product specification compact flash memory card connector

Compact Flash Memory Card Connector Product Specification

Specification No: PS98007 Rev. 3 Date: 11.10.99 of 7

PRODUCT SPECIFICATION COMPACT FLASH MEMORY CARD CONNECTOR

1. SCOPE

This specification covers the performance, tests and quality of Compact Flash Memory Card connectors that conform to the CFA’s CompactFlash Specification.

2. PRODUCT PART NUMBER

Part No* Description

Solder Tail Style Side View Photo

952-

13-5

0GC

01-X

X

Memory Card

Receptacle

Straddle Mount

952-

13-5

0GC

19-X

X

Memory Card

Receptacle SMT

952-

02-5

0SM

01-X

X

Memory Card

Receptacle

Straddle Mount

952-

02-5

0SM

19-X

X

Memory Card

Receptacle SMT

*Note: XX refers to optional contact plating (Para 3.3)



3. MATERIAL AND PLATING

3.1 Insulator : Liquid Crystal Polymer, UL 94V-0, Black

3.2 Contact : Beryllium Copper

3.3 Contact Plating: -90 Underplate : 0.00127 - 0.00381mm Nickel underplate all over

Contact Area: 0.00008 - 0.00013 mm Gold flash over 0.00076 min. 80/20 Palladium Nickel Solder Tails : 0.00127 - 0.00381 mm 90/10 Tin/Lead

-20 Underplate : 0.00127 - 0.00254mm Nickel underplate all over

Contact Area: 0.000381mm Gold plate Solder Tails : 0.00127 - 0.00381 mm 90/10 Tin/Lead

4. PRODUCT SHAPE AND DIMENSIONS Refer to product drawing

5. RATING

5.1 Voltage Rating: 100 Vac

5.2 Current Rating (per position): 0.5 A max.

5.3 Contact Resistance (per position, max.): 40mΩ (initial), ∆R = 20 mΩ (final)

5.4 Dielectric Withstanding Voltage: 1000Vac min. (for 1 minute)

5.5 Insulation Resistance: 1000MΩ min. (initial), 100MΩ min. (final)

5.6 Durability: 10,000 cycles

5.7 Operation Temperature: -20°C to +60°C

6. PERFORMANCE

6.1 Electrical Performance No. Item Test Method Standard 6.1.1 Low Level

Contact

Resistance

Specification: MIL-STD-1344A Method

3002.1

Mated connectors subjected to test

current of 1mA with 20mV open circuit

Ri = 40mΩ

(Initial)

6.1.2 Low Level

Contact

Resistance

after

Environmental/

Mechanical

Test

Specification: MIL-STD-1344A Method

3002.1

Mated connectors subjected to test

current of 1mA with 20mV open circuit

Rf = Ri ±

20mΩ (Final)

Max. 20mΩ change allowed

after test



No. Item Test Method Standard 6.1.3 Dielectric

Withstanding

Voltage

Specification: MIL-STD-202F Method 301

Measured between adjacent contacts

while subjected to test potential of

500Vrms AC for one minute.

No breakdown

or flashover,

Current leakage

1 mA max

6.1.4 Dielectric

Withstanding

Voltage after

Environmental/

Mechanical

Test


Measured between adjacent contacts

while subjected to test potential of 750V

for one minute.

No breakdown

or flashover,

Current leakage

1 mA max

6.1.5 Insulation

Resistance


Measured between adjacent contacts at a

test potential of 500 Vdc for one minute

1000MΩ Min.

6.1.6 Insulation

Resistance

after

Environmental/

Mechanical

Test


Measured between adjacent contacts at a

test potential of 500 Vdc for one minute

100MΩ Min.

6.2 Mechanical Performance No. Item Test Method Standard 6.2.1 Contact

Insertion/

Withdrawal

Force

Specification: EIA-364-13

Insert and withdraw connectors at the

speed rate of 25mm per minute

Insertion force:

39.2N Max

Withdrawal force:

6.67N - 39.2N

6.2.2 Durability

(Office

Environment)


Connectors mate and unmate for

10,000 cycles at rate of 600 cycles per

hour at 15°C to 35°C with RH 25% to

85% and Air Pressure of 86 to 106kPa

Contact Resistance

Change (low level):

±20mΩ Max from

initial reading



No. Item Test Method Standard 6.2.3 Durability

(Harsh

Environment:

Humidity and

Hydrogen

Sulfide)


Connectors mate and unmate for 5000

cycles at rate of 600 cycles per hour at

15°C to 35°C with RH 25% to 85% and

Air Pressure of 86 to 106kPa

Contact Resistance

Change (low level):

±20mΩ Max from

initial reading

6.2.4 Vibration and

High

Frequency

Specification: MIL-STD-202F Method

204D Test Condition B

Mated connectors subjected to 147

m/s2 peak, 10Hz to 2000 Hz

No mechanical

damage.

Discontinuity:

100 nsec Max.

6.2.5 Mechanical

Shock


213B

Mated connectors are subjected to a

490m/s2, half sinewave, 11ms holding

time

No mechanical

damage.

Discontinuity:

100 nsec Max.

6.3 Environmental and Other Performance No. Item Test Method Standard 6.3.1 Moisture

Resistance


106E (Excluding Vibration)

Mated connectors exposed to 10

continuous temperature and humidity

cycles (1 cycle = 24 hours)

Contact Resistance

Change (low level):

20mΩ Max

Insulation Resistance:

100 MΩ Min

6.3.2 Thermal

Shock


107G Test Condition A

Mated connectors exposed to a

temperature extreme of -55°C to

+85°C for 5 cycles *1 cycle = 1 hour)

No physical

degradation Contact

Resistance Change

(low level): 20mΩ Max


100 MΩ Min



No. Item Test Method Standard 6.3.3 Humidity

(Normal

Condition)

Specification: MIL-STD-202F

Methode 103B, Test Condition B

Mated Connectors subjected to 90 to

95% relative humidity at 40°C for 96

hours.

Contact Resistance

Change (low level):

20mΩ Max


100 MΩ Min

6.3.4 Hydrogen

Sulfide

Specification: JEIDA 38

Mated connectors exposed to 3 PPM

hydrogen sulfide at 40°C with 80%

RH for 96 hours.

Contact Resistance

Change (low level):

20mΩ Max

6.3.5 Cold

Resistance

Specification: JIS C 0020

Mated exposed to -55°C for 96 hours.

Contact Resistance

Change (low level):

20mΩ Max

6.3.6 Durability

(High

Temperature)


108A

Mated Connectors subjected to 85°C

for 250 hours

Contact Resistance

Change (low level):

20mΩ Max

Technical Inquiry:

Contact Person: Mr. T. J. Tan Tel: (65) 869 0868 E-mail: [email protected]

Sales Inquiry:

Contact Person: Mr. C. K. Ng Tel: (65) 869 0898 E-mail: [email protected]

A subsidiary of Methode Electonics Inc., U.S.A.

1 Tuas Lane, Jurong Town Singapore 638610

Tel: (65) 861 5444 Fax: (65) 861 4777

product specification compact flash memory card connector

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