pvd (physical vapour deposition) - tu wienultra high vacuum (uhv) 10-5!10-10 5•105!5•1010 0.027...

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Repetition: Physical Deposition Processes PVD (P hysical V apour D eposition) Evaporation Sputtering Diode-system Triode-system Magnetron-system ("balanced/unbalanced") Ion beam-system Ionplating DC-glow-discharge RF-glow-discharge Magnetron- discharge Arc-discharge Ion-Cluster-beam Reactive versions of the above processes

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Page 1: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Repetition: Physical Deposition Processes

PVD (Physical Vapour Deposition)

Evaporation

SputteringDiode-systemTriode-systemMagnetron-system ("balanced/unbalanced")Ion beam-system

IonplatingDC-glow-dischargeRF-glow-dischargeMagnetron- dischargeArc-dischargeIon-Cluster-beam

Reactive versions of the above processes

Page 2: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Repetition: Rates and Cooling Rates PVD

These extremely high cooling rates show, that PVD processes (apart from being a direct transition from vapor !!!! solid state) always have to be considered as non equilibrium processes.

10

377

29

3.77·10

2.9·10 2.9·10

3.77·10

Sputtering

Evaporation

Effusion cell,Ion Gun

High ratemagnetron

High rateelectrongun

E =1eV

E =0.1eV

R[nm/s]

R [K/s]

R [K/s]

10 1010 101-2

T

T

3

particle

particle

4

3

7

6

-1

Page 3: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Vacuum Physics

Mean free path: the way a gas particle (or a film particle) can travel without a collision with another particle.

Impingement rate: number of particles which hit a surface per second and unit area at constant pressure.

Coverage time: time needed for the formation of a full monolayer.

Central Termini:

Page 4: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Mean Free Path ICollision of two particles, 1 and 2 with radius r = R/2:

2r

R

σ1

If both particles are considered as points then a collision happens, if particle 1 is located within a disk of the area σσσσ = ππππ·R2. σσσσ is called the collision cross section.

Page 5: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Mean Free Path IIAparticle moves straight for a distance l through a gas. Within a cylinder of the volume V = l·σσσσ it will collide with each particle located in V.

l

σ

The cylinder contains N = n · V particles. For straight movement this is the collision number.

Page 6: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Mean Free Path IIIOne collision happens if N = 1. This yields the mean free path λλλλ as:

1nVn1N =σ⋅λ⋅=⋅⇒≡

22 rn41

Rn1

n1

⋅⋅π⋅=

⋅⋅π=

σ⋅=λ

Macroscopic information: Particle density n,from the ideal gas equation.Microscoic information: Collision cross section σ,σ,σ,σ,contains energy dependent atom/molecule radii or the general interaction cross sections of the colliding particles.

Page 7: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Mean Free Path IVState of movement of the background gas:

2rn41

⋅⋅π⋅=λ

Energeticcoating particle: relative movement may be neglected

Gas particle:relative movementmay not be neglected

2rn421

⋅⋅π⋅⋅=λ

Page 8: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Mean Free Path - Example

Tkpn

VNTkNVp

rn41

BB2 ⋅

==⇒⋅⋅=⋅⋅⋅π⋅

p = 0.1 Pa kB=1,38·10-23J/KT = 300Kr = 1.5·10-10m

cm6.14]m[105.1]mJ[1.04

]K[300]K/J[1038.1rp4

Tk

2103

23

2B

=

=⋅⋅⋅⋅π⋅⋅⋅=

=⋅⋅π⋅

⋅=λ

−−

Page 9: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Mean Free Path - Rough Estimate

λλλλp=5mmPap = 1 Pa !!!!λλλλ = 5 mm p = 10-4 Pa !!!!λλλλ = 50 m

10-5 10-4 10-3 10-2 10-1 100 101 1021E-4

1E-3

0,01

0,1

1

10

100

CO2; Ar; N

2

He

H2O

Mitt

lere

Fre

ie W

eglä

nge

[m]

Druck [Pa]

Page 10: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Mean Free Path: Scale Consideration

λλλλp=5mmPaCERN � LHC:U = 2·4.3 ·ππππ= 27 km

mbar108.1Pa108.1107.2

5]mm[

5]Pa[p

]Pa[p5]mm[

97

7

−− ⋅=⋅=

=⋅

=

Within LHC a pressure of approx. 10-9 mbar has to be maintained, to exclude interparticle collisions.

Page 11: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Gas Phase Transport

λ−⋅= xexp)0(N)x(N

A significant number of collisions happens before the mean free path is reached.Only approx. 37% of the particles reach λλλλ without a collision.The mean free path is only a statistical measure.

This means:

Clausius' law of distance:

Page 12: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Gas Phase Transport - Statistics

λ=

λ−

λ−⋅

=

∫∞

0

0

xexp

xexpxd

d1 d2

dn

Consider large ensemble of single situations:

Calculate the expectation value of free throw distances:

Page 13: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Areal Impingement Rate IInitial situation: Gas molecules hit surface

Wanted: number of gas molecules, which hit the unit surface within 1 second.

Page 14: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Areal Impingement Rate IIApproach: cylinder with unit top areas, heigth u.

Only particles with a velocity component u in the direction of e1, which trespass the top cylinder surface reach the surface within unit time.

