rorz e · pdf filerorze robotech inc. nomura-haiphong industrial zone km13 road no.5 anduong...

All Rorze products come with a 24-month guarantee.(Applicable to products shipped on or after September 1, 1996.)Specifications and products are subject to change without any obligation on the part of the manufacturer.

RORZE TECHNOLOGY SINGAPORE PTE. LTD.

RORZE TECHNOLOGY, INC.

RORZE TECHNOLOGY CONSULTANTS (SIP) CO.,LTD.

RORZE AUTOMATION, INC.

RORZE SYSTEMS CORPORATION

RORZE ROBOTECH INC.

CPB 050201

■Headquarters1588 Michinoue, Kannabe-cho, Fukayasu-gun, Hiroshima 720-2104, JapanTelephone +81-84-960-0001Facsimile +81-84-960-0200

●RORZE TECHNOLOGY, INC.1F., No.12, Industry East Road.,Ⅳ,Science-based Industrial Park, Hsinchu, Taiwan, R.O.C.Telephone +886-3-5776482Facsimile +886-3-5776461

●RORZE AUTOMATION, INC.1625 McCandless Drive, Milpitas, CA 95035, U.S.A.Telephone +1-408-935-9100Facsimile +1-408-935-9101

●RORZE SYSTEMS CORPORATION720 Korim-Dong, Yongin-City, Kyunggi-Do, 449-923, KoreaTelephone +82-31-335-9100Facsimile +82-31-337-1811

●RORZE ROBOTECH INC.Nomura-Haiphong Industrial ZoneKm13 Road No.5 Anduong District, Haiphong City, VietnamTelephone +84-31-743030Facsimile +84-31-743044

●RORZE TECHNOLOGY SINGAPORE PTE. LTD.627A, Aljunied Road, #10-11, Biztech CentreSingapore 389842Telephone +65-68445502Facsimile +65-68445510

●RORZE TECHNOLOGY CONSULTANTS (SIP) CO.,LTD.Room C1711, No.360, Hengtong Road,Shanghai 200070, China

RORZE CORPORATION

FeaturesMaster Network Control SystemWafer Handling RobotMeasurement of particlesClean system based on optimal airflow

System Application Example for EFEM

PerformanceExplanation of terms MTBF Repeatability

Wafer Transfer UnitsAtmospheric Robot RR713・RR716・RR717

RR700 RR701

Vacuum Robot MUSASHI series RR352 RR452

Aligner RA310 RA210 RA401

Opener for 300mm wafers FORS300

Elevator RE119 RE120

EFEM RS70000 series

Wafer Sorter RSC seriesRS8221

200mmEFEM RACS200 RACS200S (Compatible with SMIF Pod)

LCD Glass Substrate Handling SystemCassette Station RRG-80 (Classification 1100×1250)

OptionsCeramic Finger

NEW!!

INDEX

32

FeaturesMasternet Control System

Electromagnetic 　　　　　 brake

Vacuumchucking

Vacuumchucking

ResetSet

ResetSet

ROS-02

ROP-02

ROS-02

ROS-02

ROP-02

ROS-02VAC1

STALLORG

STALLORG

Z-axis Rotation Arm 1 Arm 2

RC-204A

FAN DetectionBrakeboard

STALLORG

CCW LIMITSTALLORG

CCW LIMIT

RC-234

R-022 R-022

VAC2VAC1VAC2RD-026MSA

RS232C

Generate MasterRC-234



Generate MasterI/O Master

DriverRD-026MSA

DriverRD-026MSA

DriverRD-026MSA

Driver

AA

CLOCK

Motor Motor Motor Motor

Link MasterRC-002RS-232C

Current signal

Mapping sensor

Mapping sensor

Chuckingconfirmation

Chuckingconfirmation

Arm1 wrist block Arm2 wrist block

9600bps9600bps

Mapping completeMapping preperation

Wafer Handling Robot

Wafer Handling Robot (with simultaneous Interpolation movement)

RD-029MS RD-026MSA

Reset

Set

VAC2

VAC1

ORG

STALL

ORG

STALL

Barrel Arm WristZ-axis

RC-420

E-083E40

CCW LIMIT

FAN Detection

STALL

ORG

STALL

ORG

RS-485

PCM-5820B

0V5V

RO

-UW

3

21 3

3132 30

R-073

1311 12654 987 10

2022 212729 28 25 2426 23

1419

15 16

18 17

RS232C

Driver DriverRD-026MSA

DriverRD-026MSA

Driver

CLOCK CLOCK CLOCK CLOCKG F E

JI H

A

A

Motor

Encoder

MotorEncoder

MotorEncoder

MotorEncoder

D C B

Z-axis STALL

Barrel STALL

Arm STALL

Wrist STALL

B

C

D

Arm CLOCK

Wrist CLOCK

Z-axis CLOCK

Barrel CLOCK

E

F

G

I

J

H





Encoder Master

Chucking confirmation

Vacuum chucking

Wrist block

Wrist encoder signal

Arm encoder signal

Barrel encoder signal

Z-axis encoder signal

Brakeboard

Mapping sensor Mapping sensor

Electromagnetic 　　　　 brake

RC-420

FE

AT

UR

ES

Masternet control system is a system to make a control system for central or remote control via a main con-

troller such as a personal computer with RS-232C, etc.

Features :

(1) Current Adapter, the Link Master RC-002 and RC-400 provide the communication between the PC and

controllers with a 3-line cable.

(2) Controllers with general I/O ports such as RC-204A, RC-207A, and RC-410 can be controlled by the com-

munication.

(3) Compact stepping motor drivers (RD series) can be mounted right next to motors.

(4) 2-ph/5-ph stepping motors (RM series) are optimized to the specifications of RORZE drivers.

System Diagram

RC-200 Series

● Because each controller is originally controlled by the commands received from the communication, easy

programs from the PC can provide high level control.

● Operation software can be written in any high level language which can control RS-232C communication.

● Compact steel casings and simple wiring make the system compact and provide free configurations.

● Because the easy unit operates with a DC power supply, it can be built into autonomous robots.

● Modular systems make the time for development of devices shorter and the system easier to diagnose

and repair.

Features

System Diagram

New ControllerRC-400 Series

● Polling is unnecessary

The Link Master RC-400 supervising each controller by high speed RS-485 (921.6kbps max.) lightens the bur-

den imposed on the host PC. (Automatic polling function) Also, the communication speed between the host

PC and a RC-400 has become about 10 times faster than before. (115.2kbps max.)

● Multi-axes synchronous interpolation can be controlled.

Using simple commands from the host computer, more than one RC-420 can be used to control the multi-axes

synchronous interpolation.

● Simple wiring

The network can consist of one RC-400 and a twisted wire pair. Communication distance is extendable up to

1.2km, and up to 120 RC-400 series controllers can be controlled.

Features

Products with RC-400 series controller

RS73000 RR732 RR421

RC-234

54

FeaturesAtmospheric Wafer Handling Robot

Standard RR701L1211-204

Min. rotational range

Max. handling range

CW limit(Rotational range )

FE

AT

UR

ES

Wafer Transfer Robot RR701This is a clean robot for semi-conductor processing. A Rorzelong-seller.

Its optimum S-curve acceleration/deceleration controller enablesit to transfer wafers at high speed. It uses a Ferro-fluidic seal onthe arm joints.

With two arms, a built-in Z-axis, wafer exchange on the processstage can take place very quickly.

Due to the Masternet Control System it can be combined freelywith Elevators, Aligners etc. to easily build a compact transfersystem.

The RR701 series has received patents as a “SCARA Robot forwafer transfer”. (JP.2739413, KP.0288085). This patented robotis used in large numbers in semi-conductor and LCD manufac-turing processes.

