product change notification (pcn) - mouser electronics › pcn › adlink_technology... · 5215...

5215 Hellyer Avenue #110, San Jose, CA 95138-1007

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6853781 1 OF 6

PRODUCT CHANGE NOTIFICATION (PCN)

Release Date: October 26th, 2018 Product Category: Express-IBR Models Affected: Express-IBR Series, Accessories and Semi-Custom Deriva�ves Purpose of No�fica�on: Product End of Lifecycle Status

Change of Lifecycle Status – End of Life Transi�on

In accordance with the Lifecycle Solu�onsSM program for ADLINK products, ADLINK announces that the product models listed in this no�fica�on and all its semi-custom deriva�ves are being transi�oned from Con�nued Availability to End of Life status. Affected by Intel’s Product Change No�fica�on (PCN, #116430-00) on August 18, 2018, Express-IBR Series, Accessories and Semi-Custom Deriva�ves will no longer be available for sale.

Material EOL: Descrip�on: Intel® BD82QM77 Pla�orm Controller Hub Manufacturer: Intel Product Code: BD82QM77 (QM77)



6853781 2 OF 6

List of Affected Models:

Model Description Recommended Successor Product(s)

Express-IBR-i7-R-3517UE

Extreme Rugged COM Express Type 6 module with Intel® Core™ i7-3517UE 1.7GHz 17W Dual Core CPU, two DDR3 ECC SODIMMs supported

Express-SLE Series COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)

Express-KLE Series COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 series and Intel® Xeon® Processors (formerly codename: Kaby Lake) *Please refer to product datasheets enclosed at the end of this PCN

Express-IBR-i3-R-3217UE

Extreme Rugged COM Express Type 6 module with Intel ® Core™ i3-3217UE 1.6GHz 17W Dual Cor two DDR3 ECC SODIMMs supported

Express-IBR-i7-R-3615QE

Extreme Rugged COM Express Type 6 module with Intel® Core™ i7-3615QE 2.3GHz 45W Quad Core CPU, two DDR3 ECC SODIMMs supported

Express-IBR- i7-R-3612QE

Extreme Rugged COM Express Type 6 module with Intel® Core™ i7-3612QE 2.1GHz 35W Quad Core CPU, two DDR3 ECC SODIMMs supported

Express-IBR-i7-R-3555LE

Extreme Rugged COM Express Type 6 module with Intel® Core™ i7-3555LE 2.5GHz 25W Dual Core CPU, two DDR3 ECC SODIMMs supported



6853781 3 OF 6

Express-IBR Functional Diagram:



6853781 4 OF 6

Express-SLE Functional Diagram:



6853781 5 OF 6

Express-KLE Functional Diagram:



6853781 6 OF 6

Key Dates: Last �me buy date: July 19th, 2019 Last �me ship date: June 12th, 2020

ADLINK will accept orders for Express-IBR product series un�l July 19th, 2019. Last �me ship date is June 12th, 2020. Orders for these products will be non-cancelable and non-returnable (NCNR) and dependent upon demand; these products may be subject to a minimum order quan�ty.

Customers of the Express-IBR product series are encouraged to migrate to Express-SLE product series or Express-KLE product series. Samples of the Express-SLE and Express-KLE are available immediately.

An important part of the Lifecycle Solu�ons program for ADLINK products is to provide customers with no�ce of any changes that might affect long-term product usage or availability. Except for circumstances requiring immediate changes, ADLINK normally provides a few months advance no�ce of changes that affect the form, fit, or func�on of the product. If you have any ques�ons or concerns about this no�ce, please contact your ADLINK sales representa�ve.

