S6SAP413A6BDA1001

Reference Board for FPGA Power Solution Designed by XC7Z015, Using Cypress PMIC

S6AP413A, MB39C031 and MB39C504

Doc. No. 002-08684 Rev. *A

Cypress Semiconductor

198 Champion Court

San Jose, CA 95134-1709

Phone (USA): 800.858.1810

Phone (Intnl): +1 408.943.2600

www.cypress.com

Copyrights

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 2

© Cypress Semiconductor Corporation, 2014-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC (“Cypress”). This document, including any software or firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress’s patents that are infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation of the Software is prohibited.

TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage (“Unintended Uses”). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.

Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 3

Preface

This manual explains how to use the evaluation board. Be sure to read this manual before using the product. For this product, please consult with sales representatives or support representatives.

Handling and Use

Handling and use of this product and notes regarding its safe use are described in the manuals.

Follow the instructions in the manuals to use this product.

Keep this manual at hand so that you can refer to it anytime during use of this product.

Notice on this Document

All information included in this document is current as of the date it is issued. Such information is subject to change without any prior notice.

Please confirm the latest relevant information with the sales representatives.

Caution of the Products Described in this Document

The following precautions apply to the product described in this manual.

WARNING Indicates a potentially hazardous situation which could result in death or serious injury and/or a fault in the user’s system if the product is not used correctly.

Electric Shock, Damage

Before performing any operation described in this manual, turn off all the power supplies to the system. Performing such an operation with the power on may cause an electric shock or device fault.

Electric Shock, Damage

Once the product has been turned on, do not touch any metal part of it. Doing so may cause an electric shock or device fault.

CAUTION Indicates the presence of a hazard that may cause a minor or moderate injury, damages to this product or devices connected to it, or may cause to loose software resources and other properties such as data, if the device is not used appropriately.

Cuts, Damage

Before moving the product, be sure to turn off all the power supplies and unplug the cables. Watch your step when carrying the product. Do not use the product in an unstable location such as a place exposed to strong vibration or a sloping surface. Doing so may cause the product to fall, resulting in an injury or fault.

Cuts The product contains sharp edges that are left unavoidably exposed, such as jumper plugs. Handle the product with due care not to get injured with such pointed parts.

Damage Do not place anything on the product or expose the product to physical shocks. Do not carry the product after the power has been turned on. Doing so may cause a malfunction due to overloading or shock.

Damage

Since the product contains many electronic components, keep it away from direct sunlight, high temperature, and high humidity to prevent condensation. Do not use or store the product where it is exposed to much dust or a strong magnetic or electric field for an extended period of time. Inappropriate operating or storage environments may cause a fault.

Damage Use the product within the ranges given in the specifications. Operation over the specified ranges may cause a fault.

Preface

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 4

Damage To prevent electrostatic breakdown, do not let your finger or other object come into contact with the metal parts of any of the connectors. Before handling the product, touch a metal object (such as a door knob) to discharge any static electricity from your body.

Damage

When turning the power on or off, follow the relevant procedure as described in this document. Before turning the power on, in particular, be sure to finish making all the required connections. Furthermore, be sure to configure and use the product by following the instructions given in this document. Using the product incorrectly or inappropriately may cause a fault.

Damage Because the product has no casing, it is recommended that it be stored in the original packaging. Transporting the product may cause a damage or fault. Therefore, keep the packaging materials and use them when re-shipping the product.

