semicon sp. z o.o. ul. zwoleńska 43/43a, 04-761 warszawa; tel. 22 615 64 31, 22 615 83 81; ...

SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl

Innovative productsInnovative technologies

Innovative productsInnovative technologies

www.semicon.com.ple-mail: [email protected]


1987 – foundation of SEMICON Sp. z o.o.

1992 – first signed distribution agreement: LEM NORMA

1993 – 1996 – next distribution agreement: Kontakt Chemie, Schurter, Multi-Contact

1997 – SMT assembly line launch

1998 – launch of an electronics store in Warsaw (Wolumen)

2003 – implementation of the ISO 9001:2008 quality system

2009 – starting stencils laser cutting service

SEMICON Sp. z o.o.

History:


2004-2007 – project: GreenRose (FP6)

2007-2008 – project: Tele-Ekg (FP6)

2009-2012 – project: Radi-Cal (FP7)

2010-2012 – project: ChipCheck (FP7)

2010-2013 – project: µBGA (FP7)

SEMICON Sp. z o.o.

Participation in EU Framework Programmes:


Currently, the company employs over 50 people including headquarter, production and shop.

Starting from 1st January 2013 we are participating in a new national project - Innovative advanced surface mount technology (SMT) printed circuit boards.

SEMICON Sp. z o.o.

Source: STATS ChipPAC

Source: PCB-togo.com

Source: code.google.com

Today:

Certificates

ISO 9001:2008 ISO 14001 AQAP 2110

We only work with companies which have UL certificates



Distribution: Electronic components Electronic materials Measuring equipment and

accesories

SEMICON Sp. z o.o.- business areas


Subcontracting: PCB assembly (THT, SMT) Laser cut SMT stencils

manufacturing Own production of laser modules

SEMICON Sp. z o.o.- business areas


THT and SMT assembly

More than 15 years experience in electronics

Customer support from design to production

Engineering consultancy Direct contact to supply chain ESD control IPC-A-610 trained employees Compliance with RoHS PCB Design possibilities Component supply possibilities


Production capacity- SMT assembly

4 SMT lines prototypes, small, medium series PCB size: max. 800 x 510 mm Components: 01005 - 74 x 74 mm, PoP PCB thickness: 0.2 mm - 4.0mm, flex PCB

assembly Pitch: ≥ 0.20 mm Selective conformal coating possibilities Glue, solder paste possibilities AOI inspection, functional tests, test

probes, BGA – X-ray measurements Hot Bar technologies (flex, LCD)

Źródło: JU

KI C

o.


Manual soldering Lead wave soldering PB-free wave soldering in

nitrogen 1.2 mln THT components

monthly/1 shift

Production capacity- THT assembly


Main customers

Medical Defence Automotive Energoelectronic Lighting Telecomm R&D


Stencils laser cutting High-speed cutting machine LPKF

Stencil Laser G6060 Frame or frameless stencils Accuracy and repeatability: ±2µ Material: stainless steel, nickel Thickness: up to 600µm (oxygen

cutting) Engineering, modifications, e.g. glue

stencils Aperture inspection – high resolution

scanner Tension inspection

Źródło: LP

KF

Laser & E

lectronics AG


Laser modules Wavelenghts: 405-850nm

Power input: 0,2 – 500mW

Pointers

Line and cross generators

Customization

Laser displacement sensors: Resolution: up to 10µm

Measurement range: up to 200mm

Measurement distance: up to 50m

System includes: laser module and position detector

Optoelectronic equipment manufacturing


Pointers Cross-hair pointers Alarm systems, laser

barriers Sensors Positioning systems Textile industry Wood processing:

Wood cutting Stone cutting Metal cutting

Tire industry Mining industry

Laser modules applications


Miniaturization in electronics

Source: pl.wikipedia.org

Passive Components


Miniaturization in electronics - ICs

Sou

rce:

Am

kor

Tech

nolo

gy,

Inc


SMT challenges

01005 components – paste screenprinting QFN, DFN components – lifting effect, voids Large and fine pitch BGAs – thermal balance,

voids, „head in pillow” effect PoP components – warpage, placing, BGAs

errors Large PCB assembly – bow and twist


First generation: multi-level structures

Second generation: PoPs

Next generation: TMV PoPs, BVA PoPs

3D package development

Source: Invensas Co

Source: Amkor Technology, Inc.

Sou

rce:

Am

kor

Tech

nolo

gy,

Inc.

World trends: higher density PoP


Why PoP? Higher speed, lower energy consumption Memory chips from different vendors Different types of memory chips: speed, capacity, etc Separate inspection of processor and memory chips Lower junction temperatures (at least compared to stacked die)

PoP – Package on Package

Sou

rce:

Ele

ctro

IQ


PoP stacking assembly options:

PoP – Package on Package

Sou

rce:

Pan

ason

ic C

o


TMV PoP – Thru Mold Via Package on Package

®

Source: Amkor Technology, Inc.

Dimension control vias reduces the distance between the system memory and the TMV after their assembly.


Why TMV PoP?

Improved warpage control and bottom package thickness. High density stacked (memory) interface. Increased die to package size ratio. TMV can provide over a

30% increase in maximum die size. Improved board level reliability. Improved fine pitch SMT process window. Supports Wirebond, flip chip devices (both area array solder

and fine pitch CuPillar), stacked die and passive components integration.TMV could also be applied to FlipStack® (combo FC+WB) and FC w/ TSV stacks.

TMV PoP – Thru Mold Via Package on Package

®

Sou

rce:

IM

AP

S.


BVA PoP – Bond Via Array Package on Package

™

Why BVA PoP?

The increase in the number of connections to the logic circuits from 300 to over 1000.

Reduction of PoP total thickness (lower than TMV PoP).

Source: Invensas Co

Reducing the pitch (up to 0.2mm) of the processor through wire leads increases the number of possible connections in the POP system.


BVA PoP – Bond Via Array Package on Package

™

Source: Invensas Co

Copper wires, height of 400µm pitch of 240µm.


Perspectives for PoP solutions

Source: Gartner, Inc

What next?


Thank you for attention!

Piotr Ciszewskie-mail: [email protected]

mailto:[email protected]

semicon sp. z o.o. ul. zwoleńska 43/43a, 04-761 warszawa; tel. 22 615 64 31, 22 615 83 81; ...

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smt laser

smt pcb assembly tht

bga fp7 semicon

flex pcb assembly pitch