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SINGULUS TECHNOLOGIESNovember, 2007
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SMART SOLUTIONS TO DRIVE THE FUTURE
SINGULUS: your guide for the high definition future
Blu-ray Disc SL/DLStephan HotzStephan Hotz
SINGULUS TECHNOLOGIES AG
SINGULUS TECHNOLOGIESNovember, 2007
- 2 -Agenda
-1- Blu-ray Disc
-2- BD SL
-3- BD DL
SINGULUS TECHNOLOGIESNovember, 2007
- 3 -
CROSS INDUSTRY PLATFORM170+ BDA membership
MotionPicture
CE Industry PC IndustryMusicIndustry
MGM
FOX
Media IndustryGame Industry
Warner
SINGULUS TECHNOLOGIESNovember, 2007
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Projected HD-DVD/Blu-ray Disc Supply
1769,52000Disc Output (Million Units)
1211,61500
142 4361,5
689
500
1000
36,7142,4
02006 2007 2008 2009 2010 2011
Blu-ray*29,3 121,8 333 642 1170 1737,5
HD-DVD Video7,4 20,6 28,5 47 41,6 32
* Includes ROM, Video & PS3
©2007 Understanding & Solutions Ltd.
All rights reserved
SINGULUS TECHNOLOGIESNovember, 2007
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Total High Definition Video Sales Forecasts
887,41000(Million Units)
523,9
887,4
600
800
233,1
200
400
600
0,89 11 75,9
0
200
2006 2007 2008 2009 2010 2011Total Blu-rayTitle Sales 0,36 7,7 61,3 205 498 867,1
Total HD-DVDTitle Sales 0 53 3 3 14 6 28 1 25 9 20 30,53 3,3 14,6 28,1 25,9 20,3
©2007 Understanding & Solutions Ltd.
All rights reserved
SINGULUS TECHNOLOGIESNovember, 2007
- 6 -Top Ten Title Sales USA YTD*
SINGULUS TECHNOLOGIESNovember, 2007
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Sony
Many Blu-ray players available
SonyBDP-S1€ 748,-BDP-S300€ 417,-
PhilipsBDP7100€ 439,-
BDP-S500€ 713,-
SamsungBD-P1400
LGBH-100 BD / HD DVD€ 1.149,-
€ 444,-BD-P1000€ 399,- Denon
DVD-3800BD€ ???
Sony PS3 80GB€ 399,-Sony PS3 40GB€ 269,-
PanasonicDMP-BD 10€ 489,-DMP-BD30€ 335
€ ???,-DVD-2500BTC€ ???,-
SharpBD HDW20
PioneerBDP-H1€ 1 500
€ 335,- BD-HDW20€ ???,-BD-HP20S€ 417,-
€ 1.500,-BDP-LX70€ 1.399,-
LoeweBluTech Vision€ ???,-
SINGULUS TECHNOLOGIESNovember, 2007
- 8 -Blu-ray / HD DVD Retail Prices
SINGULUS TECHNOLOGIESNovember, 2007
- 9 -BD Disc Industry in Production NOW!
MasteringMasteringFormattingFormattingAuthoringAuthoring ReplicationReplication
InspectionInspection
BCABCASony PicturesSonic Solutions
SINGULUSDCAECLIPSE
SINGULUS SINGULUS
AudioDev DATARIUSDATARIUS Dr. SchenckDr. ShwabBaslerETA-Optik
Tools and equipment available for ReplicatorsTools and equipment available for Replicators
pPulstec IndustrialShibaSoku
* This list is just an example and does not represent the entire industry
SINGULUS TECHNOLOGIESNovember, 2007
- 10 -Agenda
-1- Blu-ray Disc
-2- BD SL
-3- BD DL
SINGULUS TECHNOLOGIESNovember, 2007
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BLU-LINE Liquid Resin Technology
SINGULUS TECHNOLOGIESNovember, 2007
- 12 -Milestones BLU-LINE
2004: Cooperation with SONY for BD 25 Film Technology
February 2005: First BLU-LINEs BD 25 Film- and Spin-Technology
April 2005: First playable BD 25
October 2005: Start of delivery first BLU-LINEs BD 25 to customers
March 2006: World premiere of BLU-LINE
Summer 2006 Installed BLU-LINEs dominant at Customer site
2007 First year of Blu-ray Disc Mass Production with Singulus Equipment
March 2007: Start of cooperation with Sony DADC for Embossing Technology
May 2007: Startup embossing process BD 50 in KahlMay 2007: Startup embossing process BD 50 in Kahl
SINGULUS TECHNOLOGIESNovember, 2007
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BLULINE Installed Base World Wide
USA EastUSA East5 BLULINE
USA West1 BLULINE
France1 BLULINE
Macao1 BLULINE
SINGULUS TECHNOLOGIESNovember, 2007
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Replication Process Steps
Molding of the Substrate
•High demand for pit replication precision
•Smaller tolerances of tilt and deviation as for DVD✤•No optical requirements to the substrate like:
