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SN5476, SN54LS76A SN7476, SN74LS76A DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR SDLS121 – DECEMBER 1983 – REVISED MARCH 1988 1 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 Copyright 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

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  • SN5476, SN54LS76ASN7476, SN74LS76A

    DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR

    SDLS121 DECEMBER 1983 REVISED MARCH 1988

    1POST OFFICE BOX 655303 DALLAS, TEXAS 75265

    Copyright 1988, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.

  • SN5476, SN54LS76ASN7476, SN74LS76ADUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR

    SDLS121 DECEMBER 1983 REVISED MARCH 1988

    2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

  • SN5476, SN54LS76ASN7476, SN74LS76A

    DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR

    SDLS121 DECEMBER 1983 REVISED MARCH 1988

    3POST OFFICE BOX 655303 DALLAS, TEXAS 75265

  • SN5476, SN54LS76ASN7476, SN74LS76ADUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR

    SDLS121 DECEMBER 1983 REVISED MARCH 1988

    4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

  • SN5476, SN54LS76ASN7476, SN74LS76A

    DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR

    SDLS121 DECEMBER 1983 REVISED MARCH 1988

    5POST OFFICE BOX 655303 DALLAS, TEXAS 75265

  • SN5476, SN54LS76ASN7476, SN74LS76ADUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR

    SDLS121 DECEMBER 1983 REVISED MARCH 1988

    6 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

  • PACKAGE OPTION ADDENDUM

    www.ti.com 31-May-2014

    Addendum-