Low particle generation and high throughput

Single-arm Dual arm

Finger (End effector) Single finger Symmetric finger 1 Finger×2

Throughput 1.0 1.6 1.8

Foot print 1.0 1.5 1.3

Cost performance 1.0 1.1 1.4

Comparison chart of cost performance for various robot arms

Measurement of Particles

Elapsed time（ｈ）

Total

1 0 0 0 0 0 0 0

2 0 0 0 0 0 0 0

3 0 0 0 0 0 0 0

4 0 0 0 0 0 0 0

5 0 0 0 0 0 0 0

6 0 0 0 0 0 0 0

7 0 0 0 0 0 0 0

8 0 0 0 0 0 0 0

9 0 0 0 0 0 0 0

0 0 0 0 0 0 0

0 0 0 0 0 0 0

0 0 0 0 0 0 0

0

Clean booth

U L P A

H E P A

RR713

《Outline of the tests》《Method of Measurement》

In a clean room environment

([ISO] Class 1)

Particle Counter

(TS-3700, Suction rate: 1CF/min)

《Measurement results》

No. of particles when moving continuously

【Measuring Point】A point at the highest position on the Z-axis, around the vicinity of the end point of the arm when fully extended. (400mm from the Robot).

【Movement of the Robot】A Rotation of 270°, Arms stretching out and contracting at the highest point of the Z-axis. (Arm 1 and Arm 2 moving alternatively), and then the rotation and the Z-axes move to the Origin position with the arms stretching out and contracting (Arm1 and Arm 2 moving simultaneously). This is a repeated movement with a cycle time of 8.6 seconds.

【Measurement Time】Measured every 60 minutes for 12 hours.The average no. of particles per minute is calculated (particles/CF)

No. of particles

（No. of particles/CF）

≧0.1μm ≧0.2μm ≧0.3μm ≧0.5μm ≧1.0μm ≧2.0μm

0.000Average per minute （/min）

Total（12h）

1011

12

《Evaluation》Over 12 hours of continuous movement, the no. of particles is 0/CF.

76

Features System Application Example for EFEM

SY

ST

EM

AP

PL

ICA

TIO

NE

XA

MP

LE

FO

RE

FE

M

Clean system based on optimal airflowIts optimal airflow makes for a clean system.The load port can be changed even when in operation.

●Optimisation of airflow.Design based on particle analysis creates a laminar airflow inside the mini-environment. Air accumulating in the top corners ofthe system and upward spiralling of air help to prevent particles from sticking to the wafers.

●Pressure separation plateBased on the results of airflow analysis, a pressure separation plate that keeps the clean area separate from the rest of the unitwas developed to efficiently make use of the output of the FFU.

Installation of a pressure separation plate enables us to keep the transfer area free from particles.It is possible to exchange load ports even when the EFEM is in operation.

●Ability to change the load port when in operationWhen sufficient preparations have been made and the pressure separation plate is in place, the load port can be changed evenwhen the system is in operation.

Patent pendingPressure separation plate

Systems with the middle pressure separation plate

RS73000 RSC242

Ⅰ FOUP8" and 12" open cassette applicable

Ⅱ 2 FOUP8" and 12" open cassette applicable

Ⅲ 3 FOUP

RV201-F05300mm FOUP Loadport Elevator（320ST）

RE123-321-001

FFU（ULPA）

RA310-812Aligner

1600

545

317

545

98215

297.5 505 797.5

313

417

445

1175

350

16502000

E M O

PLACEMENT

PRESENCE

MANUAL

AUTO

搬入禁止

搬入予約

PA192-80M

OPERATORACCESS

LOAD

UNLOAD

505

RobotRA310-812Aligner

FFU（ULPA）

AIR2AIR1 VAC

COVER CLOSECOVER LOCK PLACEMENT UNLOADLOAD

Logitech

PLACEMENT

PRESENCE

MANUAL

AUTO

搬入禁止

搬入予約

EMO

OPERATORACCESS

LOAD

UNLOAD

PLACEMENT

PRESENCE

MANUAL

AUTO

搬入禁止

搬入予約

MENU

AUTO

SELECT

Access Vision

300

560

510

1180

70250

325 505 5052165

515 315

350

146016502000

EMO

300mm FOUP LoadportRV201-F05

200mm OC LoadportRV101

RR712L1521-3A3-E11

300mm FOUP Loadport RV201-F05

EMO switch

RA301-812Aligner

RT130-1112X-axis table

RobotRR713-L150

350

1650

1200

2000

FFU（ULPA）

448

5052200

505 360280

800

E M O

PLACEMENT

PRESENCE

UNLOAD

LOAD

PLACEMENT

PRESENCE

UNLOAD

LOAD

PLACEMENT

PRESENCE

UNLOAD

LOAD

RS232C IN

P-CN5

ROBOT-C

RS232C OUT

P-CN4

ROBOT-D

I/O

1248

800

338

660

250

70

76

Features System Application Example for EFEMS

YS

TE

MA

PP

LIC

AT

ION

EX

AM

PL

EF

OR

EF

EM

Clean system based on optimal airflowIts optimal airflow makes for a clean system.The load port can be changed even when in operation.

●Optimisation of airflow.Design based on particle analysis creates a laminar airflow inside the mini-environment. Air accumulating in the top corners ofthe system and upward spiralling of air help to prevent particles from sticking to the wafers.

●Pressure separation plateBased on the results of airflow analysis, a pressure separation plate that keeps the clean area separate from the rest of the unitwas developed to efficiently make use of the output of the FFU.

Installation of a pressure separation plate enables us to keep the transfer area free from particles.It is possible to exchange load ports even when the EFEM is in operation.

●Ability to change the load port when in operationWhen sufficient preparations have been made and the pressure separation plate is in place, the load port can be changed evenwhen the system is in operation.

Patent pendingPressure separation plate

Systems with the middle pressure separation plate

RS73000 RSC242

Ⅰ FOUP8" and 12" open cassette applicable

Ⅱ 2 FOUP8" and 12" open cassette applicable

Ⅲ 3 FOUP

RV201-F05300mm FOUP Loadport Elevator（320ST）

RE123-321-001

FFU（ULPA）

RA310-812Aligner

1600

545

317

545

98215

297.5 505 797.5

313

417

445

1175

350

16502000

E M O

PLACEMENT

PRESENCE

MANUAL

AUTO

搬入禁止

搬入予約

PA192-80M

OPERATORACCESS

LOAD

UNLOAD

505

RobotRA310-812Aligner

FFU（ULPA）

AIR2AIR1 VAC


Logitech

PLACEMENT

PRESENCE

MANUAL

AUTO

搬入禁止

搬入予約

EMO

OPERATORACCESS

LOAD

UNLOAD

PLACEMENT

PRESENCE

MANUAL

AUTO

搬入禁止

搬入予約

MENU

AUTO

SELECT

Access Vision

300

560

510

1180

70250

325 505 5052165

515 315

350

146016502000

EMO



RR712L1521-3A3-E11

300mm FOUP Loadport RV201-F05

EMO switch

RA301-812Aligner

RT130-1112X-axis table

RobotRR713-L150

350

1650

1200

2000

FFU（ULPA）

448

5052200

505 360280

800

E M O

PLACEMENT

PRESENCE

UNLOAD

LOAD

PLACEMENT

PRESENCE

UNLOAD

LOAD

PLACEMENT

PRESENCE

UNLOAD

LOAD

RS232C IN

P-CN5

ROBOT-C

RS232C OUT

P-CN4

ROBOT-D

I/O

1248

800

338

660

250

70

98

Performance

PE

RF

OR

MA

NC

E

(based on the Japan Industrial Standard No. Z8115 H10)

MTBF data in RR701 series

Glossary

Term MTBF

1994 0.42 years

1995 1.09 years

1996 1.54 years

1997 2.30 years

1998 3.47 years

1999 4.54 years

2000 7.75 years

2001 10.66 years

2002 13.11 years

2003 12.97 years

MTBF - Mean Time Between Failures -

Formula used to obtain the above figures:

Total uptime: Calculated by multiplying the accumulative number of robots shipped out up to 3 months before a summa-rizing point for each term, by 25% as the robot operation rate. (based on the assumption that robots wouldbe brought into users’ operation 3 months after shipment)

No. of failures: The no. of failures which Rorze has corrected, including initial troubles, and customers’ claims which werereported. (Those with no reocurrance of reported failures through inspection by Rorze)

No. of robots shipped: Obtained by the formula below:① + (② x 0.5)

① The accumulative number of robots shipped in the past, up to the beginning of each year ② The total number of robots shipped each year

MTBF = Total uptime (for one year)

No. of failures (for one year)

Explanation of terms used in the specifications in this catalogue.

