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Request for Proposal (RFP)Doc.No: SCG-SCOS-PCU-RFP-2018-01

Issue Date: 01-May-2018

Development, Fabrication, Testing and Realisation of Power Control Unit

Issue: A Rev: 00Page i of vi

Request for Proposal (RFP)Development, Fabrication, Testing and Realisation

of Power Control Unit

May, 2018

SPACECRAFT CHECKOUT GROUPU R RAO SATELLITE CENTRE, BANGALORE

Committed to Total Quality in Spacecraft Checkout systems and Spacecraft Checkout Operations

SCG, URSC




Issue: A Rev: 00Page ii of vi

Contents

SL. NO. DETAILS PAGE NO.

SECTION – 1

1 Scope 1

1.1 Introduction 1

2 Statement of work 1

2.1 Definition of work - fabrication 2

2.1.1 Procurement of components 2

2.1.2 Procurement of DC-DC modules 3

2.1.3 Fabrication of PCB 3

2.1.4 Fabrication of equipment 4

2.1.5 Fabrication guidelines 4

2.2 Definition of work- testing 5

2.2.1 Testing of modules 5

2.2.2 Testing of equipments 7

2.2.3 Burn-in test 7

3 Bill of Material 8

4 Vendor capability 8

4.1 Infrastructure 8


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Issue: A Rev: 00Page iii of vi


4.2 Instrumentation 9

4.3 Manpower 9

4.4 Experience 9

4.5 Responsibility of vendor 9

4.5.1 Focal point 9

4.5.2 Interaction with focal point 9

4.5.3 Schedule planning 10

4.5.4 Status reporting 10

4.5.5 Compilation of test results 10

4.5.6 Log books, folders and file maintenance 10

4.5.7 Review, Approval and Acceptance 10

4.5.8 Anomaly reporting 10

5 Safety precautions 11

6 Delivery policy 11

7 Payment procedure 12

8 Warranty and spares 12

9 Confidentiality 12

10 List of deliverables by vendor 13

11 List of inputs to vendor by URSC 14

12 Compliance 14

13 General 14


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Issue: A Rev: 00Page iv of vi


SECTION – 2

1 Introduction 23

1.1 Overview and specification 23

2 PCB fabrication 24

2.1 Power Converter card 25

2.2 Main card 25

2.3 Relay card 26

2.4 Front Panel LED card 26

2.5 Front panel LCD card 27

2.6 Keypad card 27

2.7 Front panel Micro-Controller card 28

2.8 Fan failure detection card 28

3 Mechanical fabrication 29

3.1 Mechanical housing 29

3.2 Front panel and rear panel 29

3.3 Guidelines for markings in equipment panels 35

4 Card level testing 36

4.1 Power converter card 36

4.2 Main board 36

4.3 Relay card 39

4.4 Front panel LED card 40


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Issue: A Rev: 00Page v of vi


4.5 Front panel LCD Board 40

4.6 Front panel keyboard card 41

4.7 front panel micro-controller card 41

4.8 Fan failure detection card 41

5 Unit wiring list 42

6 Integrated unit level test procedures 60

6.1 Main card related signals verification 60

6.2 Relay card related signal verification 67

6.3 Thruster pulse acquisition verification 71

Annexure

Annexure – A PCBs 70

Annexure-B Bill of Material 84

Annexure-C Fabrication guidelines 98

Annexure-D ESD control guidelines 100

Annexure-E List of Spare Components 102

Tables

Sec-1 Table-1 Vendor Compliance 15

Sec-1 Table-2 PCU Specifications 19

Sec-2 Table-1 to 15 PCU Wiring List 44


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Issue: A Rev: 00Page vi of vi

SECTION-1


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Issue: A Rev: 00Page 1 of 103

1. SCOPE

This document provides information on nature and details of work involved in “Fabrication,

Testing and Realization of Power Control Unit.

1.1 INTRODUCTION

Power Control Unit, in short called as PCU, is an embedded design using multiple

microcontrollers, housed in a 2U sub rack and is powered from AC 230 Volts source.

The main features of PCU are as follows:

Provides remote interface on RS-485 for automated operations

Controls and monitors Power Simulator output relays

Provides control signals and monitors their status

Provides measurement and monitoring of analogue and digital signals

Acquires Pulse signals and processes to calculate pulse parameters

Data related to critical power parameters are continuously transferred on to a dedicated serial

port (RS-485)

PCU can be operated in LOCAL mode or REMOTE mode. In REMOTE mode, External

Controller controls the unit. Front panel key board and display are used to facilitate Local

mode of operation.

PCU will be put into Local LOCK mode automatically if there is no key depression for a

minute. To Unlock Up and Right Keys are to be pressed simultaneously.

PCU front panel displays important analog & digital parameters

The specifications, hardware details, testing and realisation of PCU are covered in detail in the

subsequent chapters.

2. STATEMENT OF WORK

This section provides nature of work and the responsibilities of the vendor involved in

“Development, Fabrication, Testing and Realization of Power Control Unit”.

The major activities are as listed below:


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Realisation and delivery of the complete product, 10 numbers of PCUs

Study and understanding the fabrication details of PCU

Procurement of components/ modules, PCB fabrication, component assembly & testing,

module interconnection & fabrication of first unit.

Vendor shall fabricate first unit, and get approval from URSC at two stages

Stage 1: After fabrication of all PCBs and mechanical enclosure Stage 2: After integration and wiring of complete unitInspection of first unit for its workmanship by URSC, and clearance for further activities

PCB card level & unit level testing as per RFP, including 168Hrs burn-in and delivery of

the first unit.

First unit acceptance test at URSC with vendor participation and clearance from URSC for

the realisation of remaining units

Realisation, testing and delivery of remaining 9 numbers of units

Acceptance test at URSC with vendor participation for all the remaining units

2.1 DEFINITION OF WORK- FABRICATION

Vendor shall procure the components and modules required to fabricate the Power Control Unit.

All the components and modules, wherever applicable, shall undergo standalone test, before

proceeding for equipment fabrication. The following sections explain the responsibilities of vendor

in detail. The work prescribed shall be carried out at vendor facility.

2.1.1 PROCUREMENT OF COMPONENTS

a. Shall procure the components as per Bill of material given by URSC. Refer Annexure-B,

BoM -1 to 11. Shall procure components as per list of Spares (ref Annexure-E)

b. The required quantity of EL215 relays for the units will be supplied by URSC. They will

be mounted on to the PCBs by vendor after delivery of units to URSC. And hence EL215

component for the indented units shall not be considered by the party for quotation.

c. In case any of the components are obsolete, the vendor shall obtain approval from URSC

for procuring equivalent components.


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d. Shall procure components from OEM or their authorized dealers only.

e. Shall procure the interconnection wire as listed in the section2, Chapter-5

2.1.2 PROCUREMENT OF DC-DC MODULES

a. Shall procure the DC-DC modules as per Bill of material given by URSC. Refer section 3

(Bill of Material).

b. Shall procure Modules from OEM or their authorized dealers only.

c. Licenses and warranty provided by OEM/authorized dealers shall be submitted to URSC.

d. Vendor shall obtain adequate Warranty from OEM, to meet URSC warranty requirements

provided in the section 8 (Warranty & Spares).

2.1.3 FABRICATION OF PCB

a. Vendor shall fabricate the following PCBs. The Gerber files will be given by URSC after

the release of the Purchase Order.

Power Converters Card Main Card Relay Card Front Panel LED Card Front Panel LCD Card Front Panel Keypad card Front Panel Micro-Controller Card Fan Failure Detection Card

b. The required quantity of EL215 relays for units will be supplied by URSC. They will be

mounted on to the PCBs by vendor after delivery of units to URSC.c. Vendor shall follow PCB Assembly guidelines provided in Section-2, Annexure-Cd. Vendor shall follow ESD handling guidelines provided in Section-2, Annexure-D

e. Vendor shall maintain a folder for each card being fabricated

f. Any deviations, anomalies observed shall be logged and to be submitted for review by

URSC

g. Vendor shall fabricate the required number of PCBs as per RFP


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2.1.4 FABRICATION OF EQUIPMENT

a. Vendor shall study the equipment layout as given in Section-2 Chapter-3

b. Procurement of enclosure (sub-rack) as per Section-2 Chapter-3

c. Fabrication of Front & Rear panels as per Section-2 Chapter-3

d. Vendor shall mechanically fix PCBs/ modules/ Components on the chassis and

interconnect as per the wiring details given in Section-2 Chapter-5

e. Vendor shall procure the wire and carry out the harness fabrication as per wiring details

given in Section-2 Chapter-5

f. Vendor shall follow the guidelines provided in Section-2 Chapter-3, for Logos and

markings in equipment panels

g. Vendor shall follow ESD handling guidelines provided in Section-2, Annexure-D

h. Vendor shall fabricate the required number of Equipment enclosures as per RFP

2.1.5 FABRICATION GUIDELINES

a. ESD control guidelines as per Section-2, Annexure-D

b. Vendor facility will be audited against above requirements, before placing the purchase order.

Compliance to ESD guidelines is mandatory.


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2.2 DEFINITION OF WORK- TESTING

Vendor shall carryout Module/Card level, Equipment level and Integrated System level

testing. Section-2, Chapter-4 and Chapter-6 gives the test setup and the detailed Test Procedure.

The embedded software will be provided by URSC. Module/Card level, Equipment level testing is

carried out at vendor facility. Integrated system level & acceptance tests are carried out at URSC

with Vendor participation.

The detailed test procedures along with acceptance and rejection criteria are provided by

URSC. Vendor shall carryout suggestions / modifications to correct the unit for anomalies

observed during acceptance test at URSC for first unit. The suggestions / modifications may call

for minor change in components and PCB CAD files. These modifications shall be adopted for all

the remaining units including the first unit. During approval stages, URSC will provide technical

assistance to the vendor.

2.2.1 TESTING OF MODULES

Following modules shall be tested in standalone mode, before using it for equipment fabrication.

Detailed test procedures for each of these modules as provided in Section-2, chapter-4. Vendor

shall carryout these tests and records the test results in the specified format. Vendor shall log the

test conditions, test results and report deviations to the URSC focal point and proceed only after

necessary clearance. After completion of the test on each module, the results are to be reviewed

and approved by URSC. All the details of the test equipment used such as model number, serial

number, make etc are to be recorded.

Each of Power Control Unit requires fabrication of eight different PCBs. The PCBs to be

fabricated are:

1. Power Converters Card: The domestic power supply required for power all the other

cards of Power Control Unit are derived from this card. Input to this card is 24V, DC and

generates all the required output supply using five DC-DC converters.2. Main Card: This card houses two ADuC7077 and one Dall micro-controller, and does 21

channel analog data acquisition, pulse processing and Relay control signal generation.


