Product Brief

Description

Key Applications

Features and Benefits

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SZ8-Y19-XX-XX - High-power LED

Product Data Sheet

1Rev52 Apr 13 2017

SZ8-Y19-XX-XX (Cool Neutral Warm)

High-Power LED ndash WICOP2 Z8 Y19

bull The WICOP2 series is designed for high

flux output applications with high current

operation capability

bull Compact footprint(181x181mm)

enables system level cost saving

bull It incorporates state of the art SMD

design and low thermal resistant

material

bull The WICOP2 is ideal light sources for

directional lighting applications such as

Spot Lights various outdoor

applications automotive lightings and

high performance torches

bull Designed for high current operation

bull Low Thermal Resistance

bull A wide CCT range of 2600~7000K

bull ANSI compliant Binning

bull RoHS compliant

bull Phosphor film directly attached to

chip surface

Part NumberCCT CRI

Color Min Max Min

SZ8-Y19-W0-C7 Cool White 4700K 7000K 70

SZ8-Y19-W0-C8 Cool White 4700K 7000K 80

SZ8-Y19-W0-C9 Cool White 4700K 7000K 90

SZ8-Y19-WN-C7 Neutral White 3700K 4700K 70

SZ8-Y19-WN-C8 Neutral White 3700K 4700K 80

SZ8-Y19-WN-C9 Neutral White 3700K 4700K 90

SZ8-Y19-WW-C7 Warm White 2600K 3700K 70

SZ8-Y19-WW-C8 Warm White 2600K 3700K 80

SZ8-Y19-WW-C9 Warm White 2600K 3700K 90

Table 1 Product Selection Table

New Generation of WICOP

bull Residential - Replacement lamps

bull CommercialIndustrial ndash Retail Display

bull Outdoor area - FloodStreet light High Bay

RoHSLM-80

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SZ8-Y19-XX-XX - High-power LED

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Product Data Sheet

Rev52 Apr 13 2017

Table of Contents

Index

bull Product Brief 1

bull Table of Contents 2

bull Performance Characteristics 3

bull Characteristics Graph 7

bull Color bin structure 12

bull Mechanical Dimensions 21

bull Material Structure 22

bull Reflow Soldering Characteristics 23

bull Emitter Tape amp Reel Packaging 24

bull Handling of Silicone Resin for LEDs 26

bull Precaution For Use 27

bull Company Information 30

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Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C7 4700 7000

W5 167 184 299 394 535

70

W4 160 175 285 376 510

W3 152 167 271 357 485

W2 142 156 254 335 455

SZ8-Y19-WN-C7 3700 4700

W5 167 184 299 394 535

70

W4 160 175 285 376 510

W3 152 167 271 357 485

W2 142 156 254 335 455

SZ8-Y19-WW-C7 2600 3700

W3 152 167 271 357 485

70

W2 142 156 254 335 455

W1 133 146 237 313 424

V3 125 137 223 294 399

Table 2 Electro Optical Characteristics IF = 350mA (CRI 70)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

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Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C8 4700 7000

W3 152 167 271 357 485

80

W2 142 156 254 335 455

W1 133 146 237 313 424

V3 125 137 223 294 399

SZ8-Y19-WN-C8 3700 4700

W3 152 167 271 357 485

80

W2 142 156 254 335 455

W1 133 146 237 313 424

V3 125 137 223 294 399

SZ8-Y19-WW-C8 2600 3700

W1 133 146 237 313 424

80

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

Table 2 Electro Optical Characteristics IF = 350mA (CRI 80)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

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SZ8-Y19-XX-XX - High-power LED

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Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C9 4700 7000

W1 133 146 237 313 424

90

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

SZ8-Y19-WN-C9 3700 4700

W1 133 146 237 313 424

90

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

SZ8-Y19-WW-C9 2600 3700

V2 116 128 208 274 372

90

V1 109 120 195 257 349

U3 102 112 182 240 326

U2 96 106 172 227 308

Table 2 Electro Optical Characteristics IF = 350mA (CRI 90)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

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SZ8-Y19-XX-XX - High-power LED

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Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Parameter SymbolValue

UnitMin Typ Max

Forward Current [1] IF - -15 [4]

20 [3]A

Power Dissipation PD - - 78 W

Junction Temperature Tj - - 145 ordmC

Operating Temperature Topr - 40 - 125 ordmC

Storage Temperature Tstg - 40 - 125 ordmC

Viewing angle θ 140 degree

Forward voltage (350mA 85) VF 271 V

Forward voltage (700mA 85) VF 286 V

Thermal resistance (J to S) [2] RθJ-S -3 [3]

45 [4]- KW

ESD Sensitivity(HBM) Class 2 JESD22-A114-E

Table 3 Absolute Maximum Ratings

Notes

(1) At Junction Temperature 85 condition

(2) RθJ-S is tested at 700mA

(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)

(4) Using Metal PCB (Normal type)

bull Thermal resistance can be increased substantially depending on the heat sink designoperating

condition and the maximum possible driving current will decrease accordingly

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SZ8-Y19-XX-XX - High-power LED

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Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 1 Color Spectrum

Fig 2 Typical Spatial Distribution

350 400 450 500 550 600 650 700 750 800

0

20

40

60

80

100

Re

lati

ve

Ra

dia

nt

Po

we

r [

]

Wavelength [nm]

Cool white

Neutral white

Warm white

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

0

10

20

30

40

50

60

70

80

90

100

110

Re

lati

ve

Lu

min

ou

s In

ten

sit

y [

]

Angular Displacement [degrees]

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SZ8-Y19-XX-XX - High-power LED

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Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 3 Forward Voltage vs Forward Current Tj=85

Fig 4 Forward Current vs Relative Luminous Flux Tj=85

0 200 400 600 800 1000 1200 1400 1600 1800 2000

0

20

40

60

80

100

120

140

160

180

200

220

240

Re

lati

ve

Lu

min

ou

s F

lux

[

]

Forward Current [mA]

24 26 28 30 32 34

00

02

04

06

08

10

12

14

16

18

20

22

Fo

rwa

rd C

urr

en

t [A

]

Forward Voltage [V]

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SZ8-Y19-XX-XX - High-power LED

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Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Junction Temperature [oC]

CIE X

CIE Y

0 200 400 600 800 1000 1200 1400 1600 1800 2000

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Forward Current [mA]

CIE X

CIE Y

Fig 5 Forward Current vs CIE X Y Shift Tj=85

145

Fig 6 Junction Temp vs CIE X Y Shift IF=700mA

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SZ8-Y19-XX-XX - High-power LED

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Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-020

-015

-010

-005

000

005

010

015

020

025

V

F

Junction Temperature [oC]

25 50 75 100 125

0

20

40

60

80

100

120

Re

lati

ve

lu

min

ou

s f

lux

[

]

