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Prober Interface Communications Guideline

International SEMATECHTechnology Transfer # 01044112A-ENG

© 2001 International SEMATECH, Inc.

SEMATECH and the SEMATECH logo are registered service marks of SEMATECH, Inc.International SEMATECH and the International SEMATECH logo are registered service marks

of International SEMATECH, Inc., a wholly-owned subsidiary of SEMATECH, Inc.

Product names and company names used in this publication are for identification purposes only and may be trademarks or service marks of their respective companies.

Prober Interface Communications GuidelineTechnology Transfer # 01044112A-ENG

International SEMATECHApril 30, 2001

Abstract: This document from MGGM006 contains specifications for the communications interface ofprober equipment used for wafer test. It should be used as a supplement to the correspondingstandard, SEMI E91, when member companies procure wafer prober equipment. Test scenariosare also included; the scenarios can be used to determine compliance with both SEMI E91 and theadditional specification in this document.

Keywords: Standards, Specifications, Test Equipment, Probes, Testing, Automation, Equipment Performance

Authors:

Approvals: Jim Ammenheuser, Program ManagerRandy Goodall, Associate DirectorScott Kramer, DirectorLaurie Modrey, Technical Information Transfer Team Leader

D. Howard, D. Hartman, A. Kwan, R. Nageswaran, R. Odhner, and S. Stringer

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International SEMATECH Technology Transfer # 01044112A-ENG

Table of Contents

1 EXECUTIVE SUMMARY....................................................................................................... 1

2 BACKGROUND....................................................................................................................... 1

3 PURPOSE ................................................................................................................................. 1

4 SCOPE ...................................................................................................................................... 2

5 REFERENCE STANDARDS................................................................................................... 3

6 DESCRIPTION OF DATA TYPES ......................................................................................... 3

7 PERFORMANCE ..................................................................................................................... 3

8 FUNCTIONAL CRITERIA...................................................................................................... 48.1 Master Process Program Record Parameters.................................................................. 48.2 Inspection, Cleaning, and Contact Test.......................................................................... 48.3 Multi-Zone for Cleaning and Contact Test .................................................................... 58.4 Multi-Site Configuration ................................................................................................ 58.5 Probe Card ID/Contact Count ........................................................................................ 58.6 Ink Die/Inspect Ink Marks.............................................................................................. 5

9 PSEM PROCESSING STATE MODEL VARIATIONS......................................................... 69.1 Description of Additional Prober Processing States ...................................................... 6

9.1.1 EXECUTING (PROCESS Sub-State) .............................................................. 69.1.2 AWAITING LOAD (EXECUTING Sub-State) ............................................... 69.1.3 LOADING WAFER (EXECUTING Sub-State)............................................... 79.1.4 WAFER LOADED (EXECUTING Sub-State) ................................................ 79.1.5 AWAITING COMMAND (WAFER LOADED Sub-State) ............................ 79.1.6 MOVING XYZ (WAFER LOADED Sub-State).............................................. 79.1.7 INKING (WAFER LOADED Sub-State) ......................................................... 79.1.8 CLEANING (WAFER LOADED Sub-State)................................................... 79.1.9 INSPECTING (WAFER LOADED Sub-State)................................................ 79.1.10 UNLOADING WAFER (EXECUTING Sub-State)......................................... 79.1.11 CYCLING WAFERS (EXECUTING Sub-State)............................................. 7

9.2 Description of Omitted Prober Processing States Transitions ....................................... 7

10 ENTITY ID MAPPING ............................................................................................................ 910.1 Status Variable (SV) and Equipment Constant (EC) IDs............................................... 910.2 Pre-Defined Report IDs.................................................................................................. 9

10.2.1 Accessing Report IDs........................................................................................ 910.3 Data Variables (DV) and Collection Event (CE) IDs .................................................... 9

10.3.1 Accessing Data Variable IDs .......................................................................... 1010.3.2 Accessing Collection Event IDs...................................................................... 10

10.4 Alarm Text and Identification ...................................................................................... 10

11 ALARM MANAGEMENT..................................................................................................... 1111.1 Primary Alarms ............................................................................................................ 1111.2 Secondary Alarms ........................................................................................................ 11

12 REQUIRED COLLECTION EVENT LABELS .................................................................... 1112.1 Transition Event Labels................................................................................................ 11

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Technology Transfer # 01044112A-ENG International SEMATECH

12.2 Other Required Collection Event Labels...................................................................... 12

13 REQUIRED STATUS VARIABLES ..................................................................................... 13

14 REQUIRED DATA VARIABLES ......................................................................................... 14

15 REQUIRED EQUIPMENT CONSTANTS............................................................................ 14

16 REQUIRED REPORTS .......................................................................................................... 15

17 REQUIRED REMOTE COMMANDS................................................................................... 15

18 INDEX REMOTE COMMAND............................................................................................. 17

19 REMOTE COMMAND VS. PROCESS STATE/PROBER JOB STATE............................. 17

20 NEW FUNCTION S2,F65/66 ................................................................................................. 1920.1 S2,F65 User-Defined Enhanced Remote Command.................................................... 1920.2 S2,F66 User-Defined Enhanced Remote Command Acknowledge............................. 19

21 MODIFICATION TO E5 HOST COMMAND PARAMETER ACKNOWLEDGECODE (HCACK) .................................................................................................................... 19

22 DETAILED SCENARIOS...................................................................................................... 2022.1 Contents of PPMain/Masters/Dev1 .............................................................................. 2022.2 Scenario 1 – Complete Sample Run (Start to Finish) Abbreviated.............................. 22

22.2.1 Initialize Control State .................................................................................... 2222.2.2 Prepare Prober for Processing ......................................................................... 2322.2.3 Create Probe Job.............................................................................................. 2422.2.4 Process Lot ...................................................................................................... 24

22.3 Scenario 2 – Complete Sample Run (Start to Finish) Unabbreviated .......................... 2722.3.1 Initialize Control State .................................................................................... 27

22.4 Scenario 3: Clean Probe Needles ................................................................................. 4822.5 Scenario 4: Inspect Probe to Pad Alignment................................................................ 50

22.5.1 Inspection Report Definition........................................................................... 5122.6 Scenario 5: Ink a Die .................................................................................................... 5422.7 Scenario 6: Ink Multiple Die ........................................................................................ 5622.8 Scenario 7: Irrecoverable Error – Probe Job Aborted .................................................. 5822.9 Scenario 8: Irrecoverable Error – Resume After Correction........................................ 6422.10 Scenario 9: Automatic Change in Wafer Sequence ..................................................... 70

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List of Figures

Figure 1 Interface Specification Scope..................................................................................... 2

Figure 2 PSEM Processing State Diagram Variation ............................................................... 6

List of Tables

Table 1 Data Types.................................................................................................................. 3

Table 2 PSEM State Transition Table Variations ................................................................... 8

Table 3 Required Transition Event Labels............................................................................ 12

Table 4 Other Required Collection Event Labels ................................................................. 12

Table 5 Required Status Variables ........................................................................................ 13

Table 6 Required Data Variables .......................................................................................... 14

Table 7 Required Data Variables .......................................................................................... 14

Table 8 Required Reports...................................................................................................... 15

Table 9 Required Remote Commands................................................................................... 15

Table 10 Remote Commands vs. Process State/Prober Job State ........................................... 18

Table 11 Modification to E5 Host Command Parameter Acknowledge Code(HCACK) ................................................................................................................. 19

Table 12 Detailed Scenarios.................................................................................................... 20

Table 13 Example Process Program File ................................................................................ 21

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Acknowledgements

This document was developed by an International SEMATECH Test Benchmarking ProjectFocus Group consisting of the authors from Agere Systems, IBM, Intel, and Motorola.

The authors would like to acknowledge the following member company participants for theirsupport of this activity through the International SEMATECH Test Benchmarking Project:

Name Company

Mark Barber Agere SystemsJohn Matthias Agere Systems

Sandy Harrison Conexant

John Bearden IBM

Don Edenfeld IntelMike Rodgers Intel

Jim Dowland MotorolaPaul Roddy Motorola

Bill Price Philips Semiconductor

Chris Portelli-Hale ST MicroelectronicsEnzo Ferradino ST Microelectronics

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1 EXECUTIVE SUMMARY

This document supplements SEMI 91, Specification for Prober Specific Equipment Model(PSEM); it addresses areas in the PSEM standard that require additional information orexplanation. The document has a threefold purpose: 1) to expand the executing state and definethe state transitions, 2) to specify particular values for data items to be used with the remotecommand messages and to identify variable entities required to effectively communicate the stateof the equipment to the host, and 3) to supply test scenarios that can be used to determinecompliance with both SEMI E91 and the additional specifications in this document. Thisdocument is a subsidiary specification to the referenced SEMI standards. Items required by thereference standards are required in addition to the items in this guideline.

2 BACKGROUND

Methods to communicate with and control automated test equipment (ATE) and associatedperipherals such as wafer probers and module handlers vary significantly. The interfaces rangefrom serial (RS-232) to parallel (IEEE-488) to ethernet (TCP/IP), to name a few. The protocoland control messages share little to no similarities even within a similar category of equipment.The command set and structure among suppliers making the same equipment will not be thesame.

The process equipment in the front end of the line (FEOL) has been broadly using the standardsand protocols specified in the SEMI publications. Test, in the back end of the line (BEOL), hasnot yet reached that plateau. The reason is that a key piece of the puzzle had been missing.Within test are at least three general categories of equipment that need to be addressed: the tester,the module handler, and the wafer prober.

The standard covering the tester class of equipment is SEMI E30.3, Specification for TesterEquipment Specific Equipment Model (TSEM). The SEMI standard covering the module handlerclass of equipment is SEMI E 30.2, Specification for Handler Equipment Specific EquipmentModel (HSEM). The piece that was missing until September 1999 was SEMI E91, Specificationfor the Prober Specific Equipment Model (PSEM). The PSEM publication closed the loop on thethree categories of test equipment required for BEOL product test.

The opportunity now exists for the test industry to capitalize on the SEMI standards. But whatdoes “GEM/SECS-compliant” for these equipment classes really mean? If unified, the testcommunity can go a long way to define that compliance and at the same time influence theequipment manufacturers to move in a standardized direction of interpreting the standards.Simplistically, the resulting benefit would be “plug-and-play” equipment (i.e., replace one brandof prober with another and continue with testing). Idealistically plug-and-play may not beattainable, but a strong move in that direction would still provide significant benefit.

3 PURPOSE

This document supplements the SEMI E91 PSEM, which is incomplete in the EXECUTINGstate (see Figure 2, PSEM Processing State Model Diagram on page 3 of the PSEM). Thisdocument addresses this and other areas that require additional information or explanation.

This document has a threefold purpose. The first purpose is to expand the PSEM EXECUTINGstate into a super-state containing five sub-states, one of which comprises additional sub-states.

