server development introduction - mechanical system

Server Development Introduction -

Mechanical System Integration Design- Mechanical, thermal, acoustic, structural, packaging -

Server Development Introduction -

Mechanical System Integration Design- Mechanical, thermal, acoustic, structural, packaging -

• 梁銓益 C.Y. Liang

• 2021.5.6

• AGENDA

• DESIGN REVIEW ITEMS

• MECHANICAL DESIGN PROCESS

• THERMAL/ACOUSTIC DESIGN PROCESS

• ACOUSTIC DESIGN

• DEVELOPMENT FACILITY

• STRUCTURAL DESIGN

• PACKAGE DESIGN

System Integration Capability

-Review dimension

-Thermal parts

mounting proposal

ME RD

Structural

-Design review

-DFX of Mfg

EE RD

Power RD

Firmware RD

-Review power

budge of fan

-Review fan PWM

control

-Fan EE signal

-Key components

Power

consumption

review

Design Review Items

Check

Point

ProposalPhase

PlanningPhase

R&DDesignPhase

LabPilot-run

Phase

EngineeringPilot-run

Phase

ProductionPilot-run

Phase

MassProduction

Phase

Sample A Sample B 1st Production MP-1A Sample

Thermal RD

-SOW&MRD Study

-Design concept

-Cosmetic Spec

-Preliminary simulation

-Vender Selection

-Design proposal

-System Mockup

Thermal Validation

-System impedance

Validation

-Thermal parts

performance

validation

ToolingMockup Sample

ReviewProductivity

Verify Preparing

-Fan Vibration Validation

(by customer request)

-System Thermal Validation

-System Impedance Validation

-System Acoustic Validation

-Thermal parts performance

validation

-Key components power consumption

validation (CPU/DIMM/HD/fan)

-Firmware fan table validation

MECHANICAL DESIGN PROCESS

ME DESIGN FUNCTIONS SUMMARY

5

製造

PM

Mechanical

Development

Mechanical

Design

Mech. Tech.

R&D

Industrial

Design

Supply Base

Management

◆ME parts design

◆W/S review

◆Try-out sample review

◆FAI, CPK, SOP review

◆P/R quality verification

◆ME parts approval

◆ECR/ECR follow-up

◆Tooling management

◆ Cost control

◆ Supplier quality

management

◆CAE simulation

◆Thermal/acoustic

/packaging design

◆Design verification test

◆Advanced technology research

◆Project management

◆Product planning

◆Schedule control

◆Product cost handling

◆Daily communication

◆ID design

◆Graphic / artwork design

◆Color management

MECHANICAL DESIGN TOOLS

6

• Creo 6.0/7.0 Parametric: 3D/2D Design

• Cabling Module : Cabling Routing

• Mechanism Module : Mechanism Design and Analysis

• Windchill 11.0PLM For Drawing Control

DesignTools

Pro/E(Creo6.0/7.0)

WindChill11.0

MECHANICAL DESIGN PROCESS

7

Chassis proposal

Mechanical design

Design review

Proto review &

tests

Supplier selection

Chassis & tooling cost

estimation

Yes

Yes

No

No

Tryout ( T1 ) Tryout review &

tests

Yes

Tryout ( T2 )

Tryout

( T3, …Tf )

Approval &

MRR

M/P

Prototype fabrication

Tryout review &

tests

Tooling

fabrication

Tryout review &

tests

No

No

Yes

No

Yes

RFI/RFP/RFQ

MRS

DESIGN QUALITY

8

• TA – Tolerance Analysis• Structure CAE simulation• DFMEA - Design Failure Mode

and Effect Analysis

• ME Design Check List• PCB Design Check List• Form Fit Check (Test Case)• Interference Check

• ME Weekly Review Meeting• Design Review By Function

Team• Design Review Tracking List

• Mockup Sample Review meeting

• ME Part control table

DesignQuality

DesignCheck

DesignReview

SampleReview

DesignAnalysis

DESIGN REVIEW

9

Design Quality Enhancement

- Use ME Design Check List to review from Design stage to Hard Tooling Start

- Prototype sample and ME related test result review with functional teams

(Thermal/Structure/EMC/Safety/MFG etc..)