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3. Relay Card: This card generates control signal to Power Relays using MOSFET switch,

and reads the status of Relays.4. Front Panel LED Card: Indicates the status of Relays.5. Front Panel LCD card: 20 x 4 LCD display for user interface.6. keypad Card: 5 key keypad facilitates local mode of operation.7. Front Panel Micro-Controller Card: Facilitates communication between User interface

and other cards (Main and Relay Cards through RS485).8. Fan Failure Detection Card: Detects Fan failure

The test procedure for testing individual card/module as listed below.

Sl. No Module / PCB Name Module Test document

1. Power Converters Card Refer Section -2, Chapter 4.1

2. Main Card Refer Section -2, Chapter 4.2

3. Relay Card Refer Section -2, Chapter 4.3

4. Front Panel LED Card Refer Section -2, Chapter 4.4

5. Front Panel LCD card Refer Section -2, Chapter 4.5

6. keypad Card Refer Section -2, Chapter 4.6

7. Front Panel Micro-Controller Card Refer Section -2, Chapter 4.7

8. Fan Failure Detection Card Refer Section -2, Chapter 4.8

In a nut-shell, the test set-up and the environment are to be recorded in detail for the in-depth

analysis in case of any requirement to simulate an identical situation in the future.

2.2.2 TESTING OF EQUIPMENTS

Vendor shall carryout testing of Power Control Unit and produces the test results as provided in

Section-2, chapter-6. Vendor to carry out the testing activity of PCU as follow

All the cards and the integrated first unit to be tested at vendor’s place. Generation of test

results and anomaly report (if any) by vendor, to be submitted to URSC for review.

Qualification of first unit of PCU with simulation of actual interfaces (as per the

Acceptance Test Procedure) shall be carried out thoroughly with vendor participation at

URSC.


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Review of Acceptance test results and Clearance by URSC.

Fabrication, Integrated testing and Acceptance testing for the remaining units

2.2.3 BURN-IN TEST

a. Vendor shall carryout burn-in test (168 HRs – for all systems) of Power Control Units

and deliver the units along with test data

b. Vendor shall complete the testing adhering to guidelines, test setup and test procedures

provided in Section-2.


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3. BILL OF MATERIAL

Bill of material for ONE quantity of POWER CONTROL UNIT is given below.

S No Description Quantity

1. 2U Chassis 1 no Refer Annexure-B, BoM-1

2. Power Converters PCB 1 no Refer Annexure-B, BoM-2

3. Main Card PCB 1 no Refer Annexure-B, BoM-3

4. Relay Card PCB 1 no Refer Annexure-B, BoM-4

5. Front Panel LED Card PCB 1 no Refer Annexure-B, BoM-5

6. Front Panel LCD card PCB 1 no Refer Annexure-B, BoM-6

7. keypad Card PCB 1 no Refer Annexure-B, BoM-7

8. Front Panel Micro-Controller Card PCB 1 no Refer Annexure-B, Bom-8

9. Fan Failure Detection Card PCB 1 no Refer Annexure-B, Bom-9

10. Front Panel Components 1 set Refer Annexure-B, Bom-10

11. Rear Panel Components & Power supply 1 set Refer Annexure-B, Bom-11

4. VENDOR CAPABILITY

4.1 INFRASTRUCTURE

Vendor shall have fabrication lab with temperature and humidity control to carryout fabrication

and testing. Also contamination control shall be provided. ESD working environment for

assembling the electronic units shall be present with the firm which is quoting. Hiring others

facility is not acceptable.


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4.2 INSTRUMENTATION

Vendor shall have calibrated instruments to carryout testing. Major equipments are:

Function Generator

Oscilloscope

Multi-meter

Calibrator

ESD protected soldering station

In addition, fabrication lab with temperature controlled soldering station and accessories, de-

soldering pumps shall be available.

4.3 MANPOWER

Vendor shall have the manpower expertise in

Micro controller design and testing

Digital circuits design

4.4 EXPERIENCE

Vendor shall have prior experience in the same area. Shall have supplied similar equipment to

govt. / public sector organization.

URSC engineers may visit the vendor facility to evaluate the vendor capabilities.

4.5 RESPONSIBILITIES OF VENDOR

4.5.1 FOCAL POINT

Vendor shall identify a focal point for all communications/instructions to have better

management. Similarly, URSC will identify an officer to communicate with vendor.

4.5.2 INTERACTION WITH FOCAL POINT

Vendor focal point shall regularly interact with the identified URSC focal point for any

clarifications during realization process and to accomplish the tasks in scheduled periods.


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4.5.3 SCHEDULE PLANNING

Schedule plan will be made by vendor and discussed with the URSC focal point / representatives

and the same is to be implemented without any slippage. Schedule plan will be made available to

all concerned.

4.5.4 STATUS REPORTING

Status report on fabrication, testing and documentation to be submitted for review once in 15 days

to the URSC focal point.

4.5.5 COMPILATION OF TEST RESULTS

Vendor shall compile all the test results both at card level & unit level and assist in analyzing the

compliance. All the results are to be recorded and to be systematically documented. The compiled

test results should be discussed with focal point / Division Head before concluding the analysis

and documentation.

4.5.6 LOG BOOKS, FOLDERS & FILE MAINTENANCE

All log books, test procedures, test results, individual card folders and files to be maintained and to

be submitted to URSC along with hardware.

4.5.7 REVIEW, APPROVAL & ACCEPTANCE

After execution of the jobs assigned, the vendor shall present all the documents for review by

URSC for approval and acceptance. Focal point / representative reserves the right to witness

testing of any card or unit at the vendors premises as and when required.

First unit acceptance test results shall be reviewed by URSC. Acceptance criteria will be based on

meeting specifications given by URSC.

4.5.8 ANOMALY REPORTING

Any deviation / anomaly observed during fabrication or testing must be logged and reported to the

URSC focal point and shall proceed only after clearance by URSC.


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5. SAFETY PRECAUTIONS

The personnel of vendor must adhere to all the safety guidelines while handling components,

cards, modules while testing and transportation. For ESD sensitive devices, relevant precautions

have to be taken while handling. The personnel of vendor must adhere to soldering temperature

control guidelines while soldering the components.

6. DELIVERY POLICY

After reception of the purchase order, vendor shall supply 10 Nos. of POWER CONTROL UNITS

as per the table listed below

Sl.No.

Activity

Time Line

(End of ActivityDate)

Remarks

1. Reception of Purchase order To

2. Schedule Plan submission by vendor T0 + 15 days

3. Inspection of fabricated PCB and Mechanical enclosure for First Unit

T0 + 45 days 1½month from P.O release

4. Inspection of fabricated First Unit T0 + 60 Days 2 months from P.O release

5. First unit delivery to URSC with 168Hrs Burn-in test at vendor place

T0 + 75 days 2½ months from P.O release

6. First unit acceptance test completionat URSC & clearance for further activity

T0 + 90 days 3 months from P.O release

7. Delivery of 9 units T0 + 150 days 5 months from P.O release

(2 months from acceptance of First Unit)

8. Acceptance test of 9 units at URSC T0 + 180 days 6 months from P.O release


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7. PAYMENT PROCEDURE

(Refer purchase for details)

8. WARRANTY AND SPARES

WARRANTY

Vendor shall provide warranty and spares as given below

One-year standard warranty for hardware and components from the date of delivery.

SPARES

Spares to be delivered are listed at Annexure-E. Spare components to be quoted separately.

9. CONFIDENTIALITY

All documents prepared for fabrication, test procedures, log books, drawings, schematics and any

other communications, codes revealed during the process of testing will be exclusive property of

URSC and vendor shall have no right what so ever on them. These documents are to be strictly

confidential and should not be reproduced, copied/transmitted to any media without explicit

permission of URSC. Further, the vendor must not quote any of these works in any publications or

to any of their customers without explicit permission from URSC and adhere to strict

confidentiality.

10. LIST OF DELIVERABLES BY VENDOR

Following materials shall be delivered for successful completion of the work.

Sl. No. Description Remarks

1 Power Control Unit Fully fabricated and tested unit as per RFP

2 Power Cord 3 core power cord cable of 2-meter length

End connector details:

3 Pin MS Connector one side (MS-3106F 10SL-3S);

Standard 230V, 5A, 3 Pin Plug on the other side


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Sl. No. Description Remarks

3 Telescopic Slide Accuride Make (Accuride 08078) 2 set of slide with rack mounting flanges

4 RS485 cable 6 core cable of 2 meter length with 9 pin D-Type Plug to Socket connector terminations

5 Documents Fabrication history for each card and Module

Log books & Analysis report Document

Each module and equipment level test reports

Burn-in test report

6 Spares Ref Annexure-E, to be quoted separately

7 PCB Gerber files,Mechanical drawings

- system layout,

- Module fabricationdrawing

- Front and back panels

All updated files

8 Licenses and warrantycertificates

- Vendors warranty

- obtained from parties/OEM for modules/parts


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11. LIST OF INPUTS TO VENDOR BY URSC

URSC will provide the vendor with the following design details and test software to enable them

to execute the work. These details are intellectual property of URSC and shall be used only for the

work specified in this RFP.

Sl. No. Description Quantity

1. PCB Gerber files Eight Cards

2. Request for proposal containing Technical and procurement details

Comprising scope of work, Individual card details,Bill of material, card level test procedures andintegrated unit level test procedure.

3. Test Software - Hex file for all the micro-controllers.- Down-loader Software for Micro-controllers

4. Approvals By respective focal point, design team andExecutives

12. Compliance

It is mandatory to provide Vendor Compliance as listed above (including Table-01)

and PCU specification compliance (as per Table -02) while submitting quotation.

Quotations without compliance for all the above listed points and Tables-1 & 2

will be rejected.

13. GENERAL

Vendor may contact URSC for any technical clarification during realization of

the units.

URSC has the right to reject the unit and offer, if it is not meeting technical

specifications /general terms and conditions.


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TABLE-1: VENDOR COMPLIANCE

Sl.No.

Parameter Specifications Compliance /Details

1. Company profile

2. Annual turnover of the company/firm which is quoting

Shall be greater than 3 Crores INR for past 2 to 3 years. Providethe supporting document.

3. Availability of qualified manpower for allotment to the said job

Electronics Engineers – more than 5 persons

Minimum domain experience: more than 2 yrs

Soldering & Wiring technicians- more than 3 persons

Mechanical Technician- more than 3 Person

Skilled technicians in QC- more than 1 person

Administration and support - more than 2 person

Brief resume of each person’s employed in the firm shall beprovided along with the quotation. State their domainexperience, Years of experience, qualifications clearly onrequest. Failing, which the quotation will be rejected.