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This expansion is shown in Figure 2 the state transitions are defined in Table 2: PSEM StateTransition Table Variations.

The second purpose of this document is to specify particular values for SEMI E5 data items(RCMD, CPNAME, CPVAL, and CEPVAL) to be used with remote commands. In addition, thisdocument identifies variable entities such as Equipment Constants (EC), Status Variables (SV),and Data Variable items (DVVALs) required to effectively communicate the state of theequipment to the host.

The third purpose is to supply test scenarios that can be used to determine compliance with boththe PSEM and the specified variations.

4 SCOPE

As a subsidiary specification to the PSEM document, this specification attempts to resolve thebehavior of the prober as seen through the SECS-II messages and data item definitions provided.This specification covers a select subset of the total capabilities provided by the equipmentmanufacturer. Figure 1 depicts the stated objectives relative to the entire set of equipmentcapabilities.

Full Equipment Capabilities

Interface Specification

SEMI E91 (PSEM)

Figure 1 Interface Specification Scope

As shown in Figure 1, this specification does not require support for all behaviors in the PSEMspecification. In particular, this specification does not define a capability (as allowed for inPSEM) for the prober to execute an entire probe job upon the receipt of the Job STARTcommand. Instead, this specification defines the capabilities to control the processing of a job indiscrete steps from start to finish. Test results are communicated directly from the tester to thehost without intermediate processing or visibility at the prober. For this reason, there is norequirement for wafer map, end-of-wafer report, or pre-data download entities defined in thePSEM specification. The probe job is not defined to include information pertaining to the type ofprocessing to be performed, (i.e., inking, initial inspection, re-inspection, etc…).

It is recognized that the equipment manufacturer may provide addition state models (i.e., waferstate, die state, etc.) with their associated data items to reflect the particular capabilities of themanufacturer’s equipment. These additional items must not conflict with the behaviors set forthin this specification.

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In addition to the data items defined in this specification, the supplier must provide the ability forthe host to ascertain the current state of all material handling stages. This implies the ability toquery the state of the input port(s), chuck, and any applicable pipeline stages.

5 REFERENCE STANDARDS

• SEMI E5 – SEMI Equipment Communications Standard 2 Message Content (SECS-II)

• SEMI E301 – Generic Model for Communications and Control of Manufacturing Equipment(GEM)

• SEMI E37 – High-Speed SECS Message Services (HSMS) Generic Services

• SEMI E58 – Automated Reliability, Availability, and Maintainability Standard (ARAMS):Concepts, Behavior, and Services

• SEMI E912 – Specification for Prober Specific Equipment Model (PSEM)

6 DESCRIPTION OF DATA TYPES

This section contains definitions for the data types referenced in the detailed messagedescriptions.

Table 1 Data Types

Data Type Symbol

ASCII ASCII

4-byte unsigned U4

2-byte unsigned U2

1-byte unsigned U1

4-byte signed S4

2-byte signed S2

1-byte signed S1

1-byte Binary BIN1

1-byte Boolean BOOL1

7 PERFORMANCE

This specification stipulates communications to and from the equipment using single sessionHSMS. HSMS is the preferred mechanism through which all equipment functionality should beaccessed.

File create and/or transfer considerations for recipe save/load may dictate an exception due topossible performance degradation when implemented using Stream-7 under single sessionHSMS. Under these circumstances, the supplier may choose an alternative method. If so, the

1 References to the GEM specification in this document are to the revision, SEMI E30-1000.2 References to the PSEM specification in this document are to the revision, SEMI E91-0600.

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supplier must provide the capability both through the HSMS interface and the alternative method(i.e., separate I/O port, named pipes, shared memory, mapped drive, NFS mounted partition,binary file transfer, etc). When an alternative method is used, the function execution will still beinitiated through the HSMS port; for instance, a HSMS message request to load a recipe file byname.

8 FUNCTIONAL CRITERIA

All equipment capabilities available through the equipment console must be available throughthe SECS/GEM interface. This will allow the host to provide an alternative interface to theequipment.

8.1 Master Process Program Record Parameters

Records contained in the Master Process Program as “Key/Value” pairs (see PSEM section 8.4)must be available as data variables that are valid when a processing state transition occurs.Parameter overrides can be included in the START and RESUME commands. These overridesaffect the current instance of the process program only (e.g., no changes are made to the storedprocess program). Parameter overrides will appear in a list with the following structure:

Parameter Override Format:S2,F49

L,41. <DATAID>2. <OBJSPEC>3. <START|RESUME>4. L, n (# of parameter overrides)

1. L,m+1 (parameter name followed by m parameter values)1. Parameter1

2. Parameter1 value1

m. Parameter1 valuem

n. L, p+1 (parameter name followed by p parameter values)1. Parametern

2. Parametern value1

p. Parametern valuep

8.2 Inspection, Cleaning, and Contact Test

This specification does not attempt to define the steps involved in executing tasks associatedwith setting up, maintaining, or verifying proper operation of the equipment. If the equipment isin the AWAITING TASK processing state when an inspection or cleaning task is initiated, theappropriate transition to either the CLEANING or INSPECTING state will occur.

Inspection tasks include Probe Inspection, Probe-to-Pad alignment, Ink Mark Inspection, andContact Test. Each of the inspection tasks concludes with a report containing, at minimum, theInspectionResult data item. Inspection-related attributes or parametric data resulting from theinspection should be documented and made available for inclusion in a user-defined report.

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8.3 Multi-Zone for Cleaning and Contact Test

To support products fabricated from different technologies, the equipment must provide at leastthree addressable zones to be used in the Cleaning process (when the cleaning media is a block)and at least three addressable zones to be used in the Contact test process. This will preventcross-contamination from occurring.

If a cleaning operation results in the depletion of the cleaning media, the CLEANING-MEDIA-DEPLETED collection event must occur. Any future attempt to perform a cleaning operationwhile the cleaning media is depleted will result in an HCACK return code of 65 defined as“Unable to perform operation - cleaning media depleted.”

8.4 Multi-Site Configuration

The prober must provide a separate probe card configuration file to be referenced in a givenmaster process program as a PARAM_RECORDnn tag/value entry. The file must contain, atminimum, the XY coordinates of the individually addressable site locations.

The equipment must provide a pre-defined report containing the current Multi-Site configurationas a list of XY coordinate pairs. These XY coordinate pairs will be used to individually addresssite locations on the probe card.

When an automatic inspection or cleaning operation is performed as part of the equipment setupor as a result of an interval event, each of the XY site locations must be processed.

When the host requests an inspection or cleaning operation, the command will include a listcontaining the XY coordinates of the selected site locations. A zero-length list will constitute theselection of all site locations.

8.5 Probe Card ID/Contact Count

The equipment must provide the host with the ability to load the probe card ID and the numberof contacts made on the probe card. Each MOVE/INDEX command in which the Z-stage is inthe UP position will constitute a Contact Count increment event. To reset the contact count, thehost issues the RESET_CONTACT_CNT command.

8.6 Ink Die/Inspect Ink Marks

The command INK_DEVICE is used to specify inking the device at the current XY coordinates.The command INK_DIE must be used to specify inking devices at multiple XY coordinates. Thecommand INSPECT_INK_MARKS must contain a list of XY coordinates pertaining topreviously inked devices. The equipment is not responsible for maintaining a list of XYcoordinates where inking has been performed.

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9 PSEM PROCESSING STATE MODEL VARIATIONS

4

EXECUTING

5

LOADINGWAFER

AWAITINGLOAD

WAFER LOADED

AWAITINGCOMMAND

INSPECT-ING

INKING

CLEANING

MOVINGXYZ

CYCLINGWAFERS

UNLOADINGWAFER

27

29 30

35 3633 34

31 32

28

39

40

37

38

Figure 2 PSEM Processing State Diagram Variation

9.1 Description of Additional Prober Processing States

9.1.1 EXECUTING (PROCESS Sub-State)

The prober is ready to process wafers.

9.1.2 AWAITING LOAD (EXECUTING Sub-State)

The prober is waiting for a command to load a wafer.

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9.1.3 LOADING WAFER (EXECUTING Sub-State)

Prober is processing the load and preparation of a wafer.

9.1.4 WAFER LOADED (EXECUTING Sub-State)

Wafer is loaded and all setup requirements have been performed.

9.1.5 AWAITING COMMAND (WAFER LOADED Sub-State)

Prober is waiting for commands.

9.1.6 MOVING XYZ (WAFER LOADED Sub-State)

Prober is moving in one or more axis.

9.1.7 INKING (WAFER LOADED Sub-State)

Prober is inking a die on the wafer.

9.1.8 CLEANING (WAFER LOADED Sub-State)

Prober is executing probe tip cleaning.

9.1.9 INSPECTING (WAFER LOADED Sub-State)

Inspection is in process.

9.1.10 UNLOADING WAFER (EXECUTING Sub-State)

The prober is unloading the wafer.

9.1.11 CYCLING WAFERS (EXECUTING Sub-State)

The prober unloads the wafer from the chuck and returns it to the originating slot in the carrier.The prober loads the next wafer in the sequence from the carrier to the chuck and completes thepreparation of that wafer.

9.2 Description of Omitted Prober Processing States Transitions

The prober Processing State Model transition #11 has been removed from the list of definedtransitions to clarify the intended use of the equipment according to the capabilities defined inthis specification.

When the equipment is operated in the manner defined in this specification, it will not track theprogress of a given wafer as it would if the equipment had been given a wafer map. The onlycommand the equipment will receive to indicate that a probe job has been completed is the END-LOT command.

Even though the Processing State Model transition #11 is undefined in this specification, theequipment manufacturer may provide additional capabilities that use this transition. This isacceptable as long as the behaviors in this specification are maintained.

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Table 2 PSEM State Transition Table Variations

No. Current State Trigger New State Action Comment

4 SETTING UP All set-upperformance has

completed.

EXECUTING The prober executeswafer transfer and

measuring.

None.

4 SETTING UP All set up hascompleted. Wafer

is not loaded.

AWAITINGLOAD

Prober is waiting for aload wafer command.

None.

11 Executing Processing of thelast wafer of a

current lotcompleted.

The prober hasreceived START

command for nextlot

SETTING UP None None

27 AWAITINGLOAD

Load WaferCommand

LOADINGWAFER

Prober loads the waferand readies for

positioning.