Junction Temperature [oC]

Fig 7 Relative Light Output vs Junction Temperature IF=700mA

Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA

145

145

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SZ8-Y19-XX-XX - High-power LED

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Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=2A

0 20 40 60 80 100 1200

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

Ma

xim

um

Cu

rre

nt [m

A]

Ambient Temperature [oC]

Rth(j-a)=7W

Rth(j-a)=10W

Rth(j-a)=15W

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Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

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SZ8-Y19-XX-XX - High-power LED

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Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

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SZ8-Y19-XX-XX - High-power LED

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Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

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Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

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Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

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Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

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Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

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Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

2

Product Data Sheet

Rev52 Apr 13 2017

Table of Contents

Index

bull Product Brief 1

bull Table of Contents 2

bull Performance Characteristics 3

bull Characteristics Graph 7

bull Color bin structure 12

bull Mechanical Dimensions 21

bull Material Structure 22

bull Reflow Soldering Characteristics 23

bull Emitter Tape amp Reel Packaging 24

bull Handling of Silicone Resin for LEDs 26

bull Precaution For Use 27

bull Company Information 30

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

3

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C7 4700 7000

W5 167 184 299 394 535

70

W4 160 175 285 376 510

W3 152 167 271 357 485

W2 142 156 254 335 455

SZ8-Y19-WN-C7 3700 4700

W5 167 184 299 394 535

70

W4 160 175 285 376 510

W3 152 167 271 357 485

W2 142 156 254 335 455

SZ8-Y19-WW-C7 2600 3700

W3 152 167 271 357 485

70

W2 142 156 254 335 455

W1 133 146 237 313 424

V3 125 137 223 294 399

Table 2 Electro Optical Characteristics IF = 350mA (CRI 70)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

4

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C8 4700 7000

W3 152 167 271 357 485

80

W2 142 156 254 335 455

W1 133 146 237 313 424

V3 125 137 223 294 399

SZ8-Y19-WN-C8 3700 4700

W3 152 167 271 357 485

80

W2 142 156 254 335 455

W1 133 146 237 313 424

V3 125 137 223 294 399

SZ8-Y19-WW-C8 2600 3700

W1 133 146 237 313 424

80

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

Table 2 Electro Optical Characteristics IF = 350mA (CRI 80)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

5

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C9 4700 7000

W1 133 146 237 313 424

90

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

SZ8-Y19-WN-C9 3700 4700

W1 133 146 237 313 424

90

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

SZ8-Y19-WW-C9 2600 3700

V2 116 128 208 274 372

90

V1 109 120 195 257 349

U3 102 112 182 240 326

U2 96 106 172 227 308

Table 2 Electro Optical Characteristics IF = 350mA (CRI 90)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

6

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Parameter SymbolValue

UnitMin Typ Max

Forward Current [1] IF - -15 [4]

20 [3]A

Power Dissipation PD - - 78 W

Junction Temperature Tj - - 145 ordmC

Operating Temperature Topr - 40 - 125 ordmC

Storage Temperature Tstg - 40 - 125 ordmC

Viewing angle θ 140 degree

Forward voltage (350mA 85) VF 271 V

Forward voltage (700mA 85) VF 286 V

Thermal resistance (J to S) [2] RθJ-S -3 [3]

45 [4]- KW

ESD Sensitivity(HBM) Class 2 JESD22-A114-E

Table 3 Absolute Maximum Ratings

Notes

(1) At Junction Temperature 85 condition

(2) RθJ-S is tested at 700mA

(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)

(4) Using Metal PCB (Normal type)

bull Thermal resistance can be increased substantially depending on the heat sink designoperating

condition and the maximum possible driving current will decrease accordingly

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

7

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 1 Color Spectrum

Fig 2 Typical Spatial Distribution

350 400 450 500 550 600 650 700 750 800

0

20

40

60

80

100

Re

lati

ve

Ra

dia

nt

Po

we

r [

]

Wavelength [nm]

Cool white

Neutral white

Warm white

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

0

10

20

30

40

50

60

70

80

90

100

110

Re

lati

ve

Lu

min

ou

s In

ten

sit

y [

]

Angular Displacement [degrees]

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

8

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 3 Forward Voltage vs Forward Current Tj=85

Fig 4 Forward Current vs Relative Luminous Flux Tj=85

0 200 400 600 800 1000 1200 1400 1600 1800 2000

0

20

40

60

80

100

120

140

160

180

200

220

240

Re

lati

ve

Lu

min

ou

s F

lux

[

]

Forward Current [mA]

24 26 28 30 32 34

00

02

04

06

08

10

12

14

16

18

20

22

Fo

rwa

rd C

urr

en

t [A

]

Forward Voltage [V]

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

9

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Junction Temperature [oC]

CIE X

CIE Y

0 200 400 600 800 1000 1200 1400 1600 1800 2000

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Forward Current [mA]

CIE X

CIE Y

Fig 5 Forward Current vs CIE X Y Shift Tj=85

145

Fig 6 Junction Temp vs CIE X Y Shift IF=700mA

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

10

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-020

-015

-010

-005

000

005

010

015

020

025

V

F

Junction Temperature [oC]

25 50 75 100 125

0

20

40

60

80

100

120

Re

lati

ve

lu

min

ou

s f

lux

[

]

Junction Temperature [oC]

Fig 7 Relative Light Output vs Junction Temperature IF=700mA

Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA

145

145

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

11

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=2A

0 20 40 60 80 100 1200

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

Ma

xim

um

Cu

rre

nt [m

A]

Ambient Temperature [oC]

Rth(j-a)=7W

Rth(j-a)=10W

Rth(j-a)=15W

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

12

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

13

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

3

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C7 4700 7000

W5 167 184 299 394 535

70

W4 160 175 285 376 510

W3 152 167 271 357 485

W2 142 156 254 335 455

SZ8-Y19-WN-C7 3700 4700

W5 167 184 299 394 535

70

W4 160 175 285 376 510

W3 152 167 271 357 485

W2 142 156 254 335 455

SZ8-Y19-WW-C7 2600 3700

W3 152 167 271 357 485

70

W2 142 156 254 335 455

W1 133 146 237 313 424

V3 125 137 223 294 399

Table 2 Electro Optical Characteristics IF = 350mA (CRI 70)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

4

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C8 4700 7000

W3 152 167 271 357 485

80

W2 142 156 254 335 455

W1 133 146 237 313 424

V3 125 137 223 294 399

SZ8-Y19-WN-C8 3700 4700

W3 152 167 271 357 485

80

W2 142 156 254 335 455

W1 133 146 237 313 424

V3 125 137 223 294 399

SZ8-Y19-WW-C8 2600 3700

W1 133 146 237 313 424

80

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

Table 2 Electro Optical Characteristics IF = 350mA (CRI 80)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