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 5

Contents

1. Component and Wiring Layout .................................................................................................................................... 6

1.1 Component Layout ................................................................................................................................................ 6 1.2 Wiring Layout ......................................................................................................................................................... 8

2. Circuit Schematic ........................................................................................................................................................ 20

3. Component List ........................................................................................................................................................... 28

4. Evaluation Board Picture ............................................................................................................................................ 34

5. Ordering Information ................................................................................................................................................... 36

Revision History ................................................................................................................................................................... 37

Document Revision History ........................................................................................................................................... 37

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 6

1. Component and Wiring Layout

1.1 Component Layout

Figure 1-1 Component Layout (Layer 1)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 7

Figure 1-2 Component Layout (Layer 8)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 8

1.2 Wiring Layout

Figure 1-2 Wiring Layout (Layer 1)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 9

Figure 1-3 Wiring Layout (Layer 2)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 10

Figure 1-4 Wiring Layout (Layer 3)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 11

Figure 1-5 Wiring Layout (Layer 4)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 12

Figure 1-7 Wiring Layout (Layer 5)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 13

Figure 1-8 Wiring Layout (Layer 6)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 14

Figure 1-9 Wiring Layout (Layer 7)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 15

Figure 1-10 Wiring Layout (Layer 8)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 16

Figure 1-11 Wiring Layout (Layer 1 Resist)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 17

Figure 1-12 Wiring Layout (Layer 8 Resist)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 18

Figure 1-13 Wiring Layout (Layer 1 Silk)

Component and Wiring Layout

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 19

Figure 1-14 Wiring Layout (Layer 8 Silk)

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 20

2. Circuit Schematic

Figure 2-1 Circuit Schematic (POWER)

Circuit Schematic

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 21

Figure 2-2 Circuit Schematic (DDR3)

Circuit Schematic

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 22

Figure 2-3 Circuit Schematic (SD/QSPI/JX/PMOD)

Circuit Schematic

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 23

Figure 2-4 Circuit Schematic (USB/Ethernet)

Circuit Schematic

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 24

Figure 2-5 Circuit Schematic (HDMI/UART)

Circuit Schematic

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 25

Figure 2-6 Circuit Schematic (FPGA_CFG/PL)

Circuit Schematic

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 26

Figure 2-7 Circuit Schematic (FPGA_PS)

Circuit Schematic

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 27

Figure 2-8 Circuit Schematic (FPAG_POWER)

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 28

3. Component List

Table 3-1 Component List

NO.