If you have technical ques�ons about this product no�fica�on, please contact your ADLINK Field Applica�ons Engineer directly. Otherwise, you can call ADLINK at 1-800-966-5200 or 408-360-0200. For online technical support, please visit our Ask an Expert page at h�p://askanexpert.adlinktech.com/AAE/Answers.aspx and click the tab labeled “Ask a Ques�on”.

http://askanexpert.adlinktech.com/AAE/Answers.aspx

of

3 PCN #116430 - 00

Product Change Notification

Change Notification #: 116430 - 00

Change Title: Select Intel® Platform Controller Hubs,

PCN 116430-00,

Product Discontinuance,

End of Life

Date of Publication: August 18, 2018

Key Characteristics of the Change: Product Discontinuance

Forecasted Key Milestones: Product Discontinuance Program Support Begins: August 18, 2018

Last Product Discontinuance Order Date: August 23, 2019

Orders for Discontinued Products Become Non-Cancelable: August 23, 2019

Last Product Discontinuance Shipment Date: February 21, 2020

Description of Change to the Customer: Intel will discontinue the manufacturing of select products listed in the "Products Affected/Intel Ordering Codes"

table below and the products will become unavailable for additional orders after August 23, 2019.

Customer Impact of Change and Recommended Action: Please determine your remaining demand for the products listed in the "Products Affected/Intel Ordering Codes"

table and place your "Last Product Discontinuance Order" in accordance with the "Key Milestones" listed above.

Functional Analysis Correlation Request (FA/CR) support for the products listed in the "Products Affected/Intel

Ordering Codes" table will follow standard FA/CR support timelines.

Please contact your Intel Field Sales Representative with any questions, requests or concerns.

Products Affected / Intel Ordering Codes: Marketing Name Product

Code

Platform Spec Code

MM#

Intel® BD82QM67 Platform Controller Hub BD82QM67 Mobile SLJ4M 914325

Intel® BD82HM65 Platform Controller Hub BD82HM65 Mobile SLJ4P 914377

Intel® BD82B65 Platform Controller Hub BD82B65 Desktop SLJ4A 914379

Intel® BD82H61 Platform Controller Hub BD82H61 Desktop SLJ4B 914380

Intel® BD82Q67 Platform Controller Hub BD82Q67 Desktop SLJ4D 914397

Intel® BD82C206 Platform Controller Hub BD82C206 Server SLJ4G 914417

of

3 PCN #116430 - 00

Intel® BD82QM77 Platform Controller Hub BD82QM77 Mobile SLJ8A 915663

Intel® BD82HM76 Platform Controller Hub BD82HM76 Mobile SLJ8E 915666

Intel® BD82Q77 Platform Controller Hub BD82Q77 Desktop SLJ83 915673

Intel® BD82B75 Platform Controller Hub BD82B75 Desktop SLJ85 915675

Intel® BD82C216 Platform Controller Hub BD82C216 Server SLJ8H 915680

PCN Revision History:

Date of Revision: Revision Number: Reason:

August 18, 2018 00 Originally Published PCN

of

3 PCN #116430 - 00

Product Change Notification

116430 - 00 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO

LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY

RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS

INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL

PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in

personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION

CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES,

SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH,

HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS'

FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL

INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR

NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF

THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the

absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future

definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to

deviate from published specifications. Current characterized errata are available on request.

Should you have any issues with the timeline or content of this change, please contact the Intel Representative(s) for

your geographic location listed below. No response from customers will be deemed as acceptance of the change and the

change will be implemented pursuant to the key milestones set forth in this attached PCN.

Americas Contact: [email protected]

Asia Pacific/PRC Contact: [email protected] Europe Email: [email protected]

Japan Email: [email protected]

Copyright © Intel Corporation 2018. Other names and brands may be claimed as the property of others.

3D XPoint, Axxia, Basis, Basis Peak, BlueMoon, BunnyPeople, Celeron, Centrino, Cilk, Curie, Flexpipe, Intel, the Intel logo, Intel

Atom, Intel CoFluent, Intel Core, Intel. Experience What's Inside, the Intel. Experience What's Inside logo, Intel Inside, the Intel

Inside logo, Intel Insider, Intel Joule, Intel RealSense, Intel SingleDriver, Intel SpeedStep, Intel Unite, Intel vPro, Intel Xeon Phi, Intel

XScale, InTru, the InTru logo, the InTru Inside logo, InTru soundmark, Iris, Itanium, MCS, MMX, Optane, Ostro, Pali, Pentium,

picoArray, Picochip, picoXcell, Puma, Quark, SMARTi, Soletta, Sound Mark, StarPro, Stay With It, the Engineering Stay With It

logo, StreamSight, Tarari, The Journey Inside, Thunderbolt, the Thunderbolt logo, Transcede, True Key, Ultrabook, VTune, Xeon,

X-GOLD, XMM, X-PMU and XPOSYS are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.