5

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C9 4700 7000

W1 133 146 237 313 424

90

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

SZ8-Y19-WN-C9 3700 4700

W1 133 146 237 313 424

90

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

SZ8-Y19-WW-C9 2600 3700

V2 116 128 208 274 372

90

V1 109 120 195 257 349

U3 102 112 182 240 326

U2 96 106 172 227 308

Table 2 Electro Optical Characteristics IF = 350mA (CRI 90)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

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SZ8-Y19-XX-XX - High-power LED

6

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Parameter SymbolValue

UnitMin Typ Max

Forward Current [1] IF - -15 [4]

20 [3]A

Power Dissipation PD - - 78 W

Junction Temperature Tj - - 145 ordmC

Operating Temperature Topr - 40 - 125 ordmC

Storage Temperature Tstg - 40 - 125 ordmC

Viewing angle θ 140 degree

Forward voltage (350mA 85) VF 271 V

Forward voltage (700mA 85) VF 286 V

Thermal resistance (J to S) [2] RθJ-S -3 [3]

45 [4]- KW

ESD Sensitivity(HBM) Class 2 JESD22-A114-E

Table 3 Absolute Maximum Ratings

Notes

(1) At Junction Temperature 85 condition

(2) RθJ-S is tested at 700mA

(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)

(4) Using Metal PCB (Normal type)

bull Thermal resistance can be increased substantially depending on the heat sink designoperating

condition and the maximum possible driving current will decrease accordingly

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SZ8-Y19-XX-XX - High-power LED

7

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 1 Color Spectrum

Fig 2 Typical Spatial Distribution

350 400 450 500 550 600 650 700 750 800

0

20

40

60

80

100

Re

lati

ve

Ra

dia

nt

Po

we

r [

]

Wavelength [nm]

Cool white

Neutral white

Warm white

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

0

10

20

30

40

50

60

70

80

90

100

110

Re

lati

ve

Lu

min

ou

s In

ten

sit

y [

]

Angular Displacement [degrees]

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SZ8-Y19-XX-XX - High-power LED

8

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 3 Forward Voltage vs Forward Current Tj=85

Fig 4 Forward Current vs Relative Luminous Flux Tj=85

0 200 400 600 800 1000 1200 1400 1600 1800 2000

0

20

40

60

80

100

120

140

160

180

200

220

240

Re

lati

ve

Lu

min

ou

s F

lux

[

]

Forward Current [mA]

24 26 28 30 32 34

00

02

04

06

08

10

12

14

16

18

20

22

Fo

rwa

rd C

urr

en

t [A

]

Forward Voltage [V]

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SZ8-Y19-XX-XX - High-power LED

9

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Junction Temperature [oC]

CIE X

CIE Y

0 200 400 600 800 1000 1200 1400 1600 1800 2000

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Forward Current [mA]

CIE X

CIE Y

Fig 5 Forward Current vs CIE X Y Shift Tj=85

145

Fig 6 Junction Temp vs CIE X Y Shift IF=700mA

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SZ8-Y19-XX-XX - High-power LED

10

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-020

-015

-010

-005

000

005

010

015

020

025

V

F

Junction Temperature [oC]

25 50 75 100 125

0

20

40

60

80

100

120

Re

lati

ve

lu

min

ou

s f

lux

[

]

Junction Temperature [oC]

Fig 7 Relative Light Output vs Junction Temperature IF=700mA

Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA

145

145

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SZ8-Y19-XX-XX - High-power LED

11

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=2A

0 20 40 60 80 100 1200

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

Ma

xim

um

Cu

rre

nt [m

A]

Ambient Temperature [oC]

Rth(j-a)=7W

Rth(j-a)=10W

Rth(j-a)=15W

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12

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

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Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

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14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

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SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

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Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

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17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

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Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

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SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

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SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

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SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

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SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

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SZ8-Y19-XX-XX - High-power LED

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Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

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SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

4

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C8 4700 7000

W3 152 167 271 357 485

80

W2 142 156 254 335 455

W1 133 146 237 313 424

V3 125 137 223 294 399

SZ8-Y19-WN-C8 3700 4700

W3 152 167 271 357 485

80

W2 142 156 254 335 455

W1 133 146 237 313 424

V3 125 137 223 294 399

SZ8-Y19-WW-C8 2600 3700

W1 133 146 237 313 424

80

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

Table 2 Electro Optical Characteristics IF = 350mA (CRI 80)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

5

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C9 4700 7000

W1 133 146 237 313 424

90

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

SZ8-Y19-WN-C9 3700 4700

W1 133 146 237 313 424

90

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

SZ8-Y19-WW-C9 2600 3700

V2 116 128 208 274 372

90

V1 109 120 195 257 349

U3 102 112 182 240 326

U2 96 106 172 227 308

Table 2 Electro Optical Characteristics IF = 350mA (CRI 90)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

6

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Parameter SymbolValue

UnitMin Typ Max

Forward Current [1] IF - -15 [4]

20 [3]A

Power Dissipation PD - - 78 W

Junction Temperature Tj - - 145 ordmC

Operating Temperature Topr - 40 - 125 ordmC

Storage Temperature Tstg - 40 - 125 ordmC

Viewing angle θ 140 degree

Forward voltage (350mA 85) VF 271 V

Forward voltage (700mA 85) VF 286 V

Thermal resistance (J to S) [2] RθJ-S -3 [3]

45 [4]- KW

ESD Sensitivity(HBM) Class 2 JESD22-A114-E

Table 3 Absolute Maximum Ratings

Notes

(1) At Junction Temperature 85 condition

(2) RθJ-S is tested at 700mA

(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)

(4) Using Metal PCB (Normal type)

bull Thermal resistance can be increased substantially depending on the heat sink designoperating

condition and the maximum possible driving current will decrease accordingly

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

7

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 1 Color Spectrum

Fig 2 Typical Spatial Distribution

350 400 450 500 550 600 650 700 750 800

0

20

40

60

80

100

Re

lati

ve

Ra

dia

nt

Po

we

r [

]

Wavelength [nm]

Cool white

Neutral white

Warm white

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

0

10

20

30

40

50

60

70

80

90

100

110

Re

lati

ve

Lu

min

ou

s In

ten

sit

y [

]

Angular Displacement [degrees]

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

8

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 3 Forward Voltage vs Forward Current Tj=85

Fig 4 Forward Current vs Relative Luminous Flux Tj=85

0 200 400 600 800 1000 1200 1400 1600 1800 2000

0

20

40

60

80

100

120

140

160

180

200

220

240

Re

lati

ve

Lu

min

ou

s F

lux

[

]

Forward Current [mA]

