product management wirebonding webinar 2018 - we-online.com€¦ · process produktmanagement...
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www.we-online.com
Product Management Wirebonding
Webinar 2018
www.we-online.com
Latest News
Wirebonding Process
Advantages
Wirebonding Applications
Agenda
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 2
Latest NewsAcquisition of B&F Bonding GmbH
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 3
History
since 1991 in Schopfheim, emerged from
engineering office Brombacher, which was
founded in 1982
Activities
Service provider for production of Wirebonded
modules, with Gold or Aluminium wire on PCBs
or other substrates
Products
Electronic devices for medical, sensoric or
industrial applications
Property only 2 km away from our WE CBT
location in Schopfheim / 220 m2 effective area,
rented since 2008, expandable to 400 m2,
Reason for Selling
Retirement of Mr. Brombacher
Process
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 4
Bare Die Pickup
Bare Die Placement
Wirebonding (Diameter 25µm)
Wafer Waffle or Gel Pak
Glue Dispensing Positioning Placement
Gold wire Aluminium wire
Aluminium wirebonding
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 5
Gold wirebonding
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 6
Golddrahtbonden
Thermosonic
Ball-Wedge-Bonding
LED-Applications
Sensoric
Ball
Wedge
Gold wirebondingGold studbumps
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 7
Encapsulation
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 8
Substrate
Substrate
Globtop
Lensholder
WirebondingDesign Rules Suggestions
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 9
Cu
Ni
Pd
0,04 – 0,08 µm
0,1– 0,2 μm
4 – 7 μm
Au
ENEPIG
Cu
Ni
Au 0,05 – 0,1 µm
4 – 7 μm
ENIG
WirebondingDesign Rules Suggestions
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 10
WirebondingAdvantages
Miniaturization
Performance/Functionality
Reliability
• Thermal management
• Short signal paths(HF)
• Flexible layout design
• Wirebond tester (DVS 2811)
• Over 25 years of knowledge
• WE know HOW
• No housing
• Space saving
• Precision positioning
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 11
Quality ControlWirebond Tester
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 12
XYZTec Wirebond Tester
Automated Process
Standard Test Process (DVS2811)
Continuous Surface Control
Online Test
WirebondingProduct Examples
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 13
3D ToF Camera Application Medical IR Sensor Application
WirebondingProduct Examples
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 14
Summary
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 15
High placement accuracy of the unhoused chips compared to the SMD soldering process
High setting accuracy is used in the following industries:
• Optoelectronics (3D Camera Systems)
• Sensor applications
• Medical applications
Flexible design
Advantages of wire bonding
• miniaturization
• Very good electrical connection
• Good mechanical and thermal stability
Thank you for your attention!
¡Gracias por su
atención!Děkuji vám
za pozornost!
Köszönöm a
figyelmüket! Tak for deres
opmærksomhed!
Merci de
votre attention!
Tack för er
uppmärksamhet!
Produktmanagement Drahtbonden V 2018/05 © Würth Elektronik GmbH & Co. KG www.we-online.de/drahtbonden Page 16
Dipl.-Ing.(FH), MBA
Philipp Conrad
HOTLINE:
+49 175 2271600