preliminary specification final product specification · 10.1 mechancal drawing 10.2 schematic...

R665101

of 36

MODEL NO. : R665101

ISSUED DATE: 2019-4-28

VERSION : A0

■Preliminary Specification

□Final Product Specification

Customer :

Approved by Notes

Confirmed :

Prepared by Checked by Approved by

This technical specification is subjected to change without notice.

of 36

Table of Contents

Table of Contents ............................................................................................................................ 2

Record of Revision .......................................................................................................................... 3

1 General Specifications ............................................................................................................. 4

2 Input/output Terminals .............................................................................................................. 5

2.1 Main FPC Pin Assignment .............................................................................................. 5 2.2 TP FPC Pin Assignment ................................................................................................. 6 2.3 Circuit block diagram (Display) ....................................................................................... 7 2.4 MCU and Display Module Interface Configuration .......................................................... 7

3 Absolute Maximum Ratings ...................................................................................................... 8

3.1 Driving AMOLED Panel .................................................................................................. 8 4 Electrical Characteristics .......................................................................................................... 8

4.1 Driving AMOLED Panel .................................................................................................. 8 5 AC Characteristics ................................................................................................................... 9

5.1 MIPI Interface Characteristics ........................................................................................ 9 5.2 Display RESET Timing Characteristics ......................................................................... 13 5.3 TE Timing Characteristics ............................................................................................ 14

6 Recommended Operating Sequence ..................................................................................... 16

6.1 Display Power on / off Sequence ................................................................................. 16 6.2 Brightness control ........................................................................................................ 16

7 Optical Characteristics Optical Specification .......................................................................... 10

8 Environmental / Reliability Test ............................................................................................... 23

9 Quality Level .......................................................................................................................... 24

9.1 AMOLED Module of Characteristic Inspection .............................................................. 24 9.2 Sampling Procedures for each item acceptance table .................................................. 24 9.3 Inspection Item ............................................................................................................. 25

10 Mechanical Drawing ............................................................................................................... 25

10.1 Mechancal Drawing 10.2 Schematic Diagram 11 Precautions for Use of AMOLED Modules .............................................................................. 36

11.1 Handling Precautions: .................................................................................................. 36 11.2 Storage Precautions: .................................................................................................... 36 11.3 Transportation Precautions: ......................................................................................... 36

R665101

of 36

Record of Revision

Rev Issue Date Description Editor

A0 2019-04-28 Preliminary WEI YU

R665101

of 36

1 General Specifications

Feature Spec Remark

Display

Spec

Screen Size (inch) 6.65

Display Mode AMOLED

Resolution(dot) 1080(W)×2340(H)

Active Area(mm) 70.78(W)×153.36 (H)

Pixel Pitch (um) 65.54 (W)×65.54(H)

Technology Type LTPS

Color Depth 16.7M

Interface MIPI 4LANE

Surface Treatment HC

Mechanical

Characterist

ics

With TP/Without TP With TP(on Cell)

Module Outline

Dimension(W x H x D)

(mm)

72.58(W)x156.36(H)x0.93(D)

Weight (g) 19.57±2.5g

Electronic

Driver IC(Type) R66455

Touch IC(Type) GT9886

Note 1: Requirements on Environmental Protection: RoHS 2.0.

R665101

of 36

2 Input/output Terminals

2.1 Main FPC Pin Assignment

Note: I=Input; O=Output; P=Power; I/O=Input / Output

FPC connector: (Header) , B-TO-B Connector.

Main board recommended connector: (Socket), B-TO-B Connector.