4. ESD working environment for Provide supporting document with photographs of the facility.


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Sl.No.


assembling the electronic units shallbe present with the firm which isquoting. Hiring other's facility is notconsidered.

URSC shall visit and review the lab facilities if necessary. Offerwill be rejected, if Non- compliance to lab working environment.

5. Availability of electronic fabricationinstruments. Parties shall attach thelist of the instruments substantiatingthe capability to execute theassigned work.

Temperature controlled Soldering Irons- more than 4 Nos

Wire strippers- more than 4 Nos

Wire Cutters- more than 4 Nos

De-soldering pumps- more than 2 Nos

Personal Computer- more than 2 Nos

Oscilloscopes - more than 2nos

Resistive Load

Signal generator – more than 1No

Multi-meters- more than 2 Nos

Calibrator - more than 2 Nos

Provide supporting documents

6. Space availability for fabrication,testing and Burn-in test

More than 5000Sq.ft lab facility area for unit fabrication, testingand burn-in test on multiple units simultaneously.


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Sl.No.


7. Similar Electronics domain projectsundertaken to realise equipments/units by the firm

Provide purchase order & job completion copies and briefdescription of the item. It is to note here that, prior electronicsdomain experience in realising at least three projects is essential.If not, the firms will be rejected.

Demonstration of similar products Vendor to demonstrate similar products if requested by URSCafter submission of quotation. Failing which the offer will berejected.

8. Delivery terms and conditions. Party shall realise a proto-model and offer for Inspection, Test,Evaluation and Suggestions from URSC.

After clearance of the first article only party has to further go-ahead with the fabrication.

9. Burn-In test (168 Hrs continuousloading at NTP) capability

Availability of suitably rated Electricity

Rheostats

Round the clock electrical parameters monitoring of the unitsunder burn-in test

Facilitation Temperature measurement of units

10. Mechanical fabrication to house therealised unit and shall be rack mount

Provide earlier purchase order details in realising such enclosures,also provide the photographs.


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Sl.No.


compatible.

11. Secrecy and Security All documents prepared for fabrication, testprocedures, log books, drawings, schematics and anyother communications revealed during the process ofrealisation will be exclusive property of URSC andare to be strictly confidential. It should not bepublished anywhere or quoted to any customerwithout explicit permission from URSC.


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TABLE-2: POWER CONTROL UNIT (PCU) SPECIFICATIONS

The table below lists the detailed specifications of the unit. The fabricated unit as per description in

this document shall adhere to these specifications.

Sl.No.

Technical Specifications of Power Control UnitCompliance

/ Details

1. External Interfaces

1.1 Rear Panel

1.1.1 AC Main Input

230V AC,50Hz. Connector: 3 pin MS Circular Connector, Plug

1.1.2 Remote control (J4) RS485 at 9600 Baud, 9 Pin D-Type Socket

1.1.3 BPMS (J5)

RS485 at 115200 Baud, 9 Pin D-Type Socket

1.1.4 Umbilical Related Signal -J1 25 Pin D-Type Socket

1.1.5 Thruster and Analog signals (J2)

50 Pin D-Type Socket

1.1.6 SDU Control and Monitoring(J3)


1.1.7 BHC-AC Control and Monitoring (J7)


1.1.8 Optional (J6) 9 Pin D-Type Socket

1.1.9 Fuse (for AC Mains) 5 A, Socket

1.1.10Cooling Fan

Fan (KD2406PTS 1, 13.A. GN) DC 24V,1.4W

1.2 Front Panel

1.2.1 Power Switch Elcom IRS-1 ,4A 250V

1.2.2 BAS/BAT SEL DIS Control Switch

Toggle switch

1.2.3 LED Display Panel

1.2.3.1 Relay Status Indicators 44 LEDs

1.2.3.2 Battery Voltage Display 4×2, 7 Segment Display

1.2.4 LCD Display and Key Pad


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Sl.No.


/ Details

1.2.4.1 LCD Display 20×4 Alphanumeric Display Panel

1.2.4.2 Key Pad 5 Keys Membrane Key Pad

1.3 Mechanical Housing

1.3.1 Standard 19” Rack Mountable Sub-rack

Industrial standard 2U sub-rack with Telescopic slides for mounting

1.3.2 Rack Mounting Telescopic Slides

Accuride 08078 Telescopic Slide Set

1.3.3 Front Panel Handle with arresting holes

1 set

Individual Card Specifications

2.1 Power Supply (SMPS) AC to DC Converter, HWS150A-24/A

2.1.1 Input AC85-265V (47-63Hz) or DC120-370V

2.1.2 Output DC 24V, 6.5A

2.2 Power Converters Card

2.2.1 Input +24V, Connected via Through Holes

2.2.2 Output 25 Pin, D-Type Connector (Plug/Socket)

2.2.3 DC-DC Converters 5 Numbers

2.2.3.1 24V to +5V CC6-2405SF-E, 2 Numbers

2.2.3.2 24V to -5V CC3-2405SF-E, 1 Number

2.2.3.3 24V to 28V HQA2W085W280V-N07-S, 2 Numbers

2.3 Main Card

2.3.1

Analog Channels

Bipolar: -5 to +5V, 10 Channels

Single ended: 0 to 80V, 10 Channels

Differential: 0 to 80V, 3 Channels

TOTAL 23 Analog channels

2.3.2

Micro-controller

Make: Analog Devices Part No: ADuC7026 (2 Nos)

Make: Dallas Part No: DS89C430-QNL (1 Nos)


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Sl.No.


/ Details

2.3.3 Digital Monitoring 16

2.3.5 Relay Control 14 MOSFET Relays

2.4 Relay Card

2.4.1 Micro-controller Make: Dallas, Part No: DS89C430-QNL

2.4.2 External Interface RS485 Interface

2.4.2.1 Switch Supply and Control lines

50 Pin, D-Type (Socket/Plug)

2.4.2.2 Card Supply and Spare Control lines

25 Pin, D-Type (Socket/Plug)

2.4.2.3Switch

OMRON Switches (Make: OMRON, Part No: OMRON-61BR 91-7), 64 Nos

2.5 Front Panel LED card

2.5.1 Relay Status Indicators

44 LEDs:- 5mm Bi-colour LEDs (6 Nos), 5mm RED LEDs (24 Nos), 5mm Green LEDs (8 Nos) ,5mm Yellow LEDs(6 Nos)

2.5.2 Battery Voltage Display

4×2, 7 Segment Display (18×13 mm), Redcolour

2.5.3 7 Segment Display Driver ICM7218AIJI

2.6 Front Panel LCD and keypad Card

2.6.1 LCD Display Panel 20×4 Alphanumeric

2.6.2 Keypad 5 Keys (Up, Down, Right, Left and Enter)

2.7 Front Panel Micro-Controller Card

2.7.1 Micro-controller Make: Dallas, Part No: DS89C430-QNL

2.7.2 External Interface RS485 Interface

2.7.3 Interface to LCD and keypadcard

FRC Connector

2.8 Fan Failure detection Card

2.8.1 Heating element Resistor

2.8.2 Temperature detection Diode


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SECTION-2

POWER CONTROL UNIT

FABRICATION DOCUMENT


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Chapter -1

1.0 INTRODUCTION

1.1 Overview and Specifications

Power Control Unit (PCU) is a segment of Spacecraft Checkout System (SCS) having major

functions of control and monitoring on-board spacecraft signals and control of Power

Simulators output relays. This unit is an embedded system designed using multiple

microcontrollers enclosed in a 2U 19” standard sub rack.

The fabrication and testing of this unit involves following:

- Procurement of components.- Fabrication of eight different PCBs (as described in Section-2, Ch-2: PCB Fabrication

and Annexure-A).- Testing of the individual cards (as described in Section-2, Ch-4: Card Level Testing)- Fabrication of metallic enclosure (Refer Section-2, Chapter-3)- Unit assembly and internal wiring (as described in Section-2, Ch-5: Unit wiring list).- Unit level testing (as described in Section-2, Ch-6: Integrated Unit Level Test

Procedures) and calibration of analog monitoring channels.- Test report preparation, and compilation of anomalies and failures observed during

testing.

Detailed specifications of the unit are listed in Section-1, Table-2


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Chapter -2

2.0 PCB FABRICATION

Each of Power Control Unit requires fabrication of eight different PCBs. The PCBs to be

fabricated are:

1. Power Converters Card: The domestic power supply required for power all the

other cards of Power Control Unit are derived from this card. Input to this card is

24V, DC and generates all the required output supply using five DC-DC converters.2. Main Card: This card houses two ADuC7077 and one Dall micro-controller, and

does 21 channel analog data acquisition, pulse processing and Relay control signal

generation.3. Relay Card: This card generates control signal to Power Relays using MOSFET

switch, and reads the status of Relays.4. Front Panel LED Card: Indicates the status of Relays.5. Front Panel LCD card: 20×4 LCD display for user interface.6. keypad Card: 5 key keypad facilitates local mode of operation.7. Front Panel Micro-Controller Card: Facilitates communication between User

interface and other cards (Main and Relay Cards through RS485).8. Fan Failure Detection Card: to detect fan failure


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2.1 PCB Fabrication – Power Converter Card

PCB specifications are as follows:

1. PCB dimension (outline): 6.1*72. PCB Thickness:2.5 mm + 0.15mm3. Base material: High Tg FR44. PCB Type: MLB (2 Layer)5. Solder mask & Silk Screen: YES (S.M to be epoxy green color 17.5u microns

thickness)6. Type of protective plating: TIN LEAD7. Copper Thickness: Layer1-105u Layer 2-105u.

The Power Converter Card is a 2-layer board. The Gerber files necessary for the fabrication

of PCB will be provided. For component placement and layer details refer Annexure A-1.

2.2 PCB Fabrication – Main Card


1. PCB dimension (out line): 266.7*203.202. PCB Thickness:2.50 mm + 0.15mm3. Base material: High Tg FR44. PCB Type: MLB (4 Layer)5. Solder mask & Silk Screen: YES (S.M to be epoxy green color 17.5u microns

thickness)6. Type of protective plating: TIN LEAD7. Copper Thickness: Layer1-70u, Layer 2-105u, Layer 3-105u, Layer 4-70u

The Main Card is a 4-layer board. Layer 1 and 4 comprise of the routed signal, while layer 2

and 3 are dedicated for ground and power planes. The Gerber files necessary for the

fabrication of PCB will be provided. For component placement and layer details refer

Annexure A-2.

2.3 PCB Fabrication – Relay Card


1. PCB dimension (outline): 9*5.5002. PCB Thickness:3 mm + 0.15mm3. Base material: High Tg FR44. PCB Type: MLB (2 Layer)


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5. Solder mask & Silk Screen: YES (S.M to be epoxy green color 17.5u microns

thickness)6. Type of protective plating: TIN LEAD7. Copper Thickness: Layer1-70u, Layer 2-70u

The Relay Card is a 2-layer board. The Gerber files necessary for the fabrication of PCB will

be provided. For component placement and layer details refer Annexure A-7.

