sinec concept and implementation

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Sensors and Actuators A, 25-27 (1991) 125-128 Sinec Concept and Implementation K BECKER Commumcatron and Marketmg, D-8905 Mermg (F R G ) E FLASCHKA Siemens AC, Semiconductor Group, D-8000 Munich 80 (F R G) 125 Abstract The state of development of the Smec concept 1s presented here Smec 1s to become an industrial standard m mdustnal commum- cation This concept includes solutions for the serial bus level as well as the process control level Most Important for the user, however, 1s that the mdlvldual user programs have transparent access to the bus transport sys- tem (Profibus, ethernet) used Transparent here means that the transport 1s not hnked to the apphcatlon Both Smec L2 (Profibus) and Smec Hl (ethernet) are included m this concept The development of bus systems for the mdlvldual hlerarchlcal system layers IS now qmte well advanced In particular, ‘open’ interface solutions will gain an increasing market share, because only an open commu- mcatlon offers the flexlblhty to exchange the eqmpment or the components used for mod- els from different manufacturers Ths 1s a very important prerequisite for productlon technology The best descnptlon of the struc- ture and functlonmg of an open sensor mter- face 1s given by the reduced OS1 (open system interconnection) reference structure The term transport system refers to layers l-4 of the OS1 reference model The Profibus 1ssuch a standardized transport system (DIN 19245, Part 1) for layers l-2 Smec Hl uses the ethernet method (IEEE 802 3) for layers 1-2, which has been tned and tested m a lot of mdustnal apphcatlons In addition, mter- national standards are used for layers 3-4 Smec AP 1s a protocol for layers 5-7, which offers a user-configurable interface for open and transparent commumcatlon It sup- ports Smec L2 and Smec Hl Some examples of apphcatlons that have been implemented are gven 1. The Sinec Concept The central issue of this concept 1s the reahzatlon of open commumcatlon between the vanous automation umts These systems can be, for example, DEC, HP or VME bus systems or systems hke Slcomp, Smumenk, or Snnatic* The transport resources for Smec are Smec Hl, Smec H2B and Smec L2 Smec Hl 1s an ethernet network wth m- tematlonal standards for layers l-4 (Table 1) Smec H2 1s a MAP-compatible network for layers 1-4 Smec L2 1s a fieldbus based on a national German draft standard (DIN V 19245) Slnec AP and TF Smec AP (automation protocol) and Smec TF (technologcal functions) are lmplementa- tlons for layers 5-7 Users have a homo- geneous functional interface through Smec TF The portatlon of the apphcatlon software 1seasy AP and TF realize a Slemens internal *Bcomp, Smumenk and Slmatlc are trademarks of Slemens AG Elsevler Sequola/Pnnted m The Netherlands

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Sensors and Actuators A, 25-27 (1991) 125-128

Sinec Concept and Implementation

K BECKER

Commumcatron and Marketmg, D-8905 Mermg (F R G )

E FLASCHKA

Siemens AC, Semiconductor Group, D-8000 Munich 80 (F R G)

125

Abstract

The state of development of the Smec concept 1s presented here Smec 1s to become an industrial standard m mdustnal commum- cation

This concept includes solutions for the serial bus level as well as the process control level Most Important for the user, however, 1s that the mdlvldual user programs have transparent access to the bus transport sys- tem (Profibus, ethernet) used Transparent here means that the transport 1s not hnked to the apphcatlon Both Smec L2 (Profibus) and Smec Hl (ethernet) are included m this concept

The development of bus systems for the mdlvldual hlerarchlcal system layers IS now qmte well advanced In particular, ‘open’ interface solutions will gain an increasing market share, because only an open commu- mcatlon offers the flexlblhty to exchange the eqmpment or the components used for mod- els from different manufacturers Ths 1s a very important prerequisite for productlon technology The best descnptlon of the struc- ture and functlonmg of an open sensor mter- face 1s given by the reduced OS1 (open system interconnection) reference structure

The term transport system refers to layers l-4 of the OS1 reference model The Profibus 1s such a standardized transport system (DIN 19245, Part 1) for layers l-2 Smec Hl uses the ethernet method (IEEE 802 3) for layers 1-2, which has been tned and tested m a lot of mdustnal apphcatlons In addition, mter- national standards are used for layers 3-4

Smec AP 1s a protocol for layers 5-7, which offers a user-configurable interface for open and transparent commumcatlon It sup- ports Smec L2 and Smec Hl

Some examples of apphcatlons that have been implemented are gven

1. The Sinec Concept

The central issue of this concept 1s the reahzatlon of open commumcatlon between the vanous automation umts These systems can be, for example, DEC, HP or VME bus systems or systems hke Slcomp, Smumenk, or Snnatic*

