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SI2 Proprietary
SI2 Technologies, Inc.
Printed Electronics and Sensors
Presented to DoD Printed Electronics Workshop
June 3-4, 2014
ISO-9001:2008 Certified Quality Management System
SI2 Technologies, Inc.
267 Boston Road
N. Billerica, MA 01862
www.si2technologies.com
Joseph M. Kunze, Ph.D.
President and CEO
Erik S. Handy, Ph.D.
Principal Scientist
2
SI2 Technologies, Inc.
• SI2 Technologies, Inc.
– Founded in 2003
– Small business in the metro-Boston area
• Design, development and manufacture of antennas, arrays, sensors and
absorbers for military air, land, sea and space applications
– RF apertures and sensors focused on SWAP-C constrained platforms
– Structural absorbers and honeycomb for aircraft applications
– Frequency Selective Surfaces (FSS) focused on flexible and conformal printed
products for radomes and sensor applications
• Contract R&D directly with multiple Government agencies
• Product revenues from multiple prime contractors
• Management and lean technical staff with diverse technical and business
backgrounds; supported by qualified vendors for specialty services and
contract manufacturing
SI2 provides responsive, innovative and affordable solutions
3
SI2’s Additive Manufacturing Techniques
• Key attributes– Digital process
– Low temperature, ambient environment
• Enables manufacture of conformal and large area flexible electronics
– Printing of electronic materials onto composites, plastics, thin films and structural materials
– No etching or vacuum operations
• Same process from prototyping to production
Micropen Dispensing for
Printing onto Curved
Surfaces
Inkjet Roll-to-Roll System for
Manufacturing on Flexible Substrates
Direct Write (aka digital printing, additive
manufacturing) is the ability to “write” or
print electronics directly onto curved and
flexible substrates from a computer file
without tooling, masks, etc.
Printed
Substrate
Drying Oven
Direct Write
Inkjet Printer
Flexible
Substrate
4
MATURE
SI2’s Digitally Printed Electronics Roadmap
Use of hybrid digital + conventional techniques
can shorten time to maturity
5
Printed Coatings and Patterns
• Direct Write (digitally
printed) inkjet coatings are
mature
– E.g., SI2 absorber products
• Ability to print on a variety of
substrates
• Ability to mix and grade ink
types
• Additional material and
process modeling needed
– Predict system performance
from large number of
materials/process variables
• Continue development of
additional inks for specific
applications and markets
Carbon printed rolls of para-
aramid and glass/phenolic
(>10 miles printed to date)
Silver - Carbon 50/50 blend on
Rogers 4350 Dielectric
Carbon - Silver
nanoparticulate Inkjet filmsSample 010510-A, 120 Limit
0
500
1000
1500
2000
2500
3000
1.00 1.20 1.40 1.60 1.80 2.00 2.20 2.40 2.60
Conductive ink to resistive ink mix ratio (unitless)
Avera
ge s
heet
resis
tan
ce (
OP
S)
Sample 010510-A, 120 Limit
Silver to carbon mix
ratio evaluation
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Conformally Printed Electronics – Helmet Sensors
Example: Blast Dosimeter integrated with military Advanced Combat Helmet– Lightweight, low-profile “hybrid” electronics (printed circuitry + conventional circuitry)
– Dosimeter detects conditions which might lead to traumatic brain injury (TBI) – pressure/accelerometry
– May also be applicable to protective gear for first-responders, athletes, etc.
Supported by DARPA
8Proprietary Use or disclosure of data contained on this sheet is subject to the restriction on title page of this document.
Low-Cost, Printable Brain Recording System
Project Tasks:
– Develop dry, printed EEG electrodes
– Demonstrate collection of research-
quality EEG data
– Demonstrate wireless relay of EEG
data to mobile device
– Demonstrate that $30 price target can
be reached
Future Business Models:
– Sale of printed EEG kits
– Web-based “foundry” (customizable
EEG kits)
– Sale of digital printers for desktop
EEG system production
Supported by DARPA
9
Summary
• SI2 is developing printed electronics per its technology roadmap– Roll-to-roll printing of electronic materials coatings and patterns
– Recent: Wearable, unobtrusive sensors (brain monitoring)
– Current: Printed, flexible power supplies (ultracapacitors)
– Future: Printed switches, memory, low-power electronics
• Identified future printed electronics industry needs
• Potential materials and process development– Scalable, high resolution 2-D printing
– Integration of 2-D and 3-D printing
– Low-T-cure metallic inks
– Conductive inks based on silver alternatives
– Printable optical materials (low loss, high k, high/tunable n)
• Potential device packaging development– Ruggedization/harsh-environment packaging