Aug 16th, 2016 1

Ryan Riversrdrivers@eecs.berkeley.edu

(510) 809-8627

ProcessingJeff Clarkson

jclarks@berkeley.edu(510) 809-8628

Richelieu Hemphillrhemp@eecs.berkeley.edu

(510) 809-8615

Kim Chankim@eecs.berkeley.edu

(510) 809-8631

Joanna Bettingerjoannabettinger@berkeley.edu

(510) 809-8629

Aug 16th, 2016 2

Research Community Commitment

Community

AssistanceCommunication Awareness

Aug 16th, 2016 3

Nanolab Engineers

Process and Equipment engineers are here to assist you

Each tool has assigned engineers

Process/Equipment Engineer 1 is in charge of that equipment

Process Engineer 1 approves special processes on equipment

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Plan Your Work !

Some tools are heavily reservedPlan ahead one week – minimize idle time

Time = Money

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Working in the NanoLab

Nanolab Rule #1:

NEVER WORK ALONE

3rd to last person to leave must go notify the other two!

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Working in the NanoLab

Entrance Checklist:

Passed the Safety Quiz There are no announcements preventing lab access The HazMat alarm is not active Have blue shoe covers on No food or drink on person

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Gowning Procedure: Top Down

Shoe Covers Enter Gowning Bouffant Cap Bunny Suit

Shoe Covers Gloves Safety Glasses Complete

De-gowning occurs in reverse order

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Entering the Lab Area

Gowning Checklist:

No chemicals in storage box Safety Glasses on Name tag visible on coverall Changed damaged or stained coveralls/shoes/other gear Using proper size coverall and shoe cover Log on at the computer terminal before entering lab

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Equipment Qualification

Read the Manual

Take Equipment Test(520 SDH Front

Desk)

Get Training (Any Qualified

Member)

Complete Prerequisite

Requirements

Oral Qualification(Superuser)

When in doubt – ASK STAFF

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Complete Prerequisite Qualifications

• Many equipment sets have prerequisite qualifications and/or classes offered by staff

• Evaporation, SEM, E-beam Litho, and confocal microscopy classes are offered periodically

• Some toolsets have gateway tools (e.g. msink 6/8, tystar1-4, Leo SEM)

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Read the Manual

All major equipment has a lab manual on website

Process engineers update manual – send any suggestions to us!

Manual inconsistencies are reported on Mercury as process faults

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Training – All qualified can train!

Check reservations for the tool

Find a member using equipment

E-mail: <membername>@silicon.eecs.berkeley.eduRequest to observe run and get training

Each One Teach One – Train someone at least 1x per semester

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Take Equipment Test

Equipment tests available at 520 SDH (Front Desk)

Usually available online via Mercury

Specific tests are written only – copies at front desk

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Oral Qualification – Superuser Only

Check Mercury for superuser names/email

E-mail: <membername>@silicon.eecs.berkeley.eduRequest qualification. Make reservation with superuser

Sometimes process staff are the only superusers

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Process Specification

• Process Specification describes and tracks standard processes• Data is posted monthly on Nanolab Website

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Process Specification

• Reports show • Valuable data trends• Standard process conditions for the monitor• Reports indicate pre-processing steps for substrate

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Material and Process Compatibility

• The Nanolab is a diverse processing environment

• Nanolab materials restrictions are as open as possible

• Many processes are very sensitive (e.g., Sinks/Furnaces)

• Duplicate process capability allows separation of materials

• Materials restrictions are given by tool and group

• Materials restricted by: • Substrate, Process, and Maintenance

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The Lab Manual

Aug 16th, 2016 19

Ch 1 - Material and Process Compatibility

• Chapter 1.7 – Furnace pre-clean & substrate restrictions

• Equipment manuals define material compatibility/cleaning

• Every piece of equipment has specific material restrictions

• Several equipment may have group contamination protocols

• Specific tools and processes require specific cleaning

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Ch 1 - Material and Process Compatibility

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Ch 2 - Sink Information / Restrictions Sink Name

(Maximum Wafer Size)

Processes AvailableMarvell

Lab Locat

ionImportant Comments

msink1 (8") PR strip, tank develop, pre-furnacemetal clean 382 Note 2

msink2 (6") PR strip, tank develop all metals allowed 382 Metal contaminated sink - Note 1

msink3 (8") Manual Resist Processing 382

msink4 (6") TMAH & KOH etch 382 Staff Review required before wafers processed at this sink returning to msink6, msink7, msink8.