Differential areal impingement rate:

u

e

1

1

{ { du)u(n1udzdensityparticle

volumecylinder

u ⋅Φ⋅⋅⋅=−−

Page 15: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Areal Impingement Rate III

Differential areal impingement rate:

{ { du)u(n1udzdensityparticle

volumecylinder

u ⋅Φ⋅⋅⋅=−−

Total arealimpingement rate: ∫∫

∞∞

⋅Φ⋅⋅==00

u du)u(undzZ

Maxwell-distribution of one velocity-component:

Tk2um

B

B

2

eTkm2

m)u( ⋅⋅⋅−

⋅⋅⋅⋅π⋅

Page 16: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Areal impingement rate IVCalculation of the total areal impingement rate:

Tk2m

mp

Tkpn

VN

mTk

Tk2mndueu

Tk2mn

du)u(undzZ

BB

B

B

mTk

0

Tk2um

B

00u

B

B

2

⋅⋅π⋅⋅=

⋅===

=⋅⋅⋅π⋅

⋅=⋅⋅⋅⋅π⋅

⋅=

=⋅Φ⋅⋅==

∞⋅⋅

⋅−

∞∞

∫∫

4434421

Page 17: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Areal Impingement Rate V

Z = Z(p,T,m)=

Tk2m

mp

B ⋅⋅π⋅⋅=

Z = 2.7·1017 s-1cm-2

etwa 270 ML/s

m= 5.3·10-26 kg (O2)kB=1,38.10-23J/KT = 300K

p = 0.1 Pa

Z = 2.7·1014 s-1cm-2

etwa 0.2 ML/s

p = 10-4 Pa

Page 18: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Areal Impingement Rate - Graphic

Page 19: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Types of Vacuum

Name Pressure [Pa] Mean free Coverage timepath [mm] O2, 300K [ML/s]

Rough vacuum Atm!!!!1 5·10-5!!!!5 2.7·105 !!!! 2700Fine vacuum 1 !!!!0.1 5 !!!!50 2700 !!!! 270High vacuum (HV) 0.1 !!!!10-5 50!!!!5·105 270 !!!! 0.027Ultra high vacuum (UHV) 10-5 !!!!10-10 5·105!!!!5·1010 0.027 !!!! 2.7·10-7

Extreme UHV (XHV) <10-10 5·1010!!!! 2.7·10-7 !!!!

5·105 mm ≡ 500 m 5·1010 mm ≡ 50 000 km (!)

Page 20: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Types of Pumps

Gas transporting:+ Rotary pump Rough vacuum/fine vacuum+ Diffusion pump High vacuum+ Turbomolecular pump High vacuum

Gas adsorbing:+ Cold traps Fine vacuum+ Cryo pumps High vacuum/UHV+ Sublimation pumps UHV+ Getter pumps UHV

reactive gases+ Ione getter pumps UHV

inert molecules (activation)

Page 21: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Flow Types

Laminar/turbulent: Rough vacuum/fine vacuum

Flow through a pipe, diameter d:

Molecular: High vacuum, UHV

d<<λ

d>>λ

Particle collisionsprobable, global flow

Wall collisionsprobable,no flow

Page 22: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Flow Types and Pumping Systems

Efficient in the laminar region:+ Gas transporting pumps:

Rotary pumpEjector pump

+ Rotary pumps, except Turbomolecular pumps

Efficient in the molecular region :+ Gas transporting pumps:

Diffusion pumpTurbomolecular pump

+ Gas adsorbing pumps

Page 23: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Design Criteria for Vacuum Systems

Mean free path λλλλ:+ Choice of pump type+ Pump velocity+ Dimension of pipe diameters

Areal impingement rate Z:+ Coverage times (e. g. surface analytics)+ Impurity content in coatings (ratio

of impingement rate of the coating particles and of the background gas particles)

Page 24: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Impurities

High sticking coefficient αααα ≈ 1 (ZDes ≈ 0):Reactive gases:

O2H20Complex carbohydrates (pump oil)

Low sticking coefficient αααα << 1 (ZDes ≈ Z):Inert gases:

Noble gasesN2CH4Carbohydrates without reactive groups

Sticking coefficient αααα: Z

Z1 Des−=α Z ... Ipingement rateZDes... Desorption rate

Page 25: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Impurities: Example

Coating material: Al, m = 4.5·10-26 kgRate Al: 10 nm/s = 3 ·1019 At/(m2s-1)Impurity: O2, m = 5.3 ·10-26 kgSticking coefficient αααα: approx. 1 für Al und O2Temperture: 300KWanted: Background gas pressure, at which 1% Oxygen is incorporated unto the coating

Pa1011.1m

Tk2m10310p

Tk2m

mp

103110

ZZ

5

O

BO

192

B

O

O19

2

Al

O

2

2

2

2

2

−−

⋅=⋅⋅π⋅⋅⋅⋅⋅=

⋅⋅π⋅⋅⋅

⋅==

Page 26: PVD (Physical Vapour Deposition) - TU WienUltra high vacuum (UHV) 10-5!10-10 5•105!5•1010 0.027 ! 2.7•10-7 Extreme UHV (XHV)

Design Criteria: Summary

Mean free path λλλλ:Influences gas dynamics. Even at rather high pressures (10-2 Pa) the mean free path reaches the dimensions of average deposition chambers .

Areal impingement rate Z:Crucial for coating purity. The pressure of the background gas has to be at least in the medium high vacuum to guarantee sufficient film purity.