■ Movement Time: The time required (when carrying nothing) to move a fixed distance at maximum speed. (Measuredin a temperature range of 23～30℃)

■ Movement RangeR direction: Maximum possible transfer stroke (From the center of the robot to

the center of the work.)

Movement Rangeθdirection: Maximum possible rotation radius.

Movement RangeZ direction: Maximum possible vertical stroke.

■ Repeatability: Position error, resulting from repetition of positioning towards a cer-tain point in one direction.

■ Aligning Accuracy: Positioning accuracy with aligners.

■ Mass of Main Body: Weight of a main body only, excluding that of control unit, powersupply unit, D-subcables (connecting cables), etc.

R-direction

θ-direction

Z-d

irect

ion

■R-direction,θ-direction Z-direction

RepeatabilityFig. 1 and 2 show the motion pattern used for repeatability inspection.

Time of Repetition: 100 times

Measured Section: Measure the position of the tip of a finger, at the point C shown in the Fig. 1, in the X- and Y-direction.

Measuring Conditions: Measure after an aluminum finger, mounted onto the 3rd arm joint, completely stops

(after the vibration stops)

Measuring Tools: Non-contact deflection meters (laser type), vernier calipers, dial gauges, etc.

In the case of RR700L90;

Ia = 94mm (Arm dimensions)

If = 287mm (Dimensions of the finger used for the mea-

surement)

(If: Distance between the third articulated center and front

edge of finger)

L0 = 140mm (Distance between axes: Origin position)

L1 = 163mm (Distance between axes: when arm is extended)

L2 = 450mm (Transportation distance)

Theta direction conversion equationAssume Theta direction backlash angle is A(°), backlash amount B(mm) is derived from the following equation.

B = L2 x tan A

Fig.1 Motion Pattern of Arm Stretch/Retraction

Initialize

Arm stretch

Arm retraction

Rotation 180˚

Rotation 90˚

Rotation 0˚One cycle

Fig.2 Motion Flow Fig.3 Measurement on X-Y Position Deflection

Laser deflection meter(for X-direction)

Laser deflection meter(for Y-direction)

Running direction

98

PerformanceP

ER

FO

RM

AN

CE

(based on the Japan Industrial Standard No. Z8115 H10)

MTBF data in RR701 series

Glossary

Term MTBF

1994 0.42 years

1995 1.09 years

1996 1.54 years

1997 2.30 years

1998 3.47 years

1999 4.54 years

2000 7.75 years

2001 10.66 years

2002 13.11 years

2003 12.97 years

MTBF - Mean Time Between Failures -

Formula used to obtain the above figures:

Total uptime: Calculated by multiplying the accumulative number of robots shipped out up to 3 months before a summa-rizing point for each term, by 25% as the robot operation rate. (based on the assumption that robots wouldbe brought into users’ operation 3 months after shipment)

No. of failures: The no. of failures which Rorze has corrected, including initial troubles, and customers’ claims which werereported. (Those with no reocurrance of reported failures through inspection by Rorze)

No. of robots shipped: Obtained by the formula below:① + (② x 0.5)

① The accumulative number of robots shipped in the past, up to the beginning of each year ② The total number of robots shipped each year

MTBF = Total uptime (for one year)

No. of failures (for one year)

Explanation of terms used in the specifications in this catalogue.

■ Movement Time: The time required (when carrying nothing) to move a fixed distance at maximum speed. (Measuredin a temperature range of 23～30℃)

■ Movement RangeR direction: Maximum possible transfer stroke (From the center of the robot to

the center of the work.)

Movement Rangeθdirection: Maximum possible rotation radius.

Movement RangeZ direction: Maximum possible vertical stroke.

■ Repeatability: Position error, resulting from repetition of positioning towards a cer-tain point in one direction.

■ Aligning Accuracy: Positioning accuracy with aligners.

■ Mass of Main Body: Weight of a main body only, excluding that of control unit, powersupply unit, D-subcables (connecting cables), etc.

R-direction

θ-direction

Z-d

irect

ion

■R-direction,θ-direction Z-direction

RepeatabilityFig. 1 and 2 show the motion pattern used for repeatability inspection.

Time of Repetition: 100 times

Measured Section: Measure the position of the tip of a finger, at the point C shown in the Fig. 1, in the X- and Y-direction.

Measuring Conditions: Measure after an aluminum finger, mounted onto the 3rd arm joint, completely stops

(after the vibration stops)

Measuring Tools: Non-contact deflection meters (laser type), vernier calipers, dial gauges, etc.

In the case of RR700L90;

Ia = 94mm (Arm dimensions)

If = 287mm (Dimensions of the finger used for the mea-

surement)

(If: Distance between the third articulated center and front

edge of finger)

L0 = 140mm (Distance between axes: Origin position)

L1 = 163mm (Distance between axes: when arm is extended)

L2 = 450mm (Transportation distance)

Theta direction conversion equationAssume Theta direction backlash angle is A(°), backlash amount B(mm) is derived from the following equation.

B = L2 x tan A

Fig.1 Motion Pattern of Arm Stretch/Retraction

Initialize

Arm stretch

Arm retraction

Rotation 180˚

Rotation 90˚

Rotation 0˚One cycle

Fig.2 Motion Flow Fig.3 Measurement on X-Y Position Deflection

Laser deflection meter(for X-direction)

Laser deflection meter(for Y-direction)

Running direction

1110

WA

FE

RT

RA

NS

FE

RU

NIT

S

RR713・RR716・RR717

RR717L1521-3A6

RR716L1523-3A6

J.PAT. No.2739413

RR717L1521-3A6 RR716L1523-3A6

R733

R716330

±0.051.6 1.5

40

41

■Power source: Electrical 24V 23A and over. Vacuum pressure: -40kPa~-80kPa, / Flow rate: 10liters/min and over.Note1: Robot operation area may differ depending on wrist and finger.Note2: Time needed for the R direction to fully extend, the theta direction to rotate 330°and the Z direction

to perform the Z-axis stroke.Note3: The measurement of the described data above was performed on this product itself, so the data

may be different, if this product is used in a system.

Model

RR713L1521-3A3L1522-3A3

R622 300

300 ±0.1

Operation time

±0.03±0.02

1.2

1.3

1.2

2.0 2.5 45Vacuum Chucking TypeEdge Clamp Type

Remarks

Note1

Note 2

φ300mm wafer （200g）

Repeatability (in the same direction)Handledobject

Mass ofmain body

(kg)

Robot Specifications

Operation range

θ-axis( )゚

R-axis (mm)

Z-axis(mm)

R-direction(sec)

θ-direction(sec)

Z-direction(sec)

R-direction (mm)

Z-direction(mm)

θ-direction( )゚

RR716L1523-3A6RR717L1521-3A6

Control unit565

130

RC POWER

CP2(RD) CP1(RC)

RD POWER

Z MOTORROBOT

I/O

ROBOT

280

TCP/IP

FANRS-485 OUT

RS-232C KEY VGA

117

(Cle

aran

ce

res

erve

d

for

wiri

ng)

The distance between the robot and finger may differ depending on the finger length.RR713 robot, as shown above, will not transfer any work to two loadports without X-axis table.

The distance between the robot and finger may differ depending on the finger length.

