product presentation updated: 30 th may 2004. outline product overview fabry-pérot (fp) laser...
TRANSCRIPT
Product Presentation
Updated: 30th May 2004
Outline
• Product overview• Fabry-Pérot (FP) laser products• Distributed Feedback (DFB) laser products• Future products• Conclusion
Laser Product overview
• Wavelengths• 808 nm• 920 nm• 1310 nm• 1490 nm• 1550 nm• Custom
• Types• Fabry-Pérot (FP)• DFB
• Packages• Bare die• Chip-on-submount• TO-CAN• TOSA• Coaxial
• Modulation• CW / Pulsed• 1.25 Gb/s• 2.5 Gb/s• 10 Gb/s
Modulight 1310 nm FP laser diode products for digital applications
Modulight 1310 nm FP laser products
• Laser product family for different needs and applications:• ML-C-1310-FP-10G laser chip
• 10 Gb/s FP laser chip for 10G transponder and transceviver manufacturers
• SONET OC-192 VSR (< 600 m)
• SDH STM VSR-64.1r, STM I-64.1r (< 600 m)
• OIF VSR-4, (< 600m)
• 10 Gb/s over FDDI-grade MM fiber (220-300 m)
Modulight 1310 nm FP laser products
• ML-C-1310-FP-2G5• Bare 2.5 Gb/s FP die for full packaging and
assembly lines• SONET OC-48 SR / SDH STM I-16
• 1.25 Gb/s Gigabit Ethernet
• 1.06 Gb/s / 2.125 Gb/s Fibre Channel
• ML-T-1310-FP-2G5-F/B-X• ML-C-1310-FP-2G5 laser chip in a TO-56
can for 2.5 Gb/s and 1.25 Gb/s TOSA and transceiver manufacturers
• Available with flat window and ball lens caps
• Please inquire custom caps
Modulight 1310 nm FP laser products
• ML-COAX-1310-FP-2G5-2• Reliable coaxial fiber pigtail module
with ML-C-1310-FP-2G5 chip• 2 mW output power• Selectable connector
• ML-W-1310-FP-2G5 1310 nm FP epiwafers
• 1310 nm FP epiwafers with Modulight’s high-performance design or with customer’s own design
Competitive advantages
• Narrow spectral linewidth enables longer transmission distances with high-speed operation
• Strong core material design with superior temperature behavior for uncooled applications
• Controlled beam characteristics for optimal coupling efficiency
• Controlled design and manufacturing process from epiwafer to TO-can level
• Reliable long-term chip supply• Custom features available with short lead time to
production
ML-C-1310-FP-10G –10 Gb/s FP
• Proven robust manufacturing process inherited from 2.5G product
• 10 mW kink-free output power up to 85°C
• Narrow linewidth (typ. RMS 1 nm, -20 dB noise floor) reduces chromatic dispersion
• High-speed operation also at elevated temperatures
• Alignment features for automated pattern recognition
• Superior characteristic temperature of >91K 25-85°C, >88K 15-95°C (cw)
ML-C-1310-FP-10G – high-temperature operation
10 mW kink-free single transverse mode cw power
5 serial resistance
Stable slope efficiency
Example data: 10 devices from different laser bars
ML-C-1310-FP-10G – good fiber coupling
Good beam shape for optimal coupling efficiency
Typical beam ellipticity ~1.4
Horizontal FWHM 24.33°
Vertical FWHM 34.42°
ML-C-1310-FP-10G – reliability
ML-C-1310-FP-10G – S21
ML-C-1310-FP-10G –narrow spectrum
Excellent linewidth in broad temperature range
ML-C-1310-FP-10G – eye pattern
Rise time 39.6 ps (20-80)
Fall time 46.7 ps (80-20)
Jitter pk-pk 19.11 ps
Jitter rms 3.31 ps
S/N 10.21
ER > 5 dB
(Modulight 10Gb/s die in customer 10 Gb/s TO-can, Ib = 40 mA, room temperature, filtered)
ML-C-1310-FP-10G – eye pattern
10.312 Gb/s Eye-Pattern [N=231-1], 10GBASE-R mask, 20% margin
(example data from customer sub-assembly, Iljin Corp.)