24 26 28 30 32 34

00

02

04

06

08

10

12

14

16

18

20

22

Fo

rwa

rd C

urr

en

t [A

]

Forward Voltage [V]

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

9

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Junction Temperature [oC]

CIE X

CIE Y

0 200 400 600 800 1000 1200 1400 1600 1800 2000

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Forward Current [mA]

CIE X

CIE Y

Fig 5 Forward Current vs CIE X Y Shift Tj=85

145

Fig 6 Junction Temp vs CIE X Y Shift IF=700mA

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

10

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-020

-015

-010

-005

000

005

010

015

020

025

V

F

Junction Temperature [oC]

25 50 75 100 125

0

20

40

60

80

100

120

Re

lati

ve

lu

min

ou

s f

lux

[

]

Junction Temperature [oC]

Fig 7 Relative Light Output vs Junction Temperature IF=700mA

Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA

145

145

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

11

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=2A

0 20 40 60 80 100 1200

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

Ma

xim

um

Cu

rre

nt [m

A]

Ambient Temperature [oC]

Rth(j-a)=7W

Rth(j-a)=10W

Rth(j-a)=15W

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

12

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

13

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

5

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Part Number

CCT [K] [1] Min Luminous Flux [2]

ФV [3] [lm]

Min Luminous Flux [2]

ФV[3] [lm] 85 degC

CRI [4]

Ra

Min Max Group

Flux

[lm]

85 degC

Flux

[lm]

25 degC700mA 10A 15A Min

SZ8-Y19-W0-C9 4700 7000

W1 133 146 237 313 424

90

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

SZ8-Y19-WN-C9 3700 4700

W1 133 146 237 313 424

90

V3 125 137 223 294 399

V2 116 128 208 274 372

V1 109 120 195 257 349

SZ8-Y19-WW-C9 2600 3700

V2 116 128 208 274 372

90

V1 109 120 195 257 349

U3 102 112 182 240 326

U2 96 106 172 227 308

Table 2 Electro Optical Characteristics IF = 350mA (CRI 90)

(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram

Color coordinate 0005 CCT 5 tolerance

(2) Seoul Semiconductor maintains a tolerance of 7 on flux and power measurements

(3) ФV is the total luminous flux output as measured with an integrating sphere

(4) Tolerance is 20 on CRI measurements

Notes

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

6

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Parameter SymbolValue

UnitMin Typ Max

Forward Current [1] IF - -15 [4]

20 [3]A

Power Dissipation PD - - 78 W

Junction Temperature Tj - - 145 ordmC

Operating Temperature Topr - 40 - 125 ordmC

Storage Temperature Tstg - 40 - 125 ordmC

Viewing angle θ 140 degree

Forward voltage (350mA 85) VF 271 V

Forward voltage (700mA 85) VF 286 V

Thermal resistance (J to S) [2] RθJ-S -3 [3]

45 [4]- KW

ESD Sensitivity(HBM) Class 2 JESD22-A114-E

Table 3 Absolute Maximum Ratings

Notes

(1) At Junction Temperature 85 condition

(2) RθJ-S is tested at 700mA

(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)

(4) Using Metal PCB (Normal type)

bull Thermal resistance can be increased substantially depending on the heat sink designoperating

condition and the maximum possible driving current will decrease accordingly

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

7

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 1 Color Spectrum

Fig 2 Typical Spatial Distribution

350 400 450 500 550 600 650 700 750 800

0

20

40

60

80

100

Re

lati

ve

Ra

dia

nt

Po

we

r [

]

Wavelength [nm]

Cool white

Neutral white

Warm white

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

0

10

20

30

40

50

60

70

80

90

100

110

Re

lati

ve

Lu

min

ou

s In

ten

sit

y [

]

Angular Displacement [degrees]

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

8

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 3 Forward Voltage vs Forward Current Tj=85

Fig 4 Forward Current vs Relative Luminous Flux Tj=85

0 200 400 600 800 1000 1200 1400 1600 1800 2000

0

20

40

60

80

100

120

140

160

180

200

220

240

Re

lati

ve

Lu

min

ou

s F

lux

[

]

Forward Current [mA]

24 26 28 30 32 34

00

02

04

06

08

10

12

14

16

18

20

22

Fo

rwa

rd C

urr

en

t [A

]

Forward Voltage [V]

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

9

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Junction Temperature [oC]

CIE X

CIE Y

0 200 400 600 800 1000 1200 1400 1600 1800 2000

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Forward Current [mA]

CIE X

CIE Y

Fig 5 Forward Current vs CIE X Y Shift Tj=85

145

Fig 6 Junction Temp vs CIE X Y Shift IF=700mA

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

10

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-020

-015

-010

-005

000

005

010

015

020

025

V

F

Junction Temperature [oC]

25 50 75 100 125

0

20

40

60

80

100

120

Re

lati

ve

lu

min

ou

s f

lux

[

]

Junction Temperature [oC]

Fig 7 Relative Light Output vs Junction Temperature IF=700mA

Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA

145

145

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

11

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=2A

0 20 40 60 80 100 1200

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

Ma

xim

um

Cu

rre

nt [m

A]

Ambient Temperature [oC]

Rth(j-a)=7W

Rth(j-a)=10W

Rth(j-a)=15W

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

12

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

13

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

6

Product Data Sheet

Rev52 Apr 13 2017

Performance Characteristics

Parameter SymbolValue

UnitMin Typ Max

Forward Current [1] IF - -15 [4]

20 [3]A

Power Dissipation PD - - 78 W

Junction Temperature Tj - - 145 ordmC

Operating Temperature Topr - 40 - 125 ordmC

Storage Temperature Tstg - 40 - 125 ordmC

Viewing angle θ 140 degree

Forward voltage (350mA 85) VF 271 V

Forward voltage (700mA 85) VF 286 V

Thermal resistance (J to S) [2] RθJ-S -3 [3]

45 [4]- KW

ESD Sensitivity(HBM) Class 2 JESD22-A114-E

Table 3 Absolute Maximum Ratings

Notes

(1) At Junction Temperature 85 condition

(2) RθJ-S is tested at 700mA

(3) Using Metal PCB (Dielectric layer 5WmK and Cu pattern of 2oz)

(4) Using Metal PCB (Normal type)

bull Thermal resistance can be increased substantially depending on the heat sink designoperating

condition and the maximum possible driving current will decrease accordingly

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

7

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 1 Color Spectrum

Fig 2 Typical Spatial Distribution

350 400 450 500 550 600 650 700 750 800

0

20

40

60

80

100

Re

lati

ve

Ra

dia

nt

Po

we

r [

]

Wavelength [nm]

Cool white

Neutral white

Warm white

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

0

10

20

30

40

50

60

70

80

90

100

110

Re

lati

ve

Lu

min

ou

s In

ten

sit

y [

]