505

608

761.5

300

736.7

754.9

543

120

200

156

156

φ 228

φ 221

Exhaust fan

φ 228

φ 221

608

735

300

732.4

200

120

156

505

545

Exhaust fan

Atmospheric Robot

FEATURES

MOUNTING DIMENSIONS

PRODUCT DIMENSIONS PRODUCT DIMENSIONS

SPECIFICATIONS

FEATURES of RR713, RR716 & RR7171. Excellent cleanliness due to Ferro fluidic seal and fully

enclosed drum cover.2. You can choose between two types of transfer; Edge

Clamp or Vacuum chucking.3. With a stroke of 300mm, the Z-axis is compatible with

the 25-stage cassette for 300mm wafers.FEATURES of RR716 & RR7171. RR716 and 717 can transfer wafers to 2 load ports with-

out an X-axis by controlling the interpolation between therotation axis and the arm axis.

2. Initialization is not necessary due to a built-in absoluteencoder.

3. Optimal acceleration/deceleration provided by newmodel Rorze Controllers.

4. No unnecessary motion due to the optimal trajectory forwafer transfer being calculated inside the controller.

5. Having a structure with the first joint offset from the robotcenter, and a minimum rotation range the same as theexisting single arm robot, the wafer transferring distancecan be increased. (RR716)

1312

WA

FE

RT

RA

NS

FE

RU

NIT

S

Atmospheric RobotRR700 SERIES

RR700L1521-204

1. The S-curve acceleration/decelerationcontrol speeds up the wafer handlingprocess.

2. Using a Ferro fluidic seal on the armjoints minimizes the particle genera-tion.

3. Three versions are available with aZ-axis stroke of 20mm, 200mm or300mm.

RR700L0911-204

Control unit

ORG

CW

φ240

Mounting base

M5 cap screw

M6 set screw, for level adjustment

φ100 access

hole

3-equally-divided M5

M4 cap screw

Mounting base

Holes (dia. 4.5) at 4 positionsfor mountingthis unit

Min. rotational range φ360

CW limit(Rotational range 330°)

Max. handling range R408

Exhaust Fan(Option)

φ300

□220

φ228

594.5～894.5

Center of flipping:718.5～1018.5

φ300

□62

47

29

12

1043.5

300

280

156

70 155

25.4

Min. rotational 　range φ550

CW limit(Rotational range 330°)

Max. handling range: R592

Exhaust Fan(Option)

Flippable position: 267

ORG

RR700L1522-3A3

Atmospheric RobotRR701 SERIES

1. The dual-arm configuration savestime in exchanging wafers on processstages.

2. The S-curve acceleration/decelera-tion control speeds up the waferhandling process.

3. Using a Ferro fluidic seal on the armjoints minimizes the particle genera-tion.

4. Three versions are available with aZ-axis stroke of 20mm, 200mm or300mm. RR701L0911-204

Control unit

Holes(dia. 4.5) at 4 positions for mounting this unit M4 cap screw

Mounting base

3-equally-divided M5

φ100 access hole

M5 cap screw

M6 set screw, for level adjustment

Mounting base

J.PAT. No.2739413 RR701L1211-204

Min. rotational range φ340

Max. handling range R373

CW limit (Rotational range 330°） 120

100

ORG80

7.6

39

47

787.5

454

25.4

573.6

581.2

587.5

220

94

φ228

φ250□62

Exhaust Fan (Option)

RR700L0911-021L0911-204L1211-021L1211-204L1211-303

L1522-204L1522-303

L1521-021L1521-204L1521-303

R408

R462

R532

R590

R528

330

20

200

20

200

300

20

200

300

200

300

±0.05 ±0.02

±0.008

±0.012

0.7 1.3

0.8 1.5

1.0 1.8

1.5 1.8

0.6 17

2.0 24

0.6 19

2.0 26

3.0 27

0.6 22

2.0 29

3.0 30

2.0 29

3.0 30

φ100～ φ300mm wafer （200g）

θ-axis( )゚

R-axis (mm)

Handledobject R-direction

(sec)θ-direction

(sec)Z-direction

(sec)

Mass ofmain body

(kg)Remarks


ModelOperation range

Note 1

Z-axis(mm)

Repeatability (in the same direction)

R-direction (mm)

Z-direction(mm)

θ-direction( )゚

Operation timeNote 2

Note 3

Note 3

Note 3

Flip Finger

Flip Finger

■Power source: Electrical 24V 9A and over. Vacuum pressure: -40kPa~-80kPa, / Flow rate: 10liters/min and over.Note1: Robot operation area may differ depending on wrist and finger.Note2: Time needed for the R direction to fully extend, the theta direction to rotate 330° and the Z direction to perform the Z-axis stroke.Note3: For the Z-axis 300mm stroke robot, you can choose the type of mounting base to use.Note4: The measurement of the described data above was performed on this product itself, so the data may be different, if this

product is used in a system.

Model

RR701L0911-021

L1211-021L1211-204L1211-303

L1521-204L1521-303

L0911-204R373

R427

R512

R582

330

20

200

20

200

300

200

300

±0.05 ±0.02

Repeatability (in the same direction)Operation range Operation time

±0.008

±0.012

0.7 1.3

0.8 1.5

1.0 1.8

0.6 19

2.0 26

0.6 23

2.0 30

3.0 34

2.0 36

3.0 40

Note1

Note 3

Note 3

Note2

φ100～ φ300mm

wafer （200g）

Handledobject R-direction

(sec)θ-direction

(sec)Z-direction

(sec)

Mass ofmain body

(kg)


R-direction (mm)

Z-direction(mm)

θ-direction( )゚

θ-axis( )゚

R-axis (mm)

Z-axis(mm)

■Power source: Electrical 24V 12A and over. Vacuum pressure: -40kPa~-80kPa, / Flow rate: 10liters/min and over.Note1: Robot operation area may differ depending on wrist and finger.Note2: Time needed for the R direction to fully extend, the theta direction to rotate 330°and the Z direction to perform the Z-axis stroke.Note3: For the Z-axis 300mm stroke robot, you can choose the type of mounting base to use.Note4: The measurement of the described data above was performed on this product itself, so the data may be different, if this

product is used in a system.

RR701L0951-204WATER RESISTANT TYPE・Patent Pending

FEATURES

MOUNTING DIMENSIONS

PRODUCT DIMENSIONSPRODUCT DIMENSIONS

SPECIFICATIONS

FEATURES

SPECIFICATIONS

MOUNTING DIMENSIONSPRODUCT DIMENSIONS

Flip Type

15

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Vacuum RobotMUSASHI SERIES

FEATURES

1. Narrow-angle placement of arms and short transfer routereduce the swap time.

2. By adapting the direct drive and the vacuum bulkhead,only the vacuum bearing and the arms moves in vacuumenvironment. It reduces the robot gas and particle gen-eration drastically.

3. Accessing the robot from the top of the chamber for thereplacement reduces the maintenance time.

4. Compact design especially to the Z-direction allows con-trol units or other equipments to be placed under thechamber.

5. Reducing the entire parts number to 60% (of that of con-ventional company products) achieved simple light com-pact mechanism (structure) and the easy maintenanceimproves the system utilization.

Min.rotational range： φ1030

Height of transfer

105.5

700

（320）

56°

102.5

132

313

89.5

29

89.5

161.5

Finger (option)

105.5

26.5

181.1320.1

φ340

139

Robot mounting surface

（UPPER・LOWER）

（100）

（φ283）

（φ140）

LRUR

UL

LL

UPPER

LOWER

Max.handling range: 　　　　　　　R1065

R365

(Wafer center at arm origin position)

φ283

8-equally spaced M8 P.CD.310

Mounting flange in details

MUSASHI 101, 201

N E WPRODUCTN E WPRODUCT


133

1.5

16 105.5

（φ283） φ340

105.5

460.5

139

321.5

26.5

102.5

89.5

2989.5

56°

（320）

700

（100）

30ST

φ280

30ST

UL

LL URLR

UPPER

LOWER

132

Height of transfer （UPPER・LOWER）

Robot mounting surface

Min.rotational range： φ1030

Finger (option)

Max.handling range: 　　　　　　　R1065

10-6

10-4

±0.05

±0.05

－

－ 40

50

40

50

2 2－

－

1

1

1065

1065

30

30

Vacuum -proof level (Pa)

Nolimitation

Nolimitation

－

－

±0.1 ±0.008φ300mmWafer

Model


Operation range

θ-axis( )゚

R-axis(mm)

Z-axis(mm)

Handledobject


R-direction (mm)

Z-direction(mm)

θ-direction( )゚

Operation time

R-direction(sec)

θ-direction(sec)

Z-direction(sec)

Mass ofmain body

(kg)Remarks

MUSASHI 101151

MUSASHI 201251

Low vacuum type

High vacuum type

MUSASHI 151, 251

8-equally spaced M8 P.CD.310

φ283

Mounting flange in details


SPECIFICATIONS

14

1716

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Vacuum RobotRR352 SERIES

1. The use of an optimal S-curve accel-eration / deceleration controller makeshigh speed wafer transfer possible.

2. Ferrofluidic sealing materials and fil-ters prevent particles generated frombearings, belts, and other parts of thearm section, from being released intothe outer clean environment.