No Symbol I/O Description No Symbol I/O Description

1 ELVSS

Power

Power supply for Panel

2 ELVDD

Power

Power supply for Panel

3 ELVSS Power supply for Panel

4 ELVDD Power supply for Panel

5 ELVSS Power supply for Panel

6 ELVDD Power supply for Panel

7 ID O ID 8 TSP_DVDD Power TP power supply

9 GND GND Ground 10 TSP_AVDD Power TP power supply

11 D2P I MIPI data lane 12 TSP_RESET I TP Reset

13 D2N I MIPI data lane 14 TSP_INT I TP I2C

15 GND GND Ground 16 TSP_SCL I TP I2C

17 D1P I MIPI data lane 18 TSP_SDA I/O TP I2C

19 D1N I MIPI data lane 20 GND GND Ground

21 GND GND Ground

22 VCI Power Analog Power for DDIC

23 CKP I MIPI data lane

24 VLIN1_7.6V Power Analog Power for DDIC

25 CKN I MIPI data lane

26 VDDIO Power Digital Power for DDIC

27 GND GND Ground 28 RESX I Driver IC reset

29 D0P I/O MIPI data lane 30 ERR_FG Not connected

31 D0N I/O MIPI data lane 32 TE O Tear effect

33 GND GND Ground 34 VDDP_EN O AVDD enable

35 D3P I MIPI data lane 36 EL_ON2 O Swire

37 D3N I MIPI data lane 38 VPP I Power for OTP

39 GND GND Ground 40 GND GND GND

R665101

of 36

2.2 TP FPC Pin Assignment

No Symbol I/O Description

1 TSP_AVDD_3.3V P Analog Power for TP

2 NC / /

3 GND GND Ground

4 TSP_INT I Interrupt signal for TP

5 TSP_SDA I/O SDA pin for TP

6 TSP_SCL I SCL pin for TP

7 TSP_RESET I Reset Pin for TP, Active low.

8 TE I TE Pin for TP

R665101

of 36

2.3 Circuit block diagram (Display)

2.4 MCU and Display Module Interface Configuration

VBAT

AVDD VCI VDDIO

Power Block

MIPI Interface

I2C

Power Block

Display

TSP

ELVDD

ELVSS

VCI

VDDIO

AVDD

DKN

DKP

DN[3:0]

DP[3:0]

RESX

GND

TP_SCL

TP_SDA

TP_INT

GND

TP_AVDD

TP_VDDIO

TP_RESET

R665101

of 36

3 Absolute Maximum Ratings

3.1 Driving AMOLED Panel

Maximum Ratings (Voltage Referenced to VSS) Vss=0V, Ta=25℃

Item Symbol MIN MAX Unit

Analog Power supply VCI -0.3 +6.5 V

Logic Power supply VDDIO -0.3 +4.0 V

Positive Power Input ELVDD - +5.0 V

Negative Power Input ELVSS -5.4 - V

TP power supply Input TSP_AVDD -0.3 4.2 V

TP power supply for logic circuits

TSP_DVDD -0.3 4.2 V

Note: Functional operation should satisfy the limits in the Electrical Characteristics tables or Pin

Description section. If the module exceeds the absolute maximum ratings, permanent damage may occur.

Besides, if the module is operated with the absolute maximum ratings for a long time, the reliability may also

drop.

4 Electrical Characteristics

4.1 Driving AMOLED Panel Item Symbol MIN TYP MAX Unit

Logic Power supply VDDIO 1.65 1.80 3.6 V

Analog Power supply VCI 2.7 2.80 3.60 V

AVDD Supply Voltage AVDD 5.0 - 8.0 V

ELVDD Supply Voltage ELVDD 4.6 4.60 4.65 V

ELVSS Supply Voltage ELVSS -3.05 -3 - V

TP power supply Input TSP_AVDD 2.7 3.3 3.4 V

TP power supply for logic circuits

TSP_DVDD - 1.8 - V

Input Signal Voltage

High Level VIH 0.80*VDDIO - VDDIO V

Low Level VIL 0.00 - 0.20*VDDIO V

Output Signal Voltage

High Level VOH 0.80*VDDIO - VDDIO V

Low Level VOL 0.00 - 0.20*VDDIO V

Normal

IELVDD /IELVSS - 263 - mA

IVCI - 1 - mA

IVDDIO - 68 - mA

Iavdd - 32 - mA

Stand-by IVCI - 2 10 uA

IVDDIO - 5 20 uA

R665101

of 36

Normal

（totol:

spec: 2.35 w,

max: w）

WELVDD - 2000 - mW

WELVSS - 2000 - mW

IVCI - 3 - mW

IVDDIO - 123 - mW

Iavdd - 224 - mW

Stand-by（totol:

spec: mw,

max: mw）

IVCI - 6 28 uw

IVDDIO - 9 36

uw

Ta=25℃

Note1: The input digital voltage is the I/O reference voltage.

Note2: VDDIO usually ranges from 1.65V to 3.6V. If VDDIO is changed, the remaining voltage

needs to be changed to the same voltage as VDDIO.

Note3: Under full white pattern, Command Mode 90Hz.

