Presentation Topic

Darfon Green Plan Implement Schedule1st class restricted or banned material

Substance Chinese Name Darfon content

Asbestos and its Compounds 石棉及其化合物 No

Cadmium and its Compounds 鎘及其化合物 No

Chlorofluorocarbons (CFC’s) 氯氟碳化合物 No

Chloroparaffins, short-chained (10 – 13 Carbon Chain) 短鏈之氯化石蠟 (10-13 碳鏈 ) No

Chromium VI and its Compounds (Packaging Only) 六價鉻及其化合物 ( 僅限包裝 ) No

Hydrochlorofluorocarbons (HCFC’s) 氫氯氟碳化合物 (HCFC's) No

Lead and its Compounds

(Paints or Packaging Only)

鉛及其化合物( 僅限油漆或包裝 )

No

Mercury (Display Lamps not included) 汞 ( 不含顯示器燈管 ) No

Polybrominated Biphenyls (PBBs) and their Ethers/ Oxides(PBDE’s,PBBE’s)

多溴聯苯及其醚類 / 氧化物 No

Polychlorinated Biphenyls (PCB’s) and Terphenyls (PCT’s) 多氯聯苯及三聯苯 No

Polyvinyl chloride (PVC) (Mechanical Parts over 25 grams Only) 聚氯乙烯 No

Presentation Topic

Darfon Green Plan Implement Schedule2nd class restricted or banned material (Suggest)

Substance Chinese Name

Target Date

Darfon content

Remark

Antimony and its Compounds 銻及其合物 No

Arsenic and its Compounds 砷及其化合物 No

Beryllium and its Compounds 鈹及其化合物 No

Chromium VI and its Compounds 六價鉻及其化合物 No

Ethylene Glycol Ethers 乙二醇醚類 No

Lead and its Compounds 鉛及其化合物 Mar-2004 No Termination

N/A Yes Dielectric powder

Nickel and its Compounds 鎳及其化合物 N/A Yes BME inner electrode

Organophosphorous Compounds 有機磷化物 No

Phthalates 鄰苯二甲酸酯或鹽類

No

PVC 聚氯乙烯 No

Tetrabromobisphenol A (TBBA) 四溴化二苯酚 No

Presentation Topic

Darfon Green Plan Implement ScheduleROHS COMPLIANCE DECLARATION

• ROHS directive requires that from 1 July 2006 new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).

Allowed exemptions are

Lead in glass of electronic components.

Lead as an alloying element in steel containing up to 0,35 % lead by weight,aluminum containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight.

Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead),

Lead in electronic ceramic parts (e.g. piezoelectronic devices).

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Presentation Topic

Darfon Green Plan Implement ScheduleDarfon Green Plan Improvement Schedule

•Darfon MLCC/MLCI chips without contained the 1st class restricted or banned materials.

•Darfon MLCC/MLCI chips termination started to apply Lead free plating process from 1998 and met the requirement of Lead free plan.

•Darfon MLCC/NPO chips still contained Lead material due to NPO chips used low temperature sintering powder. But the content of Lead in dielectric powder is acceptable in Sony standard SS-00259 (ver.2.0).

•Darfon MLCC/NPO chips will evaluate the Lead free powder with vendor and plan to change before the Q2 of 2004.

Presentation Topic

Darfon Green Plan Implement ScheduleDarfon MLCC Inspection Report

•Attched files are the inspection report of Darfon chips by SGS. The inspection items included Pb, Cd, Hg.

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NPO Series

X7R Series

Y5V Series

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