rod-versus fiberlaser in thermal laser microprocessing · 2015. 9. 14. · rod-versus fiberlaser in...
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Rod-versus Fiberlaser in Thermal Laser Microprocessing
1)Basics Laser Microprocessing
2) Basics: pLPSSL – cwFL
3) Fine cutting: pLPSSL vs cwFL
3) Welding: pLPSSL vs cwFL-seam welding-spot welding
4)Drilling: pLPSSL vs cwFL
5)Summary
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LASAGIndustrial Lasers
Products
CW/pulsed Solid State Lasers(lamp pumped, Diode pumped)
Beam guiding technologiesBeam distribution
Beam formingProcess accessories
Process control
Solution for the customer
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Laser - Applications
� (Fine) cutting� precision drilling� micro-welding� “Scribing”
LASAGIndustrial Lasers
Stents / Hypotubes
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Turbine component(cooling hole)
Fuel Filter
Cracked connecting rod
LASAGIndustrial Lasers
Markets
� Turbines (aero, gas)� Medical (implants,instruments)� Auto (powertrain)� Solar (thermal Absorber)� Electronics (contacts)� White Ware (coffee machine))
IT-plug
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Lase Microprocessing in Industrial Production
System elementsfor
Pre-processing andfeeding
System elementsfor
Post.processingFurther handling
Beamdistribution
Beamformer
LaserLaser-beam
Beamguider
Usersurface
Control
HandlingProcess-control
Process-support.
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Laser Microprocessing: The System
Workpiece (interaction, thermal effects)
Laser technology beam-forming
(temporal/spacial)
Process support
Process-OpticsBeam distribution
PositioningContour movement
(CNC)
Protection
Control(process/system)
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Disruptive Technologies in Laser Mikroprocessing?In
dust
rial m
arke
treq
uire
men
ts:
Cos
tof o
wne
rshi
pim
prov
emen
tP
roce
ssqu
ality
, rel
iabi
lity,
pro
duct
ivity
1990 1995 2000 2005 2010 2015
FL
Diode
Indu
stria
l sho
rtpu
lse
lase
rs
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Influence of disruptive FL-cw technology on LPSSL markets
1990 1995 2000 2005 2010 2015
FL
MacrodrillingMacrocuttingMacroweldingSpotweldingMicrodrillingMicroweldingMicrocutting
Indu
stria
l mar
ketr
equi
rem
ents
:C
osto
f ow
ners
hip
impr
ovem
ent
Pro
cess
qual
ity, r
elia
bilit
y, p
rodu
ctiv
ity
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Basic problem of LPSSL/DPSSL: influence ofheat on beam quality
Laser Material
End mirror Exit mirror
Pump source(Energy)Lampen-strahlung
Wall plug efficiency LP
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Elements of disruptive FL-Technology vs Rod
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Fine cutting: pulsed 200 W Nd:YAG – cw 200 W Fiberlaser
Thickness (mm)
speed (mm/min )
4000
2000
KLS 246 (M2=2 – 20 /pulse power
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Example: Metal - Stent
LLT – Stent Cutter
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200W pulsed YAG – 200W SM Fiberlaser(fine cutting)
Application relevantparametersBeam quality number M2 1.2 2-20Average power/cw power(W) 200 50 - 200frequency(kHz)
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Material Processing: Seam-Welding SLS 200-CFS 200Influence of „Brilliance“
SLS 200(SHADOW)3kW peak
SLS 200(seam)
CFS 200
0.1mm
Court. IPG
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Spot welding:SHADOW®-Microring or single spot
• FL/LPSSL approach: “stiring“• LPSSL approach: single spot
• advantage:• Allows spot welding for low power lasers�High power(densities) for fast coupling�Movement avoids overheating(spattering)� disadvantage�Needs scanner and time
SteplessHigh SpeedAccurate andDiscreteOne Pulse Welding
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Influence of „Brilliance“ on deep welding performance
Brilliance ~Watt/Spot x cone angle (W/cm2sr)
Material: Cu CuLaser: p - Nd:YAG(240W) cw – IPG-FL (4kW)Parameter: 4 kW Pulsleistung 4kW
35 J PulsenergieTiefe: 1 mm 3mmSpeed: 0.1m/min 3m/min
IWS(Dresden)/Dt. Kupferinstitut.
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Drilling of Filters
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1000
100
10
1
1 10 100 1000 10000Holes per Second
Hole Diameter(µm)
Limit:Beam Quality
Limit at necessary energy:Pulse frequencyAverage PowerMovement
Single Shot „on the fly*Drilling (200W)Processing time
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SwissLaserNet/DU/26.11.09_#019
Disruptive Technologies in Laser Mikroprocessing?In
dust
rial m
arke
trqu
irem
ents
:C
osto
f ow
ners
hip
impr
ovem
ent
Pro
cess
qual
ity, r
elia
bilit
y, p
rodu
ctiv
ity
1990 1995 2000 2005 2010 2015
FL
Diode
Indu
stria
l sho
rtpu
lse
lase
rs
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Laser Microprocessing: The System
Workpiece (interaction, thermal effects)
Laser technology beam-forming
(temporal/spacial)
Process support
Process-OpticsBeam distribution
PositioningContour movement
(CNC)
Protection
Control(process/system)
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SwissLaserNet/DU/26.11.09_#021
Um
setz
ung
Lase
r-V
orga
ben
Mar
ktbe
dürf
niss
e
1995 2000 2005 2010 2015 2020
Precision „cost of ownership“ Speed +Precision Superspeed+Precision
„CNC“ disruptive Technology for high speed laserprocessing
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Rod-versus Fiberlaser in Thermal Laser Microprocessing
Each application has its ownOptimized laser
Decision for customer more difficult:needs more „neutral“ counseling
Potential of new lasers is limited byAccessories / CNC properties