5 AC Characteristics

5.1 MIPI Interface Characteristics HS Data Transmission Burst

HS clock transmission

A

R665101

of 36

Turnaround Procedure

Bus turnaround (BAT) from MPU to display module timing

Timing Parameters：

MIPI D-PHY characteristic

R665101

of 36

MIPI D-PHY HS-RX clock and data-clock specifications

MIPI D-PHY LP-RX/TX clock and data-clock specifications

R665101

of 36

R665101

of 36

5.2 Display RESET Timing Characteristics Reset input timing:

VDDIO=1.65 to 3.6V, VDD=2.7 to 3.6V, AGND=DGND=0V, Ta=-40 to 85℃

Timing Parameters

Note. See a custom datasheet appendix for details of “Power On/Off sequence”. In addition, tRT1

specification depends on custom power configuration.

R665101

of 36

5.3 TE Timing Characteristics

TELOM = 0: The TE output line consists of V-blanking information only. The TE output line is high during the vertical blanking period.

R665101

of 36

TELOM=1,The TE ouput line consist of both V-blanking and H-blanking information

Tvdh = The display is not updated from the frame memory. Tvdl = The display is updated from the frame memory.

R665101

of 36

6 Recommended Operating Sequence

6.1 Display Power on / off Sequence

6.1.1 Power On Sequence

6.1.2 Power Off Sequence

6.2 Brightness control Use “command 5100h, data xxh” to adjust the Manual Brightness value of the display:

In principle relationship is that 00h value means the lowest brightness and 0FFFh value means the highest brightness.

Inst/Para R/W Address

Date Type Description MIPI Other

BRTCTRL W 51h 5100h Hex Value form

0~4095(0FFF)

R665101

of 36

6.3 TP Power on Sequence

TBD

R665101

of 36

7 Optical Characteristics Optical Specification Item Symbol Condition Min Typ Max Unit Remark

View Angle

θT

CR≥10

80 -

Degree

Note 2

Test Equipment：CS2000A

θB 80 -

θL 80 -

θR 80 -

Contrast Ratio CR θ=0° 100000

Note1

Note3


Response Time

TON

25℃ 1 ms

Note1 Note4

Test Equipment：Admesy MSE

TOFF

Chromaticity

White x

(0.285) (0.300) (0.315)


Note: Chromaticity can be modified according to customer demand

y (0.295) (0.31) (0.325)

Red x (0.650) (0.680) (0.710)

y (0.285) (0.315) (0.345)

Green x (0.220) (0.250) (0.280)

y (0.680) (0.710) (0.740)

Blue x (0.105) (0.135) (0.165)

y (0.030) (0.060) (0.090)

Uniformity U 80 85 %

Note1

Note6


NTSC 100 % Note5

Luminance L Normal 408 430 452 Cd/m2

Note1

Note7


R665101

of 36

Cross-talk 3.0 %

Note8


Gamma 2.0 2.2 2.4

Note9

Gamma=2.2±0.2


Test Conditions:

the ambient temperature is 25℃.

1. The test systems refer to Note1 and Note2.

2. Note 1: Definition of optical measurement system.

The optical characteristics should be measured in dark room. The optical properties are measured

at the center point of the AMOLED screen. All input terminals AMOLED panel must be ground

when measuring the center area of the panel.

Note 2: Definition of viewing angle range and measurement system.

Fig. 1 Definition of viewing angle

R665101

of 36

Note 3: Definition of contrast ratio

“White state “: A state where the AMOLED should be driven by Vwhite.

“Black state”: A state where the AMOLED should be driven by Vblack.

Note 4: Definition of response time

The response time is defined as the AMOLED optical switching time interval between “White” state

and “Black” state. Rise time (TON) is the time between photo detector output intensity changing

from 10% to 90%. And fall time (TOFF) is the time between photo detector output intensity changing

from 90% to 10%.

Note 5: Definition of color chromaticity (CIE1931)

Color coordinates are measured at the center point of AMOLED.

R665101

of 36

Note 6: Definition of luminance uniformity

Active area is divided into 9 measuring areas (Refer Fig. 2). Every measuring point is placed at the

center of each measuring area.

Luminance Uniformity(U) = Lmin/ Lmax

L-------Active area length W----- Active area width

Fig. 2 Definition of uniformity

Lmax: The measured maximum luminance of all measurement position.

Lmin: The measured minimum luminance of all measurement position.

Note 7: Definition of luminance:

Measure the luminance of white state at the center point.