3. Due to high resolution and low drivingvibration, a wafer sitting on a robot fingercan be transferred very safely with min-imal sliding and particle generation.

4. Robot replacement can be done easilyfrom the top of a chamber.

5. Versions having symmetric fingers forhigher throughput are available asstandard models.

6.An O-ring mounting groove on theunderside comes as standard.

7. There is another model that can getthrough the gate valve with 24 mmrobot arm thickness which has beendefined in SEMI standard. (RR352S) RR352L200-122

8-equally-spaced M10

(O-ring=V150)

Holes(dia. 5) at 4 positions for mounting this unit

M4 cap screw

Mounting base

RR352L200-122

Handling range of the 1st finger 330 ゚

Handling range of the 2nd finger 330 ゚

Min.rotational range

　　　 φ600

Control unit

Vacuum -proof level （Pa）

RR352L150-112L150-122L200-112L200-122L250-122S250-112

R568

R518

R650

R600

R700

R750

330 － 10-6

±0.2

±0.1 ±0.008

±0.2

±0.1

3～43～4 －－ 20

φ50～ φ300mmwafer （200g）

Model


Note1 Note 2

Operation range

θ-axis( )゚

R-axis (mm)

Z-axis(mm)

Handledobject


R-direction (mm)

Z-direction(mm)

θ-direction( )゚

Note 3

Note 4

Operation time

R-direction(sec)

θ-direction(sec)

Z-direction(sec)

Mass ofmain body

(kg)Remarks

Symmetric Finger

Symmetric Finger Symmetric Finger

■Utilities: Power supply:24VDC, 5A max.■Seal type: Ferrofluidic

Note1: With a Rorze standard ceramic finger (finger length is 200mm for symmetric finger, otherwise 250mm)Note2: Vacuum-proof level of feed-throughNote3: The time necessary for the R direction to completely extend and the theta direction to turn 180 degrees.Note4: If the symmetrical finger type is used, a guide is needed to hold the wafer onto the finger.Note5: Some commands and parameters may cause being out of Min. rotation range during the arm origin search.Note6: The measurement of the described data above was performed on this product itself, so the data may be different, if this product is

used in a system.

FEATURES

SPECIFICATIONS


Vacuum RobotRR452 SERIES

1.This robot’s configuration, which includesa Z-axis, makes it easy to form an inte-grated transfer system.

2.The use of an optimal S-curve acceler-ation / deceleration controller makes highspeed wafer transfer possible.

3.Ferrofluidic sealing materials and fil-ters prevent particles generated frombearings, belts, and other parts of thearm section, from being released intothe outer clean environment.

4.Thanks to high resolution and low vibra-tion, a wafer sitting on a robot finger canbe transferred very safely with minimalsliding and particle generation.

5.Robot replacement can be done easi-ly from the top of a chamber.

6.Versions having symmetrical fingersfor higher throughput are available asstandard models.

7.An O-ring mounting groove on theunderside comes as standard.

8.There is another model that can getthrough the gate valve with 24 mmrobot arm thickness which has beendefined in SEMI standard. (RR452S) RR452L200-112

(O-ring=V175)

8-equally-spacedM10

RR452L200

Min. rotationalrange φ474

Rotational range

Control unit

RR452L150-112L150-122L200-112L200-122S250-112S250-251

R568

R518

R650

R600

R750

3033010

20

10-6 ±0.1 ±0.008 ±0.1 3～43～43～4

φ50～ φ300mmwafer （200g）

Vacuum -proof level （Pa）

Model


Note1 Note 2

Operation range

θ-axis( )゚

R-axis (mm)

Z-axis(mm)

Handledobject


R-direction (mm)

Z-direction(mm)

θ-direction( )゚

Note 3

Note 4

Operation time

R-direction(sec)

θ-direction(sec)

Z-direction(sec)

Mass ofmain body

(kg)

Symmetric Finger

Symmetric Finger

Remarks

■Utilities: Power supply:24VDC, 8A max.■Seal type: Ferrofluidic and Bellows

Note1: With a Rorze standard ceramic finger (finger length is 200mm for symmetric finger, otherwise 250mm)Note2: Vacuum-proof level of feed-throughNote3: Time needed for the R direction to fully extend, the theta direction to rotate 180 degrees, and the Z direction to perform the Z-axis stroke.Note4: If the symmetrical finger type is used, a guide is needed to hold the wafer onto the finger.Note5: Some commands and parameters may cause being out of Min. rotation range during the arm origin search.Note6: The measurement of the described data above was performed on this product itself, so the data may be different, if this product is

used in a system.

(Clearance reserved for wiring)

Holes(dia. 5) at 4 positions (made from the reverse side) for mounting

FEATURES

SPECIFICATIONS


1918

300mm Wafer AlignerRA310

The model RA310 is an automatic aligner module equippedwith X-axis, Z-axis andθ-axis, it performs highly-accuratecentering and notch alignment for 300mm wafers.1. Performs non-contact alignment with an infrared ana-

logue sensor to minimize the no. of particles contaminat-ing the wafers.

2. A wafer placed within ±3mm can be aligned.3. By using the Rorze Masternet Control System, with which

the controller, stepping motor driver and other electriccontrol modules are built into the mechanical unit, in theunlikely event of failure, repairs can be performed simplyby module replacement.

4. Precision and high-speed alignments are possible byusing Rorze’s new type controllers.

111

285

160

110

4 7

160

396

289

14

12

335

295

160

Stroke dia. φ50

167.5

190

176

9595

25.4

(Option)

□62

DC24V

2-φ5.1 (for positioning)

204-φ4.5 (Mounting holes)

232C IN232C OUT

Fan

EXH

VAC.SUP

φ125,φ150φ200mm, Si wafer

Model Flat or notch orientation （°）

Centering （mm）

Flat or notch centering （sec）

RA310-C12

RA310-512

φ300, Si wafer±0.2

±0.1

±0.2

Approx. 5 sec. Misalignment Allowance:±3mm

Approx. 7 sec.

14

11

Positioning accuracy

Wafer typeMass of main body （kg）

Positioning time

■Utilities: Power supply:24VDC, 4A max. / Vacuum: -60kPa to -80kPa, flow rate: 10 liters/min or more

300mm Wafer AlignerRA210

The model RA210 is an infrared edge clamp alignerequipped with a clamp axis, Z-axis, andθ-axis, it performsalignment by means of an infra-red optical sensor. 1. Using the edge clamp method of holding the wafer edge

(PEEK clamp pad), it minimizes contamination of thewafers.

2. Using the infra-red optical sensor and Rorze’s new modelcontrollers and drivers, the aligner performs high-speedand highly-accurate positioning.

3. The Z-axis has a built-in brake for preventing the Z-axisfrom dropping down when the power is turned off.

RA310-C12

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Patent pending

FEATURES

SPECIFICATIONS SPECIFICATIONS

PRODUCT DIMENSIONS

FEATURES

The picture shows a different type of our productfrom the product dimensions drawing below.


