product change notification€¦ · company confidential a printed copy of this document is...

Document No. 001-11769 Rev. *K Page 1 of 3

Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA 95134. Tel: (408) 943-2600

PRODUCT CHANGE NOTIFICATION

PCN: PCN181803 Date: May 01, 2018

Subject: Qualification of EME-G660B Mold Compound and Marketing Part Number Change for Select MM MCU Products at J-Devices To: PCN ALERTS MOUSER [email protected] Change Type: Major Description of Change: Cypress announces the qualification of EME-G660B mold compound for LQFP packages for select Mass Market MicroController Unit (MM MCU) products assembled at J-Devices. Motivation for these changes was described and pre-announced in Advance PCN 173705B. The present PCN corresponds to group GR10-A in the summary table contained in APCN 173705B. This mold compound is consistent with Cypress’s drive to Green and Pb-free RoHS compliant packages. In addition, this Green and Pb-free EME-G660B mold compound is compatible with industry standard reflow temperatures for applicable package volume, thickness and lead finish.

Material J-Devices Current BOM J-Devices New BOM

Mold Compound Hitachi Non JD Standard Epoxy CEL-9210H

Sumitomo JD Standard Epoxy EME-G660B

Leadframe Cu-alloy Cu-alloy

Die Attach Material Hitachi EN4600B Hitachi EN4600B

Bond Wire 20µm CuPdAu wire 20µm CuPdAu wire

In addition, the marketing part numbers will change from the MB prefix to the CY prefix. There may be some parts in GR10-A which will receive the mold compound change, but will not receive the SMIC Fab qualification; these parts will receive the SMIC Fab qualification in GR10-B. By the time the PCN for GR10-B is issued, all three changes will have been qualified for all 17 parts comprising that group.


Benefit of Change: The qualification of the standard J-Devices mold compound allows for an improvement in product reliability and product cycle time. Part Numbers Affected:17 See the attached ‘Affected Parts List’ file for a list of all part numbers affected by this change. Note that any new parts that are introduced after the publication of this PCN will include all changes outlined in this PCN. Qualification Status: The change has been qualified through a series of tests documented in Qualification Test Plans QTP#173409 and QTP#173410. The qualification reports can be found as attachments to this notification or by visiting www.cypress.com and typing the QTP number in the keyword search window. Sample Status: Qualification samples may not be built ahead of time for all part numbers affected by this change. Please review the attached ‘Affected Parts List’ file for a list of affected part numbers with their associated J-Devices Fukuoka and J-Devices Usuki sample ordering part numbers. Samples are available now unless there is an indication that the sample ordering part numbers are subject to lead times. If you require qualification samples, please contact your local Cypress sales representative as soon as possible, but no later than 30 days from the date of this PCN, to place any sample orders. Approximate Implementation Date: The sample requests will be available as of the date of this notification. The MB part numbers listed in attached file will be supported according to the Last Time Buy (LTB) and Last Time Ship (LTS) dates provided. Your Cypress Sales rep will be in touch with you during the LTB phase to manage the backlog transition from MB marketing part number to CY marketing part number, depending on inventory depletion level. Anticipated Impact: Products assembled are completely compatible with existing products from form, fit, functional, parametric, and quality performance perspectives. Cypress also recommends that customers take this opportunity to review these changes against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application. Method of Identification: Cypress maintains traceability of product to wafer level, including wafer fabrication location, through the lot number marked on the package. Response Required: No response is required. For additional information regarding this change, contact your local sales representative or contact the PCN Administrator at [email protected].

http://www.cypress.com/mailto:[email protected]


Sincerely, Cypress PCN Administration

Document No. 002-23518 Rev. *A ECN # : 6134156

Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.

Page 1 of 11

Cypress Semiconductor

Package Qualification Report

QTP# 173409, 162202 VERSION ** March, 2018

LQFP Package, Lead-Free, Cu-wire (CuPdAu), EME-G660B

J-Devices / Fukuoka

FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE

Prepared By: Hideho Taoka

Reviewed By: Kunihiro Miyazono

Reliability Engineer Reliability Manager

Approved By:

David Hoffman

Reliability Director

mailto:[email protected]



Page 2 of 11

PRODUCT QUALIFICATION HISTORY

QTP Number

Description of Qualification Purpose Date

173409 162202

Qualification of LQFP package with Cu-wire and EME-G660B Mold Compound at J-Devices Fukuoka

Mar., 2018



Page 3 of 11

PRODUCT DESCRIPTION (for qualification)