The transport resources for Smec are Smec Hl, Smec H2B and Smec L2

Smec Hl 1s an ethernet network wth m- tematlonal standards for layers l-4 (Table 1)

Smec H2 1s a MAP-compatible network for layers 1-4

Smec L2 1s a fieldbus based on a national German draft standard (DIN V 19245)

Slnec AP and TF Smec AP (automation protocol) and Smec

TF (technologcal functions) are lmplementa- tlons for layers 5-7 Users have a homo- geneous functional interface through Smec TF The portatlon of the apphcatlon software 1s easy AP and TF realize a Slemens internal

*Bcomp, Smumenk and Slmatlc are trademarks of Slemens AG

Elsevler Sequola/Pnnted m The Netherlands

126

TABLE 1 Companson of OS1 model and various networks and transport systems

OS1 model Smec Hl

I

Apphcatlon

6

Presentation

5

Session

4

Transport

3

Network

2

Data hnk

Ethernet

IEEE 802 3

1 Physlcal IEEE 802 3 IEEE 802 4 DIN V 19245 Tl

L

Smec H2 Smec L2

I Smec TF I I Smec AP I I I I I

I I

I I

I IS0 transport

; (IS0 IS 8072, 8073)

Class 4

I IS0 network ’ I (IS0 IS 8473)

Inactive layer

;

Token Bus

IEEE 802 4

Profibus

DIN V 19245 Tl

standard, due to the requests of customers, the protocols are opened for users and the nugratlon path has gone to international standards hke MMS (manufacturing message speaficatlon) TF 1s an Implementation of most MMS services The user has to note that the mterface of TF 1s a functlon-compat- able not a command-compatible interface to MMS Therefore, the portability of MMS apphcatlons to TF 1s complex The user mter- face depends on the actual operatmg system, such as UNIX and so on Neither MMS nor TF defines a C Interface, but this 1s necessary for portable appllcatlons

2. Realizations

Slnec Hl Module (CP 1470) This module allows umversal application

MAP

IS0 MMS/FTAM

IS0 ACSE

IS0 ASN 1

(IS0 8822-25)

IS0 session

(IS0 8326-27)

connectlon onented

IS0 transport

(IS0 IS 8072, 8073)

Class 4

IS0 network

(IS0 IS 8473)

Token Bus

IEEE 802 4

IEEE 802 4

by other parallel bus systems hke Multlbus I, II* or VME bus (Fig 1)

The features of CP 1470 include

integrated commumcatlon board with lay- ers l-4 and Smec AP on board,

universal Interface to parallel bus formed as DPRAM, reduced load of the parallel bus, modularity, conformance tested for layers l-4 and AP, high commumcatlon performance, microprocessor wth high efficiency, format of 2334mm x 114mm

The structure of the Smec HI module 1s shown m Fig 2

Only with mternatlonal standards IS it pos- sible to do an open commumcatlon between

*Multlbus IS a trademark of Intel Corporation

127

user 1 to n

I I

SINEC SINEC

TF TP

bus r~stcmr Lskc Mulubus I,11 VME-Bus

t

___)___ SINEC HI

Fig 1 Smec Hl Module (CP1470) lmk to bus systems

Ethernet Controller

Ethernet Serral Interface

Fig 2 Structure of the Smec Hl module

heterogeneous systems The network systems services like ISDN, X 25 The new metropohtan are no longer the bottleneck m mdustnal area network named FDDI (fibre dlstnbuted commumcatlon With gateways or routers, it 1s data interface) will increase the transport possible to interconnect them with telecom performance of the backbone network

128

Micro system and sensor designers will Bibliography have to consider the mterconnectlon of sen- sors and actuators with fieldbus systems m the future The Physlcal and Techmcal Instl- tute, Jena, together with the Fachhochschule Landshut have the task of defining a homo- geneous interface to interconnect sensors and actuators Through open commumcatlon it IS possible to reach the upper levels, hke the management level Without this posslblhty, automation IS limited

Smec CP 1470, short descnptlon Smec AP, manual Smec W, manual K Becker, Der DIN-Feldbus rn der Fertqpngstechmk, AMBS-Report lo/1987 K Becker, LAN m der Jlexrblen Fertrgung, Siemens Components, 3/1988 Slemens AG, Schule fur Mlkroelektromk, Kursunter- lagen Industrlelle Netzwerke E Morgan, Through MAP TOP to CIM, dtl 1988 DIN IS0 7498, OS1 reference model