- Transparency- Birefringence✣ Birefringence✣
Disc Quality Triangle at DVD
Optical properties O ti O ti P i t
Disc Quality Line at BD
Optical propertiesBirefringence Optimum Operation Point
Mechanical propertiesTilt
Signal QualityPit Replication
Mechanical propertiesTilt
Signal QualityPit Replication
Tilt Pit Replication
SINGULUS TECHNOLOGIESNovember, 2007
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Replication Process Steps
Metallizing of the Substrate by Sputtering
Possible Metals: • Silver Alloy (preference)
Al i• Aluminum
Layer thickness approx. 35 nm
Similar to DVD✣✣
SINGULUS TECHNOLOGIESNovember, 2007
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Replication Process Steps
Applying of Cover LayerApplying of Cover Layer
Hard coat layer
S ifi ti f l Thi k 100 3 i l di h d t
Common technology for the cover layer application is the
Specification for cover layer: Thickness 100µm ± 3µm including hard coat
Common technology for the cover layer application is theliquid resin spin coating technology
It is general sense that a BD-disc requires a more scratch resistantread side surface than a DVD or CD.
As a result, an additional hard coat shall be applied for surface protection.
SINGULUS TECHNOLOGIESNovember, 2007
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Cover Layer Profile100µm one-step-coating
Cover-LayerCover-LayerPrometeus
Cover-LayerPromete sPrometeus
Cover-Layer
Cover-LayerETA-RT
vs ReferencePrometeus
SINGULUS TECHNOLOGIESNovember, 2007
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Current Results @ BLU–LINE
• BD ROM SL • Cycle time 3.9s
• Yield > 85%• Cover-Layer < ± 2µm
• Ski-Jump < 40µmp µ
SINGULUS TECHNOLOGIESNovember, 2007
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Current Results @ BLU–LINEin Production, USA
• BD ROM SL•Cycle time 3.9s
• Yield > 85%• Cover-Layer < ± 2µm
• Ski-Jump < 40µmp µ
SINGULUS TECHNOLOGIESNovember, 2007
- 20 -Agenda
-1- Blu-ray Disc
-2- BD SL
-3- BD DL
SINGULUS TECHNOLOGIESNovember, 2007
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Dual Layer Technology
Dual Layer BD-Disc Structure
Molded Substrate 1 1mm ThicknessMolded Substrate 1.1mm Thickness Reflecting Layer L0 approx. 40nm Ag ThicknessSpacer-Layer 25µm ThicknessReflecting Layer L1 approx. 15nm Ag ThicknessCover Layer 75µm Thickness incl Protective Coating
2 M h d f ibl
Cover Layer 75µm Thickness incl. Protective Coating
2 Methods are feasible:
• Imprinting Pit Structure into the 25 µm Lacquered Spacer-LayerImprinting Pit Structure into the 25 µm Lacquered Spacer Layerwith the Wet-Embossing Process
• Plastic Stamper 2P Process (Polycarbonate, PMMA or Olefin as a Plastic Stamper Material)or Olefin as a Plastic Stamper Material)
SINGULUS TECHNOLOGIESNovember, 2007
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Dual Layer Technology Embossing Process
Embossing Processes (Metal Stamper)
Molding of Substrate L0
Metallizing L0
Lacquering L0 with 22µm base-resin
UV-curingUV-curing
Imprinting of Pit Structure from Metal Stamper
Lacquering L0 with 3µm pit-transfer-resin
S ti f M t l St
Imprinting of Pit Structure from Metal Stamper
UV-curing
Separation of Metal Stamper
Metallizing L1
Application of 75µm Cover Layer & Hard Coat
SINGULUS TECHNOLOGIESNovember, 2007
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SONY Announcement
Press ReleaseSony DADC Announces Production Technology Initiative for Blu-raySony DADC Announces Production Technology Initiative for Blu ray Disc Dual Layer
Hanau, February 16, 2007 - Sony DADC today announced that it will start an initiative for a production technology alliance for Blu ray Disc dual layerinitiative for a production technology alliance for Blu-ray Disc dual layer.Detailed information will be presented at the European MEDIA-TECH Showcase & Conference 2007 in Barcelona, Spain, at the Congress Center of Hotel Rey Juan Carlos I.
