RP detectors

• CTS Sensors now in production, full delivery between February and June 07

• Production GUI and DB being finalised

• Test Procedure being defined with the LAB in Praha

• New Test LAB in Geneva University…

RP Card

• 1st PCB Card with elect. components: functionality tested OK (see Gueorgui/Walter)

• Production of Kapton cards started • Optimization of lamination process on support board to

ensure good planarity

Assembly (with DT2): tools

• Being finalized• Manual positioning of the card vs support with XYΘ stage and 3D

CMM • Different glues under test

Assembly: packaging

• First exercise of packaging made with the thermo-mechanical mockup

Assembly: Mechanical decoupling

Vacuum flange/detector package decoupler

Loading Springs

Reference for Detector

Package to Pot

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Temperature Cyclingof thermomechanical

prototype

Consolidate design

Consolidate designproduce drawings Geometrical

precision test

Mechanical components

•order CE07 parts•fabricate special parts•prepare pipework / feedthroughs(incl. leak test)•fabricate interface card flanges•fabricate pot hats •(Vacuum Praha)•follow-up / reception

Tooling

•gluing tools•bonding tools•detector assembly tools•pipework bending/testing tools

•Hybrid lamination•Chip mounting/bonding•Testing

•Sensor mounting/bonding•Testing

•Detector assembly•Metrology

•Integration in pots•Testing(incl. cooling)• beam ?

availability hybrid PCB/VFAT (tested)

availability sensors (tested)

availability interface card (tested)

•Installationin zone

holiday period

Test Results Thermo-mechanical prototype

Full Integrated Module

(10 planes + complete electronics).Extended lab tests.

Beam test ?Preparation work area

end of access to undergroundareas

X-mas closure

conceptual tests

DT2 D/T

TOTEM

TOTEM

TOTEM

Internal ReviewTOTEM

Bondlab

Bondlab

TOTEM

DT2 D

DT2 D

DT2 2T

TOTEMDT2 T

2TTOTEM

Bondlab

TOTEM

2T

2T

TS/DEM

DT2 D/T

TOTEM

detectorpot insertion tool

1D, 1T

Courtesy by C. Joram