product end-of-life disassembly instructionsh22235. · 2008. 8. 22. · description #1...

EL-MF877-00 Template Revision A

Product End-of-Life Disassembly InstructionsProduct Category: Notebooks and Tablet PCs

Marketing Name / Model[List multiple models if applicable.]

HP Compaq 2230s

Name / Model #2

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructionsfor the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EUdirective 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, asapplicable.

Item Description Notes

Quantityof itemsincludedin product

Printed Circuit Boards (PCB) or Printed CircuitAssemblies (PCA)

With a surface greater than 10 sq cm 3

Batteries All types including standard alkaline and lithium coinor button style batteries

2

Mercury-containing components For example, mercury in lamps, display backlights,scanner lamps, switches, batteries

1

Liquid Crystal Displays (LCD) with a surface greaterthan 100 sq cm

Includes background illuminated displays with gasdischarge lamps

1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuringgreater than 2.5 cm in diameter or height

0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants 0

Components and parts containing toner and ink,including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, ventchambers, and service stations.

0

Components and waste containing asbestos 0

Components, parts and materials containingrefractory ceramic fibers

0

Components, parts and materials containingradioactive substances

0

EL-MF877-00 Template Revision A

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where componentsand materials requiring selective treatment can be removed.

Tool Description Tool Size (ifapplicable)

Description #1 Motor-screw-driver “+”Cross headof screwdriver

Description #2 Motor-screw-driver “*”TORX T8(2.31mm)

Description #3 Motor-screw-driver “-”

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Follow steps described in Disassembly instruction (file attached).2. If parts can be removed without using a tool, remove it first.3. Use correct screwdriver and torque value before unlock the screw.4.5. .6.7.8.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the itemscontained in the product that require selective treatment (with descriptions and arrows identifying locations).

MANUFACTURING PROCESS INSTRUCTIONSMECHANICAL ASSEMBLY

MODEL : HangZhou

Audit： Tabulator：

2.00

Station Version Station Version Station Version Station Version Station Version Station Version

1 2.00 9 2.00 17 2.00 25 2.00 33 2.00

2 2.00 10 2.00 18 2.00 26 2.00 34 2.01

3 2.00 11 2.00 19 2.00 27 2.00 35 2.00

4 2.00 12 2.00 20 2.00 28 2.01 36 2.00

5 2.00 13 2.00 21 2.00 29 2.00

6 2.00 14 2.00 22 2.00 30 2.00

7 2.00 15 2.00 23 2.00 31 2.02

8 2.00 16 2.00 24 2.00 32 2.00

Station Ver.

ALL 1.**

31 1.01

ALL 2.**

28 2.01

31 2.02

34 2.01

Add points for attention Xiao Dongxu

Cancel operation content Xiao Dongxu

2008/7/10 Revise operation content Zhang Xiaoyan

2008/7/16 Add operation content Xiao Dongxu

2008/6/25 First SOP Zhang Xiaoyan

2008/7/7 Modify Part No. Zhang Xiaoyan

A.Current station version list:

B.Version Modify list:

Date Content Design

Written by: Zhang Xiaoyan Revision:

Date: 2008/7/16 Page: 1 of 40

Sub-assembly name: SOP HANGZHOU 1.0 FA PRE-ASS’Y

Document No.: SOP HANGZHOU 1.0 FA PRE-ASS’Y

Zhang Ying

Notes ︰if finding anything uncommon, notice gaffer or assistance at once.

Working Instruction

Document No. : SOP HANGZHOU 1.0 FA PRE-ASS’Y Station :

Name: Ver. : Date :

Fixture list (Fixture standard) Qty Fixture list (Fixture standard) Qty

Step：

Tabulator: Zhang Ying Issuing department: IE

Visual inspecting

1(1/1)

1. Take out M/B from Bubble bag andhave cosmetic inspection, check ifsome mylar were missing to stick or ifsome component were wrong assembly.

