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SEMICONDUCTORS/MEMS

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www.s3-AlliAnce.com

s3 Alliance provides the network, and product portfolio that brings leading edge solutions to our customers.

our supply and service solutions are tailored to meet our customers ever changing requirements, enabling them to be competitive in what is now a truly global marketplace.

we source and offer quality products at the right price within the following areas: page equipment 3 metrology & Handling 5 Parts & consumables 6 service / cleaning and Facility 7

s3 AlliAnce

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EQUIPMENT

www.meillc.com

3

EQUIPMENT

° AMAT / Mirra, Mesa

° Speedfam IPEC / 472, Auriga, 676, 776

° Strasbaugh / 6EC, 6DSSP

Remanufactured Post CMP Scrubbers

° Ontrack / DSS 100, 200

Remanufactured Grinders

° Strasbaugh (7AF), Disco (DFG 841), Okamoto

° CMP and Backgrinding Upgrades

www.axustech.com

Remanufactured CMP/Polishing Equipment

° Semi-automated CMP Systems from 2” to 12”

° Monitoring Systems

° Pad Monitoring Systems

° Post CMP Cleaners; semi-automated (4”-12”) or fully automated 3” to 6”

www.gnptech.com

CMP / Cleaning Systems for R&D

Nozzle-less ultrasonic spray head technology

° Systems feature proprietary nozzle-less ultrasonic spray head technology

° pr s t in nifor fi s down to sub-micron thickness

° Coating applications include display, fuel cell, semicon-ductor, medical device and others

° Variety of precision coating platforms available from bench-top to large format

www.ultraspray.com

Spray Coating Systems

www.meillc.comwww.meillc.com

° Linear Wet Benches & Refurbs

° Advanced Metal Etch

° MLO

° Resist Strip

° Advanced Cleaning

° Chemical Delivery Systems

° PolySilicon Chuck/Dust/Wafer Cleaning

For semiconductor and solar industries. Product lines include fully automatic wet processing systems and controllers and semi-auto linear and rotary wet processing systems.

Tailored Wet Processing Systems

° DIDO 6“ to 12“ fully auto-mated CMP Platform (P300)

° DIWO 4 to 8“ fully automa-ted CMP Platform (6DSSP)

° Different semi automated platforms for:

° Silicon manufacturing, Rec-laim, CMP R&D, III-V, MEMS

Backgrinding

° 4“ to 8“ compatible, semi to fully automated platforms (7AA, 7AF)

° Edge Grinding 4“ to 8“ fully automated (7AB)

www.strasbaugh.com

CMP & Polishing

CO2 Snow Aerosol Cleaning

° Semi-automatic or fully automated 4“ to 12“ Equip-ment for

° MEMS Cleaning

° Backend Package Cleaning

MASK Cleaning

www.ecosnow.com

Dry Cleaning

° Backside Metal PVD Systems

° High Deposition PVD Systems

Through Silicon Via PVD Deposition

° Nano Films for Data Storage

° MEMS PVD Systems

www.tangosystemsinc.com

Metallization

° RIE

° ICP Etch

° PECVD

° Resist Strip

° Descum

Tools for the Compound Semiconductor, MEMS, Opto-Electronic and other markets. From manual to fully automated.

www.triontech.com

Manufacturer of Plasma Etch (RIE/ICP)

www.meillc.com

Remanufactured CMP / Grinding / Scrubbing Systems

www.axustech.com

CMP AMAT / Mirra, Mirra Mesa Speedfam IPEC / 472, 372M Auriga, 676, 776

Strasbaugh / 6EC, 6DSSP

Post CMP Scrubbers Ontrack / DSS 100, 200 Synergy

Grinders Strasbaugh (7AF), Disco (DFG 841), Okamoto

CMP and Backgrinding Upgrades

Foundry Services for CMP, Backgrinding and Cleaning processes

CMP Semi-automated CMP Systems from 2” to 12”

Post CMP Cleaners semi-automated (4”-12”) or fully automated 3” to 6”

CMP & Cleaning Systems for R&D / MWS

www.gnptech.com

RIE, ICP Etch Phantom III Minilock

PECVD Titan Minilock Orion Oracle III

www.triontech.com

Manufacturer of Plasma (RIE/ICP) Systems

CO2 Snow Aerosol Cleaning Semi-automatic or fully automated 4“ to 12“ Equipment for

Applications MEMS Cleaning Backend Package Cleaning Metal lift Off Particle removal

www.ecosnow.com

CO2 Dry Cleaning

Tailored Wet Processing Systems

Resist Strip

Descum / Strip Apollo (single chamber) Gemini (multi chamber)

