sipmos® power transistor
TRANSCRIPT
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SPD 09N05
SIPMOS PowerTransistor
Product SummaryDrain source voltage 55VDS V
Drain-Source on-state resistance 0.1RDS(on)
IDContinuous drain current 9.2 A
Features
N channel
Enhancement mode
Avalanche rated
dv/dt rated
175C operating temperature
Pin1 Pin2 Pin3
G D S
PackagingType Package Ordering Code
SPD09N05 Tape and ReelP-TO252 Q67040-S4136
SPU09N05 TubeQ67040-S4130-A2P-TO251
MaximumRatings , at Tj = 25 C, unless otherwise specified
Parameter Symbol UnitValue
Continuous drain current
TC = 25 C
TC = 100 C
9.2
6.5
ID A
Pulsed drain current
TC = 25 C
IDpulse 37
Avalanche energy, single pulse
ID = 9.2 A, VDD = 25 V, RGS = 25
mJEAS 35
Avalanche energy, periodic limited by Tjmax 2.4EAR
Reverse diode dv/dt
IS = 9.2 A, VDS = 40 V, di/dt= 200 A/s
dv/dt 6 kV/s
Gate source voltage VGS 20 V
Power dissipation
TC = 25 C
Ptot 24 W
Operating and storage temperature Tj , Tstg C-55... +175
55/175/56IEC climatic category; DIN IEC 68-1
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SPD 09N05
Thermal Characteristics
Parameter ValuesSymbol Unittyp. max.min.
Characteristics
RthJC - - 6.25 K/WThermal resistance, junction - case
-Thermal resistance, junction - ambient, leded RthJA - 100
-
-
-
-
75
50
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area1)
RthJA
Electrical Characteristics, at Tj = 25 C, unless otherwise specified
Parameter Symbol UnitValues
min. max.typ.
Static Characteristics
Drain- source breakdown voltage
VGS = 0 V, ID = 0.25 mA
-V(BR)DSS 55 - V
Gate threshold voltage, VGS = VDS
ID = 10 A
VGS(th) 432.1
Zero gate voltage drain current
VDS = 50 V, VGS = 0 V, Tj = 25 C
VDS = 50 V, VGS = 0 V, Tj = 150 C
-
-
IDSS A
1
100
0.1
-
Gate-source leakage current
VGS = 20 V, VDS = 0 V
IGSS - 10 nA100
Drain-Source on-state resistance
VGS = 10 V, ID = 6.5 A
RDS(on)
- 0.093 0.1
1 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70m thick) copper area for drainconnection. PCB is vertical without blown air.
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SPD 09N05
Electrical Characteristics, at Tj = 25 C, unless otherwise specified
Parameter Symbol Values Unitmin. typ. max.
Dynamic Characteristics
Transconductance
VDS2*ID*RDS(on)max , ID = 6.5 A
gfs 3 4.5 - S
Input capacitance
VGS = 0 V, VDS = 25 V, f= 1 MHz
Ciss - 215 270 pF
Output capacitance
VGS = 0 V, VDS = 25 V, f= 1 MHz
Coss - 75 95
Reverse transfer capacitance
VGS = 0 V, VDS = 25 V, f= 1 MHz
Crss - 45 60
Turn-on delay time
VDD = 30 V, VGS = 10 V, ID = 9.2 A,
RG = 50
td(on) - 15 25 ns
Rise time
VDD = 30 V, VGS = 10 V, ID = 9.2 A,RG = 50
tr - 20 30
Turn-off delay time
VDD = 30 V, VGS = 10 V, ID = 9.2 A,
RG = 50
td(off) - 30 45
Fall time
VDD = 30 V, VGS = 10 V, ID = 9.2 A,
RG = 50
tf - 25 40
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SPD 09N05
Electrical Characteristics, at Tj = 25 C, unless otherwise specified
Parameter Symbol Values Unitmin. typ. max.