Note 8: Cross Talk

A. Measure luminance at the position, P0.

B. Calculate cross talk as below equation.

R665101

of 36

W1 W2 W3 W 4W _ OFF

B1 B2 B3 B4B_ OFF

Wi_ ON W _ OFF

W _ OFF

Bi_ ON B_ OFF

B_ OFF

L L L LL

4

L L L LL

4

|L L |crosstalk 100% (i 5 to 8)

L

|L L |crosstalk 100% (i 5 to 8)

L

Note9：Gamma

Form Gray200 to Gray255.，the spec is Gamma=2.1±0.4

.

R665101

of 36

8 Environmental / Reliability Test

No Test Item Condition Remark

1 High Temperature Operation

+70℃, 240hrs According to the customer request

2 Low Temperature Operation

-20℃, 240hrs According to the customer request

3 High Temperature Storage

+80℃, 240hrs According to the customer request

4 Low Temperature Storage

-40℃, 120hrs According to the customer request

5 High Temperature & High Humidity Operation

60℃, 90% RH,240hrs According to the customer request

7 Thermal Shock (Non-operation)

-40℃(60 min)~+80℃(60 min),

Change time:5min, 24Cycles According to the customer request

8 Electro Static Discharge (Operation)

C=150pF, R=330Ω，7 points/panel

Air:±8KV, 5times; Contact:±4KV, 5 times;

(Environment: 15℃~35℃,

30%~45%, 86Kpa~106Kpa).

IEC61000-4-2 GB/T17626.2

R665101

of 36

9 Quality Level

9.1 AMOLED Module of Characteristic Inspection

The environmental condition and visual inspection shall be conducted as below:

(1) Ambient temperature: 23± 3℃

(2) Humidity: 55 ± 10%RH

(3) Ambient light intensity of visual inspection: 800 ~ 1300 lux

(4) Ambient light intensity of function inspection: ≤200lux

(5) Viewing Distance: 30 ± 5cm

(6) Viewing angle (tolerance): the front side 45° (Z) ±15°

(7) Inspection time: 10 ±5 sec

(8) Time：10S~15S

9.2 Sampling Procedures for each item acceptance table

Defect type Sampling Procedures AQL

Major defect

GB/T2828.1-2003 Inspection levelⅡ

normal inspection

single sample inspection

0.65

Minor defect

GB/T2828.1-2003 Inspection levelⅡ

normal inspection

single sample inspection

0.4

Major defect: Any defect may result in functional failure, or reduce the usability of product for its purpose. For example, electrical failure, deformation and etc.

Minor defect A defect does not reduce the usability of product for its intended purpose and un-uniformity, such as dot defect and etc. The criteria on major and/or minor judgment will be according with the classification of defects.

目视角度

R665101

of 36

9.3 Inspection Item

No Item Area Criterion of Defect Defect type

1 Dot Defect AA

Type DS

Acceptable number（A）

Minor Bright Dot ≥10mm 0

Dark Dot ≥10mm 2

Dark Dot（≥two

connections） ≥10mm 0

2 No Display AA / Not allowed Major

3 Abnormal Display

AA / Not allowed Major

4

Normally white(Unable

to switch screen)

AA / Not allowed Major

5

Line Defect

（Bright/Dark

） AA / Not allowed Major

6 ELA Mura AA 8% ND standard (under white V64 screen) Major

7 Color & Edge

Mura AA See limit sample(under full white screen ) Minor

8 Ipad air、

Color shift AA See limit sample(under full white screen ) Major

9 Water Ripple AA Not allowed Minor

10

Other mura (Water

stain、Low

gray-scale mura、S-

Line Mura)

AA 8% ND standard (under white V64 screen) Major

11 TP AA TP function NG Not allowed Major

12 Cover

edge/side breakage

Position

Z X(mm) Y(mm)