Qualification Purpose: Qualification of LQFP package with Cu-wire and EME-G660B Mold Compound at

J-Devices Fukuoka

Marketing Part #: MB91F592ASPMC-GSK5E1

Device Description: General purpose single-chip products with Flash

Cypress Division: Microcontroller and Connectivity Division

PACKAGE ASSEMBLY FACILITY SITE

208-pin LQFP J-DEVICES FUKUOKA

MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION

Package Designation: LQR 208

Package Outline, Type, or Name: 208-Low Profile Quad Flat Package

Mold Compound Name/Manufacturer: EME-G660B / SUMITOMO

Mold Compound Flammability Rating: V-0

Mold Compound Alpha Emission Rate: Alpha1:8, Alpha2:35

Lead Frame Material: Cu Alloy

Lead Finish, Composition / Thickness: Pure-Sn / 5 – 20 um

Die Backside Preparation Method/Metallization: Back Grind

Die Separation Method: Dicing

Die Attach Supplier: HITACHI

Die Attach Material: EN4600B

Bond Diagram Designation N/A

Wire Bond Method: Ultrasonic & Force

Wire Material/Size: CuPdAu / 20um (0.8mil)

Thermal Resistance Theta JA C/W: 32C/W

Package Cross Section Yes/No: Yes

Name/Location of Assembly (prime) facility: J-DEVICES FUKUOKA

MSL LEVEL 3

Reflow Profile 260℃

ELECTRICAL TEST / FINISH DESCRIPTION

Test Location: J-DEVICES FUKUOKA



Page 4 of 11



J-Devices Fukuoka

Marketing Part #: MB91F725RDPMC-GSK5E1






Package Designation: LQS144






Lead Finish, Composition / Thickness: Sn-Bi / 5 – 20 um





Bond Diagram Designation F09-HAS-BA-S03922-MLF-144LQV11-NW






MSL LEVEL 3



Test Location: J-DEVICES FKUOKA



Page 5 of 11



J-Devices FUKUOKA

Marketing Part #: S6J342AHVAEV20000






Package Designation: LQS 144

Package Outline, Type, or Name: 144- Low Profile Quad Flat Package










Bond Diagram Designation NA






MSL LEVEL 3



Test Location: J-DEVICES FUKUOKA



Page 6 of 11

RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS

Stress/Test Test Condition (Temp/Bias) Result P/F

High Temperature Operating Life Early Failure Rate

Dynamic Operating Condition, Max. rating Voltage,

125 ℃, JESD22-A108

P

High Temperature Operating Life Latent Failure Rate


125 ℃, JESD22-A108

P

High Accelerated Saturation Test (HAST)

JESD22-A110, 130℃, 85%RH, Max. rating Voltage, Precondition: JESD22-A113

P

Unbiased High Accelerated Saturation Test (UHST)

JESD22-A110, 130℃, 85%RH, Precondition: JESD22-A113

P

High Temperature Storage Life Test JESD22-A103, 150℃ P

Temperature Cycle JESD22- A104, -65℃ to +150℃ Precondition: JESD22-A113

P

Acoustic Microscopy

J-STD-020, AEC-Q006 Precondition: JESD22 Moisture Sensitivity Level 3

P

Wire Bond Pull Post TC, HAST MIL-STD-883 – Method 2011, AEC-Q006

P

Wire Bond Shear Post TC, HAST JESD22-B116A AEC-Q006

P

Cross-Section POST TC, HAST, HTSL

AEC-Q006 Meet external and internal characteristics of Cypress Package

P



Page 7 of 11

Reliability Test Data

QTP #:173409, 162202

Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism

STRESS : High Temperature Operation Life (Latent Failure Rate) MB91F725 3VC3569 1705-801 FUKUOKA 1000 77 0

MB91F725 3VC3569 1705-802 FUKUOKA 1000 77 0

MB91F725 3VC3569 1705-803 FUKUOKA 1000 77 0

S6J342 SWMCA 719ZZ117 FUKUOKA 1000 77 0

S6J342 SWLYG 719ZZ118 FUKUOKA 1000 77 0

S6J342 SWLYF 719ZZ118 FUKUOKA 1000 77 0

STRESS : High Temperature Operation Life (Early Failure Rate) S6J342 SWMCA 719ZZ117 FUKUOKA 96 800 0



STRESS : High Accelerated Saturation Test MB91F592 4K84282 1646-804 FUKUOKA 96 77 0