MASK Cleaning Post Repair Clean Full MASK Clean

Multi Wire Saw (Diamond Wire) for hard materials (Sapphire and SiC)

Linear Wet Benches Semi to Fully Automated

Upgrade Programs for SEMITOOL SST, SAT and SRD

New SRD Systems Tabletop, Single or double Stack Stand Alone

Refurbishment of Legacy Wetbenches, Parts for

Akrion, SCP, Steag, UP

Applications Advanced Metal Etch Metal Lift Off Resist Strip Advanced Cleaning

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EQUIPMENT

Nozzle-less ultrasonic spray head technology Spraysthin,uniformfilmsdowntosub-micron thickness

Variety of precision coating plat-forms available from bench-top to large format

Spray Coating Systems

PVD Systems Backside Metalisation High Deposition Rate Systems

PVD Systems

Principle surface activation

Room Temperature

Vacuum

Void-free high yield rate bonding can be realized

Room Temperature Wafer Bonder

Applications Coating applications include display, semiconductor

Photoresist, Polyimide Conductiv Coating Metal Coating (EMI Shield)

Applications Through Silicon Via Deposition Nano Films for Data Storage MEMS large PCB SAW

Applications Si / Si SiO2 / SiO2: For insulated pack. Si / Quartz, Quartz / Quartz Cu / Cu Wafer Level Pack. for MEMS (Acc.sensor)

Semi ore Fully Automatic Tape Lamination or Detape System

Wafer Mounting UV Irradiation System

Remanufactured TEL Track Systems

MARK Series ACT Series LITHIUS Series

Tape / Detape / Wafer Mounting / Systems

ACT 8 Track

Applications Wafer tape / detape before grinding Dry Film Resist Lamination for MEMSspecificapplications

Engineering Service

Spare Parts

www.ultraspray.com

www.tangosystemsinc.com

www.mhi-global.com

www.teikoku-taping.com

www.aplt.co.kr

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METROLOGY & HANDLING

2D and 3D Vision with Micro and Nano Pixel ImagingSurface Defect Inspection for:Contamination, Foreign Material, Scratch, Etch Residue, Discoloration

LED FAB Process Inspection

www.ati2000.co.kr

Automatic Wafer / Package Inspection / Laser Marking Systems

Capacitive, IR, BP or WL Interferometry

Thickness, TTV, Bow, Warp measurement

Wafer Characterization Layer thickness measurement

www.microsense.net

Wafer Dimensional Metrology

Formerly Sigmatech

Wafer Surface Metrology Roughness measurement MEMS/Membrane thickness

Manual Wafer Handling Products

Manual Wafer Transfer from 2“ to 8“ Auto Wafer Transfer

from 2“ to 8“ ManualFlat/Notchfinder Auto Flat/Finder

www.stc.tw

Scanning Acoustic Microscope

Scanning Acoustic Microscope for Semiconductor and Industrial Materials

www.acoulab.co.kr

From Manual loading to fully automated equipment

Alignement, recognition Mapping, location and characterization of the defects

Automatic Batch Wafer Systems

www.r2d-automation.com

(Italy and UK)

Single Batch Transfer 2/3 Station or

Vertical Transfer Sorters, OCR Sorters OCR Readers

Standard wafer handling solutions for non-standard wafer handling requirements (OEM, end-users)

From 50mm to 450mm Bridge tool capability with no tooling change-over

Jabil-Chad, Inc. 1565 S. Sinclair Street

Anaheim, CA 92806 TEL 714.938.0080

WEB www.chadindustries.net Excellence in Automation Since 1973

Chad Default document_A SEJ

www.chadindustries.net

Automated Wafer HandlingLoader / Unloader

Applications FLIP CHIP, BGA, FBGA, ITO sputtering Targets, Wafer bonding and Sapphire Wafer (LED)

Applications Bumps dimensions Film Thickness Step Height, cavities Ultrathin wafer

Bump inspection Post Wafer thinning and Dicing Crack Inspection

Non-standard wafer handling solutions (thin, warped, glass, thick,filmframe)

Manual Wafer Lifter from 2“ to 8“

2D & 3D X-ray Inspection System

www.seceng.co.kr/eng/

TSV 3D (Size, Void, Alignment) Cu Pillar Bump (Void) Micro Bump WLP Micro Void Analysis (Size %)

3D CT Images

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PARTS & CONSUMABLES

Retaining Ring available in different materials

PEEK, PPS, PBNavailable for AMATMirra,Reflexion Ebara FREX Others www.willbesnt.com

Retaining Ring & Customized Plastic Parts

www.saesoldia.com

CMP Pad Conditioners

(Germany & UK)