Angular Displacement [degrees]

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

8

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 3 Forward Voltage vs Forward Current Tj=85

Fig 4 Forward Current vs Relative Luminous Flux Tj=85

0 200 400 600 800 1000 1200 1400 1600 1800 2000

0

20

40

60

80

100

120

140

160

180

200

220

240

Re

lati

ve

Lu

min

ou

s F

lux

[

]

Forward Current [mA]

24 26 28 30 32 34

00

02

04

06

08

10

12

14

16

18

20

22

Fo

rwa

rd C

urr

en

t [A

]

Forward Voltage [V]

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

9

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Junction Temperature [oC]

CIE X

CIE Y

0 200 400 600 800 1000 1200 1400 1600 1800 2000

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Forward Current [mA]

CIE X

CIE Y

Fig 5 Forward Current vs CIE X Y Shift Tj=85

145

Fig 6 Junction Temp vs CIE X Y Shift IF=700mA

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

10

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-020

-015

-010

-005

000

005

010

015

020

025

V

F

Junction Temperature [oC]

25 50 75 100 125

0

20

40

60

80

100

120

Re

lati

ve

lu

min

ou

s f

lux

[

]

Junction Temperature [oC]

Fig 7 Relative Light Output vs Junction Temperature IF=700mA

Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA

145

145

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

11

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=2A

0 20 40 60 80 100 1200

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

Ma

xim

um

Cu

rre

nt [m

A]

Ambient Temperature [oC]

Rth(j-a)=7W

Rth(j-a)=10W

Rth(j-a)=15W

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SZ8-Y19-XX-XX - High-power LED

12

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

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SZ8-Y19-XX-XX - High-power LED

13

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

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SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

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SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

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SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

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SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

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SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

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SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

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SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

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SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

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SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

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SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

7

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 1 Color Spectrum

Fig 2 Typical Spatial Distribution

350 400 450 500 550 600 650 700 750 800

0

20

40

60

80

100

Re

lati

ve

Ra

dia

nt

Po

we

r [

]

Wavelength [nm]

Cool white

Neutral white

Warm white

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

0

10

20

30

40

50

60

70

80

90

100

110

Re

lati

ve

Lu

min

ou

s In

ten

sit

y [

]

Angular Displacement [degrees]

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

8

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 3 Forward Voltage vs Forward Current Tj=85

Fig 4 Forward Current vs Relative Luminous Flux Tj=85

0 200 400 600 800 1000 1200 1400 1600 1800 2000

0

20

40

60

80

100

120

140

160

180

200

220

240

Re

lati

ve

Lu

min

ou

s F

lux

[

]

Forward Current [mA]

24 26 28 30 32 34

00

02

04

06

08

10

12

14

16

18

20

22

Fo

rwa

rd C

urr

en

t [A

]

Forward Voltage [V]

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

9

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Junction Temperature [oC]

CIE X

CIE Y

0 200 400 600 800 1000 1200 1400 1600 1800 2000

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Forward Current [mA]

CIE X

CIE Y

Fig 5 Forward Current vs CIE X Y Shift Tj=85

145

Fig 6 Junction Temp vs CIE X Y Shift IF=700mA

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

10

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-020

-015

-010

-005

000

005

010

015

020

025

V

F

Junction Temperature [oC]

25 50 75 100 125

0

20

40

60

80

100

120

Re

lati

ve

lu

min

ou

s f

lux

[

]

Junction Temperature [oC]

Fig 7 Relative Light Output vs Junction Temperature IF=700mA

Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA

145

145

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

11

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=2A

0 20 40 60 80 100 1200

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

Ma

xim

um

Cu

rre

nt [m

A]

Ambient Temperature [oC]

Rth(j-a)=7W

Rth(j-a)=10W

Rth(j-a)=15W

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

12

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

13

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

8

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 3 Forward Voltage vs Forward Current Tj=85

Fig 4 Forward Current vs Relative Luminous Flux Tj=85

0 200 400 600 800 1000 1200 1400 1600 1800 2000

0

20

40

60

80

100

120

140

160

180

200

220

240

Re

lati

ve

Lu

min

ou

s F

lux

[

]

Forward Current [mA]

24 26 28 30 32 34

00

02

04

06

08

10

12

14

16

18

20

22

Fo

rwa

rd C

urr

en

t [A

]

Forward Voltage [V]

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

9

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Junction Temperature [oC]

CIE X

CIE Y

0 200 400 600 800 1000 1200 1400 1600 1800 2000

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Forward Current [mA]

CIE X

CIE Y

Fig 5 Forward Current vs CIE X Y Shift Tj=85

145

Fig 6 Junction Temp vs CIE X Y Shift IF=700mA

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

10

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-020

-015

-010

-005

000

005

010

015

020

025

V

F

Junction Temperature [oC]

25 50 75 100 125

0

20

40

60

80

100

120

Re

lati

ve

lu

min

ou

s f

lux

[

]

Junction Temperature [oC]

Fig 7 Relative Light Output vs Junction Temperature IF=700mA

Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA

145

145

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

11

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=2A

0 20 40 60 80 100 1200

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

Ma

xim

um

Cu

rre

nt [m

A]

Ambient Temperature [oC]

Rth(j-a)=7W

Rth(j-a)=10W

Rth(j-a)=15W

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

12

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

13

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

9

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Junction Temperature [oC]

CIE X

CIE Y

0 200 400 600 800 1000 1200 1400 1600 1800 2000

-0008

-0006

-0004

-0002

0000

0002

0004

0006

0008

Forward Current [mA]

CIE X

CIE Y

Fig 5 Forward Current vs CIE X Y Shift Tj=85

145

Fig 6 Junction Temp vs CIE X Y Shift IF=700mA

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

10

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-020

-015

-010

-005

000

005

010

015

020

025

V

F

Junction Temperature [oC]

25 50 75 100 125

0

20

40

60

80

100

120

Re

lati

ve

lu

min

ou

s f

lux

[

]

Junction Temperature [oC]

Fig 7 Relative Light Output vs Junction Temperature IF=700mA

Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA

145

145

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

11

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=2A

0 20 40 60 80 100 1200

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

Ma

xim

um

Cu

rre

nt [m

A]

Ambient Temperature [oC]

Rth(j-a)=7W

Rth(j-a)=10W

Rth(j-a)=15W

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

12

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

13

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

10

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

25 50 75 100 125

-020

-015

-010

-005

000

005

010

015

020

025

V

F

Junction Temperature [oC]

25 50 75 100 125

0

20

40

60

80

100

120

Re

lati

ve

lu

min

ou

s f

lux

[

]

Junction Temperature [oC]