2.4 PCB Fabrication – Front Panel LED Card


1. PCB dimension (outline): 22.1cm*6cm2. PCB Thickness:2.50 mm + 0.15mm3. Base material: High Tg FR44. PCB Type:2 Layer Board5. Solder mask & Silk Screen: YES (S.M to be epoxy green color 17.5u microns


The Front Panel Card is a 2-layer board. The card has signals routed on either sides and does

not carry high current. The connectors of this card are mounted on the bottom side (layer 2),

while the 7-segment display, LEDs and switches are mounted on top side (layer 1). The

Gerber files necessary for the fabrication of PCB will be provided. For component placement

and layer details refer Annexure A-5.

2.5 PCB Fabrication – Front Panel LCD card


PCB dimension (outline): 9.9cm*6cm PCB Thickness:2mm + 0.15mm1. Base material: High Tg FR42. PCB Type:2 Layer Board3. Solder mask & Silk Screen: YES (S.M to be epoxy green color 17.5u microns



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The Front Panel LCD Card is a 2-layer board. Layer 1 and 2 are dedicated for ground and

power planes. AC Live and Neutral are also provided to the converters through planes. The

gerber files necessary for the fabrication of PCB will be provided.

2.6 PCB Fabrication – keypad Card


1. PCB dimension (out line): 6cm X 3.5cm2. PCB Thickness:2mm + 0.15mm3. Base material: High Tg FR44. PCB Type:2 Layer Board5. Solder mask & Silk Screen: YES (S.M to be epoxy green color 17.5u microns


The keypad card is a 2-layer board. The Gerber files necessary for the fabrication of PCB will

be provided. For component placement and layer details refer Annexure A-6.

2.7 PCB Fabrication – Front Panel Micro-Controller Card:


1. PCB dimension (outline): 15.1cm*6cm2. PCB Thickness:1.70 mm + 0.15mm3. Base material: High Tg FR44. PCB Type:2 Layer Board5. Solder mask & Silk Screen: YES (S.M to be epoxy green color 17.5u microns


The Front Panel Micro-Controller card is a 2-layer board. The gerber files necessary for the


Annexure A-3.

2.8 PCB Fabrication – Fan Failure Detection Card:


1. PCB dimension (outline): 1*3


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2. PCB Thickness:1.50 mm + 0.15mm3. Base material: High Tg FR44. PCB Type:2 Layer Board5. Solder mask & Silk Screen: YES (S.M to be epoxy green color 17.5u microns


The Fan Failure Detection Card is a 2-layer board. The gerber files necessary for the


Annexure A-4.


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Chapter - 3

3.0 Mechanical Fabrication

PCU is housed in a 2U sub-rack having telescopic slides for rack mounting and front handle

for handling of the unit. The fabrication of front and rear panel’s cut-outs and screen printing

are to be carried out as per fig-3.1 to 3.5. The mechanical fabrication details are given below.

3.1 Mechanical Housing:

- The unit has to be realized in 2U size, 19” standard sub rack

- Rack mounting Aluminium chassis with 424mm width x 560mm depth.

- Top and Bottom cover plates with 2mm thickness

- Mounting plate: 2.0mm thickness, MS type

- Front and rear panel: 3.0mm thickness

- Side plate: 2.0mm thickness

- Sub-rack to be provided with Accuride made telescopic slides (Accuride

08078 Telescopic Slides Sets) with Rack mount brackets

- Unit size is including top and bottom plate

- Aluminum rods or plated steel rods shall be used for fastening and building up

strengths to the housing.

Operating temp: 15 deg C to 50 deg C

Humidity: 80% approx (Max.)

Base-Plate detail

For providing mechanical stiffness, add-on boards are assembled on a rigid plate called

‘Base-Plate’. Along with base plate, the unit top cover plate and bottom plate drawings are as

given below.

3.2 Front panel and Rear panel

The cut-out and screen printing drawings are listed in the following figures. Detailed Bill

of Material for front and rear panels are given in BoM-10 & 11 respectively.


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Figure-3.1: The Base plate drawing


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Figure-3.2: Top cover plate drawing


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Figure-3.3: Bottom cover plate drawing


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Figure-3.4: Front and Rear panel cut-out drawings


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Figure-3.5: Front panel and Rear panel screen print drawing


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3.3 Guidelines for markings in equipment panels

The ‘ISRO logo’ and the entity name (‘SCG/URSC, Bangalore’) shall be shown prominently on

the front panel of each equipment.

Vendor name and logo can be placed in back panel, if required.

The panel sticker design shall be submitted to URSC for approval, before printing.

Unique Serial numbers for the equipment shall be obtained from URSC. Serial number shall be

on the front and back panel.


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Chapter-4

Card Level Testing

This chapter discusses in detail the test procedure for individual cards. Test engineer is

required to capture waveforms and note down essential readings as per the requirement of the

test. Prior to unit level integration, the functionality of the card shall be verified by loading

the URSC supplied programs. The procedure for the same is briefed in this chapter. The

necessary circuit schematics will be provided along with the Gerber files for reference.

Necessary ADC channel calibration for the Main Card is to be done at the system level

during integrated testing.

4.1 POWER CONVERTER CARD

After placement of all the components and DC-DC converters, apply 24V to input of this

card (as defined in the wiring list), and verify all output line voltages.

Input

Apply +24V to Tag-T7 w.r.t Tag-T8

Output

ISOVCC w.r.t ISOGND

VCC w.r.t DGND/AGND

ACDC_24V w.r.t DGND/AGND

-5V w.r.t DGND/AGND

4.2 MAIN BOARD

PROGRAM DOWNLOADING TO ANALOG ARM: The test routines can be downloaded to

the Analog ARM using JTAG or ICP Connector. The downloading procedures are as given

below.

ICP Downloading: To download the test routines to the Analog ARM through serial make

sure that the pins 2& 3 of both the jumpers JP11 & JP12 of the main board are shorted.

Connect the ISP-2 connector RM2 (4way relimate) of the main board to the CN2 connector

of the serial downloader board (99-23-05 VER-1.0) through 1:1 cable (which has both side


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female relimate). The 9 pin female DSUB connector CN1 of the serial downloader board is

connected to the COM Port of the computer through the RS 232c cross cable.

Procedure to use ARMWSD: To download the Test_U2. HEX file to the ARM (U2) through

serial port open ARMWSD.

- Press the configure button and in the parts panel select ADuC7027.

- In the same configure window select comms panel set the working com port at serial

port window, and also set baud rate as 9600 at Baud rate window

- Select the file to download by clicking on the browse button.

- Press the Start button.

On the main board short the serial download jumper JP17(Boot mode) and then short

JP18 (Reset) for a moment. Unshort both the jumpers, the downloading starts automatically

and it displays the progress bar. After complete download press the Run button to run the

downloaded program.

JTAG Downloading: To download the program to Analog ARM (U2) using JTAG, make

sure that the pin 1&2 of both the Jumpers JP17 & JP18 are not shorted. Connect the JTAG

Dongle to the box type connector CN10 (labelled as JTAG -2) using a 20 core Flat ribbon

cable.

DOWNLOADING TO THRUSTER ARM: The test routines can be downloaded to the

Thruster ARM using JTAG or ICP connector. The downloading procedures are as explained

below.

ICP Downloading: To download the test routines to the Analog ARM through serial make

sure that the pins 2& 3 of both the jumpers JP11 & JP12 of the main board are shorted.

Connect the ISP-2 connector RM2 (4way relimate) of the main board to the CN2 connector

of the serial downloader board (99-23-05 VER-1.0) through 1:1 cable (which has both side

female relimate). The 9 pin female DSUB connector CN1 of the serial downloader board is

connected to the COM Port of the computer through the RS 232c cross cable.

Procedure to use ARMWSD – To download the Test_U2. HEX file to the ARM (U2)

through serial port open ARMWSD.

Press the configure button and in the parts panel select ADuC7027.


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In the same configure window select comms panel set the working com port at serial

port window, and also set baud rate as 9600 at Baud rate window

Select the file to download by clicking on the browse button.

Press the Start button.

On the main board short the serial download jumper JP16 (BOOT code) then short

JP15 (Reset) for a moment. Unshort both the jumpers, the downloading starts automatically

and it displays the progress bar. After complete download press the Run button to run the

downloaded program.

JTAG Downloading: To download the program to Analog ARM (U2) using JTAG, make

sure that the pin 1&2 of both the Jumpers JP15 & JP16 are not shorted. Connect the JTAG

Dongle to the box type connector CN10 (labelled as JTAG -1) using a 20 core Flat ribbon

cable.

DOWNLOADING TO DS89C430: To download the test routines to the main board

controller DS89C430 use the Dallas Semiconductors’ MTK2 tool kit. Use an adapter (PCB

99-13-04 VER 1.0) which communicates between the System & the controller. One end of

the adapter is connected to the computer through Female to Female 9 pin DSUB cable where

the RX & TX lines are cross connected, the DTR & GND lines are connected to the

respective DTR & GND lines. Other end of the adapter is connected to the on-board

connector CN9 through a 10 core Flat ribbon cable.

(Note: While connecting the 10 core Flat Ribbon cable to CN9, make sure that pin-1 of the

FRC cable should match with that of the of CN9.)

Procedure to download:

1. Switch on the power supply.

2. Open the push MTK2 loader and select device DS89C430.

3. Press the push button switch of the adapter board 99-13-04.

4. From the window, select the target menu and press “open COM PORT at 9600 baud”

(cntrl+T)

5. Then again select the Target menu and press “Connect loader “(cntrl+L), the

following message will be displayed.


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DS89C430 loader VER- 2.1 copy right 2002Dallas semi-conductor.

6. Click on the file menu & select “Load Flash”, browse & select the file to be

downloaded i.e. test_U3, while loading the program message will be displayed with

file path as follows

*.HEX. Erasing Flash = > Completed.

Loading Hex File……….

Load complete.

When download is complete, release the push button of the adapter switch to reset the

controller. Close the MTK2 Window.

4.3 REALY BOARD

DOWNLOADING TO DS89C430: To download the test routines to the main board

controller DS89C430 use the Dallas semiconductor’s MTK2 tool kit. Use an adapter (PCB

99-13-04 VER 1.0) which communicates between the System & the controller. One end of

the adapter is connected to the computer through Female to Female 9 pin DSUB cable where

RX & TX lines are cross connected, the DTR & GND lines are connected to the respective

DTR & GND lines. Other end of the adapter is connected to the on-board connector J1

through a 10 core Flat Ribbon cable.