Major

≤3

Lead area ≤t ≤5 ≤0.4

R665101

of 36

Chipping ≤t ≤2 ≤0.4

Edge Chipping

≤t ≤1 ≤1

13 Screen

sawtooth

Ink screen printing

W（mm） Acceptable

number（A）

Minor W≤0.05 Ignore

W＞0.05 Not allowed

CG Edge

CG edge cutting sawtooth Not allowed

Edge drop paint Reference limit sample

14 Glass crack Full area / Not allowed Major

15

Line defects of

appearance vision

（scratches,

burrs, etc.）

AA area and whole

visible area of

cover lens

W（mm） L（mm）

DS（mm

）

Acceptable number

（A）

Minor W≤0.03 - - Ignore

0.03＜W≤0.05 L≤2.0 ≥10 2

0.05＜W - - 0

- L>2.0 - 0

16

Line defects of light vision（scratches,

burrs, etc.）

AA

W（mm） L（mm）

DS（mm

）

Acceptable number

（A）

Minor W≤0.02 L≤3.0 - Ignore

0.02＜W≤0.03 L≤1.0 - 1

0.03＜W - - 0

- L>1.0 - 0

17 convex point Whole area

/ Not allowed Major

18 Dirty fit AA According to the dotted line standard, if

necessary reference limit sample. Reference

limit sample Minor

19 UV glue

Not IC side

Over coating Not allowed Minor

IC side The coating of IC side is not higher than POL.

20

Point defects of

appearance vision

（Panel/Cov

er lens concave, black and white dots,

Visible surface

D(mm) DS(mm)


Minor D≤0.1 ≥5 Ignore

0.1＜D≤0.2 ≥10 2

0.2＜D - 0

R665101

of 36

dents/bubble

s）

21

Point defects

（light

vision） AA

D(mm) DS(mm)


Minor D≤0.1 ≥10 Ignore

0.1＜D≤0.15 ≥10 2

0.15＜D - 0

22

Pitting

AA、

Ink area

Pitting：dense points of fitting D≤0.1(in the area of 10

mm*10 mm; Otherwise, it is not suitable for pitting)

Minor

D（mm） N Acceptable

number

D < 0.1mm N≤2 No

restriction

D < 0.1mm N = 3 ≤1

D < 0.1mm N > 3 Not allowed

If necessary reference limit sample; Adjacent points are not intensive.

Inspection standard for cover

No. Item Area Criterion of Defect Defect type

23

Back of cover Lens and FPC

PIN reinforcing

glue

Reinforcing rubber / Overflow and Splash glue is not allowed in PIN side.

Minor

Chamfer reinforcing

glue

Leak or break glue is not allowed; Overflow glue is less than 0.4mm and not allowed on FPC.

Minor

Back Ink Area

Splashing glue and residual glue are not allowed. Minor

Cover Lens

Bubbles in Protective

film

If there are many bubbles in the ink area near the earphone hole of the cover plate, the size and quantity of the bubbles in the ink area are not controlled; the bubbles in AA area, the two sides of the AA area and the area below the AA area fitting Φ≤2mm，N≤2 . N＞

2 is not allowed. There are no multiple bubbles in the ink area, Φ≤2mm，N≤5.

Minor

Foreign bodies

and dirty in

protective film

Foreign bodies: Φ≤0.2mm, N≤5;

Φ＞0.2mm, dirty on surface of cover lens and

protective film are not allowed.

Minor

Protective film

scratch

Face invisible scratches without control, face visible scratches with no damage to the cover plate as OK benchmark; protective film scratches without damage

Minor

R665101

of 36

to the cover plate without control, without control of the print.

Protective film

Deviation

Protective film attachment deviation≤0.4mm Minor

Appearance defects of cover lens

No cover scratches, light leakage, bumps, long windows teeth, missing teeth, dislocation caused by uneven ink are allowed.（If necessary reference limit

sample.）

Minor

heterogeneous color of cover lens

No heterogeneous color of cover lens around ICON Within 2mm. Other limited samples can refer to temporary limited samples.

Minor

small protective film dirt in the two side of receiver hole on cover lens

Discolored and mass dirt are not allowed. Minor

White cover lens with 2.5D Arc Edge white Line

Refer to limited samples. Minor

24 Hearing Hole and Key Hole

Residual glue

Not allowed Minor

25 IR hole

Ink unevenne

ss and mura

Not allowed.（If possible, reference limit samples.）

Minor

Foreign bodies

and dirty The wiped dirty is not allowed.

Dot defects

D≤0.15mm,N≤1, Not visible on black background.

Line defects

W≤0.03mm,L≤1mm,N≤1,Not visible on black

background.

Scratched

W≤0.03mm,L≤1mm,N≤1,Not visible on black

background. Transmittance test for scratched products, NG is not allowed

Backside small

protective film

The small protective film attached on the back of the IR hole does not cover the IR hole completely, and the edge of the protective film can not be exposed in the front view.