TA – TOLERANCE ANALYSIS

10

Optimize ME design , prevent interference

FORMAL DRAWING MANAGEMENT

11

Engineer Specification:

xxx-xxxx Mech. Parts

Drawing Management Rule

Part Number

Dimension & Tolerance

Material

Color & Artwork

Finish Process

Drawing Note

Version Control

INNOVATION CAPABILITY--- PATENTS

12

Design of FAN Cage rotation

Design of PCI Latch rotation

2020 Year SummaryApplication granted: 61, Patent granted: 26

Shock Absorbing Structurefor FAN vibration might

influence HDD performance

THERMAL/ACOUSTIC DESIGN PROCESS

THERMAL DESIGN CAPABILITY

Thermal/Impedance Design Process

C0 Proposal /

C1 Plan Phase

RD Design

Phase

Pilot-Run

Phase

Mass

Production

Phase

Project evaluation

& concept establish

by CAE Simulation

Prototype

thermal/impedance/

acoustic test

Tooling sample

thermal/impedance/

acoustic validation

Mass Production

thermal/impedance/

acoustic validation

RoHS/Production

Approval/PPAP


C0 Proposal /

C1 Plan Phase

RD Design

Phase

Pilot-Run

Phase

Mass

Production

Phase

Project evaluation

& concept establish

by CAE Simulation

1. NUDD / Risk assessment

2. ID outline dimensions

3. Mechanical layout and Motherboard components placement

review

4. Key components Power consumption estimation

5. Specifications study

6. CAE simulation Modeling with “FLOTHERM v12.1” or

“ICEPAK v12.0.2”.

Preliminary evaluated system/components maximum

dissipation limitation

Thermal simulation with various air flow conditions

Air flow conditions

Temperature profile

Velocity profile

Monitor points Spec.Simulated

Temp.

1 CPU 67 63.4

2 IOH 95.1 79.4

3 ICH10 92.5 70.6

4 DDR3-1A 85 60.6

5 DDR3-2B 85 60.8

6 DDR3-3C 85 62.6

7 HDD1 55 43.9

8 HDD3 55 42.6

9 PCI Thermal Load Card 1_VR 95 64.2

10 PCI Thermal Load Card 3_VR 95 65.8

11 PSU Inlet air 50 42.3


Proposal/Plan

Phase

C2 RD

Design

Phase

Pilot-Run

Phase

Mass

Production

Phase

Prototype

thermal/impedance/

acoustic test

1. Prototype Chassis

2. Prototype motherboard with key

components TTV

3. Sampling heat-sink module and

flow generator choice by thermal

simulation results

4. Thermal/Acoustic/Impedance

validation and optimum

Develop optimum fan / heat-sink choice and make sure

cooling module system’s dissipated capability

Mock-up for CPU heatsink thermal feasibility

development with TTV

Power Cord & voltage sensing wire of TTV (we

ensure real-time measurement of TTV voltage drop)

Power Cord

Voltage sensing wire

The measured is difference between

power supply and data logger. Use

logger data to estimate TTV power.

CPU TTV with heatsink

Mock-up for various CPU heat sink thermal feasibility

development

0.25

0.27

0.29

0.31

0.33

0.35

0.37

0.39

0.41

0.43

5 10 15 20 25 30 35 40 45 50

Flow rate (CFM)

The

ta (

℃/w

)

Dell Testing_Furukawa Sample with sharp corner Wistron testing_Furukawa Sample_2 with round cornerCCI Testing-CCI modified Sample2 with round corner Wistron Testing_CCI modified Sample2 with round cornerWistron Testing-Sample_1 (20081119) Wistron Testing-Sample_5 (20081119)Wistron Testing-Sample_10 (20081119) CCI Testing-Sample_1 (20081114)CCI Testing-Sample_5 (20081114) CCI Testing-Sample_10 (20081114)