The presentation will start at March 6, 2007, at 5.30 pm in Room "Sala F" and will introduce the partners of the coming production technology alliance. Sony DADC will also present its latest Blu-ray roadshowwill also present its latest Blu-ray roadshow.
SINGULUS TECHNOLOGIESNovember, 2007
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1. Wet Embossing process steps
Embossing Chamber
1. Start
L1 StamperEmbossing Head
Embossing Table Quartz Glas PlateSilicon Mat
Molded Substrate(1.1 mm thick),
L0 Reflecting Layer (35 nm Silver Alloy), Spacer Layer (22 µm
Plastic Center Pin Base Resin, 3 µm Pit Transfer Resin)
UV-Lamp
SINGULUS TECHNOLOGIESNovember, 2007
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1. Wet Embossing process steps
2. Closing Process Chamber and evacuating
Embossing Chamber
Embossing Table Quartz Glas PlateSilicon Mat
BD50 discL1 Stamper
Embossing Head
Plastic Center Pin
UV-Lamp
SINGULUS TECHNOLOGIESNovember, 2007
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1. Wet Embossing process steps
3. Embossing L1 pits in 3 µm, wet and UV-curable resin
Embossing Chamber
Embossing Table Quartz Glas PlateSilicon Mat
BD50 disc L1 StamperEmbossing Head
Plastic Center Pin
UV-Lamp
SINGULUS TECHNOLOGIESNovember, 2007
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1. Wet Embossing process steps
4. Venting by Nitrogen and curing by UV light
Embossing Chamber
Embossing Table Quartz Glas PlateSilicon Mat
BD50 disc L1 StamperEmbossing Head
Plastic Center Pin
UV-Lamp
SINGULUS TECHNOLOGIESNovember, 2007
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1. Wet Embossing process steps
5. Embossing Head drives up, disc and stamper are separted
Embossing Chamber
Embossing Table Quartz Glas PlateSilicon Mat
BD50 discL1 Stamper
Embossing Head
Plastic Center Pin
UV-Lamp
SINGULUS TECHNOLOGIESNovember, 2007
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1. Wet Embossing process steps
Embossing Chamber
6. Opening Process Chamber
L1 Stamper
Embossing Head
Embossing Chamber
Embossing Table Quartz Glas PlateSilicon Mat
BD50 disc
Plastic Center Pin
UV-Lamp
SINGULUS TECHNOLOGIESNovember, 2007
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2. Wet-Embossing Mechanical setup
Model of Wet Embossing Process UnitModel of Wet Embossing Process Unit
SINGULUS TECHNOLOGIESNovember, 2007
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2. Wet-Embossing Mechanical setup
M d l f W t E b i U itModel of Wet Embossing Unit: Opening mechanism for stamper exchange
SINGULUS TECHNOLOGIESNovember, 2007
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3. Wet-Embossing Cycle time
No. 1 2 3 4 5 6 7 8
Disc transport Closing Pumping process Pressing UV Release and
Cycle time Process and handling
steps
transport by
indexing table
Closing process chamber
chamber down to approx. 1 mbar and approach
between stamper and disc
Pressing stamper on disc
lamp On
delay
UV lamp ON opening process chamber
N2 valve closed N2 valve open N2 valve closed
Current BD DL Production
(of format/process developer)
1,60 1,50 0,25
1,40
0,45 5,900,60 1,50
Singulus 0 30Singulus(target for
BLU LINE DL 2007)0,30 0,40 0,80 0,20
0,300,70 4,50
0,60 1,50
Singulus (next target for BLU LINE DL)
0,20 0,30 0,60 0,150,30
0,65 3,000,30 0,80
SINGULUS TECHNOLOGIESNovember, 2007
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3. Cycle Time
Base Resin (BR) and Pit Transfer Resin (PTR) process times CL Process
Step Process Time [sec]
1 BR dosing 3 9
Step Process Time [sec]
1 CL dosing 6.01 BR dosing 3.9
2 BR spinning off with IR lamp 4.0
3 Xenon UV lamp for ski jump on BR 2.6
4 PTR dosing 3.3
5 PTR i i ff 3 3
2 CL spinning off with IR lamp 3.8
3 Xenon UV lamp for ski jump on CL 1.4
4 CL spinning off 0.1
5 UV curing 2.05 PTR spinning off 3.3
6 PTR centre curing 2.0
7 Embossing 3.7
5 UV curing 2.0
All process times for BR, PTR and CL are ready for cycle time < 4.0 sec.
