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Silicon Photonics: Advances in Foundry Capability for Next Generation Systems
July 12, 2016
GLOBALFOUNDRIES Capacity: ~7M Wafers/Yr*
2
28nm, ≤ 14nm 45nm–22nm 180nm–40nm350nm–90nm90nm–22nm
TECHNOLOGY
CAPACITY IN WAFERS/MONTH
SingaporeDresden,
Germany
Malta,
New York
East Fishkill,
New York
Burlington,
Vermont
14,000 (300mm) 60,000 (300mm)68,000 (300mm)
93,000 (200mm)Up to 60,000 (300mm) 40,000 (200mm)
*200mm Equivalents*Active in SiPh technology
3GLOBALFOUNDRIES Confidential
10/25G
Lin
e R
ate
Phase 3
90nm 90WG
SOI Monolithic Integration
Modulator (Traveling Wave MZI)
Ge Photodetector (PIN)
Phase shifter (Thermal & Hi speed)
Edge V & top grating coupling
Full optical passives offerings
CMOS RVT, LVT 3.3V I/O, prec R
BEOL Varactors, Inductors, T-lines
Full PDK enablement
200mm baseline
300mm transfer
25G updates
90nm 90WG +
Photonic design enhancements
4 channel CWDM Filter DEMUX
4 channel CWDM Filter MUX
Polarization splitter/rotator
Modulator (Traveling Wave MZI) (25Gbps)
C4 / Cu Pillar options
NRZ / PAM4
300mm baseline
200mm early learn
50G +
45nm 45WG
300mm
Leverage 45nm SOI RF platform
Monolithic or Hybrid Integration
Ge Epi PD, Dual Tsi
2.5D TSV options
NRZ / PAM4 / QAM
Phase 1 Phase 2
Monolithic Silicon Photonics Technology
• Monolithic Silicon Photonics Development
– Phases: 300mm technology, components for higher order modulation for higher performance systems
Photonics Industry
• Application drivers
– Industry shift from technology to product discussions
– Data Centers, Wired/Wireless infrastructure SMF SAM >100M units 2020
• 5G, small cell,chip-to-chip interconnect upsides
• Photonics industry barriers
– 4 competing MSAs with two competing fiber standards (PSM4, cWDM)
– Datacom segment proprietary interface standards and solutions
– Net: unit scale does not correlate to a foundry scale
• Technology Developments
– New photonic components for larger optical link budgets, higher data rates
• Monolithic photonic systems with first level OSA
• NRZ, PAM4, *QAM formats for higher data rates
• Design eco-system – PDKs for co-design and simulation
GLOBALFOUNDRIES Confidential 4
Silicon Photonics Monolithic TechnologyGLOBALFOUNDRIES technology and foundry access
Silicon Photonics Platform
•All function except light source integrated into Si foundry flow
•Question of Silicon Photonics fit into Si foundry: Demonstrated
Photonics IC
6
Ge Detectors
(Active)
Waveguides
(Passive)
Modulators
(Active)
Gratings/Couplers
(Passive)
Fiber Edge Coupler(Passive)
RFCMOS
(Active)
*Graphics: GF, IBM, IME
Monolithic integration of CMOS/ RF/MEMS control with photonicsMasks: 34 (CMOS) + (13) SiPh + 3 (packaging). NFET ft>150GHz
• >25Gbps SMF cWDM >2km reach (IBM 2015)
90nm Silicon Photonics Platform
7
Silicidation
Cu back-end wiring
FEOL CMOS FLOW
✓ Shared mask levels and modules
✓ Minimal additional photonics modules
MODULATOR
DETECTOR
FBEOL
packaging
structures
PACKAGING STRUCTURE
Source/drain
activation
Gate formation
Well
implants/activation
Shallow trench
isolation
Si Photonics 90nm/200mm Process Architecture
GLOBALFOUNDRIES Confidential 8
• Optical TX/RX on same silicon die
– Monolithic LA/TIA + photo diode, MZi, couplers
– Control – ADC/DAC, MCU,SPIE, …
– Very low interconnect parasitics and high intrinsic frequency performance – receive sensitivity
Silicon Modulator Ge Photodetector
Laser light source
external or integrated
Driver Amplifier
PHOTODETECTOR
MODULATOR
El.SignalEl.Signal
Fiber
+ CMOS Circuits
Complete Optical Link
Photo IBM
Photo IBM
+ CMOS Circuits
Driver
MODULATOR
Amplifier
PHOTODETECTOR
Si Photonics 90nm/200mm Technology
GLOBALFOUNDRIES Confidential 9
• 90nm process cross section optical and electrical integration
– Electrical and optical components in Cadence OA PDK
– 90nm RF/analog components (RF transistor layouts, precision resistors/capacitors, varactors, inductors, transmission lines, ..)
