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Solution Proposal by Toshiba © 2019 Toshiba Electronic Devices & Storage Corporation Smart speaker R17

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Page 1: R17 Smart speaker - toshiba.semicon-storage.com€¦ · Wi-Fi / Bluetooth TVS TVS DC/DC LDO Smart Speaker Detail of Wi-Fi / Bluetooth circuit. Criteria for device selection - Power

Solution Proposal by Toshiba

© 2019 Toshiba Electronic Devices & Storage Corporation

Smart speakerR17

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© 2019 Toshiba Electronic Devices & Storage Corporation

Toshiba Electronic Devices & Storage Corporation provides comprehensive device solutions to customers developing new products by applying its thorough understanding of the systems acquired through the analysis of basic product designs.

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BlockDiagram

© 2019 Toshiba Electronic Devices & Storage Corporation

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4© 2019 Toshiba Electronic Devices & Storage Corporation

Smart Speaker Overall block diagram~3.3V : CPU/GPU, Memory

5V : Display Driver, LED Driver, Display Power, D-AMP etc.

~3.3V : Camera, ALS etc.

15V / 5V DC

D-AmpSP

MIC

ImageProcessing

SoC

DisplayDriver

Touch Screen

Controller

LEDDriver

D-Amp

PMIC

DC/DCConverter

LCD Panel

Camera Module

Ambient Light Sensor

Wi-FiBluetooth

Voice Codec

DDR FLASH

SBD

TVS

TVS

TVS

TVS

TVS

TVS

TVS

TVS

TVS

AudioCodec

Load SW IC

MOSFET

LDO

MOSFET

eFuse IC

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5© 2019 Toshiba Electronic Devices & Storage Corporation

TVS

Processor15V/5V

DC

Power Management

IC BatteryeFuse IC

Wi-Fi / Bluetooth

TVS

TVS

DC/DC

LDO

Smart Speaker Detail of Wi-Fi / Bluetooth circuit

Criteria for device selection- Power Supply Rejection Ratio (PSRR) is a

key characteristic for wireless systems.- Wi-Fi system requires high-current power

supply.- A small Transient Voltage Suppressor

(TVS) with low Ct is suitable for ESD protection.

Proposals from Toshiba- Realize noise-resistant power supply

Small surface mount LDO regulator- Absorb Electro Static Discharge (ESD)

from antennas and prevent malfunction of the circuitTVS diode

- Robust protection functioneFuse IC

Power supply circuit

Wi-Fi / Bluetooth solution

1

11

※ Click the number in the circuit diagram to jump to the detailed description page

2

8

2

2

8

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6© 2019 Toshiba Electronic Devices & Storage Corporation

Camera /Image Sensor

PMIC /DCDC converter

TVS

Digital I/O Analog ImageProcessing

SoC

LDOLDO LDO

Photo Diode

LDO

Op-amp Image

Processing SoC

Smart Speaker Detail of sensor / camera circuit

Criteria for device selection- A low noise Op-amp is desirable for the sensor

block.- Power Supply Rejection Ratio (PSRR) is a key

characteristic for camera module.- The low Ct, small package transient voltage

suppressor (TVS) is ideal for ESD protection.

Ambient light sensor

Camera modules

2

3

1

111

7

7

※ Click the number in the circuit diagram to jump to the detailed description page

Proposals from Toshiba- Realize noise-resistant power supply

Small surface mount LDO regulator- Absorb Electro Static Discharge (ESD) from

external terminals and prevent malfunction of the circuitTVS diode

- Amplify the detected weak signal with low noiseLow noise Op-amp

- High performance image recognition by adopting specialized processing coreImage recognition processor ViscontiTM

2

3

1

7

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7© 2019 Toshiba Electronic Devices & Storage Corporation

White LED

LED Driver

LED Driver

SBD

MOSFET

Vin

White LED

Smart Speaker Detail of boost converter for LCD backlight

Criteria for device selection- Schottky Barrier Diode (SBD) requires low

VF and low IR.- High-voltage MOSFET is optimum for the

boost converter.- White LEDs for LCD back light uses LED

drivers capable of large output current.