(Note: While connecting the 10 core Flat Ribbon cable to J1, make sure that pin-1 of the FRC

cable should match with that of the of J1.)


1. Switch on the power supply.

2. Open the MKT2 loader and select device DS89C430.


4. From the window, select the Target menu and press “open COM PORT at 9600 baud”

(cntrl + T)

5. Then again select the Target menu and press “connect loader” (cntrl+L), the following

message will be displayed

DS89C430 loader VER- 2.1 copy right 2002 Dallas conductor.

6. Click on the file menu & select “Load Flash”, browse & select the file to be downloaded

i.e. lcd_test, while loading the program message will be displayed with file path as follows


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*.HEX. Erasing Flash = > Completed.

Loading Hex File……….

Load complete.

7. When download is complete, release the push button of the adapter switch to reset the


4.4 Front Panel LED Card

Verify each LED indicators by simulating the output relay status (ON: Short, OFF: Open).

Also verify corresponding LED indicators by issuing EED-Disable Control, 35V Supply ON,

SNAP and Dry Loop signals. Similarly, Spare Relay Status also to be verified.

4.5 Front Panel LCD BOARD

Downloading to DS89C430: To download the test routines to the main board controller

DS9C430 use the Dallas Semiconductors’ MTK2 tool kit. Use an adapter (PCB 99-13-04

VER 1.0) which communicates between the System & the Controller. One end of the adapter

is connected to the Computer through Female to Female 9 pin DSUB cable where the RX &

TX lines are cross connected, the DTR & GND lines are connected to the respective DTR &

GND lines. Other end of the adapter is connected to the on-board connector J1 through a 10

core Flat Ribbin cable.

(Note: While connecting the 10 core Flat Ribbon cable to J1, make sure that Pin-1 of the

FRC cable should match with that of the of J1.)


1. Switch on the power supply

2. Open the push MTK2 loader and select device DS89C430.


4. From the window, select the Target menu and press “Open COM PORT at 9600 baud”

(cntrl+T)

5. Then again select the Target menu and press “Connect loader” (cntrl+L), the following

message will be displayed


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DS89C430 loader VER – 2.1 copy right @2002 Dallas semi conductor.

6. Click on the file menu & select “Load Flash”, browse & select the file to be downloaded

i.e. relay _test _uarto, while loading the program message will be displayed with file path

as follows

*.HEX . Erasing Flash = > Compleded

Loading Hex file ……..

Load complete.

7. When download is complete, release the push button of the adapter switch to reset the


4.6 Front Panel Keypad Card

Verify keypad interface to micro-controller by downloading supplied software. The Menu

selection and navigation is through these keys, hence by keying in various keys verify change

in LCD Display.

4.7 Front Panel Micro-Controller Card

Download supplied software to Front Panel Micro-controller card, and confirm LCD Display

showing “Power Control Unit” text. Also verify Keyboard and RS-485 interface to Main and

Relay card by issuing various commands in Local Mode and capture RS485 waveforms.

4.8 Fan Failure Detection Card

Simulate the Fan failed condition by removing power to Fan, and verify Fan Failure signal.


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Chapter-5

UNIT WIRING LIST

Individual tested cards are to mounted in the metallic enclosures as per the drawing supplied.

These cards are to be electrically interconnected for full functioning of PCU. The electrical

wiring details are described in this chapter.

The following compliance to be met by Vendor for wiring the unit.


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Parameter Specification

I. Wire specification

Wire Type Teflon PTFE Insulated Silver Plated Copper Wire

Conductor Stranded conductor made of Silver plated copper wire with a silver coating > 1.00 micron

Insulation Breakdown Voltage 600 Vrms Min

Conductor Tensile strength 303 N/mm2 Max

Operating temperature 00C to 50 0C

Conformance JSS 51034

II. sleeves

Material Polyolefin shrinkable sleeve with dia 1.6mm for connector contacts.

III. Interconnections

Power signal lines 20 AWG

Signal lines 22 AWG

IV. Connectors

Connectors Refer Annexure-B ; BOM-11

V. Fasteners, Card spacers, Washers, Connector fiximg screws, Turrets, Lugs

Use Industrial grade accessories

VI. Routing As per Fabrication guidelines

Note : Plastic materials shall not be used in the fabrication of theunit.

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Table-1

REAR PANEL SIDE CONNECTORS MAIN BOARD SIDE CONNECTORS

25 PIN SOCKET

REMAKRS CONNECTOR

PIN

No CONNECTOR

PIN

No REMAKRS

EED(Main) Disable Monitor. J1 1 CN1 11 SAC16

Bat-1 Vol . Mon +ve J1 2 CN1 2

Bat-1 Vol . Mon -ve J1 3 CN1 15

Bat- 1 K-Relay O/P J1 4 CN1 10

Monitor Return( SGRP-1) J1 5 CN1 1 SGRP1

Battery Select Control J1 6 CN2 10

Battery Simulator Select Cntrl J1 7 CN2 11

Return for BAS/BAT select J1 8 CN2 23

BAT/BAS-1 DR2- A select Mon J1 9 CN3 5

BAT/BAS-1 DR2- B select Mon J1 10 CN3 4

EED (Main) Disable Control live J1 11 CN2 12

EED (Main) Disable Control Ret J1 12 CN2 24

Spare 1 pole J1 13 CN3 8 Spare1 Pole

Spare 1 NO J1 14 CN3 20 Spare1 NO

EED(Redt.) Disable Monitor. J1 15 CN1 24 SAC17

Bat-2 Vol. Mon +ve J1 16 CN1 3

Bat-2 Vol. Mon -ve J1 17 CN1 16

Bat-2 K-Relay O/P J1 18 CN1 23

Monitor Return( SGRP-2) J1 19 CN1 14 SGRP2

BAT/BAS-2 DR2- A select Mon J1 20 CN3 17

BAT/BAS-2 DR2- B select Mon J1 21 CN3 16

EED (Redt.) Disable Control live J1 22 CN2 13

EED (Redt.) Disable Control Ret J1 23 CN2 22

UC-01 Mating Sts. J1 24 CN3 3

UC-02 Mating Sts. J1 25 CN3 15


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Table-2

REAR PANEL SIDE CONNECTORS MAIN BOARD SIDE CONNECTORS

9 PIN SOCKET 9 PIN SOCKET

Isolated GND J5 1 CN5 1

NO CONNECTION ----- ----- ----- ----- NO CONN


TX-2 +ve (Isolated) J5 4 CN5 4

Tx-2 –ve (Isolated) J5 5 CN5 5



Rx-2 +ve (Isolated) J5 8 CN5 8

Rx-2 –ve (Isolated) J5 9 CN5 9

Table-3

AC-DC CONVERTER DC-DC CONV BOARD

24V V+ T3 24V

24V_GND V- T4 24V_GND

24V V+ T7 24V

24V_GND V- T8 24V_GND


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Table-4

REAR PANEL SIDE CONNECTORS MAIN BOARD SIDE (35-01-08)

25 PIN SOCKET

Snap1- Line1 J2 1 CN3 24 SNAP1 LINE1




Dry-1 Line 1 J2 5 CN3 22 DRY1 LINE1




Analog (Bi-polar) Chan. 6 I/P J2 9 CN1 18 SAC6










Analog( Diff )Chan. 3 -I/P +ve J2 19 CN1 4 DAC3+

Analog (Diff) Chan. 3 -I/P -ve J2 20 CN1 17 DAC3-

Analog (Singl. End)Chan. 18 I/P J2 21 CN1 12 SAC18


Analog (Singl. End)Chan. 22 I/P J2 23 ----- ----- NO CONN


Analog Channel common Ret. J2 25 CN2 1 AGND

Digital Channel – 1 J2 26 CN2 14 DC1







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Spare 2 pole J2 42 CN3 9 SPARE2 POLE

Spare 2 NO J2 43 CN3 21 SPARE2 NO





Spare-1 Mating Sts. J2 48 CN3 2 SPARE1 MAT STS

Spare-2 Mating Sts. J2 49 CN3 14 SPARE2 MAT STS

Digital Channels Return J2 50 CN2 25 DGND


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Table-5

7 SEGMENT (7218) BOARD (35-04-08)

MAIN BOARD SIDE CONNECTORS

(35-01-08)


CN3 1 CN8 1

CN3 2 CN8 2

CN3 3 CN8 3

CN3 4 CN8 4

CN3 5 CN8 5

CN3 6 CN8 6

CN3 7 CN8 7

CN3 8 CN8 8

CN3 9 CN8 9

CN3 10 CN8 10

NO CONNECTION CN3 11 ----- ----- NO CONNECTION

CN3 12 CN8 12

CN3 13 CN8 13

CN3 14 CN8 14

CN3 15 CN8 15


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Table-6

DC DC BOARD (35-06-08) MAIN BOARD SIDE CONNECTORS

(35-01-08)


CN1 1 CN4 1

CN1 2 CN4 2

CN1 3 CN4 3

CN1 4 CN4 4

CN1 5 CN4 5 THROUGH SWITCH

CN1 6 CN4 6 THROUGH SWITCH

CN1 7 CN4 7

CN1 8 CN4 8

CN1 9 CN4 9

CN1 10 CN4 10

CN1 11 CN4 11

CN1 12 CN4 12

CN1 13 CN4 13

CN1 14 CN4 14

CN1 15 CN4 15

CN1 16 CN4 16

CN1 17 CN4 17

CN1 18 CN4 18

CN1 19 CN4 19

CN1 20 CN4 20

CN1 21 CN4 21

CN1 22 CN4 22

CN1 23 CN4 23

CN1 24 CN4 24

CN1 25 CN4 25


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Table-7

CONNECTIONS B/W REAR PANEL, RELAY CARD & LED CARD

Rear Panel J3 Connector - 50 Pin Crimped Socket

Relay Card CN1 Connector - 50 Pin Crimped Socket

Relay Card CN2 Connector - 25 Pin Crimped Socket

LED Card CN1 Connector - 25 Pin Crimped Socket

Rear Panel J7 Connector - 25 Pin Crimped Socket

DC-DC Con:- 25 Pin Crimped Socket

SIGNAL DETAILREAR PANEL RELAYCARD LED CARD

REMARKSConn. Pin No. Conn. Pin No. Conn. Pin No.

