product/process · pcn ipd-dis/13/7887 - dated 17 jun 2013 table 1. change implementation schedule...

PCN IPD-DIS/13/7887Dated 17 Jun 2013

ACSwitches in ISOWATT220AB package: Conversion from

dipping to tin plating

1/17

PRODUCT/PROCESSCHANGE NOTIFICATION®

PCN IPD-DIS/13/7887 - Dated 17 Jun 2013

Table 1. Change Implementation ScheduleForecasted implementation date for 10-Jun-2013 change

Forecasted availability date of samples 10-Jun-2013 for customer

Forecasted date for STMicroelectronicschange Qualification Plan results availability 10-Jun-2013

Estimated date of changed product first 16-Sep-2013 shipment

Table 2. Change IdentificationProduct Identification ACSwitches in ISOWATT220AB package (Product Family/Commercial Product)

Type of change Package assembly process change

Reason for change Equipments and processes rationalization

Description of the change ST extends its standard tin plating process to ISOWATT220ABpackage. Tin dipping generates bright aspect, while tin platinggives a mat finishing of the leads.

Change Product Identification Date code and QA number

Manufacturing Location(s)

® 2/17

PCN IPD-DIS/13/7887 - Dated 17 Jun 2013

DOCUMENT APPROVAL

Name Function

Paris, Eric Marketing Manager

Duclos, Franck Product Manager

Cazaubon, Guy Q.A. Manager

® 4/17

STMicroelectronics IPD - ASD & IPAD Division

1

BU Thyristors/Triacs and Rectifiers

(1) IPD: Industrial & Power Discretes - ASD: Application Specific Device - IPAD: Integrated Passive and Active Devices

Issue date 10-06-2013 1/2

PCN Product/Process Change Notification

ACSwitches in ISOWATT220AB package:

Conversion from dipping to tin plating

Notification number: IPD-DIS/13/7887 Issue Date 10/06/2013

Issued by Aline AUGIS

Product series affected by the change T630-800W T1620-600W T1620-600W T1620-700W T1620-700W T1620-800W T1620-800W T435-600W T435-800W T830-800W T410-600W T405-600W

Type of change Package assembly process change

Description of the change

ST extends its standard tin plating process to ISOWATT220AB package.

Tin dipping generates bright aspect, while tin plating gives a matt finishing of the leads.

DIPPING PLATING

Reason for change

The change is performed in order to optimize STMicroelectronics industrial process and material.

Former versus changed product: The changed products do not present modified electrical,

dimensional or thermal parameters, leaving unchanged the

current information published in the product datasheet

The Moisture Sensitivity Level of the part (according to the

IPC/JEDEC JSTD-020D standard) remain unchanged.

STMicroelectronics IPD - ASD & IPAD Division

1

BU Thyristors/Triacs and Rectifiers

(1) IPD: Industrial & Power Discretes - ASD: Application Specific Device - IPAD: Integrated Passive and Active Devices

Issue date 10-06-2013 2/2

The footprint recommended by ST remains the same.

There is no change in the packing modes and the standard

delivery quantities either.

The products remains in full compliance with the ST

ECOPACK®1 grade.

Disposition of former products

Deliveries of former product will continue while the conversion is brought to completion and as long as former product stocks last.

Marking and traceability

The marking of the device remains the same (no change).

Traceability is ensured by the date code and the QA number.

Qualification complete date Week 18-2013

Forecasted sample availability

Samples are available on request within 2 to 4 weeks.

Product family Sub-family Commercial part

Number Availability date

ACSwitches Triac T630-800W W26/2013

Change implementation schedule

Sales types Estimated production start Estimated first shipments

All Week 25-2013 Week 37-2013

Comments:

Customer’s feedback

Please contact your local ST sales representative or quality contact for requests concerning this change

notification.

Absence of acknowledgement of this PCN within 30 days of receipt will constitute acceptance of the change

Absence of additional response within 90 days of receipt of this PCN will constitute acceptance of the change

Qualification program and results QRP13142 attached

IPD (Industrial & Power Discretes)

Group ASD & IPAD division Quality and Reliability

May 24th, 2013 Report ID: 13142QRP

Page 1/10

External Reliability Report

AC Switches in ISOWATT220AB package: Conversion from dipping to tin plating

General Information

Product Lines AC Switches

Products Description TRIACs

Product Group IPD

Product division ASD&IPAD

Package ISOWATT220AB

Locations

Wafer fab STMicroelectronics Tours (France)

Assembly plant STMicroelectronics SHENZHEN (China)

Reliability Lab STMicroelectronics Tours (France)

DOCUMENT INFORMATION

Version Date Pages Prepared by Approved by Comment Rev. 1 May 24th 2013 10 Gilles Dutrannoy JP.Rebrasse First issue

Note: This report is a summary of the reliability trials performed in good faith by STMicroelectronics in order to evaluate the potential reliability risks during the product life using a set of defined test methods. This report does not imply for STMicroelectronics expressly or implicitly any contractual obligations other than as set forth in STMicroelectronics general terms and conditions of Sale. This report and its contents shall not be disclosed to a third party without previous written agreement from STMicroelectronics.