Proposals from Toshiba- Realize a set with low power

consumption by low on-resistanceU-MOS Series MOSFET (Trench type)

- High speed and low loss diode with a small surface mount packageSchottky barrier diode

- Only one external register sets LED drive current. It can reduce BOM cost.7 segment LED driver

LCD backlight (High drive voltage)5

4

4

5

6

LCD backlight (Mid/Low drive voltage)

6

※ Click the number in the circuit diagram to jump to the detailed description page

6

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8© 2019 Toshiba Electronic Devices & Storage Corporation

CMOSSensor

LENSModule

USB Connectoror AC

3.3V1.8V

MIC Voice Codec

TVS

D-AmpSPD-Amp

TVS

AudioCodec

Image Processing

SoC

MOSFET

PowerSupply

Smart Speaker Detail of camera motion section

Criteria for device selection- A smart speaker starts to mount a camera

function. High performance processor is required to execute image, voice and audio processing at high speed.

- High efficiency and low power consumption are important factors for a USB and mobile battery system limited its maximum power supply.

※ Click the number in the circuit diagram to jump to the detailed description page

422

7

Proposals from Toshiba- Absorb Electro Static Discharge (ESD) from

external terminals and prevent malfunction of the circuitTVS diode

- Realize a set with low power consumption bylow on-resistanceU-MOS Series MOSFET (Trench type)

- High performance image recognition by adopting specialized processing coreImage recognition processor ViscontiTM

4

7

2

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RecommendedDevices

© 2019 Toshiba Electronic Devices & Storage Corporation

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10© 2019 Toshiba Electronic Devices & Storage Corporation

Device solutions to address customer needs

As described above, in the design of smart speakers, “Miniaturization ofcircuit boards”, “Low power consumption of set” and “Robust operation” areimportant factors. Toshiba’s proposals are based on these three solutionperspectives.

Compatiblewith

compactpackages

Noiseimmunity

Highefficiency

・Low loss

Miniaturizationof circuit boards

Low power consumptionof set Robust operation

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11© 2019 Toshiba Electronic Devices & Storage Corporation

Small-signal MOSFET

Small surface mount LDO regulator

TVS diode

Schottky barrier diode

Ultra low noise operational amplifier

2

4

5

3

Device solutions to address customer needs

Compatiblewith

compactpackages

Highefficiency

・Low loss

Noiseimmunity

1

LED driver for a white LEDImage processing SoC

6

7

Electronic Fuse eFuse IC8

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Line up

Value provided

12© 2019 Toshiba Electronic Devices & Storage Corporation

Part number TCR5BM series TCR3UG series TCR2EN series

Package DFN5B WCSP4F SDFN4

IOUT (Max) [A] 0.5 0.3 0.2

VDO (Typ.) [mV] 100@IOUT = 500 mA

140@IOUT=300mA

160@IOUT=150mA

R.R. (Typ.) [dB] 98 70 73IB (Typ.) [μA] 19 0.34 35

Small surface mount LDO regulatorTCR5AM / TCR13AG / TCR2EN series1 Compatible

withcompactpackages

Highefficiency

・Low loss

Noiseimmunity

LDO regulator removes the switching noise generated by the power supply circuit and provides an ideal power supply with Low power consumption.

Low loss (low dropout and low current consumption)

High ripple rejection

Our LDO regulator has high ripple rejection characteristic. Stable power supply is realized by removing switching noise generated in the power circuit.

Optimal for high-density mounting

A variety of small size packages are available.

Our LDO regulators have low dropout and low current consumption characteristics, and can minimize the loss generated by the circuit.

Low dropout voltage

Dro

p-ou

t vol

tage

V IN

-V O

UT(m

V)

Output current I OUT (mA)

New processSignificant

improvement

Conventional process

◆Return to Block Diagram TOP

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Line up

Value provided

13© 2019 Toshiba Electronic Devices & Storage Corporation

TVS diodeDF2B6M4SL / DF2B7ASL / DF2S14P2CTC2 Compatible

withcompactpackages

Highefficiency

・Low loss

Noiseimmunity

High ESD pulse absorption performance

Suppress ESD energy by low clamp voltage

Optimal for high-density mounting

Both low operating resistance and low capacitance are realized and ensures high signal protection performance and signal quality.

