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Integrated ElectronicSystems LabSeptember 2015 | Intro | 1
Research & EducationalProfile of the IntegratedElectronic Systems Lab
Prof. Dr.-Ing. Klaus Hofmann霍可思
Email: [email protected]: +49 6151 164938
September 2015
http://www.ies.tu-darmstadt.de
Integrated ElectronicSystems Lab
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Profile Overview: Education (I)
Integrated ElectronicSystems Lab
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Profile Overview: Education (I)
Bachelor
5. Sem.
4. Sem.
3. Sem.
Analog Integrated Circuit Design
Proseminar
ElektronikElektronikPraktikum
Projectseminar
Integrated ElectronicSystems Lab
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Profile Overview: Education (II)
Master ETiT/ iCE
Advanced Digital Integrated Circuit Design(Pflichtfach Datentechnik)
Printed Electronics
HDL Lab: Verilog & VHDL
Advanced Integrated Circuit Design Lab
Computer Aided Design for
Integrated Circuits
Micro-processor-Systems*
Circuit Building Blocks for
Communication Systems
SeminarIntegrated Electronic
Systems Design
Design for
Testability*
*: IES external lecturerers
Integrated ElectronicSystems Lab
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Arbeitsmodell FG IES
Systementwurf
Chip-Entwurf
Verifikation
Layout
Fab / Foundry
Test / Messung
Inbetriebnahme / Prototypen
extern
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Three major research areas
� Research Focus 1: Circuit Design and Modelling for New Technologies (e.g. Printable Electronics)� Robust Circuit Design (incl. Modelling), plus CAD aspects
� Device Modelling
� Research Focus 2: Digital High-Speed & High Performance Architectures� Hardware Architectures for high-speed/low-latency/low-power integrated
communication circuits -> Application towards 40G/100G TCP/IP, adaptive I/O interfaces, DRAM system architectures, Package identification, IPv6 hardware
� Research Focus 3: CMOS Circuitry for special environments� System architectures for single-chip systems (More-than-Moore, e.g. EL-
Driving and sensing, Mixed-Signal/RF Optical Transceiver (FTTx), Multi-scale sensor interfaces)
� High Voltage generators (Pumps/DC-DC), e.g. for OLEDs, RF-CMOS, variable Dielectrics (BaxSryTiz)
� High-Speed/Low Power data converters based on CCIIs� Robust Electronics (analog and digital) for high reliability or “dirty”
environments (“Industrie 4.0”)
Integrated ElectronicSystems Lab
Printed Electronics
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� Kooperation im TU Darmstadt / Merck Lab� Druckbarkeit einer Basiszelle für Displayanwendungen (ZnO)
� Beitrag IES: Elektronische Kompatibilität, Messungen, Modellierung
Integrated ElectronicSystems Lab
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Three major research areas
� Research Focus 1: Circuit Design and Modelling for New Technologies (e.g. Printable Electronics)� Robust Circuit Design (incl. Device Modelling), plus CAD aspects
� Research Focus 2: Digital High-Speed & High Performance Architectures� Hardware Architectures for high-speed/low-latency/low-power
integrated communication circuits -> Application towards 40G/100G TCP/IP, adaptive I/O interfaces, DRAM system architectures, Package identification, IPv6 hardware
� Research Focus 3: CMOS Circuitry for special environments� System architectures for single-chip systems (More-than-Moore, e.g.
EL-Driving and sensing, Mixed-Signal/RF Optical Transceiver (FTTx), Multi-scale sensor interfaces)
� High Voltage generators (Pumps/DC-DC), e.g. for OLEDs, RF-CMOS, variable Dielectrics (BaxSryTiz)
� High-Speed/Low Power data converters based on CCIIs
� Robust Electronics (analog and digital) for high reliability or “dirty” environments (“Industrie 4.0”)
Integrated ElectronicSystems Lab
Grundlagen: Neue Schaltungen
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� Schwerpunkt 1: Vollintegrierte Hochvolt-ASICs� Neue Materialien, MEMS, EL, OLED => Elektrische Feldstärke steuert
� Unser Beitrag: Neue Schaltungen, Zuverlässigkeit, Selbsttest
2012: 120V CP 2013: 120V CP 2013: 1x120V D/A 2014: 8*120V D/A 2014: Boost Converter
2014: EAP Driver > 500 V 2015: RF-Transceiver
Integrated ElectronicSystems Lab
Grundlagen: Neue Schaltungen
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� Schwerpunkt 2: High-Speed Communication (Future Internet)� Drahtgebundene Kommunikation mit hohem Datendurchsatz
� Dig. Phaseninterpolatoren, PHY-Training (Timing)
� Adaptive I/O-Architecturen für High Speed Datentransfer (DFG)
� TCP/IP-Stack in Hardware (IPv6, Koop. mit HHI)
� Rekonf. CCII basierter Low-Power ∆Σ Modulator für
GSM, GPS, BT, DVB, UMTS
2013: 90nm ∆Σ-SC
Integrated ElectronicSystems Lab
Anwendungsorientierte Forschung
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� Steuerbare RF-Frontends: Anwendung zweier HV-ASICs für steuerbare Antenne (LOEWE Cocoon, DFG GK TICMO)
� Industrie 4.0 (BMBF SmartTool)� Drahtlose Kommunikation im
Werkzeugmaschinenumfeld
Integrated ElectronicSystems Lab
Anwendungen (LOEWE KMU)
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� FTTH (Fiber to the Home) ASIC (Partner: DEV-Systemtechnik)� ASIC Entwurf analoger Verstärker bis 3GHz
� OPTIDAG (Partner: Pan Dacom, FG PHOT): Layer 1-Verschlüsselung Optische Übertragungsleitung)� VCSEL-Ansteuerung (Strom, Hochvolt), FPGA
Integrated ElectronicSystems Lab
Anwendungen (BMBF, Industrie)
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� ELSE - Elektrolumineszenz-Display in kapazitiver Sensorik (Partner: Firma Binder, Captron, Evobus, IDD)� ASIC & Systementwurf
� Kontroll & SteuerASIC für Raum-Klimaanlagen (Partner: GreeElectrical Appliances of Zhuhai, P.R. China)
Integrated ElectronicSystems Lab
Anwendungsorientierte Forschung
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� Rail Lab / Signalling Lab� Verbundeinrichtung Deutsche Bahn Netz und TU Darmstadt
� Signalling Lab: 5 beteiligte Fachgebiete
� Ziel: Infrastrukturelle Erneuerung der Signaltechnik (Sicherheit, extreme Langlebigkeit / Robustheit, Lebensdauerkonzepte)
� Langlebige, höchstsichere elektronische Systeme
� GSI (BMBF, TUD/GSI-Kooperation)� Neuartige elektronische Systeme für sehr schnelle Meßwertaufnahme
unter strahlungsharten Bedingungen
� Neuartiger Strahlstromtransformator (NDCCT)
� Bunch-to-Bucket Transfer SIS18->SIS100
Integrated ElectronicSystems Lab
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Vielen Dank!
谢谢您!
2012: 120V CP 2013: 120V CP 2013: 1x120V D/A 2014: 8*120V D/A 2014: Boost Converter
Thank you!
2013: 90nm ∆Σ-SC