28 LOADINGWAFER

Wafer loadcompletes

AWAITINGCOMMAND

None

29 AWAITINGCOMMAND

Move Command MOVING Prober moves in X &|Y &| Z

30 MOVING Move completes AWAITINGCOMMAND

None

31 AWAITINGCOMMAND

Ink Command INKING Prober inks device

32 INKING Inking completes AWAITINGCOMMAND

None

33 AWAITINGCOMMAND

Clean Command CLEANING Prober cleans probes

34 CLEANING Cleaning completes AWAITINGCOMMAND

None

35 AWAITINGCOMMAND

Inspect Command INSPECTING Prober executesinspection

36 INSPECTING Inspectioncompletes

AWAITINGCOMMAND

None

37 AWAITINGCOMMAND

Unload WaferCommand

UNLOADINGWAFER

Prober unloads wafer

38 UNLOADINGWAFER

Unloading wafercompletes

AWAITINGLOAD

None

39 AWAITINGCOMMAND

Cycle WafersCommand

CYCLINGWAFERS

Unloads current wafer,loads next wafer and

readies for positioning

40 CYCLINGWAFERS

Cycling waferscompletes

AWAITINGCOMMAND

None

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10 ENTITY ID MAPPING

The equipment must provide the host with the capability to dynamically discover the IDs of alldata, event, and alarm items. This capability is realized using namelists, pre-defined reports, andthe List Alarm Request.

10.1 Status Variable (SV) and Equipment Constant (EC) IDs

The S1,F11/F12 message accesses the status variable namelist. The S2,F29/F30 messageaccesses the equipment constant namelist. The SVNAME values in the S1,F12 response mustexactly match the entries in section 13 Required Status Variables. The ECNAME values in theS2,F30 response must exactly match the entries in section 15 Required Equipment Constants.

Status Variables and Equipment Constants not mentioned in this specification must bedocumented with labels as they will appear in their respective namelists.

10.2 Pre-Defined Report IDs

The equipment must provide four pre-defined reports in addition to the pre-defined reports statedin the PSEM. See section 16 for a description of the pre-defined reports. The purpose of the firstreport is to provide the RPTID value for each of the additional pre-defined reports. The hostmust be able to access the first pre-defined report using RPTID = 01. The content of the firstreport is discussed in the following section.

10.2.1 Accessing Report IDs

This section demonstrates the method of accessing the first report (RPTID=01). The format ofthe first report is a list of n entries where n = total number of pre-defined reports [# reports –1(if RPTID=01 is not included in the report)].

(IDs values are hypothetical and shown for demonstration purposes only.)

Host Equipment

Annotated Individual Report RequestRPTID = 01

S6,F21 �

Note: the following report labels must beincluded:Reports required by this specification: DATA-VARIABLE-IDS COLLECTION-EVENT-IDS RESEQUENCE-EVENTReports required by PSEM: None

� S6,F22 Report containing a list of reports with theirrespective RPTID values:L, 31. L,2 1. 40000 (ID used in section 10.3.1) 2. DATA-VARIABLE-IDS 2. L,2 1. 40001 (ID used in section 10.3.2) 2. COLLECTION-EVENT-IDS 3. L,2 1. 40002 (ID used in section 22.10) 2. RESEQUENCE-EVENT

10.3 Data Variables (DV) and Collection Event (CE) IDs

Namelists are not defined for Collection Events and Data variables (DVs). For this reason, theequipment must provide two pre-defined reports with the names and IDs of all collection eventsin one report and the names and IDs of all data variables contained in the other report.

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10.3.1 Accessing Data Variable IDs

In the following transaction, the host requests the list of IDs corresponding to the Data Variableitems. Section 14 contains the complete list of Data Variables. For this report to serve itspurpose, each of the variable labels in this report must correspond exactly to the variable labelsin section 14.

Host Equipment


S6,F21 �

Note:The ID values are hypothetical valuespresented for demonstration purposesonly.

� S6,F22 Report containing the list of Data Variable IDsL,n 1. L,2 1. 20010 2. AlarmID 2. L,2 1. 10013 2. EventLimit 3. L,2 1. 30150 2. PPChangeName … n. L,2 1. 38000 2. WaferSlotNo

10.3.2 Accessing Collection Event IDs

In the following transaction, the host requests the IDs corresponding to the collection events. Seesection 12 for formatting the collection event labels.

Host Equipment


S6,F21 �

Note: The ID values are hypotheticalvalues presented for demonstrationpurposes only.

� S6,F22 Report containing the list of Collection Event IDsL,n 1. L,2 1. 200020 2. PROCESS-STATE-TRANSITION:0 2. L,2 2. 200021 2. PROCESS-STATE-TRANSITION:1 3. L,2 1. 200022 2: COMMUNICATION-STATE-TRANSITION:1 4. L,2 1. 200023 2. CONTROL-STATE-TRANSITION:1…

10.4 Alarm Text and Identification

The prober must provide a list of all possible alarms when the S5,F5 List Alarms Request (LAR)message is sent to the prober with a zero-length list. Although the content of the alarm text isundefined in this specification, alarm text should be as descriptive as possible (simple alarmcodes are not sufficient). Note: the SECS-II definition of S5,F5 does not show the parameters asa conventional list. This specification uses a zero-length list syntax to request the list of alarms.

11


11 ALARM MANAGEMENT

This specification is somewhat incomplete in alarm management. This specification stops shortof defining a base set of alarms common to all probers. A base set of alarms would enablecommon software to control equipment from different manufacturers. Instead of specifying theset of alarms, this specification outlines the behavior of the prober under alarm conditions.

11.1 Primary Alarms

For this discussion, the term Primary Unit is defined to represent the substrate currentlyreceiving processing. The processing of the primary unit is independent of the processing ofother substrates. These other substrates are considered Secondary Units by this definition. Thisdistinction is necessary in defining the behavior of the prober under an alarm condition.

When an alarm condition affects the processing of the primary unit, the alarm is classified as aPrimary Alarm. If the alarm condition prohibits the continued processing of the primary unit, thealarm code (ALCD) must have bit 5 set (irrecoverable error) in addition to bit 8, which signifiesthat the alarm is being set. The Processing State Model must transition to the ALARM PAUSEDstate until the alarm condition has been cleared.

11.2 Secondary Alarms

The preceding paragraph introduced the terms Primary Unit, Secondary Unit, and PrimaryAlarm.

When an alarm condition exists affecting the processing of a secondary unit, such as a failure ina pipeline stage or an ID Read failure, the Processing State Model must not transition to theALARM PAUSED state. Instead, an alarm notification will be sent with the alarm code (ALCD)having bit 7 set (Attention flags) in addition to bit 8, which signifies that the alarm is being set.

If the alarm is such that the equipment is able to self-correct the problem, then the prober mustattempt to remedy the situation itself before issuing the alarm.

If a secondary alarm condition persists at the time that the prober has been directed to unload theprimary unit, the behavior of the prober must depend upon the following: A) If the secondaryalarm impedes either the processing of the next substrate or the unloading of the primarysubstrate, the Processing State Model must transition to the ALARM PAUSED state; B) If thesecondary alarm does not impede the processing of the next substrate or the unloading of theprimary substrate, then the Processing State Model must be unaffected by the existence of thesecondary alarm.

12 REQUIRED COLLECTION EVENT LABELS

This section defines the collection event names to be used in the COLLECTION-EVENT-IDSpre-defined report (see section 10.3.2).

12.1 Transition Event Labels

The following table contains the required format for the transition even labels.

PSEM does not explicitly include the Limit State Model transitions in the list of requiredcollection events (see PSEM section 6.1.2). They are, however, included in GEM Table 6.1.Limit transition event IDs are dynamically assigned and passed from the host to the equipment

12


upon the creation of a limit attribute (S2,F45). Only those limit attributes that are defined at thetime that the COLLECTION-EVENT-IDS report is requested must be included in the report.

Note: The range of values for the transitions is based upon the state model transitions currentlydefined. If a new transition is added to a state model, the transition must be included in thereport.

Table 3 Required Transition Event Labels

Transition Type Transition Event Label

Communication State Transition COMMUNICATION-STATE-TRANSITION:<01-15>

Control State Transition CONTROL-STATE-TRANSITION:<01-12>

Processing State Transition PROCESSING-STATE-TRANSITION:<00-40>

Prober Job State Transition JOB-STATE-TRANSITION:<00-09>

Alarm State Transition ALARM-STATE-TRANSITION:<01-02>

Spooling State Transition SPOOLING-STATE-TRANSITION:<01-08>

Limit State Model VID:<vid>:LIMIT-STATE-TRANSITION:<01-06>

12.2 Other Required Collection Event Labels

The following table contains the required format for the non-state transition collection eventslabels defined in GEM section 6.1 and PSEM section 6.2.1 Table 6.

Note: Some of the GEM collection events may not be applicable for prober equipment. If theyare applicable, then the label for the event must comply with the format presented in this table.

Table 4 Other Required Collection Event Labels

Event DefinitionSource Collection Event Collection Event Label

Operator Command Issued OPERATOR-COMMAND-ISSUED

Operator Equipment Constant Change OPERATOR-EQUIPMENT-CONSTANT-CHANGE

Process Program Change PROCESS-PROGRAM-CHANGE

Process Program Selected PROCESS-PROGRAM-SELECTED

Material Received MATERIAL-RECEIVED

Material Removed MATERIAL-REMOVED

Spooling Activated SPOOLING-ACTIVATED

Spooling Deactivated SPOOLING-DEACTIVATED

Spool Transmit Failure SPOOL-TRANSMIT-FAILURE

Message Recognition MESSAGE-RECOGNITION

New Exception Recipe Event NEW-EXCEPTION-RECIPE-EVENT

GEM Table 6.1

Execution Recipe Change Event EXECUTION-RECIPE-CHANGE-EVENT

Wafer Start WAFER-START

Wafer End WAFER-END

PSEM section 6.2.1Table 6

Ready to Receive Previous Data READY-TO-RECEIVE-PREVIOUS-DATA

Command Complete COMMAND-COMPLETE

Re-Sequence Event RESEQUENCE-EVENT

This Specification

Cleaning Media Depleted CLEANING-MEDIA-DEPLETED

13


13 REQUIRED STATUS VARIABLES

Some of the status variables required by PSEM or GEM specifications may not be necessary tosatisfy the capabilities requested in this specification. However, when a status variable isimplemented, the variable label must match the label in the specification. This allows commonsoftware to be written to map the variable label to the variable ID using the status variablenamelist function.

Table 5 Required Status Variables

Label Status Variable Values

CarrierIDn where n = 1 to # of carrierssupported

Same as data item CARRIERID

CarrierMapn where n = 1 to # of carrierssupported

Same as SLOT-INFO (PSEM Table 13 under JOB_CREATE)

ChuckAtTemperature 0: NO, 1: YES

ChuckMotorPosition L,31 X motor position2 Y motor position

Z motor position

ChuckOverTravel Data

ChuckPosition L,31 X coordinate2 Y coordinate

Z – 0: DOWN, 1: UP

ContactCnt Data

CoordinateQuadrant Data

CurrentWaferFlatAngle In Degrees

LotID Data

PipelineStatus Value: L,a (# of pipeline stages)1 MID1…a MIDa

A zero length text item for MID indicates no wafer present.