Pad conditioner design allows A higher lifetime Excellent reproducibility Lower defectivity, scratch precaution

Advanced Quality Control systems

EPDM Membranes Silicon Membranes Diaphragms & Seals

www.maxuptech.com

CMP Membranes & Rubber Parts

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PARTS & CONSUMABLES

° Hard Materials: SiC, GaN, Diamond, AlN

° Sapphire Slurry

° GaN, SiC and other Foundry Services

www.sinmat.com

CMP Slurries

Pad conditioner design allows:

° A higher lifetime

° Excellent reproducibility

° Lower defectivity, scratch precaution

Advanced Quality Control systems

www.saesoldia.com

CMP Pad Conditioners

Highly Dynamic complex Fluids acting as Physical Detaching instead of Chemical dissolving

° Water based

° Biodegradable

° pH neutral

° Economical

Applications:

° Photo Resist strip

° Lift off

° Parts Cleaning

° Post Wire Saw Clean

° Screen Printing Clean

www.bubbles-beyond.com

Physical Removal Liquids

Available in different materials:

° PEEK, PPS, PBN

with different designs for:

° M Mirr e e ion

° Ebara FREX

° Others

www.willbesnt.com

Retaining Ring

Bare Si Polish Pads

° Cast Foamed Elastomer with controlled Cells

° Napped Poromeric Material for Final Polishing

° Available up to 65 inches

° Segmented Diameters Larger than 66 inches

° Grooving available in a variety of grooving patterns

www.universalphotonics.com

Polishing Pads

° EPDM Membranes

° Silicon Membranes

° Diaphragms & Seals

www.maxuptech.com

CMP Membranes & Rubber Parts

Hard Materials: SiC, GaN, Diamond, AlN

Sapphire Slurry GaN, SiC and other Foundry Services www.sinmat.com

Hard Material Slurries

Wafer Cassette

Grinding Wheel for hard Materials

SiC, GaN, Sapphire

Chuck Tables New and Refurbished

www.npmt.com.tw www.ckplas.com

Wafer Cassette PEEK from 4“ to 8“ Teflon/PFA,PPfrom2“to12“

Shipping Box from 2“ to 8“

Single Wafer Carrier 2“, 3“, 4“, 5“, 6“ made of PP

GRINDING WHEEL, DICING SAW & BLADES

Mask Package

Reticle SMIF POD

www.levitronix.com

Bearingless Pumps

(CH, CZ, D, France, Italy, PL, Russia)

High Purity Pumps Chemical Mixer DI Water Heaters Chemical Heaters www.treborintl.com

Diaphragm Pumps & Heaters

Applications Photo Resist strip Lift off Parts Cleaning Post Wire Saw Clean

www.bubbles-beyond.com

Water Based Removers

Bare Si Polish Pads Cast Foamed Elastomer with controlled Cells

Napped Poromeric Mate-rial for Final Polishing

Available up to 65 inches

www.universalphotonics.com

Polishing Pads

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PARTS & CONSUMABLES

° Hard Materials: SiC, GaN, Diamond, AlN

° Sapphire Slurry

° GaN, SiC and other Foundry Services

www.sinmat.com

CMP Slurries

Pad conditioner design allows:

° A higher lifetime

° Excellent reproducibility

° Lower defectivity, scratch precaution

Advanced Quality Control systems

www.saesoldia.com

CMP Pad Conditioners

Highly Dynamic complex Fluids acting as Physical Detaching instead of Chemical dissolving

° Water based

° Biodegradable

° pH neutral

° Economical

Applications:

° Photo Resist strip

° Lift off

° Parts Cleaning

° Post Wire Saw Clean

° Screen Printing Clean

www.bubbles-beyond.com

Physical Removal Liquids

Available in different materials:

° PEEK, PPS, PBN

with different designs for:

° M Mirr e e ion

° Ebara FREX

° Others

www.willbesnt.com

Retaining Ring

Bare Si Polish Pads

° Cast Foamed Elastomer with controlled Cells

° Napped Poromeric Material for Final Polishing

° Available up to 65 inches

° Segmented Diameters Larger than 66 inches

° Grooving available in a variety of grooving patterns

www.universalphotonics.com

Polishing Pads

° EPDM Membranes

° Silicon Membranes

° Diaphragms & Seals

www.maxuptech.com

CMP Membranes & Rubber Parts

(UK & Ireland)

For following applications: Slurry mixing and dispense Electro Chemical Deposition (Au, Cu, Permalloy, Solder)

Parts for CVD and ETCH Producer, Speed, Endura, Centura

Dicing Saw

Dicing Blades Resin, Electro formed, Metal,vitrifiedBond

Screen Printing Clean

Segmented Diameters Larger than 66 inches

Grooving available in a variety of grooving patterns

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SERVICE / CLEANING AND FACILITIES