Steadily protect the connected circuits/devices using Toshiba owntechnology.

A wide range of packages (single to multi flow through) are available.

Optimum to prevent malfunction of the circuit and device protection by absorbing static electricity (ESD) and surge from external terminals .

(NOTE) : This product is an ESD protection diode and cannot be used for purposes other than ESDprotection (including but not limited to voltage regulation diode applications).

Unidirectional Bidirectional

Suitable for paths with both polar signals such as audio signals

Suitable for paths such as logic signals. There are lineups of 1in1, 2in1, 4in1, 5in1, 7in1.

◆Return to Block Diagram TOP

Part number DF2B6M4SL DF2B7ASL DF2S14P2CTC

Package SL2 SL2 CST2

VESD [kV] ±20 ±30 ±30

VRWM (Max) [V] 5.5 5.5 13

Ct (Typ.) [pF] 0.2 8.5 270

RDYN (Typ.) [Ω] 0.5 0.2 0.23

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Line up

Value provided

14© 2019 Toshiba Electronic Devices & Storage Corporation

Ultra low noise operational amplifierTC75S67TU3 Compatible

withcompactpackages

Highefficiency

・Low loss

Noiseimmunity

Enhancement type

Very small signals detected by various sensors can be amplified with very low noise.

Ultra-low noiseVIN (Typ.) = 6.0 [nV/√Hz]@f = 1 kHz

Low current consumptionIDD (Typ.) = 430 [μA]

Very small signals detected by various sensors [Note 1] can be amplify with low noise using CMOS Op-amp by optimizing the processing. We achieved one of the industry’s lowest [Note 2] input equivalent noise voltage.

The low current consumption characteristics of CMOS processing contributes to the extension of battery life of the compact IoT devices [Note 3].

Ultra low-noisecharacteristic

(Company Comparison)

[Note 1] Sensor types: vibration detection sensor, shock sensor, accelerometer, pressure sensor, infrared sensor, and temperature sensor [Note 2] Based on Toshiba data (as of May 2017) [Note 3] Compared with Toshiba’s Op-amp using bipolar processing

Equi

vale

nt in

put n

oise

vol

tage

VIN

(nV/

√Hz)

Frequency f(Hz)VNI - f

Conventional products :TC75S63TU

New product :TC75S67TU

Part number TC75S67TU

Package UFV

VDD,SS (Max) [V] ±2.75

VDD,SS (Min) [V] ±1.1

IDD (Max) [μA] 700

VNI (Typ.) [nV/√Hz] @f = 1 kHz 6

It is easy to handle because it is an enhancement type in which no drain current flows when no gate voltage is applied.

◆Return to Block Diagram TOP

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Value provided

15© 2019 Toshiba Electronic Devices & Storage Corporation

Small-signal MOSFETSSM6K341R / SSM6K514NU / SSM3K15ACT

Small package

Small package is suitable for high-density mounting.

4 Compatiblewith

compactpackages

Highefficiency

・Low loss

Noiseimmunity

SSM6K341REquivalent circuit Part number SSM6K341R SSM6K514NU SSM3K15ACT

Package SOT-23F UDFN6B CST3

Polarity N-ch N-ch N-chVDSS [V] 60 40 30ID [A] 6 12 0.1

RDS(ON) [mΩ] @VGS = 4.5 V Typ. 36 11.2 2.3 @VGS = 4 VMax 51 17.3 3.6 @VGS = 4 V

Suitable for power management switches and greatly contributes to miniaturization.

Low voltage drive Low on-resistance

It drives at VGS = 4.0 V. By reducing on-resistance between the source and drain, heat generation and power consumption can be kept low.

◆Return to Block Diagram TOP

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Value provided

16© 2019 Toshiba Electronic Devices & Storage Corporation

Schottky barrier diodeCUS10F30 / CTS05F40

This Schottky barrier diode is suitable for small-sized applications such as portable devices and prevents reverse connection of batteries.

High speed switching Resistant to reverse voltage Small package

Suitable for high speed switching applications.

Reverse voltage (VR) is high.(CTS05F40: maximum rating of VR is 40 V)

Small package is suitable for high density mounting.