Circuits Reference Name Parts Number Manufact

urer Qty. PKG Valu

e Rati

o Error TC Tempera

ture Range

Description No

Mount

1 CN5 10104111-0001LF FCI 1 SMD - - - - –55 to 85°C

CONN RCPT MICRO USB TYPE AB

2 CN4 46765-1001 Molex 1 SMD - - - - - CONN RCPT HDMI MICRO TYPE-D R/A

3 CN2 502570-0893 Molex 1 SMD - - - - –25 to 85°C

CONN MICRO SD R/A PUSH-PUSH

4 CN3 0821-1X1T-43-F Bel Fuse 1 Through

Hole - - - - -

CONN MAGJACK 2PORT 1000 BASE-T

5 CN6 87832-1420 Molex 1 SMD - - - - –55 to 105°C

CONN HEADER 14POS 2MM VERT

8 D3,D6 BAT54LT1G ON Semiconductor

2 SOT23-

3 - - - -

–55 to 125°C

DIODE SCHOTTKY 30V 0.2A

9 JP1,JP2,JP3,JP5 XG8S-0331 Omron 4 Through

Hole - - - -

–55 to 105°C

Pin Header

10 JX1,JX2 61082-101400LF FCI 2 SMD - - - - –40 to 85°C

RECEPTACLE 0.8MM 100WAY

11 J1 BCS-106-L-D-TE Samtec 1 Through

Hole - - - -

–55 to 125°C

CONN RCPT 12POS .100" DUAL VERT

12 J2,J3,J4,J5 U.FL-R-SMT-1(01) Hirose 4 SMD - - - - –40 to 90°C

Coaxial connector

13 U11,U18 CDSOT23-SR208 Bourns 2 SOT-23-

6 - - - -

–55 to 150°C

TVS DIODE 20VWM

14 U9 SN74LVC1G08DCKR

TI 1 SC-70-5 - - - - –40 to 125°C

IC GATE AND 1CH 2-INP

15 U17 CP2104-F03-GM Silicon Laboratories

1 24-QFN - - - - –40 to 85°C

IC SGL USB-TO-UART BRIDGE

16 U10 TXS0102DQER TI 1 8-

XFDFN - - - -

–40 to 85°C

IC TRANSLATOR VOLTAGE

17 D4 ZEN056V130A24LS

TE 1 3-SMD - - - - –40 to 85°C

POLYZEN 5.6V PPTC/ZENER

18 U4,U5 MT41K256M16HA-125:E

Micron 2 96-

TFBGA - - - - 0 to 95°C

DDR3L SDRAM 4GBIT 800MHZ

19 U14 ADV7511KSTZ Analog Devices

1 100-

LQFP - - - - 0 to 70°C

C XMITTER HDMI 12BIT

20 U7 S25FL512SAGBHIC10

Spansion 1 BGA-24 - - - - –40 to 85°C

NOR Flash Parallel/Serial 3V/3.3V 512Mbit

21 U6 TXS02612RTWR TI 1 24-

WQFN - - - -

–40 to 85°C

IC SDIO PORT EXPANDER 24WQFN

Component List

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 29

NO.

Circuits Reference Name Parts Number Manufact

urer Qty. PKG Valu

e Rati

o Error TC Tempera

ture Range

Description No

Mount

22 U8 88E1512-A0-NNP2I000

MARVELL 1 56-QFN - - - - - EHTERNET PHY

23 U12 USB3320C-EZK Microchip 1 32-QFN - - - - –40 to 85°C

MULTI-FREQ USB 2.0 ULPI PHY

24 U19 XC7Z015-1CLG485C

Xilinx 1 485BGA - - - - 0 to 85°C FPGA

25 X2 DSC1001DI2-024.0000

Micrel 1 SMD 24MH

z 1.8V

±25ppm

- –40 to 85°C

Oscillator

26 X1 DSC1001DI2-025.0000

Micrel 1 SMD 25MH

z 1.8V

±25ppm

- –40 to 85°C

Oscillator

27 X4 DSC1001DI2-033.3300

Micrel 1 SMD 33MH

z 3.3V

±25ppm

- –40 to 85°C

Oscillator

28 X3 KC3225A12.0000C30E00

AVX 1 SMD 12MH

z 3.3V

±50ppm

- –10 to 70°C

OSC XO 12.000MHZ CMOS

29 U2 MB39C504WQN-G-AMERE1

Spansion 1 - - - - - - DC/DC converter

30 U1 S6AP413A6BGN1C000

Spansion 1 - - - - - - DC/DC converter

31 U3 MB39C031WQN-G-142-JNEFE1

Spansion 1 - - - - - - DC/DC converter

32 U21 NC7WZ07FHX Fairchild 1 6-

UFDFN - - - -

–40 to 85°C

IC BUFFER UHS DUAL OD 6-MICROPAK

33 CN1 PJ-002AH-SMT-TR CUI 1 2.1X5.5

MM - - - -

–25 to 85°C

CONN POWER JACK

34 U20 CL584BA-148.500MHz

TamaDevice

1 SMD 148.500MH

z 3.3V

±50ppm

- –20 to 70°C

Oscillator

35 C1,C12,C22,C46,C47,C53, C54,C198,C214,C86,C87, C95,C96

C2012X5R1A476M125AC

TDK 13 2012 47uF 10V ±20% X5R –55 to 85°C

Ceramic Capacitors

36

C2,C3,C4,C5,C19,C23,C24,C29,C93,C102,C104,C124,C162,C169,C191,C195,C199,C202,C205,C209,C216,C226,C227,C229,C236,C237,C239,C246,C247,C256

