pressure sensorpressure sensors and the top wafer contains signal-condition- ing integrated...

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Page 1: pressure sensorpressure sensors and the top wafer contains signal-condition- ing integrated circuitry. The pressure sensors and the inte- grated circuits are coupled together by wirebonding
Page 2: pressure sensorpressure sensors and the top wafer contains signal-condition- ing integrated circuitry. The pressure sensors and the inte- grated circuits are coupled together by wirebonding
Page 3: pressure sensorpressure sensors and the top wafer contains signal-condition- ing integrated circuitry. The pressure sensors and the inte- grated circuits are coupled together by wirebonding
Page 4: pressure sensorpressure sensors and the top wafer contains signal-condition- ing integrated circuitry. The pressure sensors and the inte- grated circuits are coupled together by wirebonding
Page 5: pressure sensorpressure sensors and the top wafer contains signal-condition- ing integrated circuitry. The pressure sensors and the inte- grated circuits are coupled together by wirebonding