msink5 (8")HF, BHF etch

special project etch(check labels at tanks)

382 Metal contaminated sink, PR coated wafers allowed- see Note 1

msink6 (8") Final Piranha - MOS clean sink 386 No metals allowed- MOS clean sink

msink7 (6") Hot phosphoric, HF, silicon etch 386 No metals, PR coated wafers allowed

msink8 (8") Piranha clean, BHF, aluminum etch 386 No metals except aluminum in the aluminum etch

tank, no PR coated wafers

msink16 (N/A) General clean - beaker process/part clean 582A Metal contaminated sink - Note 1

msink18 (N/A) General clean - beaker process/part clean 582A Metal contaminated sink - Note 1

Note 1 - Wafers processed at this sink are metal contaminated, ARE NOT ALLOWED to return to msink6, msink7, msink8.Note 2 - Gold, copper and or other highly diffusive metals ARE NOT ALLOWED at this sink.

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Ch 2 - Working at the Sinks• PPE must be worn when working at the sinks!

• Chemically resistant gloves• Face shield• Chemically resistant apron

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Ch 2 - Working at the Sinks• Mixing chemistry can get HOT!

• Always use caution when adding chemicals and be aware of exothermic reactions

• Working at general purpose sinks (MSink16/18)• You MUST be qualified• Describe your processes to each other• Process Tag all work at the station• Do not heat up a solvent directly on the heater chuck

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Ch 2 - General Wet Chemistry Cabinets

• Located in 582A, 381/383

• Standard chemicals available to members at no charge

• Special chemical storage needs pre-approval and label

• Use partial bottles first!

If empty – ask staff to restock

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Ch 2 - Changing Organic Bottles

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Ch 2 - Chemical Waste ManagementLog Sheet

Every pour requires an entry with a volume!

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Ch 3 - Mask Making at MNL

MNL provides in-house mask making• L-Edit Layout Software• GCA 3600 Pattern Generator• Refer to MNL Chapter 3 for complete details• Contact Process Engineer Jeff Clarkson for assistance

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Ch 4 - Photolithography Equipment

GCA 8500 5X i-Line StepperTypical Resolution: 0.8 umMinimum Resolution: 0.6 umPE1: Jeff ClarksonEE1: Greg Mullins

ASML 5500/300 4X DUV StepperTypical Resolution: 0.35 umMinimum Resolution: 0.25 umPE1: Jeff ClarksonEE1: Greg Mullins

Crestec CABL 9510 E-BeamTypical Resolution: 40 nmMinimum Resolution :10 nmPE1: Kim ChanEE1: Greg Mullins

Quintel Q4000 Mask AlignerTypical Resolution: 2.5 umMinimum Resolution: 1.0 umPE1: Kim ChanEE1: Greg Mullins

Karl Suss MA6 Mask AlignerTypical Resolution: 2.5 umMinimum Resolution: 1.0 umPE1: Kim ChanEE1: Greg Mullins

Canon 4X Projection MATypical Resolution: 1.5 umMinimum Resolution: 1.0 umPE1: Kim ChanEE1: Greg Mullins

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Ch 5 - Furnaces – AP and LPCVD

Tystar 1-4, Dry/Wet Ox,Anneal, Sinter, 4” & 6” wafers

Tystar 5-7, Dry/Wet Ox,Dopant Diffusion, Anneal, 4”, 6” & 8” wafers

Tystar 9-12, Nitride,poly-Si, a-Si, Low-Temp Oxide, 4” & 6” wafers

Tystar 13-16, Dopant Diffusion, SiC, poly-Si, a-Si, 4” & 6” wafers

Tystar 17-20, Nitride,Hi-Temp Oxide, Sinter, Si-Ge, 4” & 6” wafers

1. Furnaces are divided into MOS & non-MOS.2. Substrates must be cleaned before furnace use. Last pre-furnace step:

Msink6 for non-metal substrates, and,Msink1 for metal substrates going into metal approved furnaces.