BAS-1M DC ON /OFF

STATUSJ3 1 CN1 37 CN1 15 BAS 1M MON

BAS-2M DC ON /OFF

STATUSJ3 2 CN1 36 CN1 2 BAS 2M MON

BAS-1R DC ON /OFF

STATUSJ3 3 CN1 35 CN1 14 BAS 1R MON

BAS-2R DC ON /OFF

STATUSJ3 4 CN1 34 CN1 1 BAS 2R MON

BCU-1M DC ON /OFF

STATUSJ3 5 CN1 1 CN1 7 BCU 1M MON

BCU-2M DC ON /OFF

STATUSJ3 6 CN1 18 CN1 20 BCU 2M MON

BCU-1R DC ON /OFF

STATUSJ3 7 CN1 38 CN1 8 BCU 1R MON

BCU-2R DC ON /OFF

STATUSJ3 8 CN1 39 CN1 21 BCU 2R MON

+ 28 V SUPPLY-line 1

to SDU RelaysJ3 9 CN1 32 AC_DC V+ AC-DC 24V

+ 28 V SUPPLY- line2

to SDU RelaysJ3 10 CN1 49 DC_DC V+ AC-DC 24V

BAS-1M DC ON

CNTRLJ3 11 CN1 48 BAS 1M ON

BAS-1M DC OFF

CNTRLJ3 12 CN1 47 BAS 1M OFF


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BAS-2M DC ON

CNTRLJ3 13 CN1 46 BAS 2M ON

BAS-2M DC OFF

CNTRLJ3 14 CN1 45 BAS 2M OFF

BAS-1R DC ON

CONTRLJ3 15 CN1 10 BAS 1R ON

BAS-1R DC OFF

CONTROLJ3 16 CN1 25 BAS 1R OFF

BAS-2R DC ON

CONTRLJ3 17 CN1 41 BAS 2R ON

BAS-2R DC OFF

CNTLJ3 18 CN1 6 BAS 2R OFF

RELAY CONTROLS

RETURN -1J3 19 CN1 16 24/26V GND

RELAY CONTROLS

RETURN -2J3 20 CN1 33 24/26V GND

BCU-1M DC ON

CNTRLJ3 21 CN1 31 BCU 1M ON


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Table-8



BCU-1M DC OFF

CONTRJ3 22 CN1 30 BCU 1M OFF

BCU-2M DC ON

CONTRLJ3 23 CN1 29 BCU 2M ON

BCU-2M DC OFF

CONTROLJ3 24 CN1 28 BCU 2M OFF

BCU-1R DC ON

CONTRLJ3 25 CN1 44 BCU 1R ON

BCU-1R DC OFF

CNTRLJ3 26 CN1 9 BCU 1R OFF

BCU-2R DC ON

CONTRLJ3 27 CN1 24 BCU 2R ON

BCU-2R DC OFF

CONTROLJ3 28 CN1 40 BCU 2R OFF

BCU-1M NOR

CHARGE SELECTJ3 29 CN1 15 BCU 1M NOR

BCU-1M TRI CHARGE

SELECTJ3 30 CN1 14 BCU 1M TRI

BCU-2M NOR

CHARGE SELECTJ3 31 CN1 13 BCU 2M NOR

BCU-2M TRI CHARGE

SELECTJ3 32 CN1 12 BCU 2M TRI

BCU-1R NOR

CHARGE SELECTJ3 33 CN1 27 BCU 1R NOR

BCU-1R TRI CHARGE

SELECTJ3 34 CN1 43 BCU 1R TRI

BCU-2R NOR

CHARGE SELESCTJ3 35 CN1 8 BCU 2R NOR

BCU-2R TRI

CHARGE SELECTJ3 36 CN1 23 BCU 2R TRI


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RELAY MONITOR

RETURNJ3 37 CN1 17

RELAY MONITOR

RETURNJ3 38 CN1 17

BAS-1M NOR/TRI

STSTUSJ3 39 CN1 2 CN1 4

BAS 1M N/T MON

BAS-2M NOR/TRI


BAS 2M N/T MON

BAS-1R NOR/TRI


BAS 1R N/T MON

BAS-2R NOR/TRI


BAS 2R N/T MON

Spare Relay-1 Pole J3 43 CN2 1 SPARE1 POLE

Spare Relay-1 NO J3 44 CN2 14 SPARE1 NO

Spare Relay -2 Pole J3 45 CN2 2 SPARE2 POLE

Spare Relay -2 NO J3 46 CN2 15 SPARE2 NO






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Table-9



Power Supply +ve for

70V Bus BAT/BAS

sel.

J7 1 DC-DC T1 56V

BHC- 1 AC mains ON

ControlJ7 2 CN1 11 AC MAIN1 ON

BHC- 1 AC mains

OFF ControlJ7 3 CN1 26 AC MAIN1 OFF

BHC- 2 AC mains ON

ControlJ7 4 CN1 42 AC MAIN2 ON

BHC- 2 AC mains

OFF ControlJ7 5 CN1 7 AC MAIN2 OFF

+ 28 V SUPPLY-line

3 to RelaysJ7 6

AC-

DC V+ AC-DC 24V

CONTROL RETURN

1J7 7 CN1 16

AC-

DCV- 24V GND

CONTROL RETURN

2J7 8 CN1 33

AC-

DCV- 24V GND

+ 28 V SUPPLY-line

4 to RelaysJ7 9

AC-

DCV+ AC-DC 24V

BHC-1 AC mains

ON /OFF STATUSJ7 10 CN1 5 AC MAIN1 MON

BHC-2 AC mains

ON /OFF STATUSJ7 11 CN1 22 AC MAIN2 MON

MONITOR RETURN J7 12 CN1 50 24V GND

Spare-Monitor-1 J7 13 CN1 21 CN1 3 SPARE1 MON

Spare Monitor-2 J7 14 CN1 4 CN1 16 SPARE2 MON

External Power Supply

+veJ7 15 CN2 10 ALL +VE

External Power supply

-veJ7 16 CN2 22 ALL -VE


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Power Supply -ve for

70V BAT/BAS sel.J7 17

DC-

DCT2 56V GND

Spare Relay-5 Pole J7 18 CN2 5 SPARE5 POLE

Spare Relay-5 NO J7 19 CN2 18 SPARE5 NO








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Table-10

CONNECTION B/W REAR PANEL, RELAY CARD & MAIN CARD

Rear Panel J4 Connector - 9 Pin DSUB Crimped Socket

Relay Card CN3 Connector - 9Pin DSUB Crimped Socket

Main Card CN6 Connector - 9 Pin DSUB Crimped Socket

SIGNAL DETAILREAR PANEL RELAYCARD MAIN CARD

REMARKSConn Pin No. Conn. Pin No. Conn. Pin No.

Isolated GND J4 1 CN3 1 CN6 1 ISOGND

TX-1 +ve (Isolated) J4 4 CN3 6 CN6 6 ISOTXD0+

Tx-1 –ve (Isolated) J4 5 CN3 2 CN6 2 ISOTXD0-

Rx-1 +ve (Isolated) J4 8 CN3 7 CN6 7 ISORXD0+

Rx-1 –ve (Isolated) J4 9 CN3 3 CN6 3 ISORXD0-

Table-11

CONNECTION B/W REAR PANEL & LCD CARD

Rear Panel J6 Connector - 9 Pin DSUB Crimped Socket

LCD Card CN1 Connector - 9 Pin DSUB Crimped Socket

SIGNAL DETAILREAR PANEL LCD CARD DC-DC CARD


Isolated GND J6 1 CN1 1 CN1 12 ISOGND

TX-3 +ve (Isolated) J6 4 CN1 4 ISOTXD0+

Tx-3 –ve (Isolated) J6 5 CN1 5 ISOTXD0-

Isolated +5 Power supply

J6 6 CN1 6 CN1 13 ISOVCC

Rx-3 +ve (Isolated) J6 8 CN1 8 ISORXD0+

Rx-3 –ve (Isolated) J6 9 CN1 9 ISORXD0-


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Table-12

CONNECTION B/W RELAY CARD, LCD CARD & MAIN CARD

Relay Card CN3 Connector - 9Pin DSUB Crimped Socket

LCD Card CN2 Connector - 9 Pin DSUB Crimped Socket

Main Card CN6 Connector - 9 Pin DSUB Crimped Socket

SIGNAL

DETAIL

RELAYCARD LCD CARD MAIN CARDREMARKS

Conn. Pin No. Conn. Pin No. Conn. Pin No.

ISOGND CN3 1 CN2 1 Isolated GND

ISOTXD1- CN3 4 CN2 5 CN6 4 Tx-4 –ve (Isolated)

ISORXD1- CN3 5 CN2 9 CN6 5 Rx-4 –ve (Isolated)

ISOTXD1+ CN3 8 CN2 4 CN6 8 TX-4 +ve (Isolated)

ISORXD1+ CN3 9 CN2 8 CN6 9 Rx-4 +ve (Isolated)

Table-13SIGNAL

DETAIL

RELAYCARD DC-DC CARD LED CARDREMARKS

Conn. Pin No. Conn. Pin No. Conn. Pin No.

GND CN2 11 CN1 10 CN1 12 DGND

VCC CN2 12 CN1 11 CN1 13 VCC

ISOVCC CN2 13 CN1 25 ISOVCC

GND CN2 23 CN1 CN1 24

VCC CN2 24 CN1 CN1 25

ISOGND CN2 25 CN1 24 ISOGND


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Table-14

LED BOARD (35-04-08)MAIN BOARD SIDE CONNECTORS

(35-01-08)


CN2 1 MBCN7 1

CN2 2 MBCN3 14

CN2 3 MBCN7 3

CN2 4 MBCN7 4

CN2 5 MBCN7 5

CN2 6 MBCN7 6

CN2 7 MBCN7 7

CN2 8 MBCN7 8

CN2 9 MBCN7 9

CN2 10 MBCN7 10

CN2 11 MBCN7 23

CN2 12 MBCN7 12

CN2 13 MBCN7 13

CN2 14 MBCN3 2

CN2 15 MBCN3 3

CN2 16 MBCN3 15

CN2 17 MBCN7 17

CN2 18 MBCN7 18

CN2 19 MBCN7 19

CN2 20 MBCN7 20

CN2 21 MBCN7 21

CN2 22 MBCN7 22

CN2 23 MBCN7 11

CN2 24 MBCN7 24

CN2 25 MBCN7 25


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Table-15

FANSENSE BOARD DC-DC CONV BOARD

RM1 1 RM1 1

RM1 2 RM1 2

RM1 3 RM1 3

RM1 4 RM1 4

RM1 5 RM1 5

RM1 6 RM1 6


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Chapter-6

Integrated Unit Level Test Procedures

This chapter discusses in detail the test procedure for the complete integrated Power Control

Unit. Test engineer is required to capture waveforms and note down essential readings as per

the requirement of the test. An exhaustive system level testing of the equipment is to be

carried out, wherein detailed tests, waveforms and readings are to be taken. Necessary ADC

channel calibration for the Main Card is to be done (at the system level during integrated

testing).

The test results should comply with the specifications listed in the table. Unit will be rejected

if test results do not meet the specifications.