Fig 7 Relative Light Output vs Junction Temperature IF=700mA

Fig 8 Relative Forward Voltage vs Junction Temperature IF=700mA

145

145

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

11

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=2A

0 20 40 60 80 100 1200

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

Ma

xim

um

Cu

rre

nt [m

A]

Ambient Temperature [oC]

Rth(j-a)=7W

Rth(j-a)=10W

Rth(j-a)=15W

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

12

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

13

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

11

Product Data Sheet

Rev52 Apr 13 2017

Characteristics Graph

Fig 9 Maximum Forward Current vs Ambient Temperature Tj(max)=145 IF=2A

0 20 40 60 80 100 1200

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

Ma

xim

um

Cu

rre

nt [m

A]

Ambient Temperature [oC]

Rth(j-a)=7W

Rth(j-a)=10W

Rth(j-a)=15W

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

12

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

13

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

12

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 70)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C7

W2 254 271

Refer to page

15

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WN-C7

W2 254 271

Refer to page

16~17

G 275 300W3 271 285

W4 285 299H 300 325

W5 299 313

SZ8-Y19-WW-C7

V3 223 237

Refer to page

18~20

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 70)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V2 V3 W1 W2 W3 W4 W5

5300 ndash 6000K B V2 V3 W1 W2 W3 W4 W5

4700 ~ 5300K C V2 V3 W1 W2 W3 W4 W5

4200 ~ 4700K D V2 V3 W1 W2 W3 W4 W5

3700 ~ 4200K E V2 V3 W1 W2 W3 W4 W5

3200 ~ 3700K F V2 V3 W1 W2 W3 W4 W5

2900 ~ 3200K G V2 V3 W1 W2 W3 W4 W5

2600 ~ 2900K H V2 V3 W1 W2 W3 W4 W5

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

13

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

13

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 80)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C8

V3 223 237

Refer to page

15

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WN-C8

V3 223 237

Refer to page

16~17

G 275 300W1 237 254

W2 254 271H 300 325

W3 271 285

SZ8-Y19-WW-C8

V1 195 208

Refer to page

18~20

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 80)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A V1 V2 V3 W1 W2 W3

5300 ndash 6000K B V1 V2 V3 W1 W2 W3

4700 ~ 5300K C V1 V2 V3 W1 W2 W3

4200 ~ 4700K D V1 V2 V3 W1 W2 W3

3700 ~ 4200K E V1 V2 V3 W1 W2 W3

3200 ~ 3700K F V1 V2 V3 W1 W2 W3

2900 ~ 3200K G V1 V2 V3 W1 W2 W3

2600 ~ 2900K H V1 V2 V3 W1 W2 W3

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

14

Product Data Sheet

Rev52 Apr 13 2017

Color Bin StructureTable 4 Bin Code description IF=700mA Tj=85 (CRI 90)

Part Number Luminous Flux [lm] Color

Chromaticity

Coordinate

Typical Forward Voltage [VF] [1]

Bin Code Min Max Bin Code Min Max

SZ8-Y19-W0-C9

V1 195 208

Refer to page

15

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WN-C9

V1 195 208

Refer to page

16~17

G 275 300V2 208 223

V3 223 237H 300 325

W1 237 254

SZ8-Y19-WW-C9

U2 172 182

Refer to page

18~20

G 275 300U3 182 195

V1 195 208H 300 325

V2 208 223

(1) Tolerance is 006V on forward voltage measurements

(2) All measurements were made under the standardized environment of Seoul Semiconductor

In order to ensure availability single color rank will not be orderable

Notes

Table 5 Luminous Flux rank distribution (CRI 90)

CCT CIE Luminous Flux Rank

6000 ~ 7000K A U2 U3 V1 V2 V3 W1

5300 ndash 6000K B U2 U3 V1 V2 V3 W1

4700 ~ 5300K C U2 U3 V1 V2 V3 W1

4200 ~ 4700K D U2 U3 V1 V2 V3 W1

3700 ~ 4200K E U2 U3 V1 V2 V3 W1

3200 ~ 3700K F U2 U3 V1 V2 V3 W1

2900 ~ 3200K G U2 U3 V1 V2 V3 W1

2600 ~ 2900K H U2 U3 V1 V2 V3 W1

Available Rank

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

15

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Cool white) Tj=85 IF=700mA

030 032 034 036

030

032

034

036

038 4700K

5000K

5300K

5600K

6000K

6500KB0

C1

C3

C5

C0

C2

C4

B1

B3

B57000K

B4

B2A1

A3

A5

A0

A4

A2

CIE

(y

)

CIE (x)

A0 A1 A2 A3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03028 03304 03115 03393 03041 03240 03126 03324

03041 03240 03126 03324 03055 03177 03136 03256

03126 03324 03210 03408 03136 03256 03216 03334

03115 03393 03205 03481 03126 03324 03210 03408

A4 A5 B0 B1

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03055 03177 03136 03256 03207 03462 03292 03539

03068 03113 03146 03187 03212 03389 03293 03461

03146 03187 03221 03261 03293 03461 03373 03534

03136 03256 03216 03334 03292 03539 03376 03616

B2 B3 B4 B5

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03212 03389 03293 03461 03217 03316 03293 03384

03217 03316 03293 03384 03222 03243 03294 03306

03293 03384 03369 03451 03294 03306 03366 03369

03293 03461 03373 03534 03293 03384 03369 03451

C0 C1 C2 C3

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03376 03616 03463 03687 03373 03534 03456 03601

03373 03534 03456 03601 03369 03451 03448 03514

03456 03601 03539 03669 03448 03514 03526 03578

03463 03687 03552 03760 03456 03601 03539 03669

C4 C5

CIE x CIE y CIE x CIE y

03369 03451 03448 03514

03366 03369 03440 03428

03440 03428 03514 03487

03448 03514 03526 03578

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

16

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

0350 0355 0360 0365 0370 0375034

035

036

037

038

039

D44

D43

4200K

4500K

4700K

D41

D31

D21

D11

CIE

Y

CIE X

D32

D42

D22

D12 D33

D23D13 D34

D24

D14

D11 D21 D31 D41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03548 03736 03595 03770 03641 03804 03689 03839

03539 03668 03584 03701 03628 03733 03674 03767

03584 03701 03628 03733 03674 03767 03720 03800

03595 03770 03641 03804 03689 03839 03736 03874

D12 D22 D32 D42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03539 03668 03584 03701 03628 03733 03674 03767

03530 03601 03573 03632 03616 03663 03659 03694

03573 03632 03616 03663 03659 03694 03703 03726

03584 03701 03628 03733 03674 03767 03720 03800

D13 D23 D33 D43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03530 03601 03573 03632 03616 03663 03659 03694