ReferenceDiePosition Value: L,21 REFDIEPOS_X2 REFDIEPOS_Y

14


14 REQUIRED DATA VARIABLES

Some of the data variables required by PSEM or GEM specifications may not be necessary tosatisfy the capabilities requested in this specification. However, when a data variable isimplemented, the variable label must match the label presented in the specification. This allowscommon software to be written for mapping variable labels to the variables ID. The pre-definedreport named DATA-VARIABLE-IDS contains the association between the variable label andits ID.

Table 6 Required Data Variables

Label Condition Where Valid Description

DieXCoordinate Any event associated with the movement of the chuck Data

DieYCoordinate “ “ Data

InspectionResult Upon completion of an inspection operation 0: PASS, 1: FAIL

NextWaferID State transitions within ‘EXECUTING’ process state Data

NextWaferLoc “ “ Data

NextWaferNo “ “ Data

NextWaferSlotNo “ “ Data

WaferID “ “ Data

WaferIDType “ “ Data

WaferLoc “ “ Data

WaferNo “ “ Data

WaferProdID “ “ Data

WaferSlotNo “ “ Data

Additional data variables must exist to reflect the key/value parameters defined in the processprogram. See section 8.1 for the details of this requirement.

15 REQUIRED EQUIPMENT CONSTANTS

Table 7 Required Data Variables

ECID Description

OSType Operating System type (i.e., Solaris, NT, etc…)

OSVersion Operating System version.

15


16 REQUIRED REPORTS

Table 8 Required Reports

Report Label Description

REPORT-IDS Contains the report ids for all pre-defined reports. This report must have a fixed reportid of RPTID=01

DATA-VARIABLE-IDS Contains a list of all data variable items with their corresponding VID values

COLLECTION-EVENT-IDS Contains a list of all collection events with their corresponding CEID values

RESEQUENCE-EVENT Contains a list of the following six items:

1) Brief text message describing the condition leading to the re-sequencing of thewafers.

2) The pipeline stage from which the wafer was removed.

3) The wafer slot number of the unit that has been removed from the pipeline (re-sequenced wafer).

4) The pipeline stage used to backfill the stage where the wafer was removed (backfillstage).

5) The wafer slot number of the unit taken from the backfill stage.

6) The wafer slot number taken from the load port.

17 REQUIRED REMOTE COMMANDS

These remote commands are required in addition to the remote commands listed in the PSEMand GEM specifications.

Table 9 Required Remote Commands

RCMDReq/Opt CPNAME CPVAL

CLEAN_PROBES REQ Die List L,a L1,2 1: X1 2: Y1 La,2 1: Xa 2: Ya

CONTACT_TEST REQ Die List L,a L1,2 1: X1 2: Y1 La,2 1: Xa 2: Ya

CYCLE_WAFER N/a

END_LOT N/a

INDEX N/a

INK_DEVICE N/a

16


RCMDReq/Opt CPNAME CPVAL

INK_DIE REQ DieList L,a 1 L,2 1. x index 2. y index a L,2 1. x index 2. y index

INSPECT_INK_MARKS Die List L,a L1,2 1: X1 2: Y1 La,2 1: Xa 2: Ya

INSPECT_PROBE_TO_PAD_ALIGNMENT N/a

INSPECT_PROBES REQ Die List L,a L1,2 1: X1 2: Y1 La,2 1: Xa 2: Ya

REQ ID A[1-20]LOAD_PROBE_CARD_ID

REQ CONTACT_COUNT Data

LOAD_WAFER N/a

LOAD_WAFER_FROM_INSPECT_TRAY N/a

OPT X Relative X step value

OPT Y Relative Y step value

MOVE

OPT Z 0: DOWN, 1: UP, 2: REL

OPT X Absolute X index

OPT Y Absolute Y index

MOVE_ABS

OPT Z Absolute Z index

OPT X Relative X motor steps

OPT Y Relative Y motor steps

MOVE_MOTOR_STEPS

OPT Z Relative Z motor steps

MOVE_TO_REF_DIE N/a

MOVE_WAFER_TO_INSPECT_TRAY N/a

RELOCATE_WAFER REQ SlotID 1-26

RESET_CONTACT_CNT N/a

SET_CONTROL OPT Lockout 0: OFF, 1: ON

UNLOAD_WAFER N/a

17


18 INDEX REMOTE COMMAND

In the situation where a Control Map containing the product step plan is part of the ProcessProgram, the host can use the INDEX remote command in place of the MOVE remote command.The INDEX command instructs the prober to index to the next location specified in the ControlMap. The prober indexes once for each instance of the INDEX remote command.

HCACK code 64 is defined in this specification to represent End of Step Plan. When the INDEXcommand is issued following the last location specified in the Control Map, the prober mustreturn HCACK=64. Issuing the INDEX command while the prober is located at the next to lastlocation results in the prober moving to the last location and responding with HCACK=0 unlessan error condition exists.

19 REMOTE COMMAND VS. PROCESS STATE/PROBER JOB STATE

Table 10 is an extension to the PSEM Table 14. Table 10 includes only those commandsintroduced in this specification.

18


Table 10 Remote Commands vs. Process State/Prober Job State

UNLOAD-WAFERSET-CONTROL

RESET-CONTACT-CNTRELOCATE-WAFER

MOVE-WAFER-TO-INSPECT-TRAYMOVE-TO-REF-DIE

MOVE-MOTOR-STEPSMOVE-ABS

MOVE/INDEXLOAD-WAFER

LOAD-WAFER-FROM-INSPECT-TRAYLOAD-SPECIFIED-WAFER

LOAD-PROBE-CARD-IDINSPECT-PROBE-TO-PAD-ALIGNMENT

INSPECT-PROBESINSPECT-INK-MARKS

INK-DIEINK-DEVICEEND-LOT

CYCLE-WAFERCLEAN-PROBES

PROCESSING STATEINITIDLEIDLE with ALARMSMAINTENANCEPROCESSING ACTIVE…PROCESS…SETTING UP…EXECUTING……AWAITING LOAD……LOADING WAFER……CYCLING WAFERS……UNLOADING WAFERS……WAFER LOADED………AWAITING COMMAND……… MOVING XYZ………INKING………CLEANING………INSPECTING…PAUSE……PROCESS PAUSE………PAUSING………PAUSED………CHECKING………PAUSED SETTING UP……ALARM PAUSED…STOPPING…ABORTINGProber Job STATEUNDEFINEDJOB CREATEDJOB ACTIVE…JOB SET UP…JOB PROCESSINGJOB STOPPINGJOB ABORTING

19


20 NEW FUNCTION S2,F65/66

The new user-defined function S2,F65/66 is introduced to minimize the number of messagesrequired to control the movement of the prober between die locations. The function is equivalentto the S2,F49/50 function with the modification affecting the acknowledge message (S2,F66).The Acknowledge message contains the two additional parameters: Current_X_coordinate andCurrent_Y_coordinate.

20.1 S2,F65 User-Defined Enhanced Remote Command

Description:

Identical to S2,F49. Used in place of S2,F49 to piggyback the current XY coordinates on theS2,F66 User-Defined Enhanced Remote Command Acknowledge.

Structure:

See SEMI E5, S2,F49..

20.2 S2,F66 User-Defined Enhanced Remote Command Acknowledge

Description:

Similar to S2,F50. Contains the Current XY coordinates resulting from the completion of acommand that affects either the X or the Y coordinate.

Structure: L,4 1 <HCACK> 2. Current_X_Coordinate 3. Current_Y_Coordinate 4. L,n # of parameter groups 1. L,2 1. <CPNAME1> 2. <CEPACK1> n. L,2 1. <CPNAMEn> 2. <CEPACKn>

21 MODIFICATION TO E5 HOST COMMAND PARAMETER ACKNOWLEDGECODE (HCACK)

The following HCACK code values have been defined in this specification.

Table 11 Modification to E5 Host Command Parameter Acknowledge Code (HCACK)

HCACK Code Description

64 End of Step Plan. See section 18.

65 Unable to perform operation - cleaning media depleted. This is the equipment response to theCLEAN-PROBES remote command when the cleaning media is depleted. See section 8.3.

20


22 DETAILED SCENARIOS

This section contains several scenarios demonstrating typical communications between the hostand the prober. The first six scenarios represent the anticipated equipment behavior in theabsence of error conditions. The following table lists the scenarios provided.

Where the SECS-II data definition allows multiple data formats such as formats 3() and 5() for1-byte, 2-byte, 4-byte, and 8-byte signed and unsigned integers respectively, the scenariosdemonstrate the use of 1-byte values for convenience. This does not prohibit the use ofalternative data formats presented in the SECS-II standard.

Table 12 Detailed Scenarios

Scenario Section Title Description Complete

1 22.2 Complete Sample Run (Start to Finish)Abbreviated

Complete test. Messages are specifiedbut message content is omitted.

Yes

2 22.3 Complete Sample Run (Start to Finish)Un-Abbreviated

Same as scenario 1 but will fullmessage content provided.

Yes

3 22.4 Clean Probe Needles HSMS Header suppressed. Yes

4 22.5 Inspect Probe to Pad Alignment HSMS Header suppressed. Yes

5 22.6 Ink a Die HSMS Header suppressed. Yes

6 22.7 Ink Multiple Die HSMS Header suppressed. Yes

7 22.8 Irrecoverable Error While Loading aWafer

HSMS Header suppressed. Yes

8 22.9 Irrecoverable Error Alignment Failure HSMS Header suppressed. Yes

9 22.10 Automatic Change in Wafer Sequence HSMS Header suppressed. Yes

For completeness, the following hypothetical process program has been defined for device Dev1.This process program is used to demonstrate various aspects of process program management.

Following the structure defined in PSEM section 8.3.2, the process program is composed of thefollowing items:

1. Main process program: PPMain/Masters/Dev1

2. Sub-process program: Image/PMI/Dev1

3. Sub-process program: Image/AutoAlignment/Dev1

The sub-process programs are both binary files containing image information pertaining to Dev1.

22.1 Contents of PPMain/Masters/Dev1

Table 13 is a list of the main process program. The file is stored in ASCII text with a lineterminator character of LF (0x0A).

Note: Each of the parameters in the main process program can have its real-time (immediate)value overwritten by including the revised parameter value in the parameter list attached to either�� effect until the next PP-SELECT command is issued.