Residual glue

Not allowed.

R665101

of 36

transmission rate

Under 850um condition, the transmittance of IR hole is more than 77%.

26 Camera Hole

Abnormal substance、dirt

If the problem is found, transmission test shall be carried out. Cleaning dirt is not allowed.

Minor

Residual adsorbent

ring Not allowed.

Dot Defect D≤0.1mm， and N≤1. Point defects cannot be located

in the middle. No discoloration is allowed.

line defect Not allowed

Backside small

protective film

The small protective film attached on the back of the camera hole does not cover the camera hole completely, and the edge of the protective film can not be exposed in the front view.

27

ICON

chromatic aberration

If possible, reference limit samples.

Minor

Dot defect D≤0.1mm， and N≤1. Point defects cannot be located

in the middle. No discoloration is allowed.

line defect Not allowed

28 Insulating

tape Compone

nt area

Components should be fully covered. Insulating tape should not exceed 2 mm of FPC edge or offset 2 mm from top to bottom of designated attachment area.

Minor

29 Compound adhesive

tape LTPS

No breakage, no light leakage, no influence on formation, no influence on thickness, no leakage sticking, from the Encap surface can not exceed the edge of the screen.

Minor

30 ACF Bonding area

The length of attachment is more than both ends of FPC, which should be range from 0.2 to 1mm.

Minor

31 ACF Bonding Bubble and Indentation

Bonding Area

The indentation is controlled by OK sampling limit. The bubble area is less than 1/2 of a single PAD, without overlapping two PADs, and the whole exhaust bubble length at the end of the positioning hole is less than 1/3 of that of the PAD.

Major

32 FPC after bonding

FOF Arch Height

FOF Arching Height < 0.7mm Major

FPC after folding

For the height control of FPC bending zone, see the process drawings of the module. Thickness（CG TO

TP FPC）：＜ 2.85, thickness （CG TO Driver

FPC）：＜2.20. FPC folds back and attaches back

side and lifting height is less than 0.5mm.

Minor

R665101

of 36

33 FPC Skew Bonding

area Not allowed Major

34 FPCA FPC

The component can not reverse polarity

Major

No wrong insertion

FPC should not have serious crease which destroy the line, prick and spots damage. Hard scratches of length ≥ 2mm are not allowed, based on the absence

of copper, the injured line is not allowed；

FPC does not allow corner area ≥ 2mm * 2mm;

FPC does not allow edge damage length or depth ≥

1mm

Minor

The gold fingers should not be oxidized, scraped, folded, impressed, broken, spotted or dissymmetry.

Major

Make sure FPC is not scalded, with its location holes not having deficiency or obviously shift.

Major

The component of FPC should be the same as BOM list.

Major

FPC two-dimensional code leak printing is not allowed. The printing is blurred but the readable code is OK.

Major

No remaining soldering Sn or Residual gum Major

No visual particle on the pad line Minor

Broken or defective copper foil is not allowed (width greater than 1/4 width)

Minor

35 Connect Connector noumenon

There should be no tin on the connector and no tin on the solder foot of the connector.

Minor

36 Package Other

It is not allowed to be mouldy, wet, and damaged, and not allowed to be mixed. ROHS tags need to be attached.

Major The positive and negative sides of the product can be wiped by themselves and dirt is not allowed.（Deliverable products such as A）；

Products should put into the anti-static trays, with non-overlapping, and the trays should be staggered placed.

Minor Material codes, specifications, models, quantities, weights, production dates, batches and versions must be clearly identified.

Repair items must be marked with "Repair items" on the outer case and have a repair report.

R665101

of 36

If there is any special material, the bar code of Nubia requirement should be affixed as required.

Note: If some product specifications are not clearly defined, they are not allowed to be controlled.