03520 03533 03562 03562 03603 03592 03645 03622

03562 03562 03603 03592 03645 03622 03687 03652

03573 03632 03616 03663 03659 03694 03703 03726

D14 D24 D34 D44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03520 03533 03562 03562 03603 03592 03645 03622

03511 03465 03551 03493 03590 03521 03630 03550

03551 03493 03590 03521 03630 03550 03670 03578

03562 03562 03603 03592 03645 03622 03687 03652

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

17

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Neutral White) Tj=85 IF=700mA

036 037 038 039 040035

036

037

038

039

040

041

E44

E43

3700K

4000K

4200K

E41

E31

E21

E11

CIE

Y

CIE X

E32

E42

E22

E12 E33

E23E13 E34

E24

E14

E11 E21 E31 E41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03736 03874 03804 03917 03871 03959 03939 04002

03720 03800 03784 03841 03849 03881 03914 03922

03784 03841 03849 03881 03914 03922 03979 03962

03804 03917 03871 03959 03939 04002 04006 04044

E12 E22 E32 E42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03720 03800 03784 03841 03849 03881 03914 03922

03703 03726 03765 03765 03828 03803 03890 03842

03765 03765 03828 03803 03890 03842 03952 03880

03784 03841 03849 03881 03914 03922 03979 03962

E13 E23 E33 E43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03703 03726 03765 03765 03828 03803 03890 03842

03687 03652 03746 03689 03806 03725 03865 03762

03746 03689 03806 03725 03865 03762 03925 03798

03765 03765 03828 03803 03890 03842 03952 03880

E14 E24 E34 E44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03687 03652 03746 03689 03806 03725 03865 03762

03670 03578 03727 03613 03784 03647 03841 03682

03727 03613 03784 03647 03841 03682 03898 03716

03746 03689 03806 03725 03865 03762 03925 03798

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

18

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

039 040 041 042 043

037

038

039

040

041

042

F44

F43

3200K

3500K

3700K

F41

F31

F21

F11

CIE

Y

CIE X

F32

F42

F22

F12 F33

F23F13

F34

F24F14

F11 F21 F31 F41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03996 04015 04071 04052 04146 04089 04223 04127

03969 03934 04042 03969 04114 04005 04187 04041

04042 03969 04114 04005 04187 04041 04261 04077

04071 04052 04146 04089 04223 04127 04299 04165

F12 F22 F32 F42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03969 03934 04042 03969 04114 04005 04187 04041

03943 03853 04012 03886 04082 03920 04152 03955

04012 03886 04082 03920 04152 03955 04223 03990

04042 03969 04114 04005 04187 04041 04261 04077

F13 F23 F33 F43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03943 03853 04012 03886 04082 03920 04152 03955

03916 03771 03983 03803 04049 03836 04117 03869

03983 03803 04049 03836 04117 03869 04185 03902

04012 03886 04082 03920 04152 03955 04223 03990

F14 F24 F34 F44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

03916 03771 03983 03803 04049 03836 04117 03869

03889 03690 03953 03721 04017 03751 04082 03783

03953 03721 04017 03751 04082 03783 04147 03814

03983 03803 04049 03836 04117 03869 04185 03902

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

19

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

041 042 043 044 045 046

038

039

040

041

042

043

G44

G43

2900K

3000K

3200K G41G31

G21G11

CIE

Y

CIE X

G32G42

G22

G12

G33G23

G13

G34G24

G14

G11 G21 G31 G41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04299 04165 04364 04188 04430 04212 04496 04236

04261 04077 04324 04099 04387 04122 04451 04145

04324 04100 04387 04122 04451 04145 04514 04168

04365 04189 04430 04212 04496 04236 04562 04260

G12 G22 G32 G42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04261 04077 04324 04100 04387 04122 04451 04145

04223 03990 04284 04011 04345 04033 04406 04055

04284 04011 04345 04033 04406 04055 04468 04077

04324 04100 04387 04122 04451 04145 04515 04168

G13 G23 G33 G43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04223 03990 04284 04011 04345 04033 04406 04055

04185 03902 04243 03922 04302 03943 04361 03964

04243 03922 04302 03943 04361 03964 04420 03985

04284 04011 04345 04033 04406 04055 04468 04077

G14 G24 G34 G44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04243 03922 04302 03943 04302 03943 04361 03964

04203 03834 04259 03853 04259 03853 04316 03873

04147 03814 04203 03834 04316 03873 04373 03893

04185 03902 04243 03922 04361 03964 04420 03985

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

20

Product Data Sheet

Rev52 Apr 13 2017

Color Bin Structure

CIE Chromaticity Diagram (Warm White) Tj=85 IF=700mA

043 044 045 046 047 048038

039

040

041

042

043

044

H44

H43

2600K2700K

2900K

H41H31H21H11

CIE

Y

CIE X

H32H42

H22H12

H33H23H13

H34H24H14

H11 H21 H31 H41

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04562 04260 04625 04275 04687 04289 04750 04304

04515 04168 04575 04182 04636 04197 04697 04211

04575 04182 04636 04197 04697 04211 04758 04225

04625 04275 04687 04289 04750 04304 04810 04319

H12 H22 H32 H42

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04515 04168 04575 04182 04636 04197 04697 04211

04468 04077 04526 04090 04585 04104 04644 04118

04526 04090 04585 04104 04644 04118 04703 04132

04575 04182 04636 04197 04697 04211 04758 04225

H13 H23 H33 H43

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04468 04077 04526 04090 04585 04104 04644 04118

04420 03985 04477 03998 04534 04012 04591 04025

04477 03998 04534 04012 04591 04025 04648 04038

04526 04090 04585 04104 04644 04118 04703 04132

H14 H24 H34 H44

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y

04420 03985 04477 03998 04534 04012 04591 04025

04373 03893 04428 03906 04483 03919 04538 03932

04428 03906 04483 03919 04538 03932 04593 03944

04477 03998 04534 04012 04591 04025 04648 04038

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

21

Product Data Sheet

Rev52 Apr 13 2017

Mechanical Dimensions

(1) All dimensions are in millimeters

(2) Scale none

(3) Undefined tolerance is plusmn02mm

lt Inner circuit gt

Cathode Anode

lt Top gt

lt Side gt

lt Bottom gt

Cathode

lt Recommended Solder Pattern gt

Cathode

Cu Open

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

22

Product Data Sheet

Rev52 Apr 13 2017

Material Structure

No List Material

① Encapsulation Silicone Phosphor

② Chip Source GaN ON SAPPHIRE

③ Solder-PAD Metal (Au)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

23

Product Data Sheet

Rev52 Apr 13 2017

Reflow Soldering Characteristics

We recommand reflect rate above 80 on PCB PRS

Caution

IPCJEDEC J-STD-020

Profile Feature Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3deg Csecond max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

150 degC180 degC80-120 seconds

Time maintained above

- Temperature (TL)