MB91F592 4K84282 1646-805 FUKUOKA 96 77 0

MB91F592 4K84282 1646-805 FUKUOKA 96 77 0

MB91F592 4K84282 1646-804 FUKUOKA 192 77 0

MB91F592 4K84282 1646-805 FUKUOKA 192 76 0

MB91F592 4K84282 1646-805 FUKUOKA 192 77 0

MB91F725 3VC3569 1705-801 FUKUOKA 192 77 0

MB91F725 3VC3569 1705-802 FUKUOKA 192 77 0

MB91F725 3VC3569 1705-803 FUKUOKA 192 77 0









Page 8 of 11


QTP #: 173409, 162202


STRESS : Unbiased High Accelerated Saturation Test MB91F592 4K84282 1646-804 FUKUOKA 96 77 0

MB91F592 4K84282 1646-805 FUKUOKA 96 77 0

MB91F592 4K84282 1646-806 FUKUOKA 96 77 0

MB91F725 3VC3569 1705-801 FUKUOKA 96 77 0

MB91F725 3VC3569 1705-802 FUKUOKA 96 77 0

MB91F725 3VC3569 1705-803 FUKUOKA 96 77 0




STRESS : High Temperature Storage Life Test MB91F592 4K84282 1646-805 FUKUOKA 2000 45 0

MB91F725 3VC3569 1705-801 FUKUOKA 2000 45 0







STRESS : Temperature Cycle MB91F592 4K84282 1646-804 FUKUOKA 1000 77 0

MB91F592 4K84282 1646-805 FUKUOKA 1000 77 0

MB91F592 4K84282 1646-806 FUKUOKA 1000 77 0

MB91F725 3VC3569 1705-801 FUKUOKA 1000 77 0

MB91F725 3VC3569 1705-802 FUKUOKA 1000 77 0

MB91F725 3VC3569 1705-803 FUKUOKA 1000 77 0









Page 9 of 11


QTP #: 173409, 162202


STRESS : Acoustic Microscopy (PRE-PC, POST-PC, POST-TC, POST-HAST) MB91F592 4K84282 1646-804 FUKUOKA - 22 0

