Santiago Paez (664) 120-0208

santiagopaezvaldivia@gmail.com

QUALIFICATIONS BS Electrical Engineering UAG MBA International Business CETYS Universidad Six Sigma Blackbelt Trained New product introduction (NPI) Extensive experience in new equipment/ product installation Definition of production line layouts and implementation. Process optimization. Continuous improvement. Equipment and product validation. Product troubleshooting. Eight year experience in PCB assembly Experience in SMT, wave soldering, PCB assembly. In-Circuit (ICT) and functional test. SPC, DOE, FMEA, Lean Manufacturing experience. Internal and External customer corrective actions, formal reporting. OEM customer on-site support. Proficient in Windows, Office, Word, Excel and programming experience. Oracle MRP system. Bilingual English and Spanish.

PROFESSIONAL EXPERIENCE

Honeywell InternationalTijuana, Baja California(06/1994 – 02/2006)

04/2002 – 02/2006 Senior Production Engineer

Directly responsible for ICT and functional testing area, as well as final assembly. Defined and implemented process quality collection and reporting system. Also defined and implemented Equipment OA tracking database. Test area finished 2005 at 99.5% Operational Availability. Internal and external customer interface, providing corrective actions and formal

reports. Led engineering team on quality improvements 2004-2005. Achieved process quality goal of 30% improvement year over year in that span. By the end of 2005, reached 99% ICT First Pass Yield. In 2005, eliminated ICT testing on two product lines based on year over year

performance, reducing four direct operators ($24K/yr.). Defined control limits and SPC checks for correct application of flux. Implemented No Clean Flux environment, eliminating the need to wash PCBs.

Changed flux application from Foam to Spray, optimizing material consumption ($40K/yr.)

December 2004 achieved 500 PPM level at largest OEM customer lines, reducing it from 2000 PPM in 2002.

In 2004 and 2005, implemented six additional SMT/ TH products under new product acceptance guidelines, including Cp of 1.67 (200 PPM) and First Pass Yield of at least 95%. PPAP mandatory on new parts and suppliers.

Senior Product Engineer10/1999- 04/2002

Selected as Sr. Product Engineer working for design group. Directly reporting to Honeywell Design Team in Golden Valley, MN. Responsible for new product introductions (NPI) Performed trial runs, feedback to design team resulting in product or process

improvements. Achieved production acceptance (PA) for new product including RF technology. Defined and established product layout in manufacturing floor. Supported product implementation at customer site in Toronto, Canada. Transferred two more products from contract manufacturer. Participated in Green Belt training, mentoring several teams to achieve certification.

Senior Production Engineer10/1997- 10/1999

Promoted to Senior Production Engineer. Led implementation of new SMT assembly area. Received, installed and programmed screen printer, SMT chip shooters, reflow

ovens and wave solder machine. Defined reflow, epoxy and soldering profiles. Transferred product line from contract manufacturer. Established SPC routines, QC area and SMT rework processes. Selected to attend Six Sigma Blackbelt training in April 1999 Completed training in September 1999.

Production Engineer/ General Supervisor06/1996- 10/1997

Transferred and implemented PCB thru-hole auto insertion equipment. Along with equipment, transferred PCB product directly sold to OEM customers. Implemented work instructions, quality inspections and process control. Implemented PM schedule for auto insertion machines and ICT testers. Formed and developed QC inspection team. Defined PCB criteria based on IPC

standard. Responsible for day to day production, 150 direct reports.

Production Engineer 05/1995- 06/1996

Supported day to day production of gas controls. Responded to customer complaints through formal corrective action system. Troubleshoot product fall out and implement corrective actions. Responsible for small PCB assembly area. Manual assembly, wave solder and

water wash, and ICT test.

Implemented mistake proof method for manual assembly area, resulting in improved first pass yield at test from 80% to 90%.

Evaluation Engineer07/1994- 05/1995

Evaluated new materials, processes and product modifications. Life cycle and accelerated aging test. Packaging test.