semiconductor embedded in substrate: sesub · ceatec2013-21 semiconductor embedded in substrate:...
TRANSCRIPT
CEATEC2013-21
Semiconductor Embedded in SUBstrate: SESUB
Features
• Small size: Higher integration of parts enables drastic miniaturization.
• Low profile: 4-layer substrate can be realized with a thickness of only 300 micron.
• Thermal dissipation: Efficient thermal dissipation provides higher degree of freedom for design.
• Reduced noise emissions: Chip connections within substrate enhance EMI performance.
Major Applications
• Smartphones, mobile phones, tablet devices
• Digital still cameras and other mobile devices
• Healthcare products, wearable devices, etc.
Advantages
SESUB (Semiconductor Embedded in SUBstrate) technique for embedding extremely low-profile chips into
the substrate enables the creation of extremely compact, high-performance PMUs for smartphones, as well
as the world's smallest class Bluetooth module.
SESUB technology from TDK realizes ultra-miniaturized power management units (PMU), Bluetooth modules, and more!
Compact, low-profile, low power consumption, low noise
PMU lineup
Shielded switching DC-DC converter (prototype)
11.0×11.0mm Height 1.65mm (max.)
μDC-DC
Converter
2.9
mm
2.3mm
PMUs for smartphones
11×11×1.65mm 8.9×10.3×1.4mm(Prototype)
BatteryCharger
6.65×5.3×1.4mm(Prototype)
ChargePump
2.3×2.4×1.0mm
μDC-DCConverter
2.9×2.3×1.0mm
■ 64% smaller mounting footprint
(Compared to modular construction using packaged ICs)
■ Ideal for wearable devices and portable devices with emphasis
on small size and elegant design
Bluetooth module demonstrationConventional small-size Bluetooth tag
Ultra low profile tag utilizing SESUB
Thickness 5 to 13mm
Thickness 2mm
Easily fits into any wallet
Chips are embedded in this substrate area
6.0×6.0mm
Package IC
Laminate Module SESUB module
8.5×8.5mm (= 72.3mm2)
Height 1.0mm
5.6×4.6mm (= 25.8mm2)
Height 1.0mm
-64%
Bluetooth module (Bluetooth Low Energy)
4.6m
m
5.6mm
1.0mm
Performance comparison
Without shield With shield
76.074.172.270.368.466.564.662.760.858.957.055.153.251.349.447.545.643.741.839.938.0
(dBμV)
Newly developed shielding structure for μDC-DC converter results in further reduced noise.
World’s smallest class!More compact products are under development.
5.2 × 4.3 × 1.0mm
1mm IC Die IC Die 0.3mm
Cross-section view of SESUB