- Time (tL)217~220degC80-100 seconds

Peak Temperature (Tp) 250~255

Time within 5degC of actual Peak

Temperature (tp)220-40 seconds

Ramp-down Rate 6 degCsecond max

Time 25degC to Peak Temperature 8 minutes max

Atmosphere Nitrogen (O2lt1000ppm)

(1) Reflow soldering is recommended not to be done more than two times In the case of more than

24 hours passed soldering after first LEDs will be damaged

(2) Re-soldering should not be done after the LEDs have been soldered If re-soldering is

unavoidable LED`s characteristics should be carefully checked before and after such repair

(3) Do not put stress on the LEDs during heating

(4) After reflow do not clean PCB by water or solvent

SMT recommendation(1) After reflow Over 80 reflectance of PSR is recommended Tamura RPW-8000-xx

(2) Solder paste materials (SAC 305 No Cleaning Paste ) Senju M705-GRN360-KV

(3) We recommend TOV Test 18v~28v at 1uA (per LED)

(4) We recommend IR Test 0~1uA at -5V (per LED)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

24

Product Data Sheet

Rev52 Apr 13 2017

Emitter Tape amp Reel Packaging

180

13

60

2

22

114plusmn10

9plusmn03

Notes ( Tolerance plusmn02 Unit mm )

(1) Quantity 1500pcsReel

(empty slot possible in taping reel)

(2) Cumulative Tolerance Cumulative Tolerance10 pitches to be plusmn02mm

(3) Adhesion Strength of Cover Tape Adhesion strength to be 01-07N when the cover

tape is turned off from the carrier tape at the angle of 10ordm to the carrier tape

(4) Package PN Manufacturing data Code No and quantity to be indicated on a damp

proof Package

Size

A0 200plusmn005

B0 196plusmn005

K0 075plusmn005

B

Brsquo

A Arsquo

K0

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

25

Product Data Sheet

Rev52 Apr 13 2017

Packaging Information

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

26

Product Data Sheet

Rev52 Apr 13 2017

Handling of Silicone Resin for LEDs

(1) During processing mechanical stress on the surface should be minimized as much as possible

Sharp objects of all types should not be used to pierce the sealing compound

(2) Do not use tweezers to pick up or handle WICOP2 LEDs

A vacuum pick up should only be used

(3) When populating boards in SMT production there are basically no restrictions regarding the form

of the pick and place nozzle except that mechanical pressure on the surface of the resin must be

prevented This is assured by choosing a pick and place nozzle which is smaller than the LEDrsquos

area

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs These

conditions must be considered during the handling of such devices Compared to standard

encapsulants silicone is generally softer and the surface is more likely to attract dust As

mentioned previously the increased sensitivity to dust requires special care during processing

(5) Please do not mold this product into another resin (epoxy urethane etc) and do not handle this

product with acid or sulfur material in sealed space

(6) Avoid leaving fingerprints on silicone resin parts

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

27

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(1) Storage

To avoid the moisture penetration we recommend storing LEDs in a dry box with a desiccant The

recommended storage temperature range is 5 to 30 and a maximum humidity of RH50

(2) Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency

Pay attention to the following

a Recommend conditions after opening the package

- Sealing Temperature 5 ~ 30 Humidity less than RH60

b If the package has been opened more than 1 year (MSL 2) or the color of

the desiccant changes components should be dried for 10-24hr at 65plusmn5

(3) Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering

(4) Do not rapidly cool device after soldering

(5) Components should not be mounted on warped (non coplanar) portion of PCB

(6) Radioactive exposure is not considered for the products listed here in

(7) Gallium arsenide is used in some of the products listed in this publication These products are

dangerous if they are burned or shredded in the process of disposal It is also dangerous to drink the

liquid or inhale the gas generated by such products when chemically disposed of

(8) This device should not be used in any type of fluid such as water oil organic solvent and etc

(9) When the LEDs are in operation the maximum current should be decided after measuring the

package temperature

(10) The appearance and specifications of the product may be modified for improvement without

notice

(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

28

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca

n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy T

he result can be a significant loss of light output from the fixture Knowledge of the properties of the m

aterials selected to be used in the construction of fixtures can help prevent these issues

(13) The slug is electrically isolated

(14) Attaching LEDs do not use adhesives that outgas organic vapor

(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF If the rev

erse voltage is applied to LED migration can be generated resulting in LED damage

(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS) Below is

a list of suggestions that Seoul Semiconductor purposes to minimize these effects

a ESD (Electro Static Discharge)

Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come

into contact While most ESD events are considered harmless it can be an expensive problem in

many industrial environments during production and storage The damage from ESD to an LEDs may

cause the product to demonstrate unusual characteristics such as

- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current

The following recommendations are suggested to help minimize the potential for an ESD event

One or more recommended work area suggestions

- Ionizing fan setup

- ESD tableshelf mat made of conductive materials

- ESD safe storage containers

One or more personnel suggestion options

- Antistatic wrist-strap

- Antistatic material shoes

- Antistatic clothes

Environmental controls

- Humidity control (ESD gets worse in a dry environment)

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

29

Product Data Sheet

Rev52 Apr 13 2017

Precaution for Use

b EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device

The effects from an EOS event can be noticed through product performance like

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary but there are some

common signs that will indicate an EOS event has occurred

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires

- This damage usually appears due to the thermal stress produced during the EOS event

c To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice

wwwseoulsemiconcom

SZ8-Y19-XX-XX - High-power LED

30

Product Data Sheet

Rev52 Apr 13 2017

Company Information

Published by

Seoul Semiconductor copy 2013 All Rights Reserved

Company Information

Seoul Semiconductor (wwwSeoulSemiconcom) manufacturers and packages a wide selection of

light emitting diodes (LEDs) for the automotive general illuminationlighting Home appliance signage

and back lighting markets The company is the worldrsquos fifth largest LED supplier holding more than

10000 patents globally while offering a wide range of LED technology and production capacity in

areas such as ldquonPolardquo Acrich the worldrsquos first commercially produced AC LED and Acrich MJT -

Multi-Junction Technology a proprietary family of high-voltage LEDs

The companyrsquos broad product portfolio includes a wide array of package and device choices such as

Acrich and Acirch2 high-brightness LEDs mid-power LEDs side-view LEDs and through-hole type

LEDs as well as custom modules displays and sensors

Legal Disclaimer

Information in this document is provided in connection with Seoul Semiconductor products With

respect to any examples or hints given herein any typical values stated herein andor any information

regarding the application of the device Seoul Semiconductor hereby disclaims any and all warranties

and liabilities of any kind including without limitation warranties of non-infringement of intellectual

property rights of any third party The appearance and specifications of the product can be changed

to improve the quality andor performance without notice