5 Compatiblewith

compactpackages

Highefficiency

・Low loss

Noiseimmunity

CTS05F40 Characteristics chartPart number CUS10F30 CTS05F40

Package USC CST2

VR (Max) [V] 30 40IO (Max) [A] 1.0 0.5VF (Max) [V] 0.50 0.81

IR (Max) [μA] 50 15

◆Return to Block Diagram TOP

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Value provided

17© 2019 Toshiba Electronic Devices & Storage Corporation

Step up type LED drivers for a white LED1ch drive TB62763FMG / 4ch drive TB62771FTG

Driving series connection Hi-current type white LEDs. There are 1ch and 4ch drive type drivers.

Suitable driving a white LED for an LCD back light

Capable driving series connection white LEDs

PWM dimming function

Line up are 1ch and 4ch type drivers. 1ch type is suitable for mobile LCD and 4ch one is for small LCD PC.

1ch type maximum driving number of series connection LED is 6, 4ch one is 9/ch.Built-in step up type power supply adjusts LED driving voltage according to the LED Vf.

Minimum high level time period is 330 ns about 4ch PWM control based on constant current power supply. 1ch type is possible to dim by few kHz PWM.

Part number TB62763FMG TB62771FTG

Package SON8 WQFN24

Driving ch number 1 ch 4 ch

Maximum LED driving number 6 36

Operation voltage 2.8 to 5.5 V 4.75 to 40 V

LED driving current ~80 mA ~150 mA

Built-in constant current power supply N/A Available

Built-in FET for stepping up power supply Available N/A

SON8

WQFN24

TB62763FMGTB62771FTG

6 Compatiblewith

compactpackages

Highefficiency

・Low loss

Noiseimmunity

◆Return to Block Diagram TOP

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Line up

Value provided

18© 2019 Toshiba Electronic Devices & Storage Corporation

Image recognition processor ViscontiTM

TMPV7608XBG / TMPV7706XBG / TMPV7708XBG

High performance by adopting an optimized architecture for image recognition

High image recognition performance

Low power consumption Multi-use function

Realizing high recognition performance by adopting recognition acceralation IPs, parallel multiplex architecture and high memory band width.

Heterogeneous multi-core and HW acceralator execute image recognition at low power consumption by using fully low power mode. No fan necessity can reduce restriction of the installation place of an equipment.

CoHog and DNN recognition HW, and stereo processing HW can execute multi-camera input data up to 4M pixel. It useful for various objects recognition and analyzation.

Visconti5 features

その他の特長・優位性、スケジュール

Part number TMPV7708XBG TMPV7706XBG TMPV7608XBGSeries name Visconti5 Visconti5 Visconti4

Package FCBGA1018 FCBGA621 PFBGA796

CPU

Arm® Cortex®-A532 clusters

Arm® Cortex®-R42

Arm® Cortex®-A532 clusters

Arm® Cortex®-R42

Toshiba original32 bit RISC MeP

2

Number of CPU core 10 10 8Number of camera I/F 6 ch 2 ch 4 ch

7 Compatiblewith

compactpackages

Highefficiency

・Low loss

Noiseimmunity

◆Return to Block Diagram TOP

Simultaneous execution8 image processing CPUs and 7-14acceralators can execute different image processing applications in parallel.

High execution performanceVisconti recognizes a few objects simultaneously less than 50 ms.

High performance image feature amount(CoHOG enhancement) DNN additionImproving recognition performance at low illuminance. It allow to recognize at night. Also additional DNN HW improves recognition accuracy.

* Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.* Visconti is a trademark of Toshiba Electronic Devices & Storage Corporation.

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19

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© 2019 Toshiba Electronic Devices & Storage Corporation

Electronic Fuse eFuse ICTCKE8 series

eFuse IC ( electronic fuses ) can protect circuits from abnormal conditions such as overcurrent and overvoltage repeatedly.

Repeated useHigh-speed short-circuit protection

Rich protection functions

When excessive current flows through the eFuse IC, the internal detection circuit operates and turns off the internal MOS. It is not destroyed by a single overcurrent and can be used repeatedly.

The cut-off time at the time of output short-circuit is 150ns (Typ.), and the output current is cut-off at high speed at the time of short-circuit detection.