Centering （mm）


φ300, Si waferFused silica wafer


Wafer typeMass of main body （kg）

Positioning time

■Utilities: Power supply: 24VDC, 4A max. / Air pressure: 0.5MPa, flow rate: 20 liters/min or more

RA210-C12 ±0.2 ±0.1 4.5 15

9P9P

15P

9P

圧力センサ

247

32.5

235

12

φ100 (Opening hole)

232C OUT232C IN

DC24V

AIRMAINTENANCE

95170

305 220 260

70

9020

90

150

4-M4326

Center of the spindle

50

7040

80

Wafer presence sensor

115

281.5

25.5

10.5

2-5 +0.1 +0.05326±0.02

340326

φ300

φ100(Opening Hole for the fan)

Built in exhaust fan

Spece for the connectors

ORG

(for positioning)

Detail of the hole for mounting the base

（for fixing）

(for positioning)

Fiber sensor

RA210-C12

PRODUCT DIMENSIONS

2120

Waf

er h

andl

ing

leve

l 295

Stroke dia. φ50 (512)

Holes (dia.4.5)at 4 positions,for mountingan aligner

Holes (dia.5.1+0.1/+0) at 2 positions,for positioning adjustment

M4 set screw,for mounting aligner

M6 cap screw,for level adjustment

Mounting base


Centering （mm）


RA401-512φ125,φ150,φ200mm

Si wafer ±0.1 ±0.03 Approx. 11 sec. 15


Applicable size Mass of main body （kg）

Positioning time

■Utilities: Power supply:24VDC, 4A max. / Vacuum: -40kPa to -80kPa, flow rate: 10 liters/min or more.

Aligner

RA401

Patent pending RA401-512

The model RA401, an automatic aligner module equippedwith X-, Y-, Z- and θ-axes, performs precision alignmentby using the infra-red detection method.1. Performs non-contact alignment with an infrared sensor

to minimize the no. of particles contaminating the wafers.2. Wafer size conversion can be done by changing either

hardware or software. 3. Precision alignment is possible for all wafers which are

off-center from the spindle chuck by 10mm or less.4. By using the Rorze Masternet Control System, with which

the controller, stepping motor driver and other electriccontrol modules are built into the mechanical unit, in theunlikely event of failure, repairs can be performed simplyby module replacement.

RA401-512 RA401-512

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FEATURES

SPECIFICATIONS

PRODUCT DIMENSIONS MOUNTING DIMENSIONS

Opener for 300mm wafersFORS300

197.5

243 250

319.5

1386

1187

107

865 900 1021.5

45

542

493

45.5 472

414

410

Operator access Switch

Latch Key

Horizontal datum plane

（OPTION） AGV/RGV Sensor

Floor

CID Reader（OPTION）

Connection panel

Registration Pin Chucking Pad

BOLTS planeFacical datum plane

（OPTION） info pad A,B,C,D

PLACEMENT

PRESENCE

UNLOAD

LOAD

FORS-300 plane

OPEN

Horizontaldatum

455.5±0.1

394

11871341

1386

29207 20729

68

Floor

832±0.1

900793

4562

215±0.1

472215±0.1

92

(inside of tool)

Mounting Screw 4-M8

The shaded area should be flat

Loadport Clamp Face

ModelOpen

RV201-F05 SEMI compliant FOUP15

(including Mapping operation)

Close

10 65

Operation time (sec)

Applicable carrier Weight （kg）

■Utilities: Power supply: 24VDC, 7A max.Vacuum: -60kPa to -80kPa, flow rate: 10 liters/min or more

Pneumatic pressure: 0.44MPa~0.54MPa, flow rate: 10 liters/ min or over.

SPECIFICATIONS

PRODUCT DIMENSIONS MOUNTING DIMENSIONS

標準タイプ

ストッカー対応タイプ FOSB対応タイプ

Patent pending

Standard Type

Stocker Type FOSB Type

TYPE：RV201-F05-※※※

TYPE：RV201-F05-T01 TYPE：RV201-F05-T02

Floor

Stocker hand

Floor

180°

Floor

180°

1. Motor achieves optimal motion control speeds with high accuracy.2. Motor and through-beam sensor provide accurate mapping for

cross-slot wafer and wafer thickness error detection.3. Rorze’s new model controllers optimize the motion speed.

FEATURES

2322

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Mapping ElevatorRE120

RE120-002

This elevator uses an infrared optical sensor to performhigh-speed mapping of the height level of wafers in a cas-sette on a fixed table.1. Motor operation and through-beam sensor provide accu-

rate mapping for cross-slot and wafer thickness errordetection.

2. It can perform smooth high-speed searches due to itsoptimal S-curve acceleration / deceleration controller andits exclusive search controller.

3. By using the Rorze Masternet Control System, with whichthe controller, stepping motor driver and other electriccontrol modules are built into the mechanical unit, in theunlikely event of failure, repairs can be performed simplyby module replacement.

4. It is also compatible with round transparent substratesand square substrates.

Model

RE120-002 φ125 to φ200mmwafer

±0.02

Processing object Repeatability （mm）

220

Effective stroke （mm）

2 7

Mapping time （sec）

Mass of main body （kg）

Note1

■Power source: Electrical 24V 2.5A and over. Note1: The required time to perform 200mm stroke movement and mapping.

ElevatorRE119

RE119-121

This elevator is for elevating/ lowering cassettes so thata robot can remove or insert wafers from/into its slots. Itcan also detect the height level of wafers in a cassette bymeans of an infrared optical sensor.1. Motor operation and infrared optical sensors provide

accurate mapping for the wafer position.2. It can perform smooth high-speed searches due to its

optimal S-curve acceleration / deceleration controller andits exclusive search controller.

3. By using the Rorze Masternet Control System, with whichthe controller, stepping motor driver and other electriccontrol modules are built into the mechanical unit, in theunlikely event of failure, repairs can be performed simplyby module replacement.

4. It is also compatible with round transparent substratesand square substrates.

Model

RE119-121 φ125 toφ200mm wafer cassette

±0.01

Processing object Repeatability （mm）

264

Effective stroke （mm）

6 6

Mapping time （sec）

Mass of main body （kg）

■Power source: Electrical 24V 2.5A and over. Note1: The required time to perform 210mm stroke movement and mapping.

Note1

Height of optical axis： 386

Operative area： 141～405， Origin position： 405

400

120

305

Search sensor

145

175285

RC-204A

RS-114A

RD-023MS

RC-233

DC 24V RS232C OUT

RS232C IN

RE120-002RE119-121

FEATURES

PRODUCT DIMENSIONS

SPECIFICATIONS

FEATURES

PRODUCT DIMENSIONS

SPECIFICATIONS

2524

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300mm EFEMRS70000 SERIES

RS73000Patent pending

RV201-F05Load port

EMO switch

1830

175

2000

1650

913

370

900

240

44

1300

803

INV

CP1ELB CP2

PL

GL OLWL

1250

563

505

1655

350

Clean unit

70250

322.5

300.3

497.5505

122.4

6001000

560

235

480

367

801130

200

RA310-C12

RR732L2722-372Robot

Aligner

Min.rotational range φ640

270

400 270

270

940

PRESENCE

PLACEMENT

Robot

PRESENCE

PLACEMENT

PRESENCE

PLACEMENT

Stroke

ULPA

EMO

Mini-environment1. Based on flow marker and computational fluid dynamics

analysis, we put in a pressure seperation plate.2. No particles can get in, even during replacement of the load port.3. Minimized space, vibration and noise.4. No X-axis configuration and space saving design reduces price.

Robot1. Using a free moving RR732 double-blade robot, it can exchange

wafers at the same speed as a double-armed robot.2. Can access up to three load ports without using an X-axis.3. Excellent cleanliness due to Ferro fluidic seal and fully enclosed

drum cover.4. Initialization is not necessary due to a built in absolute encoder.5. The horizontal multi-axes system with high rigidity improves

horizontal positioning accuracy.6. Optimal acceleration/deceleration provided by Rorze's new

model Controllers.7. A wide array of transfer patterns can be established with simple

programing.

The transfer range in the diagram depends on the dimensions of the load-lock opening, and the dimensions of the rear panel.