6.1 Main Card Related Signals Verification

Control Signals verification: Issue command “#1 SET cmd_no \r” via RS485 control port, where

cmd_no number is indicated in the table as below, and capture 24V Pulse of 150 msec. Repeat this

for all the signals indicated in table.

Main Card Functional

Checks

Cmd No Function / Result

01: 35 V Supply OFF 24V, 160mSec Pulse at X2 wrt X1

02: 35 V Supply ON 24V, 160mSec Pulse at Y2 wrt Y1

03: BAT Select

29V, 150 mSec Pulse at J1-6 wrt 8 (FP Switch Ena, Negative

Check with Dis)

04: BAT SIM Select

29V, 150 mSec Pulse at J1-7 wrt 8 (FP Switch Ena, Negative

Check with Dis)

05: EED M&R Dis ON 29V at J1-11 wrt 12 and at J1-22 wrt 23

06: EED M&R Dis OFF 0V at J1-11 wrt 12 and J1-22 wrt 23

07: SNAP 1 Close 0.37 ohm at J2-1 wrt 2


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Main Card Functional

Checks

08: SNAP 1 Open open at J2-1 wrt 2

09: SNAP 2 Close 0.37 ohm at J2-3 wrt 4

10: SNAP 2 Open open at J2-3 wrt 4

11: SNAP 1&2 Close 0.5 ohm at J2-1 wrt 2 and 0.5 ohm at J2-3 wrt 4

12: SNAP 1&2 Open open at J2-1 wrt 2 and open at J2-3 wrt 4

13: DRY 1 Open open at J2-5 wrt 6

14: DRY 1 Close 0.5 ohm at J2-5 wrt 6

15: DRY 2 Open open at J2-7 wrt 8

16: DRY 2 Close 0.5 ohm at J2-7 wrt 8

17: DRY 1&2 Open open at J2-5 wrt 6 and open at J2-7 wrt 8

18: DRY 1&2 Close 0.5 ohm at J2-5 wrt 6 and 0.5 ohm at J2-7 wrt 8

19: Spare 1 ON 0.5V in Diode mode at J1-13 wrt 14

20: Spare 1 OFF Open in Diode mode at J1-13 wrt 14







Status Signals verification:

Short pins as indicated in table and measure status by issuing “#1 READ 1\r” command via RS485

control port. Also confirm respective Front Panel LEDs glow.

Status Bit Pattern Short pins

Spare-2-Mon J2-49 wrt 50 Status : #01 7FFF

Spare-1-Mon J2-48 wrt 50 Status : #01 BFFF

UC02-Mat-Sts J1-25 wrt 19 Status : #01 DFFF


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Status Bit Pattern Short pins

UC01-Mat-Sts J1-24 wrt 19 Status : #01 EFFF

DR2B-Bus2-Sts J1-21 wrt 19 Status : #01 F7FF

DR2B-Bus1-Sts J1-10 wrt 19 Status : #01 FBFF

DR2A-Bus2-Sts J1-20 wrt 19 Status : #01 FDFF

DR2A-Bus1-Sts J1-09 wrt 19 Status : #01 FEFF

For Spare/Dry/Snap monitoring respective relay has to be made ON afterwards it will reflect in READ

Sts.

Spare-4-Mon #01 FF7F

Spare-3-Mon #01 FFBF

Spare-2-Mon #01 FFDF

Spare-1-Mon #01 FFEF

DRY-2-Mon #01 FFF7

DRY-1-Mon #01 FFFB

SNAP-2-Mon #01 FFFD

SNAP-1-Mon #01 FFFE

Analog Signal verification and calibration:

Feed voltage using calibrator power supply, and record the Data received through BPMS

RS485 port and tabulate. The test setup shall be as below.

Test Setup for Battery Voltage Monitoring (3 Channels):

- Feed voltage thru 10k resistor to Bat-1(J1-2 wrt 3) & Bat-2(J1-16 wrt 17) line

simultaneously- short the Battery Monitoring return lines to the SGRP(J1-19)- Connect DMM (multi-meter) at the supply end (before 10k resistor) and- Tabulate as in table below

DMM Value Expected Count Bat-1Count Bat-2 Count

5.01246 256.637952

10.0188 512.96256 511 507

15.0249 769.27488

20.0055 1024.2816 1051 1046

25.0113 1280.57856


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30.0199 1537.01888 1592 1588

35.0271 1793.38752

40.0336 2049.72032 2134 2129

45.0397 2306.03264

50.0205 2561.0496 2675 2670

55.0273 2817.39776

60.0346 3073.77152 3217 3211

65.0409 3330.09408

70.0473 3586.42176 3760 3754

75.0544 3842.78528


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Test Setup for Bipolar Channels:

Feed voltage (0 to +/- 5V) through 10 k ohm resistor using calibrator to the pins as indicated in tables in next page, and note down the measured counts

received through BPMS RS485 port.

Bipolar Channel Calibration

wrt J2-25

DMMValue

ExpectedCounts

Chn-6(J2-9)

Chn-7(J2-10)

Chn-8(J2-11)

Chn-9(J2-12)

Chn-10(J2-13)

Chn-11(J2-14)

Chn-12(J2-15)

Chn-13(J2-16)

Chn-14(J2-17)

Chn-15(J2-18)

0.005 2050.048

1.0216 2466.44736 2405 2406 2421 2398 2411 2408 2400 2413 2392 2407

2.0125 2872.32 2781 2783 2797 2771 2784 2783 2777 2790 2768 2784

3.0037 3278.31552 3157 3160 3173 3145 3157 3158 3154 3168 3144 3161

4.02 3694.592

4.503 3892.4288 3725 3730 3743 3710 3720 3725 3723 3739 3713 3731

4.8079 4017.31584 3840 3845 3859 3825 3835 3841 3839 3855 3829 3846

-4.8077 78.76608 198 191 208 202 222 204 187 195 182 193

-4.5029 203.61216

-4.0197 401.53088

-3.0036 817.72544 881 876 893 881 898 886 871 881 865 879

-2.0124 1223.72096 1256 1252 1269 1254 1271 1261 1248 1258 1241 1255

-1.02145 1629.61408 1632 1630 1645 1629 1644 1636 1625 1635 1618 1631


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Test Setup for single ended Channels:

Feed voltage (0 to 80V) through 10 k ohm resistor using calibrator to the pins as indicated in tables in next page, and note down the measured counts received through BPMS RS485 port.

Single EndedChannel

Calibration

wrt J2-25 &

J1-5,19

DMM Value Expected CountsBAT-3 (J2-19 wrt 20)

SAC-4 (J1-4)

SAC-5 (J1-18)

SAC-16 (J1-1)

SAC-17 (J1-15)

SAC-18 (J2-21)

SAC-19 (J2-22)

SAC-23 (J2-24)

5.0115 256.5888

10.0175 512.896 511 496 488 492 493 486 492 486

15.024 769.2288

20.0044 1024.22528 1027 1010 1011 1018 1020 1007 1019 1006

25.0099 1280.50688

30.018 1536.9216 1592 1527 1536 1547 1550 1530 1547 1529

35.0249 1793.27488

40.0312 2049.59744 2134 2044 2062 2076 2080 2053 2077 2052

45.0372 2305.90464

50.0183 2560.93696 2675 2560 2587 2605 2609 2576 2604 2574

55.0249 2817.27488

60.0315 3073.6128 3197 3078 3113 3136 3140 3100 3134 3097

65.0377 3329.93024

70.045 3586.304 3741 3596 3640 3667 3671 3624 3664 3622

75.0515 3842.6368


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6.2 Relay Card Related Signals Verification

Control Signals verification: Issue command “#3 SET cmd_no \r” via RS485 control port, where

cmd_no number is indicated in the table as below, and capture 24V Pulse of 150 msec. Repeat this

for all the signals indicated in table.

