rtpcompany.com rtp@rtpcompany.com

RTP Company

Overview of LDS Technology

Brice Filipczak

October 2016 - SIANE

RTP Company is an independent,

privately owned thermoplastics compounder with global

manufacturing, engineering support, and sales representation.

• 1,500+ employees

• $500+ million annual sales

• RTP Company operates 18 plants in America, Asia and Europe

ABOUT RTP COMPANY

High-Tech Compounds to Unfilled Resins

• 60+ resins• 100s of modifiers• Broadest range of

competitive compounds (From talc polypropylene to nanotube PEEK)

Annual Production

• 6,000+ commercial products

• 1,750+ new products per year

CUSTOM SOLUTIONS

SELECTIVE PLATING LASER DIRECT STRUCTURING

6,5

mm 3,5

mm

Advantages

• Standard single shot

tooling

• Great design flexibility

• Specialized

formulations

• Limited number of

platers/lasers

THERMOPLASTICS TRIANGLE

Amorphous Semi-crystalline

High Performance

Thermoplastics

Engineering

Thermoplastics

Commodity

Thermoplastics

PEEK

PEIPPS

PES

PPAPSU

PC PET PA 66

PC/ABS PBT PA 6

PPO PTT

PMMAASA

ABS

PC/PBTPOM

SAN

PS

PVC

LDPE

PP

HDPE

LLDPE

LDS PROCESS

Additive ProcessSelective metallization of thermoplasticinjection molded parts by Laser Direct

Structuring

3 Step Process1.Injection molding2.Laser activation3.Selective metallization

OVERVIEW OF LDS TECHNOLOGY

Generation of a micro-etched surface

Modified Polymer

Activated Additive by Laser

APPLICATIONS

• Connectors

• Sensors

• Antennas for

handheld devices

– Phones

– Cameras

– GPS

• Security Covers

• Various components

for part consolidation

APPLICATION 1: OMNIPOD CHASSIS

“We had challenges plating the

chassis, which was a second shot

to the lower housing without

overstating the first shot,” said

Clare. “RTP Company’s compound

gave us better control of the plating

process by providing a wider

processing window. This ability to

tailor materials ideally suited to our

needs is what will help make the

OmniPod successful.”

OmniPod has been successful with Insulet receiving multiple awards,

such as the 2006 Medical Design Excellence Award.

APPLICATION 2: HOUSINGS

Circuit patterns can be applied

directly onto plastic housings

and components in two and

three dimensions. 3-D patterns

can be applied with lines and

spaces down to 0.005 inch

(0.127 mm) with a resolution of

0.001 inch (0.025 mm).

Cybershield, Inc. is a subsidiary of Elk Corporation. Based in Dallas, TX

Cybershield is an industry leader in the design and manufacture of

metallized plastic engineered solutions for electronic equipment OEMs.

For more information, visit their website at www.cybershieldinc.com.

MATERIALS AVAILABLE

• PC

• ABS

• PC/ABS

• Nylon 6/6 with glass and mineral

• LCP with glass and mineral

• PPA with glass and mineral

• PEI with glass and mineral

• PEEK with glass and mineral

NEW GENERATION LDS PRODUCTS

Material Description RTP LDS Grade

PC High flow High impact Black RTP 399 X 131442 A Black

PC High flow High impact Colorable RTP 399 X 131471 A Natural

PC 10% GF High flow Impact modified Black RTP 399 X 131489 Black

PC 20% GF High flow Impact modified Black RTP 399 X 131494 A Black

PC/ABS 20% GF High flow Impact modified Black RTP 2599 X 131441 D Black

PC 30% GF High flow Impact modified Black RTP 399 X 131494 Black

PA Alloy GF Low warpage Natural RTP 299 M X 131508 Natural

PA Alloy GF Low warpage Black RTP 299 M X 131487 A Black

• PC based LDS to compete with MEP 3730 & MEP 3734

• Better impact properties

• Injection molding for thin-walled parts

• Short lead time

• High modulus LDS based on PC, PC/ABS

• High temperature, low warpage PA 6/6 based LDS grade

developed for PVT process

SELECTED LDS MATERIAL DATA

RTP

399 X

113385 B

RTP

699 X

113386 B

RTP

2599 X

113384 C

RTP

299 X

113399 H

RTP

4099 X

117359 D

RTP

3499-3 X

113393 C

Resin PC ABS PC/ABS PA 6/6 PPA LCP

DescriptionHigh Impact

Black

High Impact

Black

High Impact

Black

Glass Fiber

Mineral

Black

Glass Fiber

Mineral

Black

Glass Fiber

Mineral

Black

Tensile

Strength

(MPa)

50 41 50 110 114 117

Flexural

Modulus

(MPa)

2400 2400 2400 9000 10300 12400

HDT @

455 kPA

(°C)

- - - 249 279 274

SELECTED LDS MATERIAL DATA

RTP

399 X

131442 A

RTP

399 X

131442 C

RTP

399 X

131442 D

RTP

399 X

131471 A

RTP

399 X

135121 J

Resin PC PC PC PC PC

Description Low CostFast Plating

Higher CostMedium Cost

White Color

Higher Cost

Fast Plating

Medium Cost

Tensile

Strength (MPa)49 50 49 52 55

Flexural

Strength (MPa)78 85 78 91 100

Flexural

Modulus (MPa)2200 2400 2100 3000 3000

Notched Izod

Impact (J/m)450 900 600 500 450

Flammability,

UL94HB HB V-0 HB V-0

Color Black Black Black White Black

NEW GENERATION LDS PRODUCTS

Item RTP 399 X 131442 C MEP 3730

Specific gravity 1.27 1.26

Melt flow rate, 260C/5kg (g/10min) 12 11

Mold shrinkage, 3.2mm (%) 0.7 0.6

Notched Izod Impact Strength (J/m) 900 550

Unnotched Izod Impact Strength (J/m) NB NB

Tensile strength (MPa) 51 50

Tensile elongation (%) 80 >60

Tensile modulus (MPa) 2300 2100

Flexural strength (MPa) 85 82

Flexural modulus (MPa) 2400 2350

Dielectric constant 1 GHz 2.87 3.0

3 GHz 2.85 -

5 GHz 2.84 -

Dissipation factor 1 GHz 0.0077 0.0050

3 GHz 0.0064 -

5 GHz 0.0063 -

ADDITIONAL INFORMATION WEB.RTPCOMPANY.COM/INFO/DATA/LDS/

rtpcompany.com rtp@rtpcompany.com

Your Global Compounder ofCustom Engineered

Thermoplastics您全球的塑料改性专家

rtpcompany.com