Atmospheric and Vacuum Robot Repair / Exchange

Robots and Aligner Aligners, Brooks, PRI, Equipe

Genmark, RorzeHead Platen Motors

KollmorgenCVD Vaporizer / LMFM Unit Repair / Overhaul

Source Material: TEOS, TDMAT, TEP, TMCTS, BCHD

www.greenspec.co.kr

On Site H2 Generator N2 Generator

Manufacturer of Proton Exch-ange Membrane (PEM) H2 GENERATION products using electrolysis

Enhanced gas supply reliability Improved prity repeatability Improved Safety Stable and reduced costs Generallymorespace-efficient

www.protononsite.com

Hydrogen Separators, Analyzers, Generators

Hydrogen Analysis HEMS – Hydrogen Elimination

Mass Spectroscopy ppb qualificationofHydrogen

Hydrogen Generation Fuel Cell-Ready Hydrogen

Hydrogen Separation Reforming fuels Gas or Liquid, Fossil or Bio

www.powerandenergy.com

Vacuum Pump and Power Supply Repair / Exchange

Cryo Pump Repair, Refurbishment or Exchange

Power Generators / Supply Repair and Refurbishment

Refurbished turbo and mechanical pumps

www.ptbsales.com

Materials for Cleaning Critical Surfaces

www.foamtecintlwcc.com

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SERVICE / CLEANING AND FACILITIES

° Cryo Pump Repair, Refurbishment or Exchange

° Power Generators / Supply Repair and Refurbishment

www.ptbsales.com

Cryo Pump Repair and Refurbishment

Hydrogen Separation: Fuel Cell Ready Hydrogen

Hydrogen Analysis: PPT analysis of HydrogenHEMS – Hydrogen Elimination Mass Spectroscopy

Hydrogen Generation High Effi ciency, Compact Steam Reforming

www.powerandenergy.com

Hydrogen Separation, Analysis, Generation

° Aligners, Brooks, PRI, Equipe

° Genmark, Rorze

° Head Platen Motors from Kollmorgen

CVD Vaporizer / LMFM Unit Repair / Overhaul

° Source Material: TEOS, TDMAT, TEP, TMCTS

www.greenspec.co.kr

Atmospheric and Vacuum Robot Repair / Exchange

° ScrubPads

° Foams

° Microfi ber Wipers

° Swabs

° Ergonomic Tools (ScrubPen, tips...)

Complete Kits and procedure for Process Chamber Clean

° CVD, HDP chamber from AMAT, NVLS

° ETCH from LAM, AMAT, TEL

° IMPLANT Source and Chamber from VARIAN, AMAT, Axcellis

° PHOTO tracks

° PARTSwww.foamtecintlwcc.com

Materials for Cleaning Critical Surfaces

Manufacturer of Proton Exchange Membrane (PEM) H2 GENERATION products using electrolysis

° Enhanced gas supply reliability

° Improved prity repeatability

° Improved Safety

° Stable and reduced costs

° Generally more space-effi cient

www.protononsite.com

Proton Exchange Membrane

MaterialsScrubPadsFoamsMicrofiberWipersSwabsErgonomic Tools (ScrubPen, tips...)

Chamber Cleans CVD, HDP chamber from AMAT, NVLS

ETCH from LAM, AMAT, TEL VOC Free PM Wiping Change tent

IMPLANT Source and Chamber from VARIAN, AMAT, Axcellis

PHOTO tracks

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S3 S

EMI.7

LOCATIONS

S3 Alliance operates from 4 locations within Europe

www.s3-alliance.com

UK-IrelandOffice

S3 Alliance LtdSkeoge Industrial Estate Beraghmore Road Derry, BT48 8SEN. Ireland

GermanOffice

S3 Alliance GmbHMahdenstraße 23D-72138 KirchentellinsfurtGermany

ItalianOffice

S3 Alliance SRLVia Rossini 421052 Busto Arsizio (VA)Italy

RussianOfficeA Subsidiary of S3 Alliance GmbH

S3 Alliance Rus LLCUgreshskayastr.2/5,office02,Moscow, 115088Russia

Tel: +44(0) 2871 357 760Fax: +44(0) 2871 357 744E-mail: salesuk@s3-alliance.com

Tel: +49 7121 16 777-0Fax: +49 7121 16 777-10E-mail: salesgmbh@s3-alliance.com

Теl: +74956385493 +7 926 654 6386E-mail: salesrussia@s3-alliance.com

Tel: +39 033 143 0295Fax: +39 033 1430295 E-mail: salesit@s3-alliance.com