C1005X5R1A475K050BC

TDK 30 1005 4.7uF 10V ±10% X5R –55 to 85°C

Ceramic Capacitors

37

C6,C25,C31,C33,C35,C36,C37,C38,C39,C40,C41,C42,C43,C44,C45,C48,C49,C50,C51,C52,C81,C82,C83,C84,C85,C90,C91,C94,C99,C100,C103,C105,C106,C107,C108,C109,C111,C112,C113,C114,C116,C117,C118,C119,C120,C121,C122,C123,C127,C128,C129,C131,C133,C134,C135,C136,C142,C145,C146,C147,C151,C153,C154,C157,C158,C159,C161,C163,C164,C165,C166,C167,C170,C174,C175,C176,C177,C178,C180,C181,C182,C183,C192,C193,C196,C197,C186,C258,C264,C265,C266,C267,C268

C1005JB1H104K050BB

TDK 93 1005 0.1uF 50V ±10% JB –25 to 85°C

Ceramic Capacitors

38 C7 16TQC100MYF Panasonic 1 7343 100uF 16V ±20% - –55 to 105°C

POSCAP

39 C9,C130,C168,C263 GRM188R6YA225KA12D

Murata 4 1608 2.2uF 35V ±10% X5R –55 to 85°C

Ceramic Capacitors

Component List

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 30

NO.

Circuits Reference Name Parts Number Manufact

urer Qty. PKG Valu

e Rati

o Error TC Tempera

ture Range

Description No

Mount

40

C10,C55,C56,C57,C58,C59,C60,C61,C62,C63,C64,C65,C66,C67,C68,C69,C70,C71, C72,C137,C138,C139,C140,C143,C148,C149,C150,C155,C156,C160,C179,C248,C249,C269

GRM155R71E103KA01D

Murata 34 1005 0.01u

F 25V ±10% X7R

–55 to 125°C

Ceramic Capacitors

41 C11,C126 C2012X5R1A226K125AB

TDK 2 2012 22uF 10V ±10% X5R –55 to 85°C

Ceramic Capacitors

42 C13 GRM32DR60J336ME19L

Murata 1 3225 33uF 6.3V ±20% X5R –55 to 85°C

Ceramic Capacitors

43 C14,C17,C18,C20 C1005X5R1V105K050BC

TDK 4 1005 1uF 35V ±10% X5R –55 to 85°C

Ceramic Capacitors

44 C8,C15,C16,C26,C28,C32, C115,C132,C141,C144,C152,C213

C1608X5R1E106M080AC

TDK 12 1608 10uF 25V ±20% X5R –55 to 85°C

Ceramic Capacitors

45

C21,C34,C110,C173,C187, C188,C189,C190,C194,C200,C203,C206,C207,C210,C211,C212,C217,C218,C219,C220,C222,C223,C224,C225,C230,C232,C233,C234,C235,C240,C242,C243,C244,C245

GRM155R61A474KE15J

Murata 34 1005 0.47u

F 10V ±10% X5R

–55 to 85°C

Ceramic Capacitors

46 C27 6TPE220MAPB Panasonic 1

3.5 X 2.8 X

1.9mm(L X W X

H)