Relay Card

1 S/C Main ON 24V, 150mSec pulse at J3-11,13 wrt 19 & 20

2 S/C Main OFF 24V, 150mSec pulse at J3-12,14 wrt 19 & 20

3 S/C Redt ON 24V, 150mSec pulse at J3-15,17 wrt 19 & 20

4 S/C Redt OFF 24V, 150mSec pulse at J3-16,18 wrt 19 & 20

5 BAS 1 Main ON 24V, 150mSec pulse at J3-11 wrt 19 & 20

6 BAS 1 Main OFF 24V, 150mSec pulse at J3-12 wrt 19 & 20

7 BAS 1 Redt ON 24V, 150mSec pulse at J3-15 wrt 19 & 20

8 BAS 1 Redt OFF 24V, 150mSec pulse at J3-16 wrt 19 & 20

9 BAS 2 Main ON 24V, 150mSec pulse at J3-13 wrt 19 & 20

10 BAS 2 Main OFF 24V, 150mSec pulse at J3-14 wrt 19 & 20

11 BAS 2 Redt ON 24V, 150mSec pulse at J3-17 wrt 19 & 20

12 BAS 2 Redt OFF 24V, 150mSec pulse at J3-18 wrt 19 & 20

13 BAS All OFF 24V, 150mSec pulse at J3-12,14,16,18 wrt 19 & 20

14 CHR 1&2 Main ON 24V, 150mSec pulse at J3-21,23 wrt 19 & 20

15 CHR 1&2 Main OF 24V, 150mSec pulse at J3-22,24 wrt 19 & 20

16 CHR 1&2 Redt ON 24V, 150mSec pulse at J3-25,27 wrt 19 & 20

17 CHR 1&2 Redt OF 24V, 150mSec pulse at J3-26,28 wrt 19 & 20

18 CHR 1 Main ON 24V, 150mSec pulse at J3-21 wrt 19 & 20

19 CHR 1 Main OFF 24V, 150mSec pulse at J3-22 wrt 19 & 20

20 CHR 1 Redt ON 24V, 150mSec pulse at J3-25 wrt 19 & 20

21 CHR 1 Redt OFF 24V, 150mSec pulse at J3-26 wrt 19 & 20

22 CHR 2 Main ON 24V, 150mSec pulse at J3-23 wrt 19 & 20

23 CHR 2 Main OFF 24V, 150mSec pulse at J3-24 wrt 19 & 20


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Relay Card

24 CHR 2 Redt ON 24V, 150mSec pulse at J3-27 wrt 19 & 20

25 CHR 2 Redt OFF 24V, 150mSec pulse at J3-28 wrt 19 & 20

26 CHR All OF 24V, 150mSec pulse at J3-22,24,26,28 wrt 19 & 20

27 CHR 1&2 Main No 24V, 150mSec pulse at J3-29,31 wrt 19 & 20

28 CHR 1&2 Main Tr 24V, 150mSec pulse at J3-30,32 wrt 19 & 20

29 CHR 1&2 Redt No 24V, 150mSec pulse at J3-33,35 wrt 19 & 20

30 CHR 1&2 Redt Tr 24V, 150mSec pulse at J3-34,36 wrt 19 & 20

31 CHR 1 Main Nor 24V, 150mSec pulse at J3-29 wrt 19 & 20

32 CHR 1 Main Tri 24V, 150mSec pulse at J3-30 wrt 19 & 20

33 CHR 1 Redt Nor 24V, 150mSec pulse at J3-33 wrt 19 & 20

34 CHR 1 Redt Tri 24V, 150mSec pulse at J3-34 wrt 19 & 20

35 CHR 2 Main Nor 24V, 150mSec pulse at J3-31 wrt 19 & 20

36 CHR 2 Main Tri 24V, 150mSec pulse at J3-32 wrt 19 & 20

37 CHR 2 Redt Nor 24V, 150mSec pulse at J3-35 wrt 19 & 20

38 CHR 2 Redt Tri 24V, 150mSec pulse at J3-36 wrt 19 & 20

39 CHR All Nor 24V, 150mSec pulse at J3-29,31,33,35 wrt 19 & 20

40 CHR All Tri 24V, 150mSec pulse at J3-30,32,34,36 wrt 19 & 20

41 AC Main ON 24V, 150mSec pulse at J7-2 wrt 7 & 8

42 AC Main OFF 24V, 150mSec pulse at J7-3 wrt 7 & 8

43 AC Redt ON 24V, 150mSec pulse at J7-4 wrt 7 & 8

44 AC Redt OFF 24V, 150mSec pulse at J7-5 wrt 7 & 8

45 AC All ON 24V, 150mSec pulse at J7-2,4 wrt 7 & 8

46 AC All OFF 24V, 150mSec pulse at J7-3,5 wrt 7 & 8

47 Spare 1 ON 0.3 ohm at J3-43 wrt 44

48 Spare 1 OFF Open at J3-43 wrt 44


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Relay Card















63 Spare 1 Pulse

28V, 160 mSec Pulse at J3-44 wrt Load(50 ) Ret (+28V fed to

J3-43 directly)

64 Spare 2 Pulse 28V, 160 mSec Pulse at J3-46 wrt Load Ret (+28V fed to J3-45)







Status Signals verification:

Short pins as indicated in table and measure status by issuing “#3 READ 1\r” command via RS485

control port. Also confirm respective Front Panel LEDs glow.


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Status Monitoring

Spare-2-Mon J7-14 wrt 12 Status : #02 7FFF

Spare-1-Mon J7-13 wrt 12 Status : #02 BFFF

AC-Redt-Sts J7-11 wrt 12 Status : #02 DFFF

AC-Main-Sts J7-10 wrt 12 Status : #02 EFFF

CHR-2-Redt-T/N J3-42 wrt 37,38 Status : #02 F7FF

CHR-1-Redt-T/N J3-41 wrt 37,38 Status : #02 FBFF

CHR-2-Main-T/N J3-40 wrt 37,38 Status : #02 FDFF

CHR-1-Main-T/N J3-39 wrt 37,38 Status : #02 FEFF

BCU-2-Redt J3-8 wrt 37,38 Status : #02 FF7F

BCU-1-Redt J3-7 wrt 37,38 Status : #02 FFBF

BCU-2-Main J3-6 wrt 37,38 Status : #02 FFDF

BCU-1-Main J3-5 wrt 37,38 Status : #02 FFEF

BAS-2-Redt J3-4 wrt 37,38 Status : #02 FFF7

BAS-1-Redt J3-3 wrt 37,38 Status : #02 FFFB

BAS-2-Main J3-2 wrt 37,38 Status : #02 FFFD

BAS-1-Main J3-1 wrt 37,38 Status : #02 FFFE

6.3Thruster Pulse Acquisition verification

- Connect the pin no. J2-26 to J2-41 to 28V supply (all wrt J2-50). Provide the pulse to

the input lines and read the same.- Before reading the thruster pulse parameter send the command "#03 SET 01\r".- Check for the individual thruster by "#03 READ 01\r" and make sure it is reflecting in

the same thruster channel no. Tabulate for different number of pulse simulated using

power supply.- Repeat this for all the 16 channels, and check once for all the channels together.


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Annexure-A

PCBs


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Annexure A-1 : Power Converters Card


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Annexure A-2 : Main Card


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Annexure A-3 : Front Panel Micro-Controller Card


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Annexure A-4 : Fan Failure Detection Card:


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Annexure A-5 : Front Panel LED Card:


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Annexure A-6 : Keypad


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Annexure A-7 : Relay Card


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Annexure-B

Bill of Materials (BOM)


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BoM -1

19” Industrial standard 2U sub-rack with Telescopic slides for mounting.

Item

No.Description Quantity

1 19” 2U Standard Sub-rack (Tray + Front panel + Rear Panel) 1

2 Front Panel mounting Brackets with handle 1 set

3 Accuride 08078 Telescopic Slides Sets (Including Rack mount

brackets)

1 set


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BoM - 2


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BoM – 3


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BoM - 4


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BoM - 5


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BoM - 6


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BoM - 7

BoM – 8

Front Panel Micro-Controller Card PCB


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BoM - 9


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BoM- 10

Front Panel Components

ItemNo.

Description Quantity

1 Front Panel Power ON Switch, Elcom IRS-1, 4A 250V 1

2 Toggle Switch (Type: Gillard ) 1

3 Key Pad Keys 5

4 LCD Displays (20*4 Alphanumeric) 1

5 Front panel LED card PCB – Ref BoM - 5 1

6 Front panel LCD card PCB – Ref BoM - 6 1

7 Front panel keypad card PCB – Ref BoM - 7 1

8 Front panel Micro-Controller Card PCB – Ref BoM - 8 1

BoM- 11

Rear Panel Components

ItemNo.


1 50 pin D Type connector Socket (part No.: M24308/2-5) 2

2 25 pin D Type connector Socket (Part No.: M24308/2-3) 2

3 9 pin D Type connector Socket (Part No. : M24308/2-1) 3

4 Fan (KD2406PTS 1, 13.A. GN) DC 24V, 1.4W 1

5 3 Pin AC MS Circular Connector

(Plug, Part No. MS3102R 10SL – 3P)

1

6 Fuse (5A,Socket) 1

7 AC-DC Module (HWS150-24/A) from TDK Lambda 1


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ItemNo.


8 Power Cord fabricated using 3 Core cable of 2 meter length(3 Pin MS-3106F 10SL-3S Connector one side, and standard230V, 5A, 3 Pin Plug on the other side)

1

Rear panel connector description

Sl.No.

Name Type Description

1 J1 25 Pin D-Type Socket For On-board Relay control

2 J2 50 Pin D-Type Socket Thruster and Analog signal interface

3 J3 50 Pin D-Type Socket SDU-Relay control and monitoring

4 J4 9 Pin D-Type Socket Relay control and Thruster data readout

5 J5 9 Pin D-Type Socket BPMS data transfer

6 J6 9 Pin D-Type Socket Future expansion

7 J7 25 Pin D-Type Socket BHC AC and spare signal interface

Part numbers of D-Type Connectors for cable and PCBs

Sl.

No.Connector Type

Cable end Connectors* PCB Mountable Connectors*

Plug Socket Plug Socket

1 9 Pin D-Type ITT Cannon M24308/4-1 M24308/2-1 M24308/24-7 M24308/23-7




* Fully covered Solid pins with gold coated contacts.


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Annexure-C

FABRICATION GUIDELINES


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FABRICATION GUIDELINES

Tools and Equipment: Tools shall be suitable for the purpose intended and shall cause no

damage to the parts, board and solder connections.

Component Tinning & Cleaning: Tinning of the components is mandatory. Clean the

component if required in isopropyl alcohol before mounting on PCB

Soldering: Soldering shall be free from bridging, blow hole, pin hole, crack/dry solder,

excess solder and avoid damage to sensitive components.

Wires / Harness: Sharp bends in wires and harness shall be avoided. Harness shall not have

frictional contact with any mechanical part. Use Teflon grommet of suitable shape and size

whenever a wire or harness passes through a metallic part. Wires shall not be pulled, twisted

or stressed during assembly. Harness bunch shall be free from dirt, chips, loose hardware and

lacing tape scraps etc.

All cards containing COS-MOS devices shall be stored and handled in conductive bags only.

Wiremen/ test personnel shall wear well grounded conductive wrist bands.

PCB: PCBs shall be stored prior to component mounting or after wiring in a controlled

environment, in order to avoid corrosion and oxidation problem, which impairs the

performance of the PCB/wired assembly.

Harness; Harness fabrication and routing as per approved drawing only. Harness shall be

properly fixed to chassis, shall not touch any sharp metal surfaces

Connectors shall be covered with anti-static dust caps

Post fabrication inspection shall be carried-out


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Annexure-D

ESD CONTROL GUIDELINES


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ESD CONTOL GUIDELINES

Use static sensitive zone sign to alert the personnel about ESD control

Wear anti-static aprons

Use anti-static wrist strap

Use conductive flooring, don’t use vinyl and wax finished floors.

Use conductive mat in work surface. Avoid synthetic and Formica mats

Chairs shall be conductive, do not use wooden and fiber glass chairs

Store ESD sensitive components and assemblies in conductive (ESD safe) bags. Don’t use

polythene bags

Avoid use of compressed air gun

Avoid equipment like printers, copiers and CRT monitors near ESD sensitive assemblies.

Use of ionized air blowers

Handle ESD sensitive device by holding on body rather than pins

Handle ESD sensitive assemblies by holding on chassis rather than circuitry

Ensure ESD grounding every day

Vendor facility will be audited against above requirements, before placing the purchase

order.


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Annexure-E

LIST OF SPARE COMPONENTS


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LIST OF SPARE COMPONENTS

Sl.No.

Component Name Model/Part Number Make Quantity

1. DC-DC Converter CC3-2405SF-E LAMBDA Make 25 Nos.

2. CC6-2405SF--E 25 Nos.

3. HQA2W085W280V-N07-S 25 Nos.

4. AC-DC MODULE HWS150-24/A 5 Nos.

5. uC ADuC7027 LQFP 25 Nos.

6. DS89C430-QNL+44PINPLCC(BASE)

25 Nos.

7. IC MAX7420 SMD 25 Nos.

8. MOSFET SW G3VM-61BR OMARON 25 Nos.

9. DC BRUSH LESS FAN KD2406PTS 1, 13.A. GN(DC 24V, 1.4W)

5 Nos.

10 Telescopic Slide Accuride 08078 Telescopicslide with rack mountbrackets

Accuride 5 Sets

Note: Spare components to be quoted separately