Microsoft, Windows, and the Windows logo are trademarks, or registered trademarks of Microsoft Corporation in the United States

and/or other countries. Java is a registered trademark of Oracle and/or its affiliates. Bluetooth is a trademark owned by its proprietor

and used by Intel Corporation under license. Intel Corporation uses the Palm OS* Ready mark under license from Palm, Inc.

OpenCL and the OpenCL logo are trademarks of Apple Inc. used by permission by Khronos.

Learn how to use Intel Trademarks and Brands correctly at http://www.intel.com/intel/legal/tmusage2.htm.

mailto:[email protected]




http://www.intel.com/intel/legal/tmusage2.htm

Express-SL/SLECOM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Intel® Xeon® and Celeron® Processor

Features● 6th Gen Intel® Core™, Intel® Xeon® and Celeron® Processor● Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz

(supports both ECC and non-ECC memory)● 3x DDI channels, 1x LVDS (or 4 lanes eDP)

supports up to 3 independent displays● 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)● GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0● Supports Smart Embedded Management Agent (SEMA®) functions● Extreme Rugged operating temperature: -40°C to +85°C (build option)

New

Specifications● Core System

CPU Mobile Intel® Xeon®, Core™ and Celeron® Processors - 14nmXeon® E3-1515M v5 2.8/3.7GHz (Turbo), 45W (4C/GT4e)Xeon® E3-1505M v5 2.8/3.7GHz (Turbo), 45W (4C/GT2)Xeon® E3-1505L v5 2.0/2.8GHz (Turbo), 25W (4C/GT2)Core™ i7-6820EQ 2.8/3.5GHz (Turbo), 45W (4C/GT2)Core™ i7-6822EQ 2.0/2.8GHz (Turbo), 25W (4C/GT2)Core™ i5-6440EQ 2.7/3.4GHz (Turbo), 45W (4C/GT2)Core™ i5-6442EQ 1.9/2.7GHz (Turbo), 25W (4C/GT2)Core™ i3-6100E 2.7GHz (no Turbo), 35W (2C/GT2)Core™ i3-6102E 1.9GHz (no Turbo), 25W (2C/GT2)Celeron® G3900E 2.4GHz (no Turbo), 35W (2C/GT1)Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. Note: Availability of the features may vary between processor SKUs.

Memory Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM sockets (ECC/non-ECC support dependent on selected CPU/PCH)

Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11.0 support

Cache 8MB for Xeon® and Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3, 2MB for Celeron®

PCH CM236 (supports ECC memory, Intel® AMT)QM170 (supports non-ECC, Intel® AMT)HM170 (supports non-ECC, no Intel® AMT support)

Expansion Busses PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/52 PCI Express x2 (Gen3): CD connector, Lanes 6/7LPC bus, SMBus (system) , I2C (user)

Debug Headers 40-pin flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs60-pin XDP header for ICE debug of CPU/chipset

● VideoGPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs

Hardware encode/transcode HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support

Digital Display InterfaceDDI1/2/3 supporting DisplayPort/HDMI/DVI

LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC

eDP 4 lane support optional, in place of LVDS

● AudioChipset Intel® HD Audio integrated in chipset

Audio Codec located on carrier Express-BASE6 (ALC886 standard supported)

● EthernetIntel® MAC/PHY: i219LM/V (LM with AMT 11.0 support)Interface: 10/100/1000 GbE connection

Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications● I/O Interfaces

USB: 4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7)SATA: Four ports SATA 6Gb/s (SATA0,1,2,3) Serial: 2 UART ports with console redirectionGPIO: 4 GPO and 4 GPI

● Super I/OSupported on carrier if needed (standard support for W83627DHG-P)

● TPMChipset: Atmel AT97SC3204Type: TPM1.2/2.0 (TPM 2.0 support with project basis)

● PowerStandard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5 ~20V (Standard temp. only)Management: ACPI 5.0 compliant, Smart Battery supportPower States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)ECO mode: Supports deep S5 mode for power saving

● Operating SystemsStandard SupportWindows 10/8.1 64-bit, Windows 7 32/64-bit, Linux 64-bit, VxWorks

Extended Support (BSP) WES 7 32/64-bit, Linux 64-bit, VxWorks

● Mechanical and EnvironmentalForm Factor: PICMG COM.0, Rev 2.1 Type 6Dimension: Basic size, 125 mm x 95 mm

Operating TemperatureStandard: 0°C to 60°CExtreme Ruggeed: -40°C to +85°C (build option for Core™ & Celeron® 25W TDP SKUs)

Humidity5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)

Shock and VibrationIEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

HALTThermal Stress, Vibration Stress, Thermal Shock and Combined Test

● Intelligent MiddlewareSEMA®

Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM)


Mobile Intel® Xeon®

6th Gen Intel® Core™i7/i5/i3 Processor

Intel® Celeron®

Processor

(formerly “Skylake-H”)

LM73Sensor

eDP - LVDS

TPM

Mobile Intel®

QM170/HM170/CM236Chipset

LANI219

GPIO

GP I2C

SPI 0BIOS

LPC bus

SODIMM 11867/2133 MHz4-16 GB DDR4

PCIe x16 (Gen3)2 x8 or 1 x8 + 2 x4

SPI

UM

I

Debugheader

PCIe x1

HD Audio

4x SATA 6Gb/s(port 0/1/2/3)

8x USB 2.0

4x USB 3.0 (port 0/1/2/3)UART0/1

SPI 1BIOS

DDC I2C


2x PCIe x1 (Gen3)(port 6/7)

SPI_CS#

DDI 1DP/HDMI/DVI

DDI 2 DP/HDMI/DVI

DDI 3DP/HDMI/DVIsingle/dual

18/24 bit LVDS

6x PCIex1 (Gen3)(port 0-5)

NewSEMABMC

eDP x4 lanes (optional)

XDP60

SMBus

4x GPO, 4x GPI

SMBus

LPC toUART

Functional Diagram

Express-KL/KLECOM Express Basic Size Type 6 Module with 7th Gen Intel® Core™, Intel® Xeon® Processor

Features● 7th Gen Intel® Core™, Intel® Xeon® Processor● Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz

(supports both ECC and non-ECC memory)● 3x DDI channels, 1x LVDS (or 4 lanes eDP)

supports up to 3 independent displays● 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)● GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0● Supports Smart Embedded Management Agent (SEMA®) functions● Extreme Rugged operating temperature: -40°C to +85°C (build option)

Specifications● Core System

CPU Mobile Intel® Xeon®, Core™ Processors - 14nmXeon® E3-1505M v6 3.0/4.0GHz (Turbo), 45W (4C/GT2)Xeon® E3-1505L v6 2.2/3.0GHz (Turbo), 25W (4C/GT2)Core™ i7-7820EQ 3.0/3.7GHz (Turbo), 45W (4C/GT2)Core™ i5-7440EQ 2.9/3.6GHz (Turbo), 45W (4C/GT2)Core™ i5-7442EQ 2.1/2.9GHz (Turbo), 25W (4C/GT2)Core™ i3-7100E 2.9GHz (no Turbo), 35W (2C/GT2)Core™i3-7102E 2.1GHz (no Turbo), 25W (2C/GT2)Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. Note: Availability of the features may vary between processor SKUs.