220uF 6.3V ±20% - –55 to 105°C

POSCAP

48 C92,C101,C125,C201,C204,C208,C215,C221,C228,C231,C238,C241

C1210C107M4PAC7800

Kemet 12 3225 100uF 16V ±20% X5R –55 to 85°C

Ceramic Capacitors

49 C172 C1005X5R1A475K050BC

TDK 1 1005 4.7uF_NMT

10V ±10% X5R –55 to 85°C

Ceramic Capacitors

50 C184 T525D337M006ATE025

Kemet 1 7343 330uF 6.3V ±20% - –55 to 125°C

Tantalum Capacitors

51 D1 SMBJ12CA Littelfuse 1 DO-

214AA 12V - - -

–55 to 150°C

TVS DIODE 12VWM 19.9VC

52 D7 BAS21 Fairchild 1 SOT23-

3 - - - -

–55 to 150°C

DIODE SML SIG 250V 0.2A

54 LED1,LED2,LED3,LED5,LED6

LTST-C191TBKT Lite-On 5 1608 - - - - –55 to 85°C

LED BLUE CLEAR THIN

55 LED4 LTST-C191KRKT Lite-On 1 1608 - - - - –55 to 85°C

LED SUPER RED CLR THIN

56 L1,L2,L3,L4 1276AS-H-1R0M TOKO 4 SMD 1uH 3.9A ±20% - –40 to 85°C

Inductor

57 L6,L7 1276AS-H-1R5M TOKO 2 SMD 1.5uH 3.2A ±20% - –40 to 85°C

Inductor

58 L5 GLMC2R203A ALPS 1 SMD 2.2uH 7.1A ±20% - - Inductor

59 L8,L9,L10,L11,L12,L13, L14,L15,L16,L17,L18,L19

BLM18EG221SN1 Murata 12 1608 - 2A - - –55 to 125°C

FERRITE CHIP 220 OHM

60 Q1,Q7,Q9,Q10 2N7002,215 NXP 4 SOT23 - - - - –65 to 150°C

MOSFET N-CH 60V 300MA

61 Q2 FDMC8200S Fairchild 1 8-MLP - - - - –55 to 150°C

MOSFET N-CH DUAL 30V

62 Q3,Q4,Q5,Q6 BSS138 Fairchild 4 SOT-23 - - - - –55 to 150°C

MOSFET N-CH 50V 220MA

63

R113,R115,R117,R123,R131,R146,R147,R148,R168,R176,R201,R163,,R208,R210

RK73Z1ETTP KOA 14 1005 0 1A - - –55 to 155°C

Chip resistors

64 R2 RK73H1ETTP1501F

KOA 1 1005 1.5K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

Component List

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 31

NO.

Circuits Reference Name Parts Number Manufact

urer Qty. PKG Valu

e Rati

o Error TC Tempera

ture Range

Description No

Mount

65 R4,R5,R19,R21,R136,R138

RK73H1ETTP1003F

KOA 6 1005 100K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

66 R7,R8,R9,R13,R28,R30, R189,R190,R191

RK73H1ETTP1002F

KOA 9 1005 10K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

Component List

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 32

NO.

Circuits Reference Name Parts Number Manufact

urer Qty. PKG Valu

e Rati

o Error TC Tempera

ture Range

Description No

Mount

67 R10,R11,R27,R29 RK73H1ETTP2201F

KOA 4 1005 2.2K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

68 R12,R32,R33,R124,R129, R159,R177,R183,R185,R193,R240,R241,R242,R243

RK73H1ETTP2400F

KOA 14 1005 240 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

69 R15 RK73H1ETTP10R0F

KOA 1 1005 10 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

70 R17 RK73H1ETTP3303F

KOA 1 1005 330K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

71 R18 KRL2012E-M-R004-F-T5

Susumu 1 2012 0.004 1W ±1% ±50ppm/°

C

–55 to 155°C

Precision Current Sensing resistors

72 R20 RK73H1ETTP2203F

KOA 1 1005 220K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

73 R156 RK73H1ETTP1002F

KOA 1 1005 10K_NMT

0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

74 R31,R199,R200 RK73H1ETTP80R6F

KOA 3 1005 80.6 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

75 R149,R166,R182,R236,R237

RK73H1ETTP1000F

KOA 5 1005 100 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

76

R127,R133,R184,R209,R195,R212,R213,R214,R215,R216,R217,R218,R219,R220,R221,R222,R223,R224,R225,R226,R227,R228,R229,R230,R231,R232,R233,R234,R235

