poweramerica next generation power · 2017-12-20 ·...

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Agenda Wide Bandgap Devices and Applications Short Course Nov. 79, 2017 PowerAmerica Offices, 930 Main Campus Dr., Suite 200, Raleigh, NC Tuesday, Nov. 7 8 AM8:30 AM Registration/Breakfast/Opening Remarks 8:30 AM–10:15 AM Power GaN Transistor Design Fundamentals and Application David Reusch, EPC 10:15 AM10:30 AM Break 10:30 AM11:15 AM Power GaN Transistor Design Fundamentals and Application David Reusch, EPC 11:15 AM12:30 PM Practical Implementation of SiC MOSFETs for Power Converter Design David Levett, Infineon 12:30 PM1:15PM Lunch 1:15 PM2:15 PM Practical Implementation of SiC MOSFETs for Power Converter Design David Levett, Infineon 2:15 PM2:30 PM Break 2:30 PM4:00 PM Introduction to WBG Module Packaging and Impact on Circuit Design Doug Hopkins, N.C. State University 4:00 PM4:10 PM Break 4:10 PM5:30 PM Introduction to WBG Module Packaging and Impact on Circuit Design Doug Hopkins, N.C. State University Wednesday, Nov. 8 8:00 AM8:15 AM Breakfast 8:15 AM9:15 AM Introduction to WBG Module Packaging and Impact on Circuit Design Robert Shawn, Wolfspeed 9:15 AM9:30 AM Break 9:30 AM10:20 AM MV Fast Charger System Specification, Design Requirements Srdjan Lukic, N.C. State University 10:20 AM10:30 AM Break 10:30 AM11:20 AM WBG SiC Inverter for Electric and Hybrid Vehicles Iqbal Husain, N.C. State University 11:20 AM11:30 AM Break P OWERAMERICA Next Generation Power Electronics Manufacturing Innovation Institute

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Page 1: POWERAMERICA Next Generation Power · 2017-12-20 · Power!GaN!Transistor!DesignFundamentals!and!Application! David!Reusch,EPC! 10:15!AM%10:30!AM! Break! 10:30!AM%11:15!AM! Power!GaN!Transistor!DesignFundamentals!andApplication!

                   

Agenda    Wide  Bandgap  Devices  and  Applications  Short  Course  

Nov.  7-­‐9,  2017  PowerAmerica  Offices,  930  Main  Campus  Dr.,  Suite  200,  Raleigh,  NC  

   

Tuesday,  Nov.  7  8  AM-­‐8:30  AM   Registration/Breakfast/Opening  Remarks      8:30  AM–10:15  AM   Power  GaN  Transistor  Design  Fundamentals  and  Application    

David  Reusch,  EPC  10:15  AM-­‐10:30  AM   Break  10:30  AM-­‐11:15  AM   Power  GaN  Transistor  Design  Fundamentals  and  Application    

David  Reusch,  EPC  11:15  AM-­‐12:30  PM   Practical  Implementation  of  SiC  MOSFETs  for  Power  Converter  

Design    David  Levett,  Infineon  

12:30  PM-­‐1:15PM   Lunch  1:15  PM-­‐2:15  PM   Practical  Implementation  of  SiC  MOSFETs  for  Power  Converter  

Design  David  Levett,  Infineon  

2:15  PM-­‐2:30  PM   Break  2:30  PM-­‐4:00  PM   Introduction  to  WBG  Module  Packaging  and  Impact  on  Circuit  

Design  Doug  Hopkins,  N.C.  State  University  

4:00  PM-­‐4:10  PM   Break  4:10  PM-­‐5:30  PM   Introduction  to  WBG  Module  Packaging  and  Impact  on  Circuit  

Design  Doug  Hopkins,  N.C.  State  University  

   

Wednesday,  Nov.  8  8:00  AM-­‐8:15  AM   Breakfast  8:15  AM-­‐9:15  AM   Introduction  to  WBG  Module  Packaging  and  Impact  on  Circuit  Design    

Robert  Shawn,  Wolfspeed  9:15  AM-­‐9:30  AM   Break  9:30  AM-­‐10:20  AM   MV  Fast  Charger  System  Specification,  Design  Requirements  

Srdjan  Lukic,  N.C.  State  University  10:20  AM-­‐10:30  AM   Break    10:30  AM-­‐11:20  AM   WBG  SiC  Inverter  for  Electric  and  Hybrid  Vehicles  

Iqbal  Husain,  N.C.  State  University    11:20  AM-­‐11:30  AM   Break  

POWERAMERICANext Generation Power Electronics Manufacturing Innovation Institute

Page 2: POWERAMERICA Next Generation Power · 2017-12-20 · Power!GaN!Transistor!DesignFundamentals!and!Application! David!Reusch,EPC! 10:15!AM%10:30!AM! Break! 10:30!AM%11:15!AM! Power!GaN!Transistor!DesignFundamentals!andApplication!

11:30  AM-­‐12:20  PM   High  Voltage  SiC  Power  Device  Characterization  and  Converter  Applications    Subhashish  Bhattacharya,  N.C.  State  University    

12:20  PM-­‐1:00  PM   Lunch  1:00  PM-­‐5:30  PM   Packaging  Lab  Module  

Fab  and  Testing  Lab  Module  Applications  Lab  Module    Attendees  will  be  divided  into  three  groups  and  rotate  through  three  teaching  modules    

1:00PM-­‐2:30PM 2:30PM-­‐4:00PM 4:00PM-­‐5:30PM Group  A Packaging  lab  module Fab  lab  module(2:30PM-­‐3:00PM)

Testing  lab  module(3:15PM-­‐3:45PM) System  lab  module

Group  B Fab  lab  module(1PM-­‐1:30PM) Testing  lab  module(1:45PM-­‐2:15PM)

System  lab  module Packaging  lab  module

Group  C System  lab  module Packaging  lab  module Fab  lab  module(4PM-­‐4:30PM) Testing  lab  module(4:45PM-­‐5:15PM)

6:00  PM-­‐8:30PM   Networking  Dinner  Reception      

Thursday,  Nov.  9  8:00  AM-­‐8:30  AM   Breakfast  8:30  AM-­‐9:00AM   SiC  Bulk  Substrate:  Advantages,  Challenges  and  Solutions  

Elif  Balkas,  Wolfspeed  9:00  AM-­‐9:40  AM     SiC  Epitaxial  Technology  

Al  Burk,  Wolfspeed  9:40  AM-­‐9:50  AM   Break  9:50  AM-­‐11:20  AM   SiC  Design,  Fabrication,  Roadmap  and  Cost  Analysis  

Victor  Veliadis,  PowerAmerica  11:20  AM-­‐11:30  AM   Break  11:30  AM-­‐12:30  PM   Wide  Bandgap  Testing  Techniques  

Teja  Kothamasu,  Keysight  Technologies  12:30  PM     Adjourn