3. III-V compounds are not allowed in any furnace.

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Ch 5 - Rapid Thermal Processors

RTP1 – III-V, PZT, metals; up to 6” wafersRTP2 – III-V; process up to 6” wafers

RTP3 – Si non-MOS, metals; up to 6” wafersRTP4 – Si MOS, silicidation; up to 6” wafers

RTP8 – Si MOS Gate Oxidation;Process up to 8” wafers

Rapid Thermal Processing has time scales on the order of seconds to reach up to 1100ºC. Applications include thermal oxidation, anneal, dopant activation and metal reflow.

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Ch 6 - Thin Film Deposition – PECVD/HFCVD

System Name Power Type Temp Materials

oxford2 RF Plasma 100-350C a-Si, SixNy, SiO2

pqecr ECR Plasma 25-300C Al, Cr, Cu, Fe*, ITO, Ni*, SiO2, Ti, W

sp3 Hot Filament 700C Diamond

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Ch 6 - Thin Film Deposition – ALD

System Name ALD type Temp Materials

cambridge RF Plasma/Thermal 100-500C Al2O3, TiO2, ZrO2, TiN, Ru, SiO2

picosun Thermal 160-300C Al2O3, TiO2

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Ch 6 - Thin Film Dep – PVD Sputter

All PVD tools require use of light blue “vacuum” gloves

System Name Type Porous Reactive Targets User Changed? Materials

mrc944 RF Magnetron

No No 4 N Al/2%Si, Al/Mn, Ni, NiV, W, Ti

edwards RF/DCMagnetron

Yes Yes 3 Y Al, Cr, Cu, Fe*, ITO, Ni*, SiO2, Ti, W

randex DC Diode Yes Yes 2 N

gartek DC Magnetron

No No 3 N Al, Nb

aln2 AC/DC Magnetron

No Yes 4 N Mo, AlN, Al

Topgun DC Magnetron

No Yes 4 N Al, Cu, Si, Ti

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Ch 6 - Thin Film Dep – PVD Evaporation

Evaporators require Evaporation Training Workshop Qualification

System Name Type Temp Porous Dielectrics Magnetics Sources Materials

cha E-beam High Yes No No 6 Ag, Al, Au, Cr, Cu, Nb, Pd, Pt, Sn, Ti

tescal Thermal High Yes No Yes 3 Ag, Al, Au, Cr, Nb, Pd, Pt, Ir, Ru

nrc Thermal Low-High Yes No (TBD) Yes 2 Ag, Al, Au, Co, Cr, Cu, Fe, In, Ni, Pd, Pt, Si, Sn, Ti, ITO, TCO

ultek E-beam High No No No 3 Al, Au, Cr, Cu, Pd, Pt, Ti

edwardseb3 E-beam Mid-High No Yes No 4 Ag, Al, Mn, Mg, Si, SiO2

dw E-beam Low-High No Yes No 4 Ag, Al, Mn, Zn

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Ch 7 – Etching Systems – Plasma

System Name Type Chemistry He cooling Materials Group

Lam6 RIE Fluorine Yes SiN, SiO2, BARC

Lam7 TCP/Bias Cl2/BCl3 Yes Al, Ti

Lam8 TCP/Bias HBr/Cl2 Yes Silicon, SiC, SiGe

Technics-c RIE SF6/He No SiN, SiO2, Si

Centura-3-5 ICP/Bias Various, Cl2 Yes III-V Nitrides

Centura-met ICP/Bias Cl2/BCl3 Yes Al, Ti, W

Centura-mxp RIE CF4/CHF3/CH3F Yes SiN, SiO2

Matrix-etch RIE CF4/SF6/O2 No Si, SiN, SiO2, Mo

Semi RIE CF4/O2 No Nb, SiO2

Ptherm RIE Various No Various

Sts2 DRIE SF6/O2, C4F8 Yes Si

Sts-oxide DRIE C4F8, H2 Yes SiO2

Aug 16th, 2016 36

Ch 7 – Etching Systems – Other

System Name Type Chemistry Materials Group

Primaxx Vapor Anhydrous HF SiO2

Xetch Vapor XeF2 Si

Ionmill6 Ion Mill Physical Ar Sputter Various

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Ch 8 -Testing and Inspection Equipment

MNL has a wide range of test and inspection equipment. See Chapter 8 in the MNL Manual for a complete list. Contact MNL Process Engineer Jeff Clarkson for assistance.

Aug 16th, 2016 38

Thank You for your attention!