ML-C-1310-FP-2G5
• 1310 nm bare FP laser die for up to 2.5 Gb/s digital applications• For customers with own packaging and assembly lines
• Reliable AlGaInAs/InP epi structure with Modulight’s high-performance design
• 7 mW rated output power (to be upgraded)
• >2.5 Gb/s operation -40-85°C
• Low <5 serial resistance
• Automated testing in Modulight’s verification process at 25°C and 85°C• I-L curve (Ith, Iop, slope, kink power)• I-V curve (Vop, Rs)• Spectral measurement (Central wavelength,
RMS spectral width)• Beam shape (ThetaV, ThetaH)
ML-C-1310-FP-2G5
• Narrower (<1 nm) spectral width than for competing 1310 nm FP laser products Reduced
chromatic dispersion
Longer transmission distances than with conventional MLM lasers
Developed for mass production
• Modulight’s chip products developed to match customers’ automated process lines• Die-shear force typ. 390 g• Ball shear force typ. 48 g• Wire pull strength >6 g
• Metal reflection and dicing quality suitable for pattern recognition methods
• Good beam shape for optimal coupling efficiency• Typical beam ellipticity ~1.4
(32:23)
Unbeaten temperature performance
• Best 2.5 Gb/s 1310 nm high-temperature FP laser chip in the market
• Suitable for uncooled transmitters, transceivers and transponders
• Best high-temperature performance• Slope efficiency typ. 0.28
W/A@85 °C• Key to low cost through simple
packaging• Higher manufacturing and design
tolerances for customers
ML-T-1310-FP-2G5-F/B-X• Modulight’s high-performance 2.5 Gb/s nm
1310 nm FP chip in a TO-56 can• Available with flat window and ball lens caps• Ask for custom caps• Ball lens cap can with low beam divergence
(<10°)• Stable focal distance• 100% gross leak test for hermeticity• 300-700 µA monitor PD current• 0.30 W/A slope efficiency 25°C (cw, with ball
lens cap)• 0.22 W/A slope efficiency 85°C (cw, with ball
lens cap)
Customer interface – quality of service
• Fast customer response• Modulight’s committed technical and sales personnel in your
service for after-sales support
• Product-specific quality plans available for customer review• Describing QC/QA activities in Modulight’s production in
detail• Exact description of all verification and validation criteria
• Easy access to production and verification data through Modulight’s manufacturing database• Delivery of all verification data to customer in electrical
format• Full process traceability
ML-C-1310-FP-2G5 – reliability
ML-C-1310-FP-2G5 – threshold current
2nd derivative method
ML-C-1310-FP-2G5 – frequency response
ML-C-1310-FP-2G5 – 2.5 Gb/s eye pattern
2.488 Gb/s, Iop = 30 mA, ext ratio 9.24 dB. OC-48/STM-16 mask, 20% margin
(Modulight 2.5 Gb/s die in customer sub-assembly, Iljin Corp.)
ML-C-1310-FP-2G5 – for 1.25 Gb/s and 2.5 Gb/s
2.488 Gb/s, OC-48/STM-16 filter
(Modulight 2.5 Gb/s die in Customer’s SFP transceiver)
ML-C-1310-FP-2G5 –2.5 Gb/s eye pattern
ML-T-1310-FP-2G5-F-3
• 55 km Gigabit Ethernet transmission, 13.5 dB extinction ratio, Pout = -0.2 dBm
• 25 °C ambient temperature (Tc = 41°C)• λ=1310.08, λ = 0.88 nm• Modulight TO-can in Allied Telesyn (US) GigE transceiver sub-assembly
Modulated spectrumEye pattern after 55 km transmission
ML-T-1310-FP-2G5-F-3
• 40 km Gigabit Ethernet transmission, 9.9 dB extinction ratio, Pout = -0.8 dBm
• 70°C deg ambient temperature (Tc = 87.5°C)
• λ=1325.10, λ = 0.79 nm• Modulight TO-can in Allied Telesyn (US) GigE transceiver sub-assembly
Eye pattern after 40 km transmission Modulated spectrum
1310 nm FP epiwafers
• Use Modulight’s standard production design in your own device process
or• Base your own FP or DFB design on
Modulight’s proprietary active area design• Exploit Modulight’s processing services for
broad-area characterisation or device-level epiwafer qualification
Modulight 1310 nm DFB products
1310 nm DFB laser products
• Products for SONET OC-48, 1x/2x Fibre Channel and long-reach Gigabit Ethernet• ML-C-1310-DFB-2G5
• 300x300 µm bare die
• ML-T-1310-DFB-2G5• TO-56 can with flat window cap or aspherical lens cap
1310 nm DFB laser products
• Active area design platform inherited from Modulight’s mature 1310 nm FP products• Focus on full operating temperature range (0-
85°C), not just RT operation• Small slope saturation at elevated temperatures• Small beam ellipticity
• Cost-effective grating process• Typ 43 dB SMSR• Typ 0.07 nm FWHM (-20 dB noise floor)• Temperature shift 0.09 nm/K
ML-C-1310-DFB-2G5 – frequency response
ML-C-1310-DFB-2G5 – 4 Gb/s modulation test
• Data Rate 4 Gb/s.• PRBS: 231-1• Eye Diagrams @
temperatures of 0, 25, 50, 75, 85, 100°C andlink distances of 0km, 2km and 10km
• Temperature compensation not optimized.• RF filter between LDD and LD not optimized.
⇨ Some ringing occurs in eyes, can be eliminated by optimized filter circuit
• LD maintains SM operation with 40 dB SMSR at all evaluated operation conditions.
• Clear open eyes @ all evaluated operation conditions• 10 km transmission with 4 Gb/s @ 0 - 100°C
Link: 0 m; Temp.: 0°C
Link: 0 m; Temp.: 25°C
Link: 0 m; Temp.: 50°C
Link: 0 m; Temp.: 75°C
Link: 0 m; Temp.: 85°C
Link: 0 m; Temp.: 100°C
Link: 2 km; Temp.: 0°C
Link: 2 km; Temp.: 100°C
Link: 10 km; Temp.: 0°C
Link: 10 km; Temp.: 100°C
Future DFB products from Modulight
• 2.5 Gb/s 1550 nm DFB die & TO-can• Long reach applications
• 1490 nm DFB die & TO-can • PON
• 10 Gb/s directly modulated 1310 nm DFB die• Based on Modulight’s 10G 1310 nm FP design• For uncooled transceivers/transponders
Conclusion
• Robust and manufacturable laser products• Strong customer focused technical pre and
after sales• Key success factors
• Agility, Reliability, Customer Focus and Profitability
• Quality, environment and cost-effectiveness in mind
• Volume manufacturing capacity in own building