R665101

R665101

泡棉上

铜箔在

客户

端需

接地

Component Area Max:H=1.15mm(含锡

）Component Area Max:H=1.00mm(含

锡）

导电

布0.05mm-XPHF1R03-050D

IC点胶溢

胶范

围0.6mm

(不可高于

IC高度

)

PIN DESCRIPTION

40GND

39GND

38D3N

37

36D3P

35ELON2

34GND

33VDDP_EN

32D0N

31TE

30D0P

29ERR_FG

28GND

27RESX

26CKN

25VDDI

24CKP

23VLIN1_7.6V

GND21

VCI_3.3V

20D1N

19GND

18D1P

17TSP_SDA

16GND

15TSP_SCL

14D2N

13TSP_INT

12D2P

11TSP_RESET

10GND

9TSP

_AVDD_3.0V

8ID(GND)

7

6ELVSS

5ELVDD

4ELVSS

3ELVDD

2ELVSS

1ELVDD

VPP(MTP POWER)

TSP_DOVDD_1V8

补强

板区

域

87

65

4

FEDCBA

65

4

32

1

FEDCB

3

A

21

ASSY-Outline

7

Notes:1.Display Mode:6.65 inch OLED,正

向扫描

;2.Driver IC: R66455；3.TP IC: GT9886；4.储

存温

度: -30~80℃

,操作温度: -20~70℃

;5.Module FPC Connector：

OK-14M024-04公座;

AA

LTPS Glass

Encap

LTPS Glass

AA

COF上的

导电

布

含导电布

不含

保护膜

厚度

10 Drawing

10.1 Module Mechanical Drawing

of 36

10.2 Tp Fpc Drawing

R665101

of 36

10.3 Driver Fpc Drawing

R665101

of 36

Packing Drawing

Picture 1

如本印章非红色,则表明该

文件为非受控版本,不会受

到控制和更新.请使用受控

文件.

分发号: 受控章

7

5

Detail AScale 1:1

8

6

9

10

1213

1

11

2

3

4

Notes:

1.材料: 透明防静电PET，料厚0.8mm，表面电阻105~109 ;

2.拔模角度:7°;

3.长宽尺寸以内侧为基准，高度尺寸以表面为基准;

4.未标高度公差:±0.3，其他未标公差:±0.5;

5.未标尺寸以CAD实际尺寸为准，公差参照未标公差说明；

6.Mark深度≤1.0mm，标注字母a~h为参考平面标识，实际不加工；

7.带“*”的标示为重点管控尺寸，“（）”的标示为参考尺寸；

8.产品符合“维信诺昆山公司禁用限用物质标准”要求。

14

Packing Condition Contents

Packing Type TRAY + Carton packing type

TRAY material model tray (105~109Ω)

Tray packing type See the picture 1

Number of panels per tray 6 pieces

Number of Tray per carton 22units (( 20 units + 2empty)PET tray )

Number of panels per carton 120 pieces

R665101

of 36

11 Precautions for Use of AMOLED Modules

11.1 Handling Precautions: 11.1.1 The display panel is made of glass. Do not subject it to a mechanical shock by dropping it

from height. 11.1.2 Do not press down the screen on the adjoining areas too hard because the color tone may

be shifted. 11.1.3 The polarizer covering the display surface of the AMOLED module is soft and easily

scratched. Handle this polarizer carefully. 11.1.4 If the display surface is contaminated, blow on the surface and gently wipe it with a soft

dry cloth. If it is still not completely clear, moisten the cloth with ethyl alcohol. 11.1.5 Solvents may damage the polarizer. Do not use water, ketone or aromatic solvents except

ethyl alcohol. Do not attempt to disassemble the AMOLED Module. 11.1.6 If the logic circuit power is off, do not apply the input signals. 11.1.7 To prevent destruction from static electricity, be careful to maintain an optimum working

environment. 11.1.8 Be sure to make yourself in contact with the ground when handling with the AMOLED

Modules. 11.1.9 Tools required for assembly, such as soldering irons, must be properly ground. 11.1.10 To reduce the generation of static electricity, do not conduct assembly or other work under

dry conditions. 11.1.11 To protect the display surface, the AMOLED Module is coated with a film. Be careful when

peeling off this protective film, because static electricity may generate.

11.2 Storage Precautions: 11.2.1 When storing the AMOLED modules, be sure that they are not directly exposed to the

sunlight or the light of fluorescent lamps. 11.2.2 The AMOLED modules should be stored under the storage temperature range. If the

AMOLED modules will be stored for a long time, the recommended condition is: Temperature: 0℃~40℃ Relatively humidity: ≤80%

11.2.3 The AMOLED modules should be stored in the room without acid, alkali or harmful gas.

11.3 Transportation Precautions: 11.3.1 The AMOLED modules should not be suffered from falling and violent shocking during

transportation. Besides, excessive press, water, damp and sunshine, should be avoided.

R665101

preliminary specification final product specification · 10.1 mechancal drawing 10.2 schematic...

Documents