product end-of-life disassembly instructions - hewlett packardh22235. · hp z640 workstation...

Product End-of-Life Disassembly Instructions Product Category: Workstations

Marketing Name / Model [List multiple models if applicable.] HP Z640 Workstation Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sqcm Yes

5

Batteries All types including standard alkaline and lithium coin or button style batteriesYes

1

Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Includes background illuminated displays with gas discharge lamps

Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height

Denali 925w PSU 2

External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardantsweighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)

Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent chambers, and service stations.

EL-MF877-00 Template Revision B

PSG instructions for this template are available at EL-MF877-01

http://standards.corp.hp.com/elclass/AMF87701.htm

Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers

Components, parts and materials containing radioactive substances

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if

applicable) Screwdriver T-15 Micro shear 170II Solder iron Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove/disengage any security devices that prohibit opening the workstation. 2. Disconnect the power cord from the electrical outlet and then from the workstation. 3. Disconnect all peripheral device cables from the workstation. 4. Remove the access panel.(see Figure 1 below) 5. Disconnect SATA/FUI cables from the MB.(see Figure 2-4 below) 6. Disconnect other power cables from the MB.(see Figure 5-8 below) 7. RemoveODD SATA cables from the chassis.(see Figure 9-10 below) 8. Remove HDD/ODD/GFX from chassis.(see Figure 11-16 below) 9. Remove the heatsink from MB.(see Figure17-18 below) 10. Separate the fan from CPU heatsink.（see Figure 19-20 below） 11. Remove the CPU/MEM from MB（see Figure 21-24 below） 12. Remove MB from chassis（see Figure 25-26 below） 13. Remove front and rear system fan from chassis（see Figure 27-32 below） 14. Remove PSU from chassis（see Figure 33-34 below） 15. Remove FIO cables and FIO assembly from chassis（see Figure 35-40 below） 16. Remove PSU cables from chassis（see Figure 41-46 below） 17. Remove front and rear handle（see Figure 47-50 below） 18. Remove top panel and front upper vent.（see Figure 51-52 below） 19. Remove PSU cover.(see Figure 53-56 below) 20. Disconnect all the cables and remove the Electrolytic Capacitors.(see Figure 57-59 below) 21. Dispose of all removed components according to regulatory requirements.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).




Figure1 Remove the Access Panel

Figure2 Disconnect HDD SATA cables from MB

Figure3Disconnect ODD SATA cable from MB

Figure4 Disconnect the FIO cables(USB3.0/FUI/Audio cable) from MB

Figure5 Disconnect MB power cable from MB

Figure6 Disconnect MEM and CPU power cables from MB




Figure7 Disconnect front system fan cable from MB

Figure8 Disconnect rear system fan cable from MB

Figure9 Disconnect SATA cable from ODD

Figure10 Remove the ODD SATA cables from clips

Figure11 Press the HDD’s latch on HDD cage

Figure12 Remove the HDD from cage




Figure13 Lift the ODD’s latch on ODD cage

Figure14 Remove the ODD/Blank from cage

Figure15 Loose the PCIE retainer

Figure16 Remove the graphic card from MB

Figure17 Disconnect CPU Heatsink power cable from MB

Figure18 Loose the 4 screws and remove Heat sink




Figur19 Loose the 4 Heatsink screws

Figure20 Separate the fan from heatsink and fan guard

Figure21 Rotate the ILM handle and open it up

Figure22 Remove the CPU from the board

Figure23 Remove the Memory from the board

Figure24 Press the latch(red mark) and Remove the battery from MB




Figure25 Rotate the MB clip

Figure26 Remove MB from chassis

Figure27 Remove graphic card power cable from front system fan housing

Figure28 Press the front system fan latch on fan guard and remove it

Figure29 Press the 3 latch to Separate the fan from front fan housing

Figure30 Separate the front system fan from fan guard




Figure31 Loose the screw of rear system fan and remove it

Figure32 Press the 4 latch Separate the rear system fan from fan guard

Figure33 Disconnect the power cables(M1,G3,R3) from PSU

Figure34 Rotate the PSU handle and lift the PSU

Figure35 Remove the speaker cable from clip

Figure36 Disconnect the speaker cable




Figure37 Disconnect the FIO cable from FIO PCA

Figure38 Cut the FIO cable tie

Figure39 Remove the front panel

Figure40 Loose the screw and remove the FIO assembly

Figure41 Loose the screw of chassis bottom left and right trim foot

Figure42 Remove the left and right foot from chassis




Figure43 Loose the 2 screws of side panel

Figure44 Slide and remove the side panel

Figure45 Cut 4 cable tie on the chassis bottom

Figure46 Remove the cables

Figure47 Loose the screw of chassis front handle

Figure48 Remove the front handle




Figure49 Loose the screw of chassis rear handle

Figure50 Remove the rear handle

Figure51 Push and remove the top Panel

Figure52 Remove front upper vents

Figure53 Remove 5 screws from PSU side top

Figure54 Remove 4 screws from PSU side bottom




Figure55 Remove 3 screws from PSU side left

Figure56 Pull the side-cover out, then open covers away

Figure57 Cut 2 ties from inner wire (blue mark) then remove 4 screws from main-PCB then removes the main-PCB and house-keeping-PCB

Figure58 Remove 2 connectors (blue mark) then remove 4screws (red mark) then remove the EMI-PCB

Figure59 Remove the big capacitors (C3,C4height>2.5cm) from EMI-PCB using solder iron




product end-of-life disassembly instructions - hewlett packardh22235. · hp z640 workstation...

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