Memory Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM sockets (ECC/non-ECC support dependent on selected CPU/PCH)

Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11.6 support

Cache 8MB for Xeon® and Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3

PCH CM238 (supports ECC memory, Intel AMT)QM175 (supports non-ECC, Intel AMT)HM175 (supports non-ECC, no Intel AMT support)

Expansion Busses PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/52 PCI Express x2 (Gen3): CD connector, Lanes 6/7LPC bus, SMBus (system) , I2C (user)

Debug Headers 40-pin flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs60-pin XDP header for ICE debug of CPU/chipset

● VideoGPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs

Hardware encode/transcode HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support

Digital Display InterfaceDDI1/2/3 supporting DisplayPort/HDMI/DVI

LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC

eDP 4 lane support optional, in place of LVDS

● AudioChipset Intel® HD Audio integrated in chipset

Audio Codec located on carrier Express-BASE6 (ALC886 standard supported)

● EthernetIntel® MAC/PHY: i219LM/V (LM with AMT 11.0 support)Interface: 10/100/1000 GbE connection


Specifications● I/O Interfaces

USB: 4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7)SATA: Four ports SATA 6Gb/s (SATA0,1,2,3) Serial: 2 UART ports with console redirectionGPIO: 4 GPO and 4 GPI

● Super I/OSupported on carrier if needed (standard support for W83627DHG-P)

● TPMChipset: InfineonType: TPM 2.0

● PowerStandard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5 ~20V (Standard temp. only)Management: ACPI 5.0 compliant, Smart Battery supportPower States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)ECO mode: Supports deep S5 mode for power saving

● Operating SystemsStandard SupportWindows 10 64-bit, Linux 64-bit, VxWorks

Extended Support (BSP) Linux 64-bit, VxWorks

● Mechanical and EnvironmentalForm Factor: PICMG COM.0, Rev 2.1 Type 6Dimension: Basic size, 125 mm x 95 mm

Operating TemperatureStandard: 0°C to 60°CExtreme Ruggeed: -40°C to +85°C (build option for 25W TDP SKUs)

Humidity5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)

Shock and VibrationIEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

HALTThermal Stress, Vibration Stress, Thermal Shock and Combined Test

● Intelligent MiddlewareSEMA®

Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM)


Functional Diagram

Mobile 7th GenIntel® Xeon®

Intel® Core™i7/i5/i3 Processor

(formerly “Kaby Lake-H”)

LM73Sensor

eDP - LVDS

TPM

Mobile Intel®

QM175/HM175/CM238Chipset

LANI219

GPIO

GP I2C

SPI 0BIOS

LPC bus


PCIe x16 (Gen3)2 x8 or 1 x8 + 2 x4

SPI

UM

I

Debugheader

PCIe x1

HD Audio

4x SATA 6Gb/s(port 0/1/2/3)

8x USB 2.0

4x USB 3.0 (port 0/1/2/3)UART0/1

SPI 1BIOS

DDC I2C


2x PCIe x1 (Gen3)(port 6/7)

SPI_CS#

DDI 1DP/HDMI/DVI

DDI 2 DP/HDMI/DVI

DDI 3DP/HDMI/DVIsingle/dual

18/24 bit LVDS

6x PCIex1 (Gen3)(port 0-5)

NewSEMABMC

eDP x4 lanes (optional)

XDP60

SMBus

4x GPO, 4x GPI

SMBus

LPC toUART

www.adlinktech.comAll products and company name listed are trademarks or trade names of their respective companies.

Updated Jun. 07, 2018. ©2018 ADLINK Technology, Inc. All Rights Reserved.All specifications are subject to change without further notice.

