quantum technology: supplying the picks and shovels · 2016-08-03 · event 7th august 2014,...

The Business of Science®

© Oxford Instruments 2014

Quantum Technology: Supplying

the Picks and Shovels

Dr John Burgoyne

Quantum Control Engineering: Mathematical Solutions for Industry – Open for Business

Event 7th August 2014, 12.30-17.00, Isaac Newton Institute, Cambridge



Why “picks and shovels”?

20 February 2006

…Tools enable discovery



Behind the metaphor

New ideas

+

New tools

New

science =



Why this dialogue is important V

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A suite of materials, metrology and

measurement tools for QT

Plasma deposition

and etch

Qbit measurement

Qbit manipulation

Surface analysis

- chemical

SEM

MBE & UHV sputtering fabrication

Surface analysis

- structural



Device fabrication



• Growth

• MBE

• Nanowires/nanotubes

• High temperature plasma-

enhanced chemical vapour

deposition (PECVD)

• Deposition

• PECVD

• Inductively coupled plasma

(ICP) deposition

• Ion beam deposition

• Atomic layer deposition (ALD)

• Etch

• ICP etch

• Reactive ion etch (RIE)

• Ion beam etch

Enabling device fabrication via a suite of

advanced techniques and processes



Capabilities from research to pilot-scale and production

– solutions that grow with the technology

Wafer handling

50 mm Wafer size 450 mm

Production – cassette to cassette

Open load



Multi-tool clusters

Kelvin probe

ALD

(thermal &

plasma)

Hex handler

with integrated

Kelvin Probe

PECVD Sputter

ICP-CVD

#1

ICP-CVD

#2



• Process library of > 6,000 processes

developed over 25 years

• Accessible to all our customers

• Close collaboration with major

Universities and R&D facilities

• Caltech, Cornell, LBNL, TU

Eindhoven, IMEC, Southampton

University, Cambridge University, …

• Process guarantees for key

parameters

• Including wafer-to-wafer repeatability

for rate and uniformity

Our process advantage

TEOS based SiO2 deposition Typical GaN etched feature (PR

remains intact)

Waveguide etch HB LED substrate etch

SiC metal mask etch High rate SiNx at 8 0ºC



• Unique capability of ALD for

monatomic/ mono-molecular layer

control over extremely high aspect

ratio features

• Example (top): ALD of Al2O3 on

carbon nanotubes (CNT)

• Using TMA and O2 plasma

• O2 plasma just enough to react

with TMA but not etch CNT

• No additional functionalisation of

CNT necessary

• Example (bottom): 20 nm HfO2

onto 25:1 AR Si trenches

• Conformality ~ 100%

Extreme aspect ratio conformal deposition via

Atomic Layer Deposition

Trench corner

HfO2 Si

Trench bottom

HfO2

Si



Deposition UHV multi-chamber tool: Institute for

Quantum Computing, University of Waterloo, Canada



• MBE and UHV sputtering

methods on multiple

materials within the same

device

• Metals, metal oxides,

superconductors,

topological insulators…

• XPS (X-ray photoelectron

spectroscopy) analysis of

samples

• Oxford Instruments

Omicron ARGUS analyser

• In-process analysis

• Enables layer-by-layer

quality control of the MBE

and sputtering growth

processes

Deposition UHV multi-chamber tool: Institute for

Quantum Computing, University of Waterloo, Canada



Device physics and

characterisation



• QT device physics needs low (ultra-low)

temperatures

• The initial, “obvious” advantage: no liquid

cryogens

• No compromise on performance

• Base temperature <10 mK

• Cooling power up to 400 µW at 100 mK

• Attraction for QT science emerged:

greatly enhanced sample space vs. ‘wet’

• 240 mm diameter mixing chamber plate

• Open structure for easy experimental

access

• Ease of use

• Sample in vacuum with only a single room

temperature O-ring seal (no IVC)

• Fully automatic cool-down from room

temperature to base

• Remote control through TCP/IP protocol

A key enabler for QT/QIP R&D: the TritonTM

Cryofree® dilution refrigerator platform



• ULT plus…

• Electrical

• Wide bandwidth electronics

• GHz pulse sequences

• Low noise amplification

• Low temperature filtering and amplification

• Low electron temperatures

• Magnetic

• Homogeneous fields

• Gradient fields

• 3D Vector fields

• AC fields

• Optical

• Low vibration

• HV/UHV

• fs pulse sequences

• Single photon emitters

• Optical windows

• Spectroscopic detectors

• Atomic

• UHV

• Gas injection

• Ion/electron beam

• Rapid scan SPM

What else is needed for QIP ‘read/write’

control

http://qdev.nbi.ku.dk/research/solid-state_qubits/

http://qdev.nbi.ku.dk/research/coupled_nanowires_and_nanotubes/

http://qdev.nbi.ku.dk/research/topological_quantum_systems/

http://qdev.nbi.ku.dk/research/novel_devices/



Triton DR: typical experimental services

96 off dc

lines

Still plate

100 mK

plate

4 K plate

2 off optical

fibres

10 off UT-85

rigid coaxial

cables

10 off S1

flexible coaxial

cables

Mixing chamber

plate, <10 mK



Experimental services, heat sinking and

available cooling powers

“Fully loaded” Triton DR: base temperature < 15 mK



Triton DR integrated 3-axis superconducting

magnets



Multiple Triton DR systems: Centre for Quantum

Devices, Niels Bohr Institute, University of

Copenhagen, Denmark



Multiple Triton DR systems: TU Delft,

Netherlands



Fast throughput: top-loading sample

exchange



• 4 off 18 GHz

• 25 off dc lines

30 mm top-loading sample puck



OVC break

Sample puck

Magnet

Vacuum lock

and gate valve

Drive rods

Fast throughput with larger sample space:

bottom-loading sample exchange



• 14 off 40 GHz

• 50 off dc lines

• < 8 hours cool-down

time

70 mm bottom-loading sample puck



MC plate

Docking

station

Sample holder

Coaxes routed

from MC plate

to docking

station

Field centre

Fast throughput with larger sample space:

bottom-loading sample exchange

Repeat connect/disconnect cycles



Sample instrumentation



New platform for yet greater capacity and

capability: TritonXL

Ø 240 mm

706 mm

Ø 430 mm

1003 mm



TritonXL: sample space and wiring access

Triton

• Ø 240 mm

• 1 x 50mm + 2 × 40 mm

+ 1 x 65 mm LoS ports

TritonXL

• Ø 430 mm

• 6 x 50 mm + 1 x 100 mm

LoS ports



• The future

• On-board cold electronics

• Filtering, multiplexing, amplifiers, …

• Enhanced measurement

• Electron temperature thermometry

• Standardised measurement pucks

• Anticipating close participation in a number of QT Hubs

• For discussion!

• What are we not seeing yet in QC/QIP?

• What are we not seeing yet in QT beyond QC/QIP?

And finally…



Thank you

quantum technology: supplying the picks and shovels · 2016-08-03 · event 7th august 2014,...

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