21


Table 13 Example Process Program File

File Entry # Bytes

PRODID:SK6000X01 17

WAFER_SIZE:300 15

DIE_SIZE_X:550000 18

DIE_SIZE_Y:470000 18

REFERENCE_DIE_COORD_X:5 24

REFERENCE_DIE_COORD_Y:130 26

OVER_DRIVE:75 14

FLAT_ANGLE:270 15

FLAT_TYPE:NOTCH 16

HOT_CHUCK:ON 13

HOT_CHUCK_TEMP:50 18

HOT_CHUCK_TOL:3 16

SOAK_TIME:5 11

ID_READER:ON 12

ID_READER_TYPE:BCR 18

ID_READER_LOC:BOTTOM 20

OPTICS_LAMP:ON 14

UNITS:METRIC 12

NEEDLE_CLEANING:ON 18

NEEDLE_CLEANING_TYPE:DIE 24

NEEDLE_CLEANING_INTERVAL:500 28

NEEDLE_CLEANING_METHOD:BLOCK2 29

NEEDLE_CLEANING_OVERDRIVE:3 27

CONTACT_TEST_ZONE:1 19

CHUCK_HEIGHT:150 16

CHUCK_UNDER_TRAVEL:1 20

PARAM_RECORD01:Image/PMI/Dev1 30

PARAM_RECORD02:Image/AutoAlignment/Dev1 40

Total Bytes: 548

22


22.2 Scenario 1 – Complete Sample Run (Start to Finish) Abbreviated

This section contains a complete scenario beginning with the initialization of communicationsthrough the completion of a test lot. The scenario contains the list of messages communicatedwithout containing the contents of the messages. Refer to Section 22.3 for the same scenario withfull message content.

22.2.1 Initialize Control State

Host Prober

Prepare to initiate a connectionrequestSkt = socket(…);

Prepare to receive a connection request.Skt = socket(…);Bind(skt,…);Listen(skt,…);

Initiate connection request and waitfor response

Receive a connection request, accept it andsend response

Connect(skt,…); TCP/IP Connect.Req

→TCP/IP Connect.Rsp

←

Accept(skt,…);

Initiate the HSMS Select procedure:send request and receive response

HSMS Select.Req

→HSMS Select.Rsp

←

Respond to HSMS select procedure: receiverequest and send response

Allow the prober to establish the communications

� S1,F13 Prober initiates the communication establishmentrequest

Communication establishment requestconfirmation

S1,F14 �

This discussion assumes that the prober Control State is configured to default to the OFF-LINEstate with the ATTEMPT ON-LINE substate being the default entry point for the OFF-LINEstate. The default entry substate of the ON-LINE state is the LOCAL state.

Host Prober

� S1,F1 Operator actuates ONLINE switch

Host acknowledges ONLINE request S1,F2 �

Event notification for the Control State Transitions will occur if the events are already enabled. Later, an S2,F37 message issent to explicitly enable all events.

� S6,F11 CEID=CONTROL-STATE-TRANSITION:7

Acknowledge S6,F12 �

� S6,F12 Operator selects REMOTECEID=CONTROL-STATE-TRANSITION:8


23


22.2.2 Prepare Prober for Processing

At this point, reports can be linked to collection events and collection event notifications can beenabled or disabled.

Host Prober

S2,F37 �Enable all Collection Event Notifications

� S2,F38 Acknowledge

In this scenario, the host has received notification that a particular lot needs to be processed. Thehost checks the prober to see if the prober’s Material/Process Matrix contains the correct processprogram ID for the given Material ID (MID) of the lot to be processed. In this case, the proberdoes not have the entry for the MID value so the host checks the availability of the processprogram on the prober. In this case, the process program does not exist on the prober so the hostdownloads the process program and updates the Material/Process Matrix.

Host Prober

Process Program ID Request S7,F7 �

� S7,F8 Respond with a zero length list to indicate theabsence of an entry for the specified MID value

Request the availability of the requiredprocess program

S7,F33 �

� S7,F34 Respond with zero length entries for the UNFLENand FRMLEN data items to indicate theunavailability of the requested process program.

If the process program is multi-block,request permission to send multi-blockprocess program

S7,F1 �

� S7,F2 Grant permission to send multi-block processprogram

S7,F3 �

� S7,F4 Acknowledge process program

S7,F1 �

� S7,F2

S7,F3 �

Since a given process program containssub-process programs (OCR, Inspection,Control Map,…), one download isrequired for each of the components of theoverall process program. S7,F3/F4 is usedfor downloading unformatted processprograms. S7,F23/F24 is used forformatted process programs.

� S7,F4

Update the Material/Process Matrix S7,F11 �

� S7,F12

The above scenario is contrived to demonstrate a potential use of the M/P matrix. An alternativeapproach is to simply create a job with a specified PPID. If the prober does not contain thespecified process program, the prober can initiate a download of the required process programduring the SETUP process state.

24


22.2.3 Create Probe Job

This scenario demonstrates the creation of a probe job for the specified lot. It is assumed that thecarrier containing the wafers for the given lot has already been received at port 1. The Create Jobcommand is limited to providing information to the prober about the number of wafers to beprocessed and the location of the wafers. No information indicates the nature of the processing tobe performed.

Host Prober

RCMD=“JOB_CREATE” S2,F49 �

� S2,F50

� S6,F11 CEID=JOB-STATE-TRANSITION:01


22.2.4 Process Lot

22.2.4.1 Issue Start Command

Host Prober

RCMD= “START” S2,F49 �

� S2,F50 HCACK=0



� S6,F11 CEID=PROCESSING-STATE-TRANSITION:03




� S6,F11 CEID-PROCESSING-STATE-TRANSITION:04


22.2.4.2 For the 1st Wafer DO

Host Prober

Issue Command: “LOAD-WAFER” S2,F49 �

� S2,F50 HCACK=4





� S6,F11 CEID=COMMAND-COMPLETE


25


22.2.4.3 Prepare 1st Die

Host Prober

Issue Command: MOVEX: 1st die X index, Y: 1st die Y index,Z: UP

S2,F49 �





� S2,F50 HCACK=0 (DONE)

22.2.4.4 For Each Additional Die DO (Move Absolute)

Host Prober

Issue Command: MOVEX: die X index, Y: die Y index

S2,F49 �



� S6,F11 CEID=PROCESSING-STATE-TRANSITIN:30


� S2,F50 HCACK=0 (DONE)

22.2.4.5 For Each Additional Die DO (Index Per Control Map)

Host Prober

Issue Command: INDEX S2,F65 �





� S2,F66

HCACK=0 (DONE)Current X CoordinateCurrent Y Coordinate[HCACK=65 (End of Step Plan) when step plan iscompleted]

Note: Intermixing the INDEX and the MOVE commands does not have a guaranteed behavior.

26


22.2.4.6 For Each Additional Wafer DO

Host Prober

Issue Command: “CYCLE-WAFER” S2,F49 �

� S2,F50 HCACK=4





Execute the instructions from a) sections 22.2.4.3 and 22.2.4.4 or b) section 22.2.4.5 forprocessing the die on each wafer.

22.2.4.7 Ending the Lot

Host Prober

Issue Command: “END-LOT” S2,F49

� S2,F50 HCACK=4

� S6,F11CEID=PROCESSING-STATE-TRANSITION:5(IDLE)


� S6,F11CEID=JOB-STATE-TRANSITION:5Occurs when last wafer has been restored to thecassette




27


22.3 Scenario 2 – Complete Sample Run (Start to Finish) Unabbreviated

22.3.1 Initialize Control State

TCP/IP (BSD Sockets)

Host Prober

Prepare to initiate a connectionrequestSkt = socket(…);

Prepare to receive a connection request.Skt = socket(…);Bind(skt,…);Listen(skt,…);

Initiate connection request andwait for response

Receive a connection request, accept it and sendresponse

Connect(skt,…);TCP/IP Connect.Req

→TCP/IP Connect.Rsp

←

Accept(skt,…);

HSMS

Byte # Byte Comments

1 0x00

2 0x00

3 0x00

4 0x0A

4-Byte message length

5 0x00

6 0x01Session ID

7 0x00

8 0x00

9 0x00

10 0x01 Select.Req=1

11 0x00

12 0x00

13 0x00

14 0x01

Transaction ID=1

Select.Req Message �

Comments Byte Byte #0x00 1

0x00 2

0x00 34-Byte message length

0x0A 4

0x00 5Session ID

0x01 6

0x00 7

Select Status (0=OK) 0x00 8

0x00 9

Select.Rsp=2 0x02 10

0x00 11

0x00 12

0x00 13

� Select.Rsp Message

Transaction ID=1

0x01 14

28


Establish Communications Request

0x00 1

0x00 2


0x1C 4

0x00 5Session ID

0x01 6

W-Bit=1, Stream = 1 0x81 7

Function=13 0x0D 8

Ptype=0 0x00 9

Stype=0 0x00 10

0x00 11

0x00 12

0x00 13Transaction ID=2

0x02 14

0x01 15List. 1-length byte.2 items in the list 0x02 16

1st item: ASCII; 1-length byte 0x41 17

7 bytes 0x07 18

“B” 0x42 19

“R” 0x52 20

“A” 0x41 21

“N” 0x4E 22

“D” 0x44 23

<space> 0x20 24

“X” 0x58 25

2nd item: ASCII: 1-length byte 0x41 26

5 bytes 0x05 27

“1” 0x31 28

“.” 0x2E 29

“0” 0x30 30

“.” 0x2E 31

� S1,F13Establish Communication Request

MDLN=“BRAND X”SOFTREV = 1.0.2

“2” 0x32 32

Byte # Byte Comment1 0x00

2 0x00

3 0x00

4 0x11


5 0x00

6 0x01Session ID

7 0x01 W-Bit=0, Stream=1

8 0x0E Function=14

9 0x00 Ptype=0

10 0x00 Stype=0

11 0x00

12 0x00

13 0x00

14 0x02

Transaction ID=2

15 0x01

16 0x02

List. 1-length byte.2 items in the list

S1,F14 �Establish Communication Request Acknowledge

COMMACK=0

29


17 0x21 1st item: BIN1, 1-length byte

18 0x01 1 byte

19 0x00 <COMMACK=0>

20 0x01 2nd item: List. 1-length byte

21 0x00 Zero length list

S1,F14 �Establish Communication Request Acknowledge

COMMACK=0 (continued)

Comment Byte Byte #0x00 1

0x00 2


0x0A 4

0x00 5Session ID

0x01 6

W-Bit=1, Stream=1 0x81 7

Function = 1 0x01 8

Ptype=0 0x00 9

Stype=0 0x00 10

0x00 11

0x00 12

0x00 13

� S1,F1Operator actuates ON-LINE switch

Transaction ID=3

0x03 14


2 0x00

3 0x00

4 0x0C


5 0x00

6 0x01Session ID

7 0x01 W-Bit=0, Steam=1

8 0x02 Function = 2

9 0x00 Ptype=0

10 0x00 Stype=0

11 0x00

12 0x00

13 0x00

14 0x03

Transaction ID=3

15 0x01

16 0x00

List. 1-length byte0 items in the list

S1,F2 �Acknowledge request for ON-LINE


0x00 2


0x17 4

0x00 5Session ID

0x01 6


Function = 11 0x0B 8

Ptype=0 0x00 9

� S6, F11Transition to ON-LINE LOCAL

Stype=0 0x00 10

30


0x00 11

0x00 12

0x00 13Transaction ID = 4

0x04 14

List. 1-length byte 0x01 15

3 items 0x03 16

1st item: U1, 1 length byte 0xA5 17

1 byte 0x01 18

DATAID = 0 0x00 19

2nd item: U4, 1 length byte 0xB1 20

1 byte 0x01 21

CEID=CONTROL-STATE-TRANSITION:7

��22-25

3rd item: List 1-length byte 0x01 26

� S6, F11Transition to ON-LINE LOCAL

(continued)