FEATURES

PRODUCT DIMENSIONS

Interpolation motion fixed support toolThe motion path of multi-axes interpolation control robotscan be created on Simulation Software. (Patent Pending)

●Creating Paths VisuallyUsing Motion path simulation software, the wafer transfer motion path can becreated visually.

●Checking for interferenceSimulation of the system layout can establish the shortest transfer path and cancheck for interference between the robot and the system.

●Motor rotation speed checkBecause it can simulate the motors rotation speed and the robots movement atthe same time, it can check the electrical load to the motor.

●Calculating Transfer TimeTransfer time can be calculated by measuring the time of one movementbetween two fixed points.

Features of RS70000 series

■RR730・RR732

1. Can access up to three load ports withoutusing an X axis.

2. Excellent cleanliness due to Ferro fluidicseal and fully enclosed drum cover.

3. Initialization is not necessary due to a built inabsolute encoder.

4. Horizontal articulated simultaneous multi-axiscontrol robot with high rigidity improves posi-tioning accuracy.

5. You can choose between two types of transfer;Edge Clamp or Vacuum chucking.

6. A single-arm robot with freely controlled dualblades has comparable wafer swap speed todouble-arm robots.

7. Optimal acceleration/deceleration providedby new model Rorze Controllers.

8. The transfer path can be easily designedusing the simulation software.

9. The transfer speed can be fixed so as not toput a load on the wafer.

RR730L2712-372 RR732L2722-372

FEATURES

With Multiaxial Interpolating Control RobotWith Multiaxial Interpolating Control RobotWith Multiaxial Interpolating Control Robot

Patent pending

2726

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Wafer Sorter with 300mm Wafer ID Reading FunctionRSC SERIES

RSC242

Mini-environment feature1. High-speed, with minimized space, vibration and noise.

ID reading1. SEMI M12, T7 and M1.15 compliant.2. It can read both the top and reverse sides of a wafer.3. A combination of optical and image processing gives high ID

recognition.

Robot feature1. Excellent cleanliness due to Ferro fluidic seal and fully enclosed

drum cover.

Patent pending

FEATURES

1. Based on the visible airflow analysis, weput in a pressure separation plate fordecreasing particle generation around thetransferring section.

2. Separated operation can be done with 2robots.

3. Dual arm robot provides high speed han-dling to and from any stage.

4. Optimal acceleration/deceleration providedby Rorze's new model controllers.

5. Using the edge clamp type end-effector forholding a wafer, it prevents particle attach-ment on the back side of wafer.

RSC242

EMO switch

Clean unit

RV201-F05300mm FOUP Loadport

RR717L1522-3A6Robot

Signal tower

AlignerRA210-C12

ULPA

Touch panel

RV201-F05300mm FOUP Loadport

OME E M O

928

H.D.P.=900

4410p×24

240

865（Stage height）

1650

350

2000

325 505 505 3251660

250

70510

510

70250

450

760

450

1660

1460

55

Finger pitch： 10

300 stroke

PORT 1 PORT 2

MENU SELECT

AUTO

Access Vision

CorporationRORZE

Access Vision

MENU SELECT

AUTO

CorporationRORZE

DOCK/UNDOCKCLAMP/UNCLAMPMANUAL MODELOAD

UNLOAD ERRORPLACEMENTPRESENCE

DOCK/UNDOCKCLAMP/UNCLAMPMANUAL MODELOAD

UNLOAD ERRORPLACEMENTPRESENCE

WAFER SORTER

POWER

AIR2VAC AIR1 AIR3

Logitech

FEATURES

560

70

RobotRR712L1521-3A3-E11

FFU（ULPA）

RA310-812Aligner

AIR2AIR1 VAC


Logitech

505

510

505

PLACEMENTPRESENCE

MANUALAUTO

搬入禁止搬入予約

PLACEMENTPRESENCE

MANUALAUTO

搬入禁止搬入予約

2165

1180

2000

1650

1460

350

250

325

300

OPERATORACCESS

LOADUNLOAD

315515

MENU

AUTO

SELECT

Access Vision

EMOEMO



Stocker can be integrated.

RR713RISUTO-048

232C OUT232C IN

DC24V

MAINTENANCE AIR

25070

510

510

70250

1660

450

760

450

VACAIR1

RR717L1522-3A6Robot

505

X-axis tableRT130-521

Finger pitch: 10300 stroke

10P×24

240

44

350

EMO switch

325


Power supply box

Touch panel

EMO switch

1660

FFU（ULPA）

515 315

RA210-C12Aligner

865 (Stage height)

H.D.P.900

928.5

146016502000

CLAMP/UNCLAMP

DOCK/UNDOCKERROR

LOAD

UNLOAD

PRESENCE

PLACEMENT

PORT 1ME O

STOPRUNMainte. 80

0

PUSH

AUTO

SELECTMENU

Access Vision

ERROR

LOAD

UNLOADPLACEMENT

PRESENCE

DOCK/UNDOCK

CLAMP/UNCLAMP

POWER

WAFER SORTER

PORT 2 M OE

SELECT

AUTO

MENU

Access Vision

RSC131

RSC151

FEATURES

2928

Wafer Sorter with 200mm Wafer ID Reading FunctionRS8221 Compatible with SMIF Pod

RS8221

EMO

Clean unit control panel

900

375

RR700L0911-021

273

147RR304L90-124

Pre-aligner OCR

ID OCR

350

197.5

290

Signal tower

197.5

Clean unit

750

355

1060

1530

350

1880

Touch panel display

EMO switch

CorporationRORZE

Robot

TBF201Buffer station

Robot

SMIF ElevatorRE201-822

ULPA

These systems have been developed for reading identificationnumbers marked on individual wafers and then sorting thewafers according to process applications. 1. Realizes a high throughput of 450 wafers or more per hour

using one of the two transfer robots RR304L90 or RR700L90.It has an MTBF of 10.06 years or more.

2. Compact size - the main body width is 750mm.3. Has abundant sorter functions and enables easy recipe regis-

tration.4. Can be operated with just one switch on the touch panel.5. Complete compatibility with SECSII/GEM is enabled through

optional items.

WA

FE

RT

RA

NS

FE

RU

NIT

S

FEATURES

PRODUCT DIMENSIONS

200mm EFEMRACS200

RACS200

Signal towerOption

RE120-002 RA301-512AlignerMapping Elevator

RobotRR701L1211-3A3

X-sxis unitRT107-1201

EMO switch

A192-80MJ

210

1640

320275

20

320225 275

360

697 768

20

225

197

140

71

1680

1550

600

160

910

300 stroke

950

100

1850

Area sensor

OptionBar code reader

1850

POWER OFFEMERGENC

Y

Min. rotational radius φ396

Max. handling range

Max. handling range

　　　　

　　　　 R452

R452

Max. handling range

　　　　 R452

200mm wafer transfer system consists of a dual armrobot with a 300mm Z-axis stroke, high-speed wafer search,and alignment using an infrared optical sensor.1. A double arm robot transfers the wafers with vacuum

chucking.2. Minimized contamination by means of a non-contact

infrared analogue sensor allows the aligner to performprecise centering and orientation of wafers.

3. An optional barcode reader outputs barcode informationof cassette.

4. An FFU can also be fitted as an option.

FEATURES

PRODUCT DIMENSIONS

3130

WA

FE

RT

RA

NS

FE

RU

NIT

S

200mm EFEMRACS200S Compatible with SMIF Pod

RACS200SPatent pending

1000 upper face of stage

2200

Punching

Clean unitULPA

2100

300

1405

1800

395

100

330

805

355 285

79

900

1200

ElevatorRE201-832

AlignerRA301-512

300 stroke

8"SMIF

423.5

EMO switch285

1940

355

250

330

437.5

884

210.5

446.5

RR701L1211-3A3Robot

EMO switch

Max.handling range: R492



200mm wafer transfer system is compatible with SMIF-Pods. It consists of a dual arm robot with a 300mm Z-axisstroke, a SMIF compatible elevator with infrared wafersearch sensor, and an aligner.1. A double arm robot transfers the wafers with vacuum

chucking.2. Minimized contamination by means of a non-contact

infrared analogue sensor allows the aligner to performprecise centering and orientation of wafers.