Ordering Information● Express-KLE-E3-1505M v6

Basic Size COM Express® Type 6 module with Intel® Xeon® E3-1505M v6 and GT2 level graphics, CM238 chipset

● Express-KLE-E3-1505L v6 Basic Size COM Express® Type 6 module with Intel® Xeon® E3-1505M v6 and GT2 level graphics, CM238 chipset

● Express-KL-i7-7820EQ Basic Size COM Express® Type 6 module with Intel® Core™ i7-7820EQ and GT2 level graphics, QM175 chipset

● Express-KL-i5-7440EQBasic Size COM Express® Type 6 module with Intel® Core™ i5-7440EQ and GT2 level graphics, QM175 chipset

● Express-KL-i5-7442EQBasic Size COM Express® Type 6 module with Intel® Core™ i5-7442EQ and GT2 level graphics, QM175 chipset

● Express-KL-i3-7100E Basic Size COM Express® Type 6 module with Intel® Core™ i3-7100E and GT2 level graphics, HM175 chipset

● Express-KL-i3-7102E Basic Size COM Express® Type 6 module with Intel® Core™ i3-7102E and GT2 level graphics, HM175 chipset

AccessoriesHeat Spreaders

● HTS-SL-BHeatspreader for Express-SL with threaded standoffs for bottom mounting

● HTS-SL-BT Heatspreader for Express-SL with through hole standoffs for top mounting

Passive Heatsinks

● THS-SL-BLLow profile heatsink for Express-SL with threaded standoffs for bottom mounting

● THS-SL-BT Low profile heatsink for Express-SL with through hole standoffs for top mounting

● THSH-SL-BLHigh profile heatsink for Express-SL with threaded standoffs for top mounting

Active Heatsink

● THSF-SL-BLHigh profile heatsink with Fan for Express-KL with threaded standoffs for bottom mounting

Starter Kit● Starterkit-COM Express 6 PLUS

COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit

www.adlinktech.comAll products and company name listed are trademarks or trade names of their respective companies.

Updated Feb. 08, 2018. ©2018 ADLINK Technology, Inc. All Rights Reserved.All specifications are subject to change without further notice.

Ordering Information● Express-SLE-E3-1515M v5

Basic COM Express Type 6 module with Intel® Xeon® E3-1515M v5 and GT4e level graphics, CM236 chipset, support ECC

● Express-SLE-E3-1505M v5 Basic COM Express Type 6 module with Intel® Xeon® E3-1505M v5 and GT2 level graphics, CM236 chipset, support ECC

● Express-SLE-E3-1505L v5 Basic COM Express Type 6 module with Intel® Xeon® E3-1505L v5 and GT2 level graphics, CM236 chipset, support ECC

● Express-SL-i7-6820EQBasic COM Express Type 6 module with Intel® Core™ i7-6820EQ and GT2 level graphics, QM170 chipset

● Express-SL-i7-6822EQBasic COM Express Type 6 module with Intel® Core™ i7-6822EQ, and GT2 level graphics, QM170 chipset

● Express-SL-i5-6440EQ Basic COM Express Type 6 module with Intel® Core™ i5-6440EQ and GT2 level graphics, QM170 chipset

● Express-SL-i5-6442EQ Basic COM Express Type 6 module with Intel® Core™ i5-6442EQ and GT2 level graphics, QM170 chipset

● Express-SL-i3-6100EBasic COM Express Type 6 module with Intel® Core™ i3-6100E and GT2 level graphics, HM170 chipset

● Express-SL-i3-6102EBasic COM Express Type 6 module with Intel® Core™ i3-6102E and GT2 level graphics, HM170 chipset

● Express-SL-G3900E Basic COM Express Type 6 module with Intel® Celeron® G3900E and GT1 level graphics, HM170 chipset

AccessoriesHeat Spreaders

● HTS-SL-BHeatspreader for Express-SL with threaded standoffs for bottom mounting

● HTS-SL-BT Heatspreader for Express-SL with through hole standoffs for top mounting

Passive Heatsinks

● THS-SL-BLLow profile heatsink for Express-SL with threaded standoffs for bottom mounting

● THS-SL-BT Low profile heatsink for Express-SL with through hole standoffs for top mounting

● THSH-SL-BLHigh profile heatsink for Express-SL with threaded standoffs for bottom mounting

Active Heatsink

● THSF-SL-BL High profile heatsink with fan for Express-SL with threaded standoffs for bottom mounting

Starter Kit● Starterkit-COM Express 6 PLUS

COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit

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