0 items 0x00 27


2 0x00

3 0x00

4 0x0D


5 0x00

6 0x01Session ID


8 0x0C Function = 12

9 0x00 Ptype=0

10 0x00 Stype=0

11 0x00

12 0x00

13 0x00

14 0x04

TransactionID = 4

15 0x21 BIN1. 1-length byte

16 0x01 1 byte

17 0x00 ACKC6=0

S1,F2 �Acknowledge Transition to ON-LINE LOCAL


0x00 2


0x17 4

0x00 5Session ID

0x01 6


Function = 11 0x0B 8

Ptype=0 0x00 9

Stype=0 0x00 10

0x00 11

0x00 12


0x05 14


� S6, F11Operator has selected REMOTE

3 items 0x03 16

31


1st item: U1, 1 length byte 0xA5 17

1 byte 0x01 18

DATAID = 0 0x00 19


1 byte 0x01 21

CEID=CONTROL-STATE-TRANSITION:8

��22-25


� S6, F11Operator has selected REMOTE

(continued)

0 items 0x00 27


2 0x00

3 0x00

4 0x0D


5 0x00

6 0x01Session ID


8 0x0C Function = 12

9 0x00 Ptype=0

10 0x00 Stype=0

11 0x00

12 0x00

13 0x00

14 0x05

TransactionID = 5

15 0x21 BIN1. 1-length byte

16 0x01 1 byte

17 0x00 ACKC6=0

S6,F12 �Acknowledge Event Notification

Prepare Prober for Processing


2 0x00

3 0x00

4 0x11

4-byte message length

5 0x00

6 0x01SessionID

7 0x82 W-Bit=1,Stream=2

8 0x25 Stream = 37

9 0x00 Ptype=0

10 0x00 Stype=0

11 0x00

12 0x00

13 0x00

14 0x06

Transaction ID=6

15 0x01 List. 1-length byte

16 0x02 2 items in the list

17 0x25 1st item: BOOL1, 1-length byte

18 0x01 1 byte

19 0x01 CEED=TRUE (Enable)

20 0x01 2nd item: List. 1-length byte


S2,F37 �Enable/Disable Event Report

CEED=TRUE (Enable)Empty list selects all collection events

32



0x00 2

0x00 34-byte message length

0x0D 4

0x00 5Session ID

0x01 6


Function = 38 0x26 8

Ptype=0 0x00 9

Stype=0 0x00 10

0x00 11

0x00 12


0x06 14

BIN1, 1-length byte 0x21 15

1 byte 0x01 16

� S2,F38Enable/Disable Event Report Acknowledge

ERACK=0 (OK)

ERACK=0 0x00 17


2 0x00

3 0x00

4 0x17


5 0x00

6 0x01Session ID


8 0x07 Function = 7

9 0x00 Ptype=0

10 0x00 Stype=0

11 0x00

12 0x00

13 0x00

14 0x07

TransactionID = 7

15 0x41 ASCII, 1-length byte

16 0x0B 11 bytes

17 0x4D “M”

18 0x41 “A”

19 0x54 “T”

20 0x45 “E”

21 0x52 “R”

22 0x49 “I”

23 0x41 “A”

24 0x4C “L”

25 0x20 <sp>

26 0x49 “I”

27 0x44 “D”

S7,F7 �Process Program ID Request

33



0x00 2


0x0C 4

0x00 5Session ID

0x01 6

W-Bit=0,Stream=7 0x07 7

Function = 8 0x08 8

Ptype=0 0x00 9

Stype=0 0x00 10

0x00 11

0x00 12

0x00 13TransactionID = 7

0x07 14


� S7,F8Process Program ID Data

Empty list signifying that no process programHas been identified for this MID

0 items 0x00 16


2 0x00

3 0x00

4 0x1F


5 0x00

6 0x01Session ID


8 0x21 Function=33

9 0x00 Ptype=0

10 0x00 Stype=0

11 0x00

12 0x00

13 0x00

14 0x08

TransactionID = 8

15 0x41 ASCII, 1-length byte

16 0x13 19 bytes

17 0x50 “P”

18 0x50 “P”

19 0x4D “M”

20 0x61 “a”

21 0x69 “i”

22 0x6E “n”

23 0x2F “/”

24 0x4D “M”

25 0x61 “a”

26 0x73 “s”

27 0x74 “t”

28 0x65 “e”

29 0x72 “r”

S7,F33 �Process Program Availability Request

For the process program named“PPMain/Masters/Dev1”

34


30 0x73 “s”

31 0x2F “/”

32 0x44 “D”

33 0x65 “e”

34 0x76 “v”

35 0x31 “1”

S7,F33 �Process Program Availability Request

For the process program named“PPMain/Masters/Dev1”

(continued)


0x00 2


0x27 4

0x00 5Session ID

0x01 6


Function = 34 0x12 8

Ptype=0 0x00 9

Stype=0 0x00 10

0x00 11

0x00 12


0x08 14


3 items 0x03 16

1st item: ASCII 1-length byte 0x41 17

19 bytes 0x13 18

“P” 0x50 19

“P” 0x50 20

“M” 0x4D 21

“a” 0x61 22

“i” 0x69 23

“n” 0x6E 24

“/” 0x2F 25

“M” 0x4D 26

“a” 0x61 27

“s” 0x73 28

“t” 0x74 29

“e” 0x65 30

“r” 0x72 31

“s” 0x73 32

“/” 0x2F 33

“D” 0x44 34

“e” 0x65 35

“v” 0x76 36

“1” 0x31 37

2nd item: U1, 1-length byte 0xA5 38

1 byte 0x01 39

UNFLEN=0 0x00 40

3rd item: U1, 1-length byte 0xA5 41

1 byte 0x01 42

� S7,F34Process Program Availability Data

UNFLEN=0, FRMLEN=0Zero lengths indicate that the process program

“PPMain/Masters/Dev1” is unavailable

FRMLEN=0 0x00 43

35



2 0x00

3 0x00

4 0x25


5 0x00

6 0x01Session ID


8 0x01 Function = 1

9 0x00 Ptype=0

10 0x00 Stype=0

11 0x00

12 0x00

13 0x00

14 0x09

Transaction ID = 9



17 0x41 1st item: ASCII 1-length byte

18 0x13 19 bytes

19 0x50 “P”

20 0x50 “P”

21 0x4D “M”

22 0x61 “a”

23 0x69 “i”

24 0x6E “n”

25 0x2F “/”

26 0x4D “M”

27 0x61 “a”

28 0x73 “s”

29 0x74 “t”

30 0x65 “e”

31 0x72 “r”

32 0x73 “s”

33 0x2F “/”

34 0x44 “D”

35 0x65 “e”

36 0x76 “v”

37 0x31 “1”

38 0xA9 2nd item: U2, 1-length bit

39 0x02 2 bytes

40 0x02

41 0x24Size = 548

S7,F1 �Request permission to send process program.

This message is not necessary since theprocess program can be sent as a single block.

It is recommended though (SEMI E30 section 4.6.5.4)


0x00 2


0x0D 4

0x00 5Session ID

0x01 6

� S7,F2Process Program Load Grant

PPGNT=0 (OK)


36


Function = 2 0x02 8

Ptype=0 0x00 9

Stype=0 0x00 10

0x00 11

0x00 12


0x09 14


1 byte 0x01 16

� S7,F2Process Program Load Grant

PPGNT=0 (OK)(continued)

PPGNT=0 0x00 17


2 0x00

3 0x01

4 0x3C


5 0x00

6 0x01Session ID


8 0x03 Function = 3

9 0x00 Ptype=0

10 0x00 Stype=0

11 0x00

12 0x00

13 0x00

14 0x0A

Transaction ID = 10




18 0x13 19 bytes

19-37 �� “PPMain/Masters/Dev1”

38 0x42 2nd item:ASCII, 2-length bytes

39

40

0x010x18

Length = 280 bytes

41 0x50 “P”

42 0x52 “R”

43 0x4F “O”

44 0x44 “D”

45 0x49 “I”

46 0x44 “D”

47 0x3A “:”

48 0x53 “S”

49 0x4B “K”

50 0x36 “6”

51 0x30 “0”

52 0x30 “0”

53 0x30 “0”

54 0x58 “X”

55 0x30 “0”

56 0x31 “1”

57 0x0A LF

S7,F3 �Process Program Send

37


58 0x57 “W”

59 0x41 “A”

60-542 �� “FER_SIZE:300 LF … ment”

543 0x2F “/”

544 0x44 “D”

545 0x65 “e”

546 0x76 “v”

547 0x31 “1”

548 0x0A LF

S7,F3 �Process Program Send

(continued)

Repeat the sequence: � S7,F4S7,F1 �� S7,F2S7,F3 �� S7,F4

for the files Image/PMI/Dev1 and Image/AutoAlignment/Dev1using Binary instead of ASCII.

