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Wireless Control Application Note v1.0, 2010-03-24 TDA5240 Family Enhanced Sensitivity Multi-Configuration Receiver Technical Selection Guide SmartLEWIS TM RX+

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Page 1: SmartLEWISTM RX+ TDA5240 Family - Infineon

Wireless Control

Appl icat ion Note v1.0, 2010-03-24

TDA5240 FamilyEnhanced Sensitivity Multi-Configuration Receiver

Technical Select ion Guide

SmartLEWISTM RX+

Page 2: SmartLEWISTM RX+ TDA5240 Family - Infineon

Edition 2010-03-24Published byInfineon Technologies AG81726 Munich, Germany© 2010 Infineon Technologies AGAll Rights Reserved.

Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.

InformationFor further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).

WarningsDue to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

Page 3: SmartLEWISTM RX+ TDA5240 Family - Infineon

TDA5240 FamilyTechnical Selection Guide

Application Note 3 v1.0, 2010-03-24

Trademarks of Infineon Technologies AGBlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™,CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™,EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™,ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™,PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SensoNor™, SIEGET™, SINDRION™,SMARTi™, SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™,XPOSYS™.

Other TrademarksAdvance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™,REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership.Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble NavigationLtd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation.FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ ofCommission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ ofINTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ ofMaxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP.MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATAMANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ ofOmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RFMicro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of TexasInstruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of DiodesZetex Limited.Last Trademarks Update 2010-03-22

TDA5240 Family Enhanced Sensitivity Multi-Configuration Receiver Revision History: 2010-03-24, v1.0Previous Revision: --- Page Subjects (major changes since last revision)

Page 4: SmartLEWISTM RX+ TDA5240 Family - Infineon

TDA5240 FamilyTechnical Selection Guide

Table of Contents

Application Note 4 v1.0, 2010-03-24

Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1 Overview and General Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2 Different System Approaches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3 Overall System Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table of Contents

Page 5: SmartLEWISTM RX+ TDA5240 Family - Infineon

TDA5240 FamilyTechnical Selection Guide

List of Figures

Application Note 5 v1.0, 2010-03-24

Figure 1 General Comparison Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Figure 2 RF/IF System Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 3 Baseband Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Figure 4 Output Sources of Digital Receiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Figure 5 Typical TDA5225 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 6 Typical TDA5235/40 Application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

List of Figures

Page 6: SmartLEWISTM RX+ TDA5240 Family - Infineon

TDA5240 FamilyTechnical Selection Guide

Overview and General Comparison

Application Note 6 v1.0, 2010-03-24

1 Overview and General ComparisonThis is a simple technical guideline for selecting the best matching member out of the SmartLEWIS TDA5240family for your application.

The TDA5240 family consists of 3 chip sets:• TDA5240 is the superset of this family and supports the autonomous receive mode, where the desired payload

is automatically extracted and interrupts can trigger the host microcontroller to read the payload from the FIFO.• TDA5235 has some minor restrictions compared to TDA5240:

• TDA5235 is only capable of two independent configuration sets, while TDA5240 has four independent configuration sets.

• TDA5235 is able to support only one RF channel within each configuration set, while TDA5240 can handle up to three RF channels per configuration sets.

• TDA5225 does not support the autonomous receive mode: • Only the transparent receive data is available. • A decision on valid data and a Clock-Data-Recovery must be applied in the application controller.• Payload extraction needs to be done in the application controller.

A short overview on the available features is shown in the general comparison matrix in Figure 1.

Figure 1 General Comparison Matrix

TDA5240

TDA5235

TDA5225

Hig

h S

ensi

tivity

NR

Z S

licer

Outp

ut

Man

ches

ter

Deco

din

g

Multi-

Channel

Fram

e Syn

c

Dig

ital

Deco

din

g

IF F

ilter

inte

gra

ted

5V P

ads

X X X X XX X X

X X XX X X

X X X X X

X

Page 7: SmartLEWISTM RX+ TDA5240 Family - Infineon

TDA5240 FamilyTechnical Selection Guide

Overview and General Comparison

Application Note 7 v1.0, 2010-03-24

Figure 2 is comparing the key features of the RF/IF system.