In addition to short-circuit protection, the circuit is protected by overcurrent clamp (OCC), overvoltage clamp (OVC), Thermal shut down (TSD), inrush current suppression, Reverse current protection (optional), and other. functions

8

◆Return to Block Diagram TOP

Part number TCKE800NA/NL* TCKE805NA/NL TCKE812NA/NL*

Package

VIN [V] 4.4 ~ 18RON (Typ.) [mΩ] 28Return function NA: Automatic return, NL: Latch type (external signal control)

VOVC (Typ.) [V] - 6.04 15.0

WSON10B3.0x3.0x0.7mm

* Under development

Current limitsetting

Example of reference circuit

TCKE805NA/NL

MOSFET for preventing reverse current(Option)

Slew rate setting

Output enableUVLO setting

Highefficiencyin all areas

Highefficiency

・Low loss

Compatiblewith

compactpackages

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© 2019 Toshiba Electronic Devices & Storage Corporation

If you are interested in these products andhave questions or comments about any of them,please do not hesitate to contact us below:

Contact address: https://toshiba.semicon-storage.com/ap-en/contact.html

Page 21: R17 Smart speaker - toshiba.semicon-storage.com€¦ · Wi-Fi / Bluetooth TVS TVS DC/DC LDO Smart Speaker Detail of Wi-Fi / Bluetooth circuit. Criteria for device selection - Power

21© 2019 Toshiba Electronic Devices & Storage Corporation

Terms of useThis terms of use is made between Toshiba Electronic Devices and Storage Corporation (“We”) and customers who use documents and data that are consulted to design electronics applications on which our semiconductor devices are mounted (“this Reference Design”). Customers shall comply with this terms of use. Please note that it is assumed that customers agree to any and all this terms of use if customers download this Reference Design. We may, at its sole and exclusive discretion, change, alter, modify, add, and/or remove any part of this terms of use at any timewithout any prior notice. We may terminate this terms of use at any time and for any reason. Upon termination of this terms of use, customers shall destroy this Reference Design. In the event of any breach thereof by customers, customers shall destroy this Reference Design, and furnish us a written confirmation to prove such destruction.

1. Restrictions on usage1.This Reference Design is provided solely as reference data for designing electronics applications. Customers shall not use this Reference Design for any other purpose, including without

limitation, verification of reliability.2.This Reference Design is for customer's own use and not for sale, lease or other transfer.3.Customers shall not use this Reference Design for evaluation in high or low temperature, high humidity, or high electromagnetic environments.4.This Reference Design shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.

2. Limitations1.We reserve the right to make changes to this Reference Design without notice.2.This Reference Design should be treated as a reference only. We are not responsible for any incorrect or incomplete data and information.3.Semiconductor devices can malfunction or fail. When designing electronics applications by referring to this Reference Design, customers are responsible for complying with safety standards

and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of semiconductor devices could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Customers must also refer to and comply with the latest versions of all relevant our information, including without limitation, specifications, data sheets and application notes for semiconductor devices, as well as the precautions and conditions set forth in the "Semiconductor Reliability Handbook".

4.When designing electronics applications by referring to this Reference Design, customers must evaluate the whole system adequately. Customers are solely responsible for all aspects of their own product design or applications. WE ASSUME NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

5.No responsibility is assumed by us for any infringement of patents or any other intellectual property rights of third parties that may result from the use of this Reference Design. No license to any intellectual property right is granted by this terms of use, whether express or implied, by estoppel or otherwise.

6.THIS REFERENCE DESIGN IS PROVIDED "AS IS". WE (a) ASSUME NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (b) DISCLAIM ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO THIS REFERENCE DESIGN, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

3. Export ControlCustomers shall not use or otherwise make available this Reference Design for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). This Reference Design may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of this Reference Design are strictly prohibited except in compliance with all applicable export laws and regulations.

4. Governing LawsThis terms of use shall be governed and construed by laws of Japan.

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22© 2019 Toshiba Electronic Devices & Storage Corporation

RESTRICTIONS ON PRODUCT USE• Toshiba Electronic Devices & Storage Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related

hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if

reproduction is without alteration/omission.• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing

adequate designs and safeguards for their hardware, software and systems which Minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.

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• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

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