MB91F592 4K84282 1646-805 FUKUOKA - 22 0

MB91F592 4K84282 1646-806 FUKUOKA - 22 0

MB91F725 3VC3569 1705-801 FUKUOKA - 22 0

MB91F725 3VC3569 1705-802 FUKUOKA - 22 0

MB91F725 3VC3569 1705-803 FUKUOKA - 22 0

STRESS : Wire Bond Pull Post TC MB91F592 4K84282 1646-804 FUKUOKA 1000 36 0

MB91F592 4K84282 1646-805 FUKUOKA 1000 36 0

MB91F592 4K84282 1646-806 FUKUOKA 1000 36 0

MB91F725 3VC3569 1705-801 FUKUOKA 1000 36 0

MB91F725 3VC3569 1705-802 FUKUOKA 1000 36 0

MB91F725 3VC3569 1705-803 FUKUOKA 1000 36 0

STRESS : Wire Bond Pull Post HAST MB91F592 4K84282 1646-804 FUKUOKA 192 36 0

MB91F592 4K84282 1646-805 FUKUOKA 192 36 0

MB91F592 4K84282 1646-806 FUKUOKA 192 36 0

MB91F725 3VC3569 1705-801 FUKUOKA 192 36 0

MB91F725 3VC3569 1705-802 FUKUOKA 192 36 0

MB91F725 3VC3569 1705-803 FUKUOKA 192 36 0

STRESS : Wire Bond Shear Post TC MB91F592 4K84282 1646-804 FUKUOKA 1000 36 0

MB91F592 4K84282 1646-805 FUKUOKA 1000 36 0

MB91F592 4K84282 1646-806 FUKUOKA 1000 36 0

MB91F725 3VC3569 1705-801 FUKUOKA 1000 36 0

MB91F725 3VC3569 1705-802 FUKUOKA 1000 36 0

MB91F725 3VC3569 1705-803 FUKUOKA 1000 36 0

STRESS : Wire Bond Shear Post HAST MB91F592 4K84282 1646-804 FUKUOKA 192 36 0

MB91F592 4K84282 1646-805 FUKUOKA 192 36 0

MB91F592 4K84282 1646-806 FUKUOKA 192 36 0

MB91F725 3VC3569 1705-801 FUKUOKA 192 36 0

MB91F725 3VC3569 1705-802 FUKUOKA 192 36 0

MB91F725 3VC3569 1705-803 FUKUOKA 192 36 0



Page 10 of 11


QTP #: 173409, 162202


STRESS : Cross-Section Post TC MB91F592 4K84282 1646-804 FUKUOKA 1000 1 0

MB91F592 4K84282 1646-805 FUKUOKA 1000 1 0

MB91F592 4K84282 1646-806 FUKUOKA 1000 1 0

MB91F725 3VC3569 1705-801 FUKUOKA 1000 1 0

MB91F725 3VC3569 1705-802 FUKUOKA 1000 1 0

MB91F725 3VC3569 1705-803 FUKUOKA 1000 1 0

STRESS : Cross-Section Post HAST MB91F592 4K84282 1646-804 FUKUOKA 192 1 0

MB91F592 4K84282 1646-805 FUKUOKA 192 1 0

MB91F592 4K84282 1646-806 FUKUOKA 192 1 0

MB91F725 3VC3569 1705-801 FUKUOKA 192 1 0

MB91F725 3VC3569 1705-802 FUKUOKA 192 1 0

MB91F725 3VC3569 1705-803 FUKUOKA 192 1 0

STRESS : Cross-Section Post HTSL MB91F592 4K84282 1646-804 FUKUOKA 2000 1 0

MB91F592 4K84282 1646-805 FUKUOKA 2000 1 0

MB91F592 4K84282 1646-806 FUKUOKA 2000 1 0

MB91F725 3VC3569 1705-801 FUKUOKA 2000 1 0

MB91F725 3VC3569 1705-802 FUKUOKA 2000 1 0

MB91F725 3VC3569 1705-803 FUKUOKA 2000 1 0


Document History Page

Document Title: QTP#173409 J-Devices Fukuoka Site LQFP Package with Cu-wire Qualification Report Document Number: 002-23518


Page 11 of 11

Rev. ECN No.

Orig. of Change

Description of Change

** 6115474 KUMI Initial Release

*A 6134156 KUMI Corrected Qualification purpose (added mold Compound)



Page 1 of 11

Cypress Semiconductor

Package Qualification Report

QTP# 173410, 161604 VERSION *A March, 2018

LQFP Package, Lead-Free, Cu-wire (CuPdAu), EME-G660B

J-Devices / Usuki

FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE

Prepared By:

Hideho Taoka Reviewed By:

Kunihiro Miyazono Reliability Engineer Reliability Manager

Approved By:

David Hoffman

Reliability Director



Page 2 of 11

PRODUCT QUALIFICATION HISTORY

QTP Number

Description of Qualification Purpose Date

161604 Qualification of LQFP package with Cu-wire and EME-G660B Mold Compound at J-Devices Usuki

Mar., 2018

173410 Qualification of LQFP package with Cu-wire and EME-G660B Mold Compound at J-Devices Usuki

Mar., 2018



Page 3 of 11



J-Devices Usuki

Marketing Part #: MB91F524KHBPMC1-GS-F4E1




144-pin LQFP J-DEVICES USUKI


Package Designation: LQN144











Bond Diagram Designation N/A



Thermal Resistance Theta JA °C/W: 46°C/W


Name/Location of Assembly (prime) facility: J-DEVICES USUKI

MSL LEVEL 3



Test Location: J-DEVICES USUKI



Page 4 of 11



J-Devices Usuki

Marketing Part #: MB91F526KSBPMC1-GSE1






Package Designation: LQN144






Lead Finish, Composition / Thickness: Sn-Bi / 5 – 20 um





Bond Diagram Designation F09-HAS-BA-S04223-MLF144LQS5






MSL LEVEL 3






Page 5 of 11



J-Devices Usuki

Marketing Part #: MB96F004RAPMC-GS-ERE2






Package Designation: LQM120











Bond Diagram Designation F09-HAS-BA-S04107-MLF120LQV61






MSL LEVEL 3






Page 6 of 11

RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS

Stress/Test Test Condition (Temp/Bias) Result P/F



125 ℃, JESD22-A108 P

High Temperature Operating Life Latent Failure Rate


125 ℃, JESD22-A108 P

High Accelerated Saturation Test (HAST)

JESD22-A110, 130℃, 85%RH, Max. rating Voltage, Precondition: JESD22-A113

P

Unbiased High Accelerated Saturation Test (UHST)