3. Using a SMIF-Pod compatible elevator which detect theheight level of wafers using an infra-red sensor, it cantransfer wafers from and to cassette in the SMIF-Pod.

4. Top mounted clean unit assures a highly clean transferarea environment inside the equipment.

Features of RORZE SMIF-Pod System

Horizontal airflow to the wafer.

Control equipment

Airflow optimal direction plate

Clean laminar air flow.

●Keeps the transfer area at ISO class 1 with total control of airflow and pressure and the sealing structure.

●Keeping the transfer area pressure positive keeps out particles from the external environment.

●Installing an airflow optimizing plate creates airflow parallel to the wafers. With this airflow, particles generated due to opening/closing the Pod are immediately exhausted, and are prevented from contaminating the wafers.

●Installing all parts which generate particles in the lower flow part of the clean airflow prevents partic-les from getting into the transfer level.

●Control devices are installed separately from the clean area.

●Elevators compatible with the SMIF-Pod are used in this system.

●Compatible with 200mm SMIF-Pod and Reticle Pod.

●Compatible with silicon wafers and glass wafers.

●The elevator can perform accurate mapping for 　cross-slot wafer, and also wafer thickness error 　detection.

The effect of the airflow optimal direction plate (from airflow analysis)

FEATURES

PRODUCT DIMENSIONS

3332

RRG-80

This is loading/unloading equipment compliant with large fifth generation substrates.

1. New type robots, RR420 or RR421, are mounted in this cassette station. Their small rotation radius gives them long arm reach.

2. A highly rigid CFRP end effector uses a special shape (patent pending) that reduces the bending of the substrate in order toavoid interference with the cassette. The end effector is also compatible with 0.5mm thick substrates. A substrate misalignmentdetection sensor is also built in.

3. Long distance transfer of over 10 m at high speed is made possible with the accurate rack-and-pinion robot transfer axis.

4. The cassette station has a segmented structure at each stage that facilitates compatibility with AGV, MGV, RGV and stockers.

5. The Cassette positioning mechanism is equipped with a floating structure to control particles generated from the bottom of thecassette.

6. Using a lot of aluminum profile gives easy compatibility with a lot of options, such as FFU and Ionizer. It is structured so that itcan be taken apart and reassembled even when installed in a small space.

7. Maintenance work from both sides and from the inside of the cassette station is possible. Because no maintenance work has tobe taken place inside the stocker or in the AGV movement range, maintenance safety is improved.

RRG -10 to -70 handle substrates smaller than 1100 x 1250mm.Please ask the nearest FA center for details. (550 x 650mm, 680 x 880mm, 730 x 920mm, etc)

Glass Substrate HandlerCassette Station (Classification 1100×1250) RRG-80

RR421Patent pending

Equipped with robot

GL

AS

SS

UB

ST

RA

TE

HA

ND

LE

R

FEATURES

TEACHING

MODE SWITCH

AUTO

φ1800

PASS LINE 1100

FLOOR TO TOP 2200

FLOOR TO SIGNAL TOWER 2500

3465

1100

1250

12001360136013601200

6480

3465

6480

5120

3760

EMERGENCY OFF EMERGENCY OFF

EMERGENCY OFF



EQ-20

EQ-20

!GENTITLE-INSERT

!GENTITLE-RU!GENTITLE-MAX

!GENTITLE-INSERT

!GENTITLE-RU!GENTITLE-MAX

EQ-20

EQ-20

15

PRODUCT DIMENSIONS

The new type of End-Effector can transfer glass substrates with a thickness of 0.5mm.

233 233660

PIC

K U

P30

Gla

ss P

itch

36

Glass Support point 608

Glass Support point 472

Gla

ss b

endi

ng18

.59

9.2

3

5.9

A special shape reduces bending, giving us safe handling of substrates.

GLASS 1100

GLA

SS

125

0

34 35

c 303FN-3720

v 3A-FN21054

Code 7 Code 8 Code 9

206 221 230

1.7 3.0 1.7

1.6 2.9 1.6

175 230

2.1 2.1

2.0 2.0

Remarks

Compatible with RA401-512

Compatible with RA401-312

Structure of Model No.

3 0 3 F N - 1 1 9 6 - 1

Drawing No.

Model No.

FN-

3 A - F N 2 1 0 5 4 - 1

Drawing No.

Model No.

-FN -

-

4225.6

954 63

20

B18

26

2-C6

4-C2

A

45°

1.61.7

Top surface

8

45

R27

4

72

Wafer chucking groove

Long hole (4 x 8) at 2 positions

Access hole (dia. 3.8) at 4 positions

R45

A

17

（30）

107

12490


Long hole (6 x 10) at 2 positions

4-C2

3015

18B

2-C6

4225.6

426

75

3.5

2.9

Top surface

45°


OptionsCeramic Finger

z303FN-1196313FN-4640

303FN-1677x

Section Code 1 Code 2 Code 3 Code 4 Code 5 Code 6

A 195 175 195 206 175 175

B 1.7 1.7 3.0 3.0 2.1 3.0

C 1.6 1.6 2.9 2.9 2.0 2.9

A 221 195

B 2.1 2.1

C 2.0 2.0

A 195 195 195 221 165 175

B 3.0 2.1 1.7 1.7 1.7 1.7

C 2.9 2.0 1.6 1.6 1.6 1.6

A 158 188 228

B 111 141 181

A 315 275 290

B 245 205 220

Drawing No.

z

x

c

v

303FN-1196

313FN-4640

303FN-1677

303FN-3720

3A-FN21054

A

1530

B2-C15

25.642

18

2-C6

26

C

4Wafer chucking groove

Top surface

Dia. 20 and 12, groove width: 1.0 max.


25.6

2-C62615

30A

50115

242-C8

42

18

CB

4


Top surface

Dia. 20 and 12, groove width: 1 max.


OP

TIO

NS

All Rorze products come with a 24-month guarantee.(Applicable to products shipped on or after September 1, 1996.)Specifications and products are subject to change without any obligation on the part of the manufacturer.

RORZE TECHNOLOGY SINGAPORE PTE. LTD.

RORZE TECHNOLOGY, INC.

RORZE TECHNOLOGY CONSULTANTS (SIP) CO.,LTD.

RORZE AUTOMATION, INC.

RORZE SYSTEMS CORPORATION

RORZE ROBOTECH INC.

CPB 050201

■Headquarters1588 Michinoue, Kannabe-cho, Fukayasu-gun, Hiroshima 720-2104, JapanTelephone +81-84-960-0001Facsimile +81-84-960-0200

●RORZE TECHNOLOGY, INC.1F., No.12, Industry East Road.,Ⅳ,Science-based Industrial Park, Hsinchu, Taiwan, R.O.C.Telephone +886-3-5776482Facsimile +886-3-5776461

●RORZE AUTOMATION, INC.1625 McCandless Drive, Milpitas, CA 95035, U.S.A.Telephone +1-408-935-9100Facsimile +1-408-935-9101

●RORZE SYSTEMS CORPORATION919 Korim-Dong, Yongin-City, Kyunggi-Do, 449-923, KoreaTelephone +82-31-335-9100Facsimile +82-31-337-1811

●RORZE ROBOTECH INC.Nomura-Haiphong Industrial ZoneKm13 Road No.5 Anduong District, Haiphong City, VietnamTelephone +84-31-743030Facsimile +84-31-743044

●RORZE TECHNOLOGY SINGAPORE PTE. LTD.627A, Aljunied Road, #10-11, Biztech CentreSingapore 389842Telephone +65-68445502Facsimile +65-68445510

●RORZE TECHNOLOGY CONSULTANTS (SIP) CO.,LTD.Room C1711, No.360, Hengtong Road,Shanghai 200070, China

RORZE CORPORATION

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