SINGULUS TECHNOLOGIESNovember, 2007
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4. Process results
Base ResinAlmost flat BR layer up to r = 58.8 mm (upward peak would influences BR and PTR uniformity after(upward peak would influences BR and PTR uniformity after embossing)
P fil f PCSurface profile
Profile of PC surface
with BR
SINGULUS TECHNOLOGIESNovember, 2007
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4. Process results
Thickness of BR and PTR after embossing
Improved thickness variation and bubble-free outer edge by preventing an increase of BR atouter edge by preventing an increase of BR at the outer edge and optimized PTR thickness
±4 µm ±1,5 µm
SINGULUS TECHNOLOGIESNovember, 2007
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4. Process results
Inline scanner results by Dr. Schwab
Total (TS0) 100 ± 2.5 µm Each coating process needs further opti-mization, however
CL (TS1) 75 ± 2 5 µmSL 25 ± 1 5 µm
uniformity of all layers is o.k. so far.
CL (TS1) 75 ± 2.5 µmSL 25 ± 1.5 µm
SINGULUS target:
± 1.0 µm for each layer
± 2.0 µm for TS0
SINGULUS TECHNOLOGIESNovember, 2007
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4. Process results
• Spacer-Layer uniformity2µm + 23µm < ± 1µm
• Cover-Layer uniformity75 < ± 275µm < ± 2µm
• Local Defects < 180µm
SINGULUS TECHNOLOGIESNovember, 2007
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4. Process results
Replication
Replication measured pby AFM is very good:
SINGULUS TECHNOLOGIESNovember, 2007
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4. Process results
Radial Run Out
Results: RRO = 20 µm … 70 µm (specification: < 75 µm)(specification: < 75 µm)
Further improvements: - Improved tool for stamper exchangep p g- It will be necessary for very good RRO to install the stamper in an optimized orientation relative to the pembossing head
SINGULUS TECHNOLOGIESNovember, 2007
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4. Process results
AudioDev B600 BDR Pro: Jitter
Reference Disc SINGULUS
Only leading and trailing jitter of L0 is a little bit above specification limit of 6.5 %.specification limit of 6.5 %.
SINGULUS TECHNOLOGIESNovember, 2007
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BLULINE II
SINGULUS TECHNOLOGIESNovember, 2007
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Design
SINGULUS TECHNOLOGIESNovember, 2007
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Design
SINGULUS TECHNOLOGIESNovember, 2007
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Design
SINGULUS TECHNOLOGIESNovember, 2007
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Size Comparison BLU-LINE I vs BLULINE II
Lenght 6.6mWidth 4.9m Lenght 3.2m
Width 3.6m
SINGULUS TECHNOLOGIESNovember, 2007
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Material flow BLULINE II SL
SINGULUS TECHNOLOGIESNovember, 2007
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BLULINE II DL Material Flow
SINGULUS TECHNOLOGIESNovember, 2007
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Production Methods for BD DL
Requirement for spin coated layer +- 1µm
• 22µm base-resin• 3µm pit-transfer-resinµ p• 72µm cover-layer• 3µm hard-coat-resin
Requirement for the BLULINE DL
• Controlled temperature in production cell• Uniform and constant disc temperature• Controlled IR exposure over radius of disc
SINGULUS TECHNOLOGIESNovember, 2007
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BLULINE II Conclusion
• New Cooling Conveyor with Target Temp. of 30°C at the Exit Position
• Internal Temp. Conditioning for Further Temp. Homogeneity Across the Disc
I d UV S i C T h l ith Di t M t D i• Improved UV-Spin-Cure Technology with Direct Motor Drive
• Nearly 100% Lacquer Recycling and Pressure Dispense System Integrated
• New and Smaller IR-Lamps for Optimized cl Homogeneity p p g y
• SiN Metallizer Integrated on Last Position Prior Inline Scanning
• Sputtering of Full-Reflective- and Semi-Reflective Layer with 1 Metallizer
• BD DL Lacquering Stations are Identical to cl Stations
• BD DL Wet-Embossing Station in Cooperation with Sony
• Layout on smallest Footprint to Produce BD SL/DL Products
• Inline BCA Optional Available
SINGULUS TECHNOLOGIESNovember, 2007
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YOUR TOTAL SOLUTION FOR BD