JESD22-A110, 130℃, 85%RH, Precondition: JESD22-A113

P

High Temperature Storage Life Test JESD22-A103, 150℃ P

Temperature Cycle JESD22- A104, -65℃ to +150℃ Precondition: JESD22-A113

P

Acoustic Microscopy

J-STD-020, AEC-Q006 Precondition: JESD22 Moisture Sensitivity Level 3

P

Wire Bond Pull Post TC, HAST MIL-STD-883 – Method 2011, AEC-Q006

P

Wire Bond Shear Post TC, HAST JESD22-B116A AEC-Q006

P

Cross-Section POST TC, HAST, HTSL

AEC-Q006 Meet external and internal characteristics of Cypress Package

P



Page 7 of 11

RELIABILITY FAILURE RATE SUMMARY

Stress/Test Device Tested/ Device Hours

# Fails

Activation Energy

Thermal AF3

Failure Rate


7,344 Devices 0 N/A N/A 0 PPM (1)

High Temperature Operating Life1,2 Long Term Failure Rate

1,341,000 DHRs 0 0.7 78 9 FIT (2)

1 Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C. 2 Chi-squared 60% estimations used to calculate the failure rate. 3 Thermal Acceleration Factor is calculated from the Arrhenius equation

AF = E

k 1

T

-1

T

A

2 1

exp

where:

EA =The Activation Energy of the defect mechanism. K = Boltzmann's constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions.



Page 8 of 11


QTP #:173410, 161604


STRESS : High Temperature Operation Life (Latent Failure Rate) MB91F524 4K 1502N01 J-DEVICES 1000 78 0

MB96F004 7G57336 1707N01 J-DEVICES 1000 77 0

MB96F004 7G57336 1707N02 J-DEVICES 1000 77 0

MB96F004 7G57336 1707N03 J-DEVICES 1000 77 0

STRESS : High Temperature Operation Life (Early Failure Rate) MB91F526 4K90173 1746-N01 J-DEVICES 96 832 0

MB91F526 4K91441 1746-N02 J-DEVICES 96 856 0

MB91F526 4K90173 1746-N03 J-DEVICES 96 851 0

STRESS : High Accelerated Saturation Test MB91F524 4K 1502N01 J-DEVICES 96 78 0

MB91F526 4K67725 1642N01 J-DEVICES 192 77 0

MB91F526 4K67725 1642N02 J-DEVICES 192 77 0

MB91F526 4K67725 1642N03 J-DEVICES 192 77 0

MB96F004 7G57336 1707N01 J-DEVICES 192 77 0

MB96F004 7G57336 1707N02 J-DEVICES 192 77 0

MB96F004 7G57336 1707N03 J-DEVICES 192 77 0

STRESS : Unbiased High Accelerated Saturation Test MB91F524 4K 1502N01 J-DEVICES 96 80 0

MB96F004 7G57336 1707N01 J-DEVICES 96 77 0

MB96F004 7G57336 1707N02 J-DEVICES 96 77 0

MB96F004 7G57336 1707N03 J-DEVICES 96 77 0

STRESS : High Temperature Storage Life Test MB91F524 4K 1502N01 J-DEVICES 1000 45 0

MB91F526 4K67725 1642N01 J-DEVICES 2000 45 0

MB91F526 4K67725 1642N02 J-DEVICES 2000 45 0

MB91F526 4K67725 1642N03 J-DEVICES 2000 45 0

MB96F004 7G57336 1707N01 J-DEVICES 2000 45 0



Page 9 of 11


QTP #: QTP #:173410, 161604


STRESS : Temperature Cycle MB91F524 4K 1502N01 J-DEVICES 500 80 0

MB91F526 4K67725 1642N01 J-DEVICES 1000 77 0

MB91F526 4K67725 1642N02 J-DEVICES 1000 77 0

MB91F526 4K67725 1642N03 J-DEVICES 1000 77 0

MB96F004 7G57336 1707N01 J-DEVICES 1000 77 0

MB96F004 7G57336 1707N02 J-DEVICES 1000 77 0

MB96F004 7G57336 1707N03 J-DEVICES 1000 77 0

STRESS : Acoustic Microscopy (PRE-PC, POST-PC, POST-TC, POST-HAST) MB91F526 4K67725 1642N01 J-DEVICES - 22 0

