW (Hz)

1k

10k

100k

1M

POUT (W)

GaN

Traction

Inverter Power DC/DC

Converter

OBC

SiC (Silicon Carbide)

Aux. DC/DC

Converter

Advantages of SiC in Traction Inverters 9

Drive Train Electrification : Enabled by SiC Technology

(*) 90kW Traction Inverter, 800V bus, fPWM=16kHz, Tfluid = 60 C

(**) applicable to DC to DC converter when present

SiC

MOSFET

Silicon IGBT

+ Diode Traction Inverter - End User Value Proposition

Power Semiconductors size:

Up to 70% smaller Up to

75%

Overall

size

reduction

Up to 10% Mileage Extension

Extended life in use

Cooling System:

Up to 70% smaller

Passive Components:

Up to 80% smaller (**)

Die area for 100A nominal current

[mm2]150 25

Max Junction temperature [°C] 175 200

Normalized switching

energy 7 1

Normalized Power Loss(*)

(Typical Mission profile)10 1

Average junction temperature at

nominal power [°C] (*) 110 90

Traction Inverter

Advantages of SiC in On-Board Battery Chargers 10

Case Study 11kW, 3-Phase OBC

*including heatsink , passive components, switches, filters

**only due to semi-conductor components

SiC MOSFET

+ Diode

Silicon IGBT

+ Diode OBC - End User Value Proposition

Reduce heatsink size

60%

weight,

volume

reduction

Higher Efficiency

Reduce passive component size

Reduce congestion and decrease car

weight

Losses [W] 300 216

Switching Frequency [kHz] 25 100/150

Volume* [cm3] 4593 1986

Weight* [g] 7708 3074

Efficiency** [%] 96.9 97.7

On-board Charger

Challenges for Silicon Carbide 11

Manufacturing CapacityTechnical

Defectivity

Macro-steps

Triangle SFS

Buried SFS

PIT = MP

Reliability

SiC Manufacturing at a glance

ST is Growing its Silicon Carbide Experience 12

• ST is currently providing leading OEMs

and Tier 1s with its SiC solutions

• Increasing number of partners for SiC

clearly shows that ST is the leader and

has deepest technical understanding

• ST has one of the broadest SiC

portfolio covering every clients

requirements

• Bare Die

• Through hole Package

• SMD Package

• Module Package

• Custom Package

June 2003

2" ST line

June 2006

3" ST line

June 2011

4" ST line

June 2016

6" ST line

Pioneers..

2003 – 2”

line startup2006 – 3”

line startup

2011 – 4”

line startup

2016 – 6”

line startup

0

1

2

3

4

2017 2018 2019 2020 2021 2022

Normalized Capacity

100

185235

285335

375

0

100

200

300

400

2017 2018 2019 2020 2021 2022

Normalized Capacity

Supply & Value Chain - SiC Subrates 13

…The agreement governs the supply of a

quarter billion dollars of Cree’s advanced

150mm silicon carbide bare and epitaxial wafers

to STMicroelectronics…

…ST will acquire 55% of Norstel’s share

capital, with an option to acquire the

remaining 45%…

…Norstel AB is a manufacturer of conductive and

semi-insulating Silicon Carbide (SiC) wafers…

SiC Innovation at STTechnology and Packaging Roadmap

14

Power Modules

In Production

Production 2020

Production 2019

ACEPACKTM

SMIT

ACEPACKTM DRIVE

Customer dedicated

module

650V to 1200V

MOSFETs and DIODEs

2017 2018

x7

MOSFETs Units shipped per year

SiC adoption faster than expected Package offer - Discrete – Mini-module – Modules

Front-end Evolution

Discrete Packaging

Continuous

Shrinkage[Ron x cm2]

x2 shrink1st Gen

2nd Gen

In Production

x4 shrinkPlanar

Planar

Trench3rd Gen

ACEPACKTM 1

ACEPACKTM 2

Conclusions and Takeaways 15

6” wafer production and EPI

process step in-house in ST

Bare Die, Discrete Package

and Module offer

Automotive GradeAEC-

Q101

SiC MOSFET and Diode products

available and significantly growing

for 1200V and 650V

Standard product offer

and customized solutions

• Electric Vehicles are disrupting the automotive market

• ST has complete range of solutions for each key

growing applications in xEVs

• SiC Technology provides substantial advantages over

Si including an optimized total cost of ownership

• Introducing the new material in Automotive is

challenging but our experience proves it’s doable

• Ramp up of SiC Technology in STMicroelectronics is

much faster as compared to market

• ST has strong SiC ecosystem supporting its long-

term SiC roadmap and business