CPU TTV with heatsink

CPU TTV with heatsink test data

Heatsink performance curve

Testing with Wind Tunnel

Monitor points Spec. Test result

1 CPU 67 64.8

2 IOH 95.1 78.6

3 DDR3-1A 85 61.0

4 DDR3-1D 85 59.5

5 DDR3-2B 85 53.7

6 DDR3-2E 85 54.4

7 DDR3-3C 85 58.4

8 DDR3-3F 85 61.8

9 HDD1 55 41.8

10 HDD2 55 41.7

11 HDD3 55 41.7

12 HDD4 55 41.9

13 PCI Thermal Load Card_VR 95 62.1


HDD TTVDIM TTVCPU TTV

Mock-up system for thermal validation

Prototype Thermal Development

Flow Management

Flow Meter Bench

Flow Impedance

Measurement

Impedance Control by Chassis

flow characterCFM

Max

Pressure

(in H2O)

Min

Pressure

(in H2O)

20 0.18 0.14

25 0.27 0.22

30 0.37 0.29

35 0.48 0.38

40 0.61 0.48

45 0.75 0.60

50 0.92 0.72

• Fan Performance P-Q

• System/sub-system/component flow impedance

Mock-up for impedance feasibility development

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

1.40

1.50

1.60

10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0

Q(cfm)

Ps(i

n A

q)

Upper Limit

Lower Limit

pitch 1.6 no gesket

pitch 1.6 old bezel

no HDDpitch 1.6 with gesket

pitch 1.6 old bezel

with HDDpitch 1.6 new bezel

with HDDpitch 1.6 new bezel

with HDD traypitch 1.6 old bezel

with HDD traypitch 1.6 new cage1



origin HDDpitch 1.6 new cage2

origin HDDcage1 no gasket

cage1 with gasket

cage2 no gasket

cage2 with gasket

Testing with Wind Tunnel

Impedance Curve

Proposal/Plan

Phase

RD Design

Phase

C3 Pilot-

Run Phase

Mass

Production

Phase

Tooling sample

thermal/impedance/

acoustic validation

1. Tooling Chassis

2. Sample motherboard

3. Tooling heat-sink module

4. Temperature measurement with

thermocouple in high/low ambient

environment

5. Thermal power measurement and

VR efficiency calculation

Develop optimum acoustic/thermal design and make

sure system’s dissipated capability


Thermal Sample Stage Test

Monitor points Spec. Test result

1 CPU 67 63.6

2 IOH 95.1 53.9

3 DDR3-1A 85 51.6

4 DDR3-1D 85 54.5

5 DDR3-2B 85 54.4

6 DDR3-2E 85 54.6

7 DDR3-3C 85 54.4

8 DDR3-3F 85 52.4

9 HDD1 55 42.6

10 HDD2 55 42.8

11 HDD3 55 42.6

12 HDD4 55 42.7

13 PCI Thermal Load Card_VR 95 58.9


Pilot build system for thermal validation

Pilot build PCBA SAS HDD, 750GBDDR3, Elpida 8GB

Proposal/Plan

Phase

RD Design

Phase

Pilot-Run

Phase

C4 Mass

Production

Phase

Mass Production

thermal/impedance/

acoustic validation

RoHS/Production

Approval/PPAP

1. System/components performance

validation

2. RoHS report review and approval

3. Production approval/PPAP

4. Manufacturing issue support

5. Mass production quality issue support

Provide standard specification document and golden

sample for manufacture and ramp up


Thermal Parts Approval

Passive Heat sinkAir-baffle

FAI

RoHS

Performance

ACOUSTIC DESIGN

ACOUSTICS DESIGN METHODOLOGY

• MAJOR NOISE SOURCES IN COMPUTER

• FAN OF SWITCH POWER SUPPLY

• FAN OF CPU FAN-SINK

• HOUSING FAN

• HARD DISK DRIVER / ODD

• GRAPHIC CARD FAN

• Clarify the major noise contribution

ACOUSTICS DESIGN METHODOLOGY

• MAJOR NOISE TRANSMITTED TYPES

• AIR BORNE

• STRUCTURAL BORNE

Air Borne Noise

- Optimal fan speed vs. noise level

Idle RPM Max. RPM

Acoustic Spec.