RK73H1ETTP40R2F

KOA 29 1005 40.2 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

77

R61,R71,R121,R125,R128, R130,R132,R178,R180,R181,R188

RK73H1ETTP1001F

KOA 11 1005 1k 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

78 R112,R116,R122,R126,R192

RK73H1ETTP4991F

KOA 5 1005 4.99K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

79

R86,R114,R143,R144,R152, R153,R169,R170,R171,R172,R173,R174,R175,R207,R238,R239

RK73H1ETTP4701F

KOA 16 1005 4.7K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

80 R118,R119,R120,R194,R196,R197,R198

RK73H1ETTP2002F

KOA 7 1005 20K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

81 R134 RK73Z1JTTD KOA 1 1608 0 1A - - –55 to 155°C

Chip resistors

82 R137 RK73H1ETTP8061F

KOA 1 1005 8.06k 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

83 R139 RK73H1ETTP1502F

KOA 1 1005 15K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

84 R140,R141,R142,R145 RK73H1ETTP4702F

KOA 4 1005 47K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

85 R150 RK73H1ETTP2702F

KOA 1 1005 27K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

86 R151 RK73H1ETTP22R0F

KOA 1 1005 22 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

Component List

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 33

NO.

Circuits Reference Name Parts Number Manufact

urer Qty. PKG Valu

e Rati

o Error TC Tempera

ture Range

Description No

Mount

87 R154,R155 RK73H1ETTP2001F

KOA 2 1005 2K 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

88 R157 RK73H1ETTP33R0F

KOA 1 1005 33 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

89 R158,R161,R162,R165,R167,R164,R186,R211

RK73Z1ETTP KOA 8 1005 0_NM

T 1A - -

–55 to 155°C

Chip resistors

90 R160 RK73H1ETTP8870F

KOA 1 1005 887 0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

91 R179,R187 RK73H1ETTP1001F

KOA 2 1005 1K_NMT

0.063W

±1% ±100ppm/°C

–55 to 155°C

Chip resistors

92 SW1,SW2 7914J-1-000E Bourns 2

5.0X5.0X4.19mm(L X W

X H)

- - - - –55 to 125°C

SWITCH TACTILE SPST-NO 0.1A 24V

93 U13 TPS2051BDBVT TI 1 SOT23-

5 - - - -

–40 to 85°C

IC PWR DIST SWITCH SNGL

94 U15 CM2020-01TR ON Semiconductor

1 38TSSO

P - - - -

–40 to 85°C

IC HDMI XMITTER PORT P/I

96 D5 BAT54LT1G_NMT ON Semiconductor

1 SOT23-

3 - - - -

–55 to 125°C

DIODE SCHOTTKY 30V 0.2A

97 C88,C89,C97,C98 C1608JB1V475K080AC

TDK 4 1608 4.7uF 35V ±10% JB –25 to 85°C

Ceramic Capacitors

98 TP1,TP2 LC-22-G-BLACK MAC8 2 DIP - - - - - TEST POINT

100 SW3 CHS-02B Copal 1 SMD - - - - –40 to 85°C

DIP Switch

101 F1 045101.5MRL Littelfuse 1 SMD 1.5A 125V

- - –55 to 125°C

Fuse

102 JP4 XG8S-0231 Omron 1 Through

Hole - - - -

–55 to 105°C

Pin Header

103 SH1,SH2,SH3,SH4,SH5 XJ8A-0241 Omron 5 - - - - - –55 to 105°C

JUMPER

104 PS1,PS2,PS3,PS4

4

Pattern short

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 34

4. Evaluation Board Picture

Figure 4-1 Picture (Top)

Evaluation Board Picture

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 35

Figure 4-2 Picture (Back)

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 36

5. Ordering Information

Table 5-1 Ordering Information

Part Number EVB Revision Note S6SAP413A6BDA1001 Rev 0.1 ---

S6SAP413A6BDA1001 Reference Board for FPGA Power Solution , Doc. No. 002-08684 Rev. *A 37

Revision History

Document Revision History

Document Title: S6SAP413A6BDA1001 Reference Board for FPGA Power Solution Designed by XC7Z015, Using Cypress PMIC

S6AP413A, MB39C031 and MB39C504

Document Number: 002-08684

Revision Issue Date Origin of

Change

Description of Change

** 03/06/2015 ATTS Initial release.

*A 04/29/2016 ATTS Migrated to Cypress format.