pppl: cad development of modular coils
DESCRIPTION
July 21, 2003. PPPL: CAD Development of Modular Coils. 1.5. Surface A. 1.0 nominal. 1.5. Surface B. 6.664. .31 x .38 VPI groove. 2.664. 1/8 foam layer. 5.0. 1.675 x 4.671 winding pack. 4.671. clamp. 1/8 VPI layer. 4.1. 1. 5.1. 2. Modular Coil - C (13). - PowerPoint PPT PresentationTRANSCRIPT
PPPL:CAD Development of Modular Coils
July 21, 2003
4.671
4.1
5.1
1.0 nominal
5.0
.31 x .38VPI groove
1/8 foamlayer
1/8 VPIlayer
1.675 x 4.671winding pack
clamp
2.664
1.5
1.5
6.664 Surface B
Surface A
1
2
Modular Coil - A (11)
Modular Coil - B (12)
Modular Coil - C (13)
3
Interference Concerns
This collision should be able to be avoided with a tweak to the surface
Since there is no “Wing” in this area we’ll have an extra 1.5” to work with 4
Modular Coil - A (11)
5
Modular Coil - B (12)
6
Modular Coil - C (13)
7
Winding-Clamp Concern Areas
8