MB91F526 4K67725 1642N02 J-DEVICES - 22 0

MB91F526 4K67725 1642N03 J-DEVICES - 22 0

MB96F004 7G57336 1707N01 J-DEVICES - 22 0

MB96F004 7G57336 1707N02 J-DEVICES - 22 0

MB96F004 7G57336 170N03 J-DEVICES - 22 0

STRESS : Wire Bond Pull Post TC MB91F526 4K67725 1642N01 J-DEVICES 1000 36 0

MB91F526 4K67725 1642N02 J-DEVICES 1000 36 0

MB91F526 4K67725 1642N03 J-DEVICES 1000 36 0

MB96F004 7G57336 1707N01 J-DEVICES 1000 36 0

MB96F004 7G57336 1707N02 J-DEVICES 1000 36 0

MB96F004 7G57336 1707N03 J-DEVICES 1000 36 0

STRESS : Wire Bond Pull Post HAST MB91F526 4K67725 1642N01 J-DEVICES 192 36 0

MB91F526 4K67725 1642N02 J-DEVICES 192 36 0

MB91F526 4K67725 1642N03 J-DEVICES 192 36 0

MB96F004 7G57336 170N01 J-DEVICES 192 36 0

MB96F004 7G57336 1707N02 J-DEVICES 192 36 0

MB96F004 7G57336 1707N03 J-DEVICES 192 36 0



Page 10 of 11


QTP #: QTP #:173410, 161604


STRESS : Wire Bond Shear Post TC MB91F526 4K67725 1642N01 J-DEVICES 1000 36 0

MB91F526 4K67725 1642N02 J-DEVICES 1000 36 0

MB91F526 4K67725 1642N03 J-DEVICES 1000 36 0

MB96F004 7G57336 1707N01 J-DEVICES 1000 36 0

MB96F004 7G57336 1707N02 J-DEVICES 1000 36 0

MB96F004 7G57336 1707N03 J-DEVICES 1000 36 0

STRESS : Wire Bond Shear Post HAST MB91F526 4K90173 1642N01 J-DEVICES 192 36 0

MB91F526 4K91441 1642N02 J-DEVICES 192 36 0

MB91F526 4K90173 1642N03 J-DEVICES 192 36 0

MB96F004 7G57336 1707N01 J-DEVICES 192 36 0

MB96F004 7G57336 1707N02 J-DEVICES 192 36 0

MB96F004 7G57336 1707N03 J-DEVICES 192 36 0

STRESS : Cross-Section Post TC MB91F526 4K67725 1642N01 J-DEVICES 1000 1 0

MB91F526 4K67725 1642N02 J-DEVICES 1000 1 0

MB91F526 4K67725 1642N03 J-DEVICES 1000 1 0

MB96F004 7G57336 1707N01 J-DEVICES 1000 1 0

STRESS : Cross-Section Post HAST MB91F526 4K67725 1642N01 J-DEVICES 192 1 0

MB91F526 4K67725 1642N02 J-DEVICES 192 1 0

MB91F526 4K67725 1642N03 J-DEVICES 192 1 0

MB96F004 7G57336 1707N01 J-DEVICES 192 1 0

STRESS : Cross-Section Post HTSL MB91F526 4K67725 1642N01 J-DEVICES 1000 1 0

MB91F526 4K67725 1642N02 J-DEVICES 1000 1 0

MB91F526 4K67725 1642N03 J-DEVICES 1000 1 0

MB96F004 7G57336 1707N01 J-DEVICES 2000 1 0


Document History Page

Document Title: QTP#173410 J-Devices Usuki Site Cu-wire Qualification Report Document Number: 002-23247


Page 11 of 11

Rev. ECN No.

Orig. of Change

Description of Change

** 6089772 KUMI Initial Release

*A 6134098 KUMI Corrected Qualification purpose (added mold Compound), Wire material from Cu to CuPdAu, and added mil value.

Item Marketing Part Number New Part Number New Mold Compound Cu Wire Change Package Code Last Time Buy (LTB) Date Last Time Ship (LTS) Date

1 MB9BF116SPMC-GK7E1 CY9BF116SPMC-GK7E1 Mold N/A LQS144 31-Oct-18 29-Apr-19


3 MB9BF216SPMC-GE1 CY9BF216SPMC-GK7E1 Mold N/A LQS144 31-Oct-18 29-Apr-19


5 MB9BF218TPMC-GK7E1 CY9BF218TPMC-GK7E1 Mold N/A LQP176 31-Oct-18 29-Apr-19



8 MB9BF318TPMC-GE1 CY9BF318TPMC-GK7E1 Mold N/A LQP176 31-Oct-18 29-Apr-19









17 MB9BF618TPMC-GK7E1 CY9BF618TPMC-GK7E1 Mold N/A LQP176 31-Oct-18 29-Apr-19

product change notification€¦ · company confidential a printed copy of this document is...

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