HDD ON HDD OFF

Air Borne Noise Control

• Define temperature sensors and fan behaviors of fan speed control table

- sensor offset

- sensor time averaging

- sensor xxx

- sensor Alert

- sensor Start-up Over temperature Delay

- sensor xxx

- sensor T-run

- sensor fan hysteresis

- sensor xxx

- sensor threshold

- Fan blowout

- Fan fault detect

- Fan fault threshold

- PWM minimum duty cycle

- PWM high speed duty cycle

Effective noise-reduction solution in HDD random seeking mode

Noise Level dBA

35363738

39404142

Hard Mount Soft Mount

STRUCTURE BORNE NOISE- HDD SOFT-MOUNT EVALUATION

Acoustic Laboratory

Reference box for EUT and measurement surface & Microphones' Positions

“ISO9296”

Sound power and pressure measurement

Artificial Head vs. Abnormal Noise

• TEST EQUIPMENT: HEAD ACOUSTICS ARTIFICIAL HEAD & ITS

SOFTWARE ANALYZER.

• EXCEPT EXPLICIT FAN ACOUSTIC NOISE MEASUREMENT, WE

CAN USE THE EQUIPMENT TO VERIFY IF THE MAIN BOARD

ALONE (NOT INCLUDE FAN & STORAGE DEVICES) EMITS

ABNORMAL SOUND FROM ELECTRICAL COMPONENT SUCH AS

COILS.

STRUCTURE DESIGN

Structural Design Process

• Combine Experimental and CAE Simulation to enhance structural issue predicted capability

• Screening structural problem before tooling start

Proposal/Plan PhaseRD Design

PhasePilot-Run Phase

Mass

Production

Phase

Project evaluation by

1. CAE - Strength &

Usability

2. CAE - Drop

3. CAE - Shock &

Vibration

4. CAE – Sag & Bow

CAE & Prototype

test

1. Shock

2. General

Vibration

3. Rotation

Vibration

4. Acoustic

5. Sag & Bow

6. Tensile

strength test

Validation and Correlation

ME Strcutre Development Process

Structure CAE design

• ANSYS/LS DYNA FOR STRUCTURE CAE DESIGN

• STATIC ANALYSIS

• MODAL ANALYSIS

• SHOCK ANALYSIS

Structural Development

Sag & Bow Measurement

900

800

700

600

500

400

300

200

100

0

050

100150

200250

300350

450

-3.00-2.50-2.00-1.50-1.00-0.500.000.501.00

Depth (mm)

Width (mm)

Granite Table Top Surface Contour Plot

-3.00--2.50 -2.50--2.00 -2.00--1.50 -1.50--1.00 -1.00--0.50 -0.50-0.00 0.00-0.50 0.50-1.00

HDD Degradation Measurement

(RV test)

Load = 17 Kgf

Static simulation

Modal simulation

Shock simulation

Structure CAE design- Static Analysis

Pre-Bend Simulation

Review system placement

Propose case-lower sag area

and pre-bend shape based on

the chassis is flat.

Simulate mass effect

Mock-up

Experiment

Tooling

Fan

Power

PCI cards

Structure CAE design- Static Analysis

Pre-Bend Simulation

Statics CAE Simulation

1. The loading is 17Kgf.

2. The HDD cage torsion deformation evaluation at the fully extended

condition.

Load = 17 Kgf

Reaction Deformation Motion during Shock

Test

• Back-plate metal could have displacement

Displace

Shock on the bottom

Reaction Deformation Motion during Shock

Test

• L10 Level Shock Simulation

• ABNORMAL NOISE ANALYSIS (INTERNAL VIBRATION)• FAN SPEED 16000 RPM = 266 HZ

Structure CAE design- Modal

Fan rotating frequency very

simulate to PCB’s resonance

frequency => Fix PCB to solve

it

Structure CAE design- Shock

Square Wave

This area will deform very seriously cause

PSU follow the response. Need to improve

the cutting section stiffness.