Figure 2 RF/IF System Comparison

50 300 kHz

(on- chip filter)

+ ext. CER filter

10.7 MHz

274 kHz

Single/Doubleconversion

Fine: 10.5 Hz

ΣΔ PLL

- 119 dBm

50 300 kHz

( on- chip filter)

+ ext. CER filter

10.7 MHz

274 kHz

Single/Doubleconversion

Fine: 10.5 Hz

ΣΔ PLL

-116 dBm Peak

- 119 dBm

50 300 kHz

(on- chip filter)

+ ext. CER filter

10.7 MHz

274 kHz

conversion

Fine: 10.5 Hz

ΣΔ PLL

- 119 dBm

Channel Bandwidth

PLL Type

Multi- Channel Resolution

Receiver Type

IF Frequency

Sensitivity (ASK,

2 kbit/s , BER=2*10

Sensitivity (FSK,

2 kbit/s, fdev = +/- 10 kHz, BER=2*10

50 - 300 kHz

( - filter)

+ ext. CER filter

10.7 MHz

274 kHz

Fine: 10.5 Hz

ΣΔ PLL

- 119 dBm

TDA5235

50 - 300 kHz

( - filter)

+ ext. CER filter

10.7 MHz

274 kHz

Fine: 10.5 Hz

ΣΔ PLL

- 119 dBm

TDA5225

50 - 300 kHz

( - filter)

+ ext. CER filter

10.7 MHz

274 kHz

Single/Double

Fine: 10.5 Hz

ΣΔ PLL

- 119 dBm

TDA5240

Channel Bandwidth

PLL Type

Multi-Channel Resolution

Receiver Type

IF Frequency

Sensitivity (ASK,

2 kbit/s, BER=2*10-3)

Sensitivity (FSK,

2 kbit/s, fdev = +/- 10 kHz, BER=2*10-3)

-116 dBm Peak -116 dBm Peak

Page 8: SmartLEWISTM RX+ TDA5240 Family - Infineon

TDA5240 FamilyTechnical Selection Guide

Overview and General Comparison

Application Note 8 v1.0, 2010-03-24

Detailed differences in the digital baseband processing can be seen in Figure 3.

Figure 3 Baseband Comparison

1

2

40 kchip/s

112 kchip/s

(●)

simple slicer only

3

4

40 kchip/s

112 kchip/s

3

4

40 kchip/s

112 kchip/s

Frame Synchronization

Unit (TSI)

Bi- phase Code

(ClkRecovery )

Digital Slicer in Digital Baseband

Sliced baseband output

externally)

Number of RF channels

per Configuration

Number of Configurations

Max. ASK Data Rate

Max. FSK Data Rate

1

2

40 kchip/s

112 kchip/s

TDA5235

(●)

simple slicer only

3

4

40 kchip/s

112 kchip/s

TDA5225

3

4

40 kchip/s

112 kchip/s

TDA5240

-

(

Manchester Code (ClkRecovery)

(simple slicer allows NRZ processing

12 mA

@ 2.2MHz

12 mA

@ 2.2MHz

(●)

WU only

(●)

Const ON OFF only

12 mA

@ 2.2MHz

Fast Wake- up on RSSI

Wake- up Generator +

Wake up Interrupt Generator

FsyncMID and EOM

RX_RUN and CLK_OUT output

SPI Interface

Current consumption 12 mA

@ 2.2MHz

256 bits

12 mA

@ 2.2MHz

(●)

simple RSSI-only

(●)