2. Pack up bubble bag.

When taking and fetching M/B, takecare to hold the two long sides of M/B

with both hands.

2.00 2008/07/10

Fig.1

Fig.2


Working Instruction


Name: Ver. : Date :


Step：


FIS-M/B Shipping Label

Operate sequentially according to step, Print CT LABEL.

1.Scan 12 codes indicating model, M/B SNO, ECR

2.Pringt M/B CT LABEL.

3.Tear TEST LABEL on MB and stick it on process card.

4.Tear M/B S/N Label and stick it on process card.

After placing M/B on the table, tear the label with both hands.

※ operation order : DCODE →VER→MB SNO→ECR, if disarraying this order, system will give out a notice.※ VERSION must be two codes, otherwise system will give out a notice.

Notebook 1

Scanner 1

Barcode printer 1

2(1/1)

1

FA1AM9000000011

MACCT.BAT

2

3

4

2.00 2008/07/10


Working Instruction


Name: Ver. : Date :


Step：


1.Stick Shipping Label on M/B.

2.SCAN M/B S/N of process card,

LABEL & PRODUCT ID&FA-ECR

3.Take out Modem from Kitting box,

tear Modem CT label and stick it

onto Modem itself.

Board input

Notebook 1

Scanner 1

3

3(1/1)

2.00 2008/07/10


Working Instruction


Name: Ver. : Date :


Step：


assemble CPU

1. Put M/B on B-Side supporting fixture, suck

CPU with vacuum suck pen and assemble it on

M/B, tighten CPU screws with Flat screw driver.

Care the orientation when inserting CPU , pay

attention to the position of small triangle (Fig.1).

CPU must be inserted completely and seem

level after assembling.

The indicator on SOCKET must be rotated

from right-hand OPEN to left-hand CLOSED.

(Fig.2).

2. Put M/B B-side on the line with its face up.

4(1/1)

B side supporting fixture 1

Flat screw driver 1

Vacuum suck pen 1

Fig.1

Fig.2

2.00 2008/07/10


Working Instruction


Name: Ver. : Date :


Step：


assemble Thermal

1. Put M/B on B-Side supporting fixture.(Fig.1).

2. Take Thermal Module (6043B0050101)

and assemble it. (Fig.2). Check whether

the protecting membrane of heat paste hasbeen torn or not.

3. Tighten screws sequentially (SET) * 4. (Fig.2).

Torsion：2.0 ± 0.5 kgf．cm

Screws can't be stripped.

Screws can't be crooked when tightening.


5(1/1)

B side Supporting fixture 1

Automatic crossing screw driver 1

Kitting Box 1

1

2

4

3

Fig.1

Fig.2

2.00 2008/07/10


Working Instruction


Name: Ver. : Date :


Step：


Insert RJ11 cable(6017B0128201) intoModem and put it on line.

Take Bluetooth.

Insert Bluetooth Cable(6017B0127101) intoBluetooth and put it on line.

Insert Modem and Bluetooth cable

6(1/1)

Kitting Box 1

Fig.1

Fig.2

Fig.3

2.00 2008/07/10


Working Instruction


Name: Ver. : Date :


Step：


1. Put M/B on B-Side supporting fixture..

2. Assemble Modem onto M/B.(Fig.2).

3. Tighten screws of Modem sequentially.(6052B0089301) * 2

Torsion：1.5 ± 0.5 kgf．cm

When tightening the first screw, press lower-

right side of Modem lightly in order to connect

MODEM and M/B CNTR completely.

Screws can't be stripped.

Screws can't be crooked when tightening.

4. Trim Modem Cable, and stick acetic acidtape(6054A0076201) to fasten it ontoMB(Fig.3).


assemble Modem

7(1/1)

B side Supporting fixture 1

Automatic crossing screw driver 1

Kitting Box 1

1

2

Fig.1

Fig.2

Fig.3

2.00 2008/07/10

product end-of-life disassembly instructionsh22235. · 2008. 8. 22. · description #1...

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