Create Probe Job

1 0x00

2 0x00

3 0x01

4 0xC9


5 0x00

6 0x01Session ID

7 0x82 W-Bit=1,Stream=2

8 0x31 Function=49

9 0x00 Ptype=0

10 0x00 Stype=0

11 0x00

12 0x00

13 0x00

14 0x0B

Transaction ID = 11



17 0xA5 1st item: U1, 1-length byte

18 0x01 1 byte

19 0x00 DATAID=0

20 0x41 2nd item: ASCII 1-length byte

21 0x00 0 length text (OBJSPEC=null)

22 0x41 3rd item: ASCII 1-length byte

23 0x0A 10 bytes

24-33 �� RCMD=”JOB_CREATE”

34 0x01 4th item: List. 1-length byte



37 0x05 5 bytes

38-42 �� ProberJobID = “LOT_A”

43 0x21 2nd item: BIN1, 1-length byte

44 0x01 1 byte

45 0x01 LOC = 1


47 0x01 1 byte

S2,F49 �RCMD = “JOB_CREATE”

38


48-56 �� PRODID=”SK6000X01”

57 0x41 4th item: ASCII 1-length byte

58 0x13 1 byte

59-77 �� PPID=PPMain/Masters/Dev1

78 0x41 5th item:ASCII 1-length byte

79 0x02 2 bytes

80 0x32 “2”

81 0x35 “5”

82 0x25 6th item: BOOL1, 1-length byte

83 0x01 1 byte

84 0x01 SLOT_ORD=TRUE (wafers takenfrom the lowest slot)

85 0x01 7th item: List 1-length byte


87 0x01 1st item: List 1-length byte



90 0x08 8 bytes

91-98 �� Wafer ID: “WAFER 01”

99 0x25 2nd item: BOOL1, 1-length byte

100 0x01 1 byte

101 0x01 Subject to processing: TRUE

102 –116

��2nd item : ��

117 –131

��3rd item: ��

132 –446

��




450 0x08 8 bytes

458 �� Wafer ID: “WAFER 25”

459 0x25 2nd item: BOOL1, 1-length byte

460 0x01 1 byte

461 0x01 Subject to processing: TRUE

S2,F49 �RCMD = “JOB_CREATE”

(continued)

Comments Byte Byte #HSMS Header S2,F50 �� 1-14


2 items in the list 0x02 16

1st item: BIN1, 1-length byte 0x21 17

1 byte 0x01 18

HCACK=0 0x00 19

2nd item: List. 1-length byte 0x01 20

� S2,F50Enhanced Remote Command Acknowledge

Transaction ID = 11HCACK=0 (DONE)


39


Comments Byte Byte #

HSMS Header S6,F11 �� 1-14



1st item: U1,. 1-length byte 0xA5 17

1 byte 0x01 18

DATAID=0 0x00 19

2nd item: U4,. 1-length byte 0xB1 20

1 byte 0x01 21

CEID=JOB-STATE-TRANSITION:1

��22-25

3rd item: List. 1-length byte 0x01 26

� S6,F11Event Report Send

Transaction ID = 12Transition to “JOB CREATED” state

In Prober Job State Model


Byte # Byte Comments1-14 �� HSMS Header S6,F12

15 0x21 BIN1, 1-length byte

16 0x01 1 byte

17 0x00 ACKC6=0 (OK)

S6,F12 �Event Report Acknowledge

Transaction ID = 12

Process LotIssue START command





18 0x01 1 byte

19 0x00 DATAID=0


21 0x00 0 length (OBJSPEC=null)


23 0x05 5 bytes

24-28 �� “START”

29 0x01 4th item: LIST. 1-length byte


S2,F49 �Enhanced Remote Command

Transaction ID = 13RCMD = “START”





1 byte 0x01 18

HCACK=0 (DONE) 0x00 19








1st item: U1, 1-length byte 0xA5 17

1 byte 0x01 18


Transaction ID = 14Prober Job Transition #3 into

JOB SET UP stateDATAID=0 0x00 19

40


2nd item: U4, 1-length byte 0xB1 20

4 bytes 0x04 21


��22-25



Transaction ID = 14Prober Job Transition #3 into

JOB SET UP state(continued)



15 0xA5 U1, 1-length byte

16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 14





1 byte 0x01 18

DATAID=0 0x00 19

2nd item: U4 1-length byte 0xB1 20

4 bytes 0x04 21

CEID=PROCESSING-STATE-TRANSITION:3

��22-25



Transaction ID = 15Transition to SETTING UP stateIn Prober Processing State Model




16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 15





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transaction ID = 16Transition to JOB PROCESSING state

In Prober Job State Model




16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 16

41






1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21

CEID = PROCESSING-STATE-TRANSITION:4

��22-25



Transaction ID = 17Transition to AWAITING LOAD state

In Prober Processing State Model




16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 17

For the 1st Wafer DO





18 0x01 1 byte

19 0x00 DATAID=0




23 0x09 9 bytes

24-33 �� “LOAD-WAFER

34 0x01 4th item: LIST. 1-length byte



Transaction ID = 18RCMD = “LOAD-WAFER”





1 byte 0x01 18

HCACK=4 0x04 19



Transaction ID = 18HCACK=4

(Send Event Report when task is completed)


42







1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transaction ID = 19Transition to LOADING WAFER state





16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 19





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transaction ID = 20Transition to AWAITING COMMAND state





16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 20





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21

CEID = COMMAND-COMPLETE �� 22-25



Transaction ID = 18Remote Command “LOAD-WAFER” Complete


43




16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 18

Prepare 1st DieThe Prober now has the reference die located under the probes with the Z-stage down.





18 0x01 1 byte

19 0x00 DATAID=0




23 0x04 4 bytes

24-27 �� “MOVE”



30 0x01 1st item: List. 1-length byte



33 0x01 1 byte

34 0x58 “X”

35 0x69 2nd item: S2, 1-length byte

36 0x02 2 bytes

37 0xnn

38 0xnnX index of 1st die

39 0x01 2nd item: List 1-length byte



42 0x01 1 byte

43 0x59 “Y”


45 0x02 2 bytes

46 0xnn

47 0xnnY index of the 1st die

48 0x01 3rd item: List. 1-length byte



51 0x01 1 byte

52 0x5A “Z”

53 0xA5 2nd item: U1, 1-length byte

54 0x01 1 byte

55 0x01 CEPVAL = 1 (UP)


Transaction ID = 21RCMD = “MOVE”X = 1st die X indexY = 1st die Y index

Z = UP

44






1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transaction ID = 22Transition to MOVING XYZ stateIn Prober Processing State Model




16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 22





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25








16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 23





1 byte 0x01 18






45


For each Additional Die DO (Move Absolute)





18 0x01 1 byte

19 0x00 DATAID=0




23 0x04 4 bytes

24-27 �� “MOVE”



30 0x01 1st item: List. 1-length byte



33 0x01 1 byte

34 0x58 “X”


36 0x02 2 bytes

37 0xnn X index of 1st die

38 0xnn




42 0x01 1 byte

43 0x59 “Y”


45 0x02 2 bytes

46 0xnn Y index of the 1st die


Transaction ID = 24RCMD = “MOVE”X = 1st die X indexY = 1st die Y index





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25





46




16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 25





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25








16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 26





1 byte 0x01 18






For each Additional Die DO (Index per Control Map)Note: Intermixing the ‘INDEX” and the “MOVE” commands does not have a guaranteed behavior.





18 0x01 1 byte

19 0x00 DATAID=0




23 0x04 5 bytes

24-28 �� “INDEX”

S2,F65 �Special Remote Command

Transaction ID = 24RCMD = “INDEX”

47






1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25







16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 25





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25








16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Transaction ID = 26





1 byte 0x01 18



4 bytes 0x04 21

Current X Coord �� 22-25

3rd item: U4, 1 length byte 0xB1 26

4 bytes 0x04 27

Current Y Coord �� 28-31

4th item: List 1-length byte 0x01 32

� S2,F66Special Remote Command Acknowledge

Transaction ID = 24HCACK=0 (DONE)Current X Coord = ??Current Y Coord = ??


48


For the Remaining Wafers DO

RCMD = “CYCLE-WAFER” S2,F49 �

� S2,50 Acknowledge HCACK=4







Repeat preceding steps for processing the die on each wafer

Ending the Lot

RCMD=”UNLOAD-WAFER” S2,F49 �

� S2,F50 HCACK=4







RCMD = “END-LOT” S2,F49 �

� S2,F50 HCACK=0







22.4 Scenario 3: Clean Probe Needles

The prober must allow for both automatic and on-demand needle cleaning. Section 13 (RequiredStatus Variables) includes a list of required attributes the prober must provide to facilitate theconfiguration of the needle cleaning feature.

Automatic needle cleaning is enabled by setting the attribute NeedleCleaning=ON. Whether ornot automatic needle cleaning is enabled, the prober must perform the needle cleaning operationwhen the host issues the remote command CLEAN-PROBES. If the host initiates the needlecleaning operation when automatic needle cleaning is enabled, the counter representing thenumber of contacts between cleaning operations must be reset such that the next automaticneedle cleaning will not occur before the next full contact interval. This short scenario depictsthe host issuing the CLEAN-PROBES command from the AWAITING COMMAND state.When the prober performs an automatic needle cleaning as the result of the needle cleaninginterval being reached, the resulting communications will be similar to the following scenarioexcept that the S2,F49/F50 messages will be present.

49



1–14 �� HSMS Header S2,F49




18 0x01 1 byte

19 0x00 DATAID=0




23 0x0B 11 bytes

24–35 �� “CLEAN-PROBES”




RCMD = “CLEAN-PROBES”Zero-length list = clean all sites






1 byte 0x01 18

HCACK=4 0x04 19



HCACK=4A separate S6,F11 report will be generated

When the task is completed







1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transition to CLEANING stateIn Prober Processing State Model



1-14 �� HSMS Header S6,F12


16 0x01 1 byte

17 0x00 ACKC6=0 (OK)

S6,F12 �

Event Report Acknowledge

50







1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transition to AWAITING COMMAND stateIn Prober Processing State Model





16 0x01 1 byte

17 0x00 ACKC6=0 (OK)







1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21

CEID = COMMAND-COMPLETE

��22-25



Remote Command Complete





16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


22.5 Scenario 4: Inspect Probe to Pad Alignment

The prober must provide the probe mark inspection capability with the following definedbehavior. Probe-to-Pad alignment inspection may be performed at any time while processing awafer with the constraint that the inspection must remain disabled upon the initial processing of anew wafer up until the point at which the probe needles have made first contact with the wafer.From that point on, the inspection feature must be enabled. When the host issues the remotecommand INSPECT-PROBE-TO-PAD-ALIGNMENT, the inspection must be performed for the

51


last point of contact. The inspection file used in the inspection process must be identified as asub-process record within the main process program file.

22.5.1 Inspection Report Definition

The following report definition may be defined and linked to the inspection complete eventnotification for the purpose of receiving the inspection result along with any inspection-relatedparametric values the equipment provides.



15 0x01 List, 1-length byte



18 0x01 1 byte

19 0x00 DATAID=0


21 0x01 1 item in the list




25 0x01 1 byte

26 0x01 RPTID=1



29 0xB1 1st item: U4, 1-length byte

30 0x04 4 bytes

31-34 �� VID=0x4000000C

S2,F33 �Define Report

Note: This report can be extended to includeadditional inspection results as

desired

Comment Byte Byte #



1 byte 0x01 16

� S2,F34Define Report Acknowledge

DRACK=0 (OK) 0x00 17

Byte # Byte Comment


15 0x01 List, 1-length byte



18 0x01 1 byte

19 0x00 DATAID=0



22 0x01 1st item: List, 1-length byte


24 0xB1 1st item: U4, 1-length byte

S2,F35 �Link Event Report

52


25 0x04 4 byte

26-29 �� CEID=0x20000009




33 0x01 1 byte

34 0x01 RPTID=1

S2,F35 �Link Event Report

(continued)

Comment Byte Byte #



1 byte 0x01 16

� S2,F36Link Event Report Acknowledge

LRACK=0 (Accepted) 0x00 17

Byte # Byte Comment





18 0x01 1 byte

19 0x00 DATAID=0




23 0x1A 26 bytes

24-53��

INSPECT-PROBE-TO-PAD-ALIGNMENT




RCMD = “INSPECT-PROBE-TO-PAD-ALIGNMENT”






1 byte 0x01 18

HCACK=4 0x04 19



HCACK=4A separate S6,F11 report will be generated

When the task is complete.