Const ON-OFF only

12 mA

@ 2.2MHz

256 bitsFIFO size

Self Polling Mode

-

-

Interrupt Generation for ,

Page 9: SmartLEWISTM RX+ TDA5240 Family - Infineon

TDA5240 FamilyTechnical Selection Guide

Overview and General Comparison

Application Note 9 v1.0, 2010-03-24

Page 10: SmartLEWISTM RX+ TDA5240 Family - Infineon

TDA5240 FamilyTechnical Selection Guide

Different System Approaches

Application Note 10 v1.0, 2010-03-24

2 Different System ApproachesFor the TDA5225, only the DATA or DATA_MATCHFIL output signal can be used (transparent mode; seeFigure 4). BER sensitivity measurements, as noted in the data sheet, use the transparent receive mode TMMF(DATA_MATCHFIL output signal), where the received data is sampled with ideal data clock. TheDATA_MATCHFIL output signal will provide higher systematic jitter than the DATA output signal.Please keep in mind, that Sensitivity in this transparent mode is significantly depending on the implemented clockand data recovery algorithm of the user software in the application controller.

TDA5235/40 can deliver high sensitivity due to internal available multi-bit signals (TDA5225 only delivers a 1-bitoutput signal) and a real hardware clock-recovery unit. The autonomous receive mode of a TDA5235/40, where the host controller can stay in idle mode, leads to reducednoise of the application controller and improved system performance. Therefore the system standby powerconsumption can be further reduced. Especially the usage of TDA5235/40 features like Fast-Fallback or Ultrafast-Fallback further reduces the receivers On time, which has direct influence to the average current consumption.

Figure 4 Output Sources of Digital Receiver

eomfsync

datadata_clk

wakeup

8 to 16 samples per chip

FSK detector

fractional SRC

SRCbypass

fsout / fsin = 0.5 … 1.0

adjust_length

Matched Filter

RAW Data Slicer for external processing

DATA(Sliced RAW Data for external processing )

Signal Detector

chip_data

chip_data_clock

sync

CR PLL Slicer CDR PLL

Blind Sync

Initial Phase & Data rate

Data Slicer

Chip Data Decoder

Framer (TSI Detector)

Decoder

WU Unit

From ASK/FSK

emodulator

RXSTR RXD

FIFO

CH_STR

CH_DATA

MUX

SIGN

DATA_MATCHFIL(Matched Filtered Data for external processing )

Chip Data

Invert

Data Invert

Data Invert DINVEXT

CHIPDINV

TDA5225 TDA5235/40

Page 11: SmartLEWISTM RX+ TDA5240 Family - Infineon

TDA5240 FamilyTechnical Selection Guide

Different System Approaches

Application Note 11 v1.0, 2010-03-24

A typical TDA5225 application is shown in Figure 5, where the application controller is recovering clock and data.

Figure 5 Typical TDA5225 Application

A power-up and start-up sequence can look like the following (Power OFF ==> DATA output): • Power Off (P_ON = 0)

• No RF reception is required• Power On (P_ON = 1)

• Initiated by application controller• TDA5225 has finished after 3ms in maximum (tReset, see item C9 in data sheet)

• SLEEP mode is reached (but registers are not configured for the application)• SPI communication required to configure TDA5225 for the target application after (each) Power On cycle.

• Required configuration time is depending on SPI speed and number of registers to configure; last command is setting the TDA5225 into Run Mode

• Run Mode • After 460µs (typical) the TDA5225 is ready to receive; • Wait for Data processing delay and Raw Data Slicer settling time

• Data at DATA output can be used for processing in the application controller

Note: After a successful start-up, also a receiver polling (on-off duty cycle) can be applied either with the built-inSelf Polling feature or by switching between Run Mode Slave and Sleep Mode. In both cases the register contentof the radio stays preserved.

1 2 3 4 5 6 7 8 9 10 11 12 13 14

28 27 26 25 24 23 22 21 20 19 18 17 16 15

IFB

UF_

IN

IFB

UF_

OU

T

GN

DA

IFM

IX_I

NP

IFM

IX_I

NN

VDD

5V

VDD

D

VDD

D1V

5

GN

DD

PP0

PP1

PP2

P_O

N

XTAL

1

IF_O

UT

VDD

A

RS

SI

PP3

GN

DRF

LNA

_IN

P

LNA

_IN

N T2 T1

SD

O

SD

I

SC

K

NC

S

XTA

L2

TDA5225

SAWfilter

RF in

IF CERfilter(opt.)

