research interest reliability of “green” electronic systems nano-based pb-free technology...
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Research Interest
• Reliability of “green” electronic systems
• Nano-based Pb-Free Technology
• Processing, characterization, and defects ID of Pb-Free electronic materials and components
• Metal and alloy based electroplating processes
• Sn whisker phenomenon
• Numerical analysis and simulation of residual stresses in thin films
• Residual stress analysis using X-Ray Diffraction Technologies
• Polymer and metal based composite materials
• Aerosol Jet Printing Techology
Dr. Aleksandra Fortier
Assistant Professor Email: [email protected]
Development of Novel Technique for Mitigation of Sn Whiskers Growth in Electronics
Sn Film
Brass-substrate
Microstructure of Electronic Component coated with Pure Sn Film
5µm
Growth of Sn Whisker over time on the surface of Sn film
10µm
Sn
Sn
Ni
Ni
Brass substrate
Microstructure of Electronic Component coated with Composite Ni/Sn Film
20µm
Whisker free Electronic Component with composite film
Inside Set-up
3mm
Residual Stress Measurements in Thin Films Using XRD Technology
Physical Set-up of the XRDPosition of Angles
Direction of Stress Measurement
Bragg’s Law Strain Calculation
Principles of Residual Stress Analysis with XRD
Advantages of Novel Technique for Mitigation of Sn Whiskers Growth
Non-uniform compressive residual stress distribution in Electronic Component coated
with Pure Sn Film (captured with XRD)
Distribution of uniform tensile stress in Electronic Component coated with composite
film (captured with XRD)
Advantages of Composite Plating•Uniform stress distribution in the film over time
•Whisker -free Components•Uniform microstructure
•Minimize likelihood of electronic systems failure
t=0.00012”
Model 2Model 1
Model 3
Simulation Analysis of Residual Stress Development in Thin Films
Stress Distribution in Thin Film
Cross section of Model
Residual Stress Results in Thin Films using ANSYS Software Tool
Stress Distribution in Composite Thin Film
Cross section of Model
Development of Functional Components using Aerosol Jet Printing Technology
Equipment
Components developed from nano to micro scale in size
Thin Layer Deposits from 100 nm
Variety of materials and substrates can be used
Material viscosities from 1- 1,000 cP
Nanomaterial Deposition Capability
Non-planar Capability
Flexibility for researchers to define specific application
Low Temperature Processing
Wide range of applications
3D Electronics
Alternative Energy
Biomedical Applications
Displays Sensors
Metal Components
Components Repair
Medical Implants
Hybrid Manufacturing
Benefits From Research Results
•Reduced Materials and Manufacturing Costs
• Reduced Process Time
• Improved product performance
• Improved manufacturing process
•Amount Controlled Deposition
•No need for post processing
Economical & Environmentally
clean process
Economical & Environmentally
clean process
• Data –driven• Printing pattern created in CAD• Flexible shapes
• Data –driven• Printing pattern created in CAD• Flexible shapes