53







1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transition to INSPECTING stateIn Prober Processing State Model





16 0x01 1 byte

17 0x00 ACKC6=0 (OK)







1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25








16 0x01 1 byte

17 0x00 ACKC6=0 (OK)







1 byte 0x01 18


Remote Command CompleteInclude Report containing the

Inspection result as defined aboveInspectionResult=0: Pass, 1: Fail

DATAID=0 0x00 19

54



4 bytes 0x04 21

CEID = COMMAND-COMPLETE

��22-25



1st item: List 1-length byte 0x01 28



1 byte 0x01 31

RPTID=1 0x01 32

2nd item: List 1-length byte 0x01 33

1 item in the list 0x01 34


1 bytes 0x01 36


Remote Command CompleteInclude Report containing the

Inspection result as defined aboveInspectionResult=0: Pass, 1: Fail

(continued)

InspectionResult 0x0n 37




16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


22.6 Scenario 5: Ink a Die

The inking capability must include the remote command INK-DEVICE for inking the currentdevice and the remote command INK-DI for inking a selection of die. This scenariodemonstrates the communications associated with the command INK-DEVICE.






18 0x01 1 byte

19 0x00 DATAID=0




23 0x09 9 bytes

24-33 �� “INK-DEVICE”




RCMD = “INK-DEVICE”

55


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transition to INKING stateIn Prober Processing State Model


Byte # Byte Comment

1-14 �� HSMS Header for S6,F12


16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25





Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Comment Byte Byte #

HSMS Header for S2,F50 �� 1-14




1 byte 0x01 18

HCACK=0 (Done) 0x00 19



HCACK=0 (Done)


56


22.7 Scenario 6: Ink Multiple Die

This scenario demonstrates the capability to ink a select list of die using the remote commandINK-DIE. For this scenario, the prober is instructed to ink the three die at locations: -2,-2; -1,-1,1,1. The process state model will undergo the state transition from AWAITING COMMAND toINKING and remain in the INKING state until the task is complete, at which time the processingstate model will transition back to the AWAITING COMMAND state.






18 0x01 1 byte

19 0x00 DATAID=0




23 0x09 9 bytes

24-30 �� “INK-DIE”





35 0x65 1st item: S1, 1-length byte

36 0x01 1 byte

37 0xFE X= -2

38 0x65 2nd item: S1,. 1-length byte

39 0x01 1 byte

40 0xFE Y= -2



43 0x65 1st item: S1,. 1-length byte

44 0x01 1 byte

45 0xFF X= -1


47 0x01 1 byte

48 0xFF Y= -1

49 0x01 3rd item: List 1-length byte


51 0x65 1st item: S1, 1-length byte

52 0x01 1 byte

53 0x01 X= 1


55 0x01 1 byte

56 0x01 Y= 1


RCMD = “INK-DIE”

57


Comment Byte Byte #





1 byte 0x01 18




HCACK=4(Send Event Report when task is completed)


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transition to INKING stateIn Prober Processing State Model


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25





Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


58


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21

CEID=COMMAND-COMPLETEBG

��22-25



Task “INK-DIE” Complete


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


22.8 Scenario 7: Irrecoverable Error – Probe Job Aborted

The purpose of this scenario is to demonstrate the behavior of the prober in response to anirrecoverable error while loading a wafer. The nature of the error is not specified. The operatorchooses to abort the probe job.


1-14 lll HSMS Header S2,F49




18 0x01 1 byte

19 0x00 DATAID=0




23 0x0A 10 bytes

24-33 lll “LOAD-WAFER”



S2,F49 �Enhanced Remote CommandRCMD = “LOAD-WAFER”

59


Comment Byte Byte #

HSMS Header for S2,F50 lll 1-14




1 byte 0x01 18






Comment Byte Byte #

HSMS Header S6,F11 lll 1-14




1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


lll22-25



Transition to LOADING WAFER stateIn Processing State Model


Byte # Byte Comment

1-14 lll HSMS Header for S6,F12


16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Comment Byte Byte #




1st item: B1, 1-length byte 0x21 17

1 byte 0x01 18

ALCD=bits 8 & 5 0x90 19


1 byte 0x01 21

ALID lll 22

3rd item: ASCII, 1-length byte 0x01 23

(1-40) bytes lll ??

� S5,F1Alarm Report Send

ALCD=bits 8 & 5 (Irrecoverable error set)

Alarm Text lll ??

60


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC5=0 (Accepted)

S5,F2 �Alarm Report Acknowledge

Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


lll22-25



Transition to ALARM PAUSED inProcessing State Model


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


The operator checks the prober out and determines that a hard-failure condition exists.The operator chooses to abort the probe job through the host. If the operator aborts the probe job

from the console, then the message sequence would be different.

Byte # Byte Comment

1-14 lll HSMS Header S2,F49




18 0x01 1 byte

19 0x00 DATAID=0




23 0x0A 5 bytes

24-28 lll “ABORT”




RCMD = “ABORT”

61


Comment Byte Byte #

HSMS Header for S2,F50 lll 1-14




1 byte 0x01 18






The receipt of the “ABORT” command terminates the “LOAD-WAFER” command.Therefore the event notification for the completion of the “LOAD-WAFER” command is sent.

Note: The COMMAND-COMPLETE event notification is not particularly enlighteningsince it does not signify the abnormal completion of a command.

Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21

CEID=COMMAND-COMPLETE lll 22-25



Remote Command “LOAD-WAFER” Complete


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21CEID=PROCESSING-STATE-

TRANSITION: 20lll

22-25



Transition to ABORTING inProcessing State Model


62


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


The prober unloads the product for the probe job. If the hard failure disables the chuck while a wafer ison the chuck, the operator is notified of the need to manually extract the wafer from the chuck.

Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21

CEID=JOB-STATE-TRANSITION:8 lll 22-25



Transition to JOB ABORTING inJob State Model


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


The operator acknowledges the completion of the abort process on the prober console

Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


lll22-25



Transition to the IDLE state inProcessing State Model


63


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21

CEID=JOB-STATE-TRANSITION:9 lll 22-25



Transition to the UNDEFINED state inProber Job State Model

(Prober Job State model ceases to exist)


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21




Remote Command “ABORT” complete


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


64


The alarm condition still exists so the prober automatically transitions to the IDLE with ALARMS state

Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21




Transition to IDLE with ALARMS state inProcessing State Model


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


22.9 Scenario 8: Irrecoverable Error – Resume After Correction

The purpose of this scenario is to demonstrate the behavior of the equipment when an alignmentfailure occurs. The operator interacts with the equipment to correct the alignment. Theequipment resumes operation when the alarm is cleared.






18 0x01 1 byte

19 0x00 DATAID=0




23 0x0A 10 bytes

24-33 �� “LOAD-WAFER”



S2,F49 �Enhanced Remote CommandRCMD = “LOAD-WAFER”

65


Comment Byte Byte #





1 byte 0x01 18






Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transition to LOADING WAFER stateIn Processing State Model


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Comment Byte Byte #





1 byte 0x01 18

ALCD=bits 5 & 8 0x90 19


1 byte 0x01 21

ALID �� 22


(1-40) bytes �� ??


ALCD=bits 8 & 5 (Irrecoverable error set)

Alarm Text �� ??

66


Byte # Byte Comment



16 0x01 1 byte


S5,F2 �

Alarm Report Acknowledge

Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transition to ALARM PAUSED inProcessing State Model


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


The operator checks the prober out and determines that an alignment failure has occurred.The operator interacts with the prober to clear the alarm condition.

Comment Byte Byte #





1 byte 0x01 18

ALCD=bits 5 0x10 19


1byte 0x01 21

ALID �� 22


(1-40) bytes �� ??


ALCD= bit 5 (Irrecoverable error cleared)

Alarm Text �� ??

Byte # Byte Comment



16 0x01 1 byte


S5,F2 �Alarm Report Acknowledge

67


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21

CEID=PROCESSING-STATE-TRANSITION: 14

��22-25



Transition to PAUSED inProcessing State Model


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


The operator issues the RESUME command when the alignment procedure is completed.A report could be linked to the OPERATOR-COMMAND-ISSUED event containing

the remote command issued. This is not shown in this scenario.

Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21

CEID=OPERATOR-COMMAND-ISSUED

��22-25



Operator Command Issued


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


68


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transition to the CHECKING state inProcessing State Model


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transition to the LOADING WAFER state inProcessing State Model


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


69


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21


��22-25



Transition the AWAITING COMMAND state inProcessing State Model


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21

CEID=COMMAND-COMPLETE �� 22-25



Remote command “LOAD-WAFER’ completed.


Byte # Byte Comment



16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


70


22.10 Scenario 9: Automatic Change in Wafer Sequence

This scenario demonstrates the messaging that results when the prober automatically removes awafer from a pipeline stage due to a non-recoverable fault with the wafer. The messaging willinform the host that the wafer sequencing has changed by issuing the RESEQUENCE-EVENTwith the RESEQUENCE-EVENT pre-defined report.

Load Port Pipeline Stage 1 Pipeline Stage 2 Pipeline Stage 3

(Next: Wafer Slot #20)

(Wafer Slot #16) (Wafer Slot #15) (Wafer Slot #12)

Pre-align FailureRe-sequence Required

Comment Byte Byte #





1 byte 0x01 18

DATAID=0 0x00 19


4 bytes 0x04 21

CEID=RESEQUENCE-EVENT �� 22-25



1st item: ASCII 1-length byte 0x41 28

13 bytes 0x0D 29

“PREALIGN FAIL” �� 30-42

2nd item: U1 1-length byte 0xA5 43

1 byte 0x01 44

Re-sequence stage: 3 0x03 45

3rd item: U1 1-length byte 0xA5 46

1 byte 0x01 47

Re-sequence wafer Slot #: 12 0x0C 48

4th item: U1 1-length byte 0xA5 49

1 byte 0x01 50

Backfill stage: 2 0x02 51


1 byte 0x01 53

Backfill wafer Slot #: 15 0x0F 54


1 byte 0x01 56


RESEQUENCE-EVENT

Next Load Port WaferSlot #: 20 0x14 57

Byte # Byte Comment1-14 �� HSMS Header for S6,F12


16 0x01 1 byte

17 0x00 ACKC6=0 (OK)


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Austin, TX 78741

http://www.sematech.orge-mail: [email protected]

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