IF C

ERfil

ter

(opt

.)

VS

VS

SPI Bus

4

DATA

NINT (Interrupt source = RSSI)

Application controller (incl. software clock + data

recovery )

Configure radio

Received data

Page 12: SmartLEWISTM RX+ TDA5240 Family - Infineon

TDA5240 FamilyTechnical Selection Guide

Different System Approaches

Application Note 12 v1.0, 2010-03-24

A typical TDA5235/40 application is shown in Figure 6, where the application controller is only waiting for aninterrupt to readout the received payload from the FIFO.

Figure 6 Typical TDA5235/40 Application

The power-up and start-up sequence can look like the following (Power OFF ==> ready to receive): • Power Off (P_ON = 0)

• No RF reception is required• Power On (P_ON = 1)

• Initiated by application controller• TDA5235/40 has finished after 3ms in maximum (tReset, see item C9 in data sheet)

• SLEEP mode is reached (but registers are not configured for the application)• SPI communication required to configure TDA5235/40 for the target application after the Power On cycle.

• Required configuration time is depending on SPI speed and number of registers to configure; last command is setting the TDA5235/40 either into Run Mode Slave or Self Polling Mode (In both cases the register content of the radio stays preserved).

• Run Mode Slave (similar is valid for Self Polling Mode)• After 460µs (typical) the TDA5235/40 is ready to receive; • The receiver is scanning autonomously for the target data and if successful, the application controller

gets informed (NINT) to pick data from the FIFO via SPI. • Self Polling Mode

• Additionally, the receiver is automatically polling (on-off duty cycle) to further reduce the average current consumption.

1 2 3 4 5 6 7 8 9 10 11 12 13 14

28 27 26 25 24 23 22 21 20 19 18 17 16 15

IFB

UF_

IN

IFB

UF_

OUT

GN

DA

IFM

IX_I

NP

IFM

IX_I

NN

VDD

5V

VDD

D

VDD

D1V

5

GN

DD

PP0

PP1

PP2

P_O

N

XTA

L1

IF_O

UT

VDD

A

RSS

I

PP3

GN

DR

F

LNA

_INP

LNA

_IN

N T2 T1

SD

O

SD

I

SCK

NCS

XTA

L2

TDA5235 or TDA5240

SAWfilter

RF in

IF CERfilter(opt.)

IF C

ERfil

ter

(opt

.)

VS

VS

SPI Bus

Application controller

4

NINT (Interrupt source = EOM)

Configure radio / Read RX FIFO data

Detect a received packet

Page 13: SmartLEWISTM RX+ TDA5240 Family - Infineon

TDA5240 FamilyTechnical Selection Guide

Overall System Current Consumption

Application Note 13 v1.0, 2010-03-24

3 Overall System Current ConsumptionThe current consumption of TDA5225 and TDA5235/40 are equal.In a TDA5225 system the RAW Data Slicer settling time needs to be taken into account for the average currentconsumption.A system using the TDA5225 will have a higher overall system current consumption, as an additional current isrequired for the „high performance“ software clock recovery in the application controller.Features like FFB or UFFB are only available in TDA5235/40, but not in TDA5225. Therefore the decision on validdata must be taken by the application controller, which must stay ON for the „whole“ time of reception andconsumes current at this time.TDA5225 only has RSSI criterion for Wake-up (WU) generation. This is the weakest WU criterion and will lead toFalse-Alarms (= unnecessary wake-ups of the application controller) as an appropriate RSSI threshold needs tobe set for not losing sensitivity (please note that RSSI shows a slight temperature dependency, which needs to betaken into account).Therefore the overall system current consumption using a TDA5225 will always be higher compared to a systemusing a TDA5235 or TDA5240.

Page 14: SmartLEWISTM RX+ TDA5240 Family - Infineon

Published by Infineon Technologies AG

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