Dynamic Characteristics
Gate to source charge
VDD = 40 V, ID = 9.2 A
2 nC1.3Qgs -
- 3.5QgdGate to drain charge
VDD = 40 V, ID = 9.2 A
5.25
Gate charge total
VDD = 40 V, ID = 9.2 A, VGS = 0 to 10 V
- 7 11Qg
Gate plateau voltage
VDD = 40 V, ID = 9.2 A
V(plateau) 5.9 - V-
Reverse Diode
Inverse diode continuous forward current
TC = 25 C
IS - - 9.2 A
Inverse diode direct current,pulsed
TC = 25 C
ISM - - 37
Inverse diode forward voltage
VGS = 0 V, IF = 18.5 A
VSD - 1.05 V1.8
Reverse recovery time
VR = 30 V, IF=IS , diF/dt= 100 A/s
trr - 50 ns75
Reverse recovery charge
VR = 30 V, IF=lS , diF/dt= 100 A/s
Qrr - C0.085 0.13
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SPD 09N05
Power Dissipation
Ptot = f(TC)
0 20 40 60 80 100 120 140 160 C 190
TC
0
2
4
6
8
10
12
14
16
18
20
22
W
26SPD09N05
Ptot
Drain current
ID = f(TC)parameter: VGS 10 V
0 20 40 60 80 100 120 140 160 C 190
TC
0
1
2
3
4
5
6
7
8
9
A
11
SPD09N05
ID
Transient thermal impedance
ZthJC = f(tp)
parameter : D= tp/T
10-7
10-6
10-5
10-4
10-3
10-2
100
s
-310
-210
-110
010
110
K/W
SPD09N05
ZthJC
single pulse
0.01
0.02
0.05
0.10
0.20
D = 0.50
Safe operating area
ID = f(VDS)
parameter : D= 0 , TC = 25 C
10-1
100
101
102
V
-110
010
110
210
A
SPD09N05
ID
RDS(on)
=VDS
/ID
DC
10 ms
1 ms
100 s
10 s
tp = 2.5s
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SPD 09N05
Typ. output characteristics
ID = f(VDS)parameter: tp = 80 s
0.0 1.0 2.0 3.0 4.0 V 5.5
VDS
0
2
4
6
8
10
12
14
16
18
20
A
24
SPD09N05
ID
VGS [V]
a
a 4.0
b
b 4.5
c
c 5.0
d
d 5.5
e
e 6.0
f
f 6.5
g g 7.0
h
h 7.5
i
i 8.0
j
j 9.0
k
k 10.0
l
Ptot = 24W
l 20.0
Typ. drain-source-on-resistance
RDS(on) = f(ID)
parameter: VGS
0 2 4 6 8 10 12 14 16 A 19
ID
0.00
0.04
0.08
0.12
0.16
0.20
0.24
0.32
SPD09N05
RDS(on)
VGS [V] =
c
c5.0
d
d5.5
e
e6.0
f
f6.5
g
g7.0
h
h7.5
i
i8.0
j
j9.0
k
k10.0
l
l20.0
Typ. transfer characteristicsID= f(VGS)
parameter: tp = 80 s
VDS 2 x ID x RDS(on) max
0 1 2 3 4 5 6 7 8 V 100
5
10
15
20
A
30
ID
Typ. forward transconductance
gfs = f(ID);Tj = 25C
parameter: gfs
0 2 4 6 8 10 12 14 16 A 200
1
2
3
4
S
6
gfs
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SPD 09N05
Drain-source on-resistance
RDS(on) = f(Tj)
parameter : ID = 6.5 A, VGS = 10 V
-60 -20 20 60 100 140 C 200
Tj
0.00
0.04
0.08
0.12
0.16
0.20
0.24
0.28
0.34
SPD09N05
RDS(on)
typ98%
Gate threshold voltage
VGS(th) = f(Tj)parameter : VGS = VDS, ID = 10 A
-60 -20 20 60 100 140 V 200
Tj
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
4.0
4.4
V
5.0
VGS(th)
min
typ
max
Typ. capacitances
C = f(VDS)
parameter: VGS = 0 V, f= 1 MHz
0 5 10 15 20 25 30 V 40
110
210
310
pF
C
Ciss
Coss
Crss
Forward characteristics of reverse diode
IF = f(VSD)
parameter: Tj , tp= 80 s
0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0
-110
010
110
210
A
SPD09N05
IF
Tj = 25 C typ
Tj = 25 C (98%)
Tj = 175 C typ
Tj = 175 C (98%)
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SPD 09N05
Typ. gate charge
VGS = f(QGate)parameter: ID puls = 9.2 A
0 2 4 6 8 nC 11
QGate
0
2
4
6
8
10
12
V
16
SPD09N05
VGS
DS maxV0,8
DS maxV0,2
Avalanche EnergyEAS = f(Tj)
parameter: ID = 9.2 A, VDD = 25 VRGS = 25
20 40 60 80 100 120 140 C 180
Tj
0
5
10
15
20
25
30
mJ
40
EAS
Drain-source breakdown voltage
V(BR)DSS = f(Tj)
-60 -20 20 60 100 140 C 20050
52
54
56
58
60
62
64
V
66
SPD09N05
V(BR)D
SS
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