Ge detector Modulator
CMOS
Si Photonics 90nm/200mm Design Kit
GLOBALFOUNDRIES Confidential 10
• Cadence 6.1.5.507
– Co-design of electrical and optical components in a cadence PDK
– Thermal effects modeled
• Tool and model highlights
– MMSIM (spectre) 11.1.0.576/ISR17
– Calibre DRC/LVS/xRC
– Waveguide path tool
• Waveguide layout tool including bends,tapers
• Generates schematic symbol for simulation and extraction
• CAD flow of combined E/O is differentiating in the industry
MZI Modulator
Waveguide bend
Path tool Mode
converter
Traveling Wave Mach Zender 25Gb/s
GLOBALFOUNDRIES Confidential 11
MZI: Higher Order Modulation
GLOBALFOUNDRIES Confidential 12
• Segmented MZi LSB/MSB topology – PAM4 -2X higher symbol rate
• 50Gbps symbol rate with 25Gbaud line rate
– BER < 10-12 without FEC
– ER 6 dB
Fiber Alignment: V-Groove + Mode converters
GLOBALFOUNDRIES Confidential 13
• Far BEOL modular process for lateral fiber attach
– TMAH selective mask and etch
– Vertical grating couplers also available for optical input/test
RX: Receivers
GLOBALFOUNDRIES Confidential 14
• Lowest input referred noise: lowest system interconnect capacitance
– Self-biased inverter, CML stages
– Limiting amplifier: Cherry-Hooper gm-Zt 6-7 KOhm gain
– 28.5 Gbaud 400mV pk-pk extracted eye
– BER <10-12 with 58uA p-p sensitivity
– -10.8dBm OMA for 0.7A/W photodector sensitivity
Photonic Components: PDK: 10G and 25G
GLOBALFOUNDRIES Confidential 15
Key updates: WDM MUX/deMUX and PSR – wavelength and polarization diversity
Photonic
Passive
Elements
(optical only)V0.04_0.0
Aug 2016
V0.04_1.0
YE16
Device Name PCELL NameAlpha4 Alpha4.1
Straight Waveguide
(8 channel model) wgrx8 X X
90 Degree Bend
Waveguide bendrx X X
90 Degree Bend
Waveguide, (4
channel model) bendrx4 X X
90 Degree Bend
Waveguide, (8
channel model) bendrx8 X X
Linear Taper
Waveguide taperrx X X
Linear Taper
Waveguide (4
channel model) taperrx4 X X
Linear Taper
Waveguide (8
channel model) taperrx8 X X
4 channel WDM
Filter DEMUX (MZI
Lattice) wddemux4 X
4 channel WDM
Filter MUX (MZI
Lattice) wdmux4 X
Photonic
Passive
Elements
(optical only)V0.04_0.0
Aug 2016
V0.04_1.0
YE16
Device Name PCELL NameAlpha4 Alpha4.1
Polarization
splitter/rotator psr X X
Polarization Splitter
& Rotator (4
channel model) psr4 X X
Polarization Splitter
& Rotator (8
channel model) psr8 X
Waveguide
crossings in RX crossrx X X
Directional Coupler dcoupler X X
Directional Coupler
(2 input model) dcoupler2 X X
Wavelength
independent 3dB
coupler widcoupler X
Wavelength
independent 3dB
coupler (4 channel
model) widcoupler4 X
Absorber (for
waveguide
termination) absorber X X
Photonic Components: PDK: 10G and 25G
GLOBALFOUNDRIES Confidential 16
Key updates: PAM4 Modulator for 2X increase in data rates
Photonic
Electrooptic
Elements
(optical and
electrical)V0.04_0.0 Aug
2016
V0.04_1.0
YE16
Device Name PCELL NameAlpha4 Alpha4.1
Modulator
(Traveling Wave
MZI) (10Gbps) modulator10 X X
PAM4 Modulator modpam4 X
Ring Modulator modring
Ge
Photodetector
(PIN) detector X X
Dual Ge
Photodetector
(PIN) dualdet X X
Si PIN (3 in 1) sipin X
Phase shifter
(Thermal) phasetherm X X
Phase shifter
(High speed,
reverse biased
PN diode) phasepn X X
Photonic
Packaging and
Inline Test
(optical only)V0.04_0.0
Aug 2016
V0.04_1.0
YE16
Device Name PCELL NameAlpha4 Alpha4.1
Modulator (Traveling
Wave MZI)
(10Gbps) modulator10 X X
Vertical grating
incoupler (PC only) iograt X X
Ideal IR light source irsource X X
In-line optical
power/phase meter irmeter X X
In-line optical
power/phase meter
(4 channel) irmeter4 X X
In-line optical
power/phase meter
(8 channel) irmeter8 X X
Reference Design4x25 Gbaud cWDM 100Gbps monolithic solution
Si Photonics 90nm/200mm Technology
GLOBALFOUNDRIES Confidential 18
• 100G (25G 4l cWDM) integrated optical transceiver in 90nm nano-photonic process
– 1291-1311nm, self aligned fiber coupling to the chip
• Power budget per lane: 110mW RX, 135mW TX, 100mW heaters
WDM DeMUX’s
Receiver TIA + LA Circuits
Self-aligned fiber coupling
WDM MUX
Polarization management
Modulators
Input of external lasers
Transmitter Circuits1291nm
1331nm1271nm1311nm
IBM 100G Tx/Rx
25Gx4λ
Si Photonics 90nm/200mm Prototype Results
GLOBALFOUNDRIES Confidential 19
• 100G (25G x 4l cWDM) integrated electro-optical transceiver
– O-band 1260-1355um,RX = -10.8dB OMA (25Gbps BER<10-12)
– TX = VL=1.61Vcm, MZI loss = 7.2dB/cm, FOM=12 VdB
Summary
GLOBALFOUNDRIES Confidential 20
• Silicon photonic industry shift from technology to product discussions
– Data Centers, Wired/Wireless infrastructure drive adoption
• GLOBALFOUNDRIES integrated technology and IP ecosystem
– 90nm monolithic RFCMOS + silicon photonics + fiber coupling
– Full Cadence PDK for E/O co-design, polarization, temperature, and wavelength parametrics
– Demonstrated: integrated 25 Gbaud 100Gbit cWDM O-band
• Developments for next generation higher data-rate systems
– Specialized components for higher order modulation (PAM4, 16/64QAM)
– Optimized components for polarization and wavelength diversity
– Product Design Kit: co-design of electrical and photonic components
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