Page 2/10

TABLE OF CONTENTS 1 APPLICABLE AND REFERENCE DOCUMENTS ................ ............................................................................ 3

2 GLOSSARY .......................................... ............................................................................................................. 3

3 RELIABILITY EVALUATION OVERVIEW ................... ..................................................................................... 4

3.1 OBJECTIVES ............................................................................................................................................... 4

3.2 CONCLUSION ............................................................................................................................................. 4

DEVICE CHARACTERISTICS ................................................................................................................................... 5

3.3 DEVICE DESCRIPTION ................................................................................................................................. 5

4 TEST RESULT SUMMARY ............................... ................................................................................................ 6

4.1 TEST VEHICLE ............................................................................................................................................ 6

4.2 TEST PLAN AND RESULT SUMMARY .............................................................................................................. 7

5 ANNEXES .......................................................................................................................................................... 8

5.1 DEVICE DETAILS ......................................................................................................................................... 8

5.2 TEST DESCRIPTION .................................................................................................................................... 9

6 APPENDIX ....................................................................................................................................................... 10




Page 3/10

1 APPLICABLE AND REFERENCE DOCUMENTS

Document reference Short description JESD 47 Stress-Test-Driven Qualification of Integrated Circuits

MIL-STD-750C Test method for semiconductor devices SOP 2614 Reliability requirements for product qualification (ST internal document) SOP 267 Product maturity levels (ST internal document) 0061692 Reliability tests and criteria for qualifications (ST internal document)

PCN reference IPD-DIS/13/7887

2 GLOSSARY

BOM Bill Of Materials DUT Device Under Test F/G Finished Good

HTRB High Temperature Reverse Bias PCT Pressure Cooker Test P/N Part Number RH Relative Humidity SS Sample Size

TCT Temperature Cycling Test THB Temperature Humidity Bias HTS High Temperature Storage




Page 4/10

3 RELIABILITY EVALUATION OVERVIEW

3.1 Objectives Qualification of the conversion from dipping to tin plating on ISOW ATT220AB products at ST China (Shenzhen).

3.2 Conclusion Qualification plan requirements have been fulfilled without any exception. Reliability tests have shown that the devices behave correctly against environmental tests (no failure). Moreover, the electrical parameter stability during the accelerated tests demonstrates the product robustness which is consequently expected during their lifetime. .




Page 5/10

Device Characteristics

3.3 Device description

TBXXXXX (25A – 600V)

Package Code Label ISO220T

Product Family TRIAC

fab site label TOURS

Assembly site label SHENZHEN B/E

passivation/glassivation Glass

T1620-800W/7 (16A – 800V)

Package Code Label ISO220T

Product Family TRIAC

fab site label TOURS

Assembly site label SHENZHEN B/E

passivation/glassivation Glass




Page 6/10

4 TEST RESULT SUMMARY

4.1 Test vehicle TBxxxxx (25A 600V)

Lot # Process/ Package Comments LOT 1 ISOWATT22AB Qualification lot

T1620-800W/7 (16A 800V)

Lot # Process/ Package Comments LOT 2 ISOWATT220AB Qualification lot




Page 7/10

4.2 Test plan and result summary

Table of results from lots 1 &2

Test Std ref. Conditions SS Step

Failure/SS

LOT 1 LOT 2

Solderability J STD-002 Dry aging 2 baths

SnPb / SnAgCu 245°C 40 8 hours 0/20 0/20

Solderability J STD-002 Steam aging

2 baths SnPb / SnAgCu 245°C

40 8 hours 0/20 0/20




Page 8/10

5 ANNEXES

5.1 Device details

5.1.1 Pin connection

5.1.2 Package outline/Mechanical data




Page 9/10

5.2 Test Description

Test name Description Purpose Package -oriented test

Solderability

Test done under environmental stress conditions: Dry then Steam aging tests +

dipping in 2 baths SnPb / SnAgCu 245°C

To evaluate the lead solderability.




Page 10/10

6 APPENDIX List of involved products: T630-800W T1620-600W T1620-700W T1620-800W T435-600W T435-800W T830-800W T410-600W T405-600W T820-800W

Public Products List®

PCN Title : ACSwitches in ISOWATT220AB package: Conversion from dipping to tin plating PCN Reference : IPD-DIS/13/7887 PCN Created on : 17-JUN-2013

Subject : Public Products List

Dear Customer,

Please find below the Standard Public Products List impacted by the change:

ST COMMERCIAL PRODUCT

T1620-600W T405-600W T410-600W T435-600W T435-800W T630-800W T830-800W

1/1

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