• SHOCK CAUSES PSU BRACKET DEFORMED• ENHANCE SIDE CHASSIS CASE STRENGTH

The same deformation location

between CAE and experiment

Structure CAE design- Shock

• HDD CAGE SHOCK DEFORMATION EVALUATION BEFORE TOOLING

• HALF-SINE 2MS 71G (REF. SPECIFICATION)

Too weak and easy to bendThese corners need remove the cut

VIBRATION - EM SHAKER

--- King Design KD-9363-EM-2000F-50N200 x 2 sets• Generated force : 2000 kgf

• Frequency : 2 – 2000 Hz

• Slip table & Head expander size : 750mm x 750mm

• According to C-S-1-9711-002, C-H-1-9711-005

STRUCTURAL VALIDATION

• OP & NON-OP X,Y,Z AXIS VIBRATION TEST

Shock TesterLansmark 65-8LTT811

• 65cm*81cm

• Max acceleration 600G.

• Min/Max pulse duration :2 msec Min.

80 msec Max.

• Max velocity change :25 ft/sec (7.62 m/sec)

• Test software: TP3

⧫ All Wistron products are tested for shock capability in both operating and non-operating conditions (both Half-Sineand Square Wave)

⧫ Lansmont Free-Fall Drop Tower for Fragility Shock and Damage Boundary Test

⧫ Lansmont TP3 (Test Partner) 16-channel Analysis System for Mechanical Design Verification

⧫ 3-axes accelerometer used with CAE

corner shock

SHOCK TESTER (II)

• BRAND :LANSMONT

• MODEL :95/115-D

• SPEC.

• TABLE SIZE :95X115CM

• MAX LOAD :1134KG

• PULSE DUATION:2~60MSEC

• MAX GRMS :600GRMS

• VELOCITY :7.6M/SEC

Structural Validation _ Rack Level

• General Vibration test

PACKAGE DESIGN

PACKAGING DESIGN PROCEDURES

• STEP 1 - DEFINE THE ENVIRONMENT SPEC.

By Region…By Freight Types…


• STEP 2 - PRODUCT STRUCTURE CONDITION BY FRAGILITY ANALYSIS

• STEP 3 - PRODUCT IMPROVEMENT FEEDBACK


• STEP 4 - CUSHION MATERIAL SELECTION BY PERFORMANCE

EPE EPS Paper


• STEP 5 - PACKAGE DESIGN


• STEP 6 – TEST THE PRODUCT/PACKAGE SYSTEM

• DROP TEST _ ASTM D5276 (AMERICAN SOCIETY FOR TESTING AND MATERIALS)

• RANDOM VIBRATION TEST

• SWEEP FREQUENCY VIBRATION TEST

• INCLINE/HORIZONTAL IMPACT TEST

• SHOCK TEST

PACKAGING DESIGN

• PACKAGE DESIGN AND VALIDATION

• DESIGN BY WISTRON HEAD QUARTER

• SPECIFICATION AND SOW : ASTM D5276

• TEST CONTENTS : DROP/RANDOM VIB./SINGLE CONTAINER RESONANCE

• MANUFACTURE AT CUSTOMER & WISTRON WORLDWIDE SITE (CHINA, MEXICO, CZECH)

PLYWOOD PALLET PERFORMANCE TEST

• PLYWOOD PALLET DESIGN AND PERFORMANCE VALIDATION

• DESIGN BY WISTRON HEAD QUARTER

• SPECIFICATION AND SOW : ASTM D1185

• TEST CONTENTS : RACKING/FORKLIFT/STATIC STACKING/CORNER DROP/TINE TIPS IMPACTS ON BLOCK OR STRINGER END/TINE HELL IMPACTS ON LEAD EDGE

• MANUFACTURE AT CUSTOMER & WISTRON WORLDWIDE SITE (CHINA, MEXICO, CZECH)

PACKAGE & UN-PACKAGE DROP TESTER

King Design KD 500

Drop high from 0~100 cm

Test software: TP3

Drop surface

(1) concrete floor

(2) wood surface

(3) steel plate

King Design KD 128A

Drop high from 30~130 cm

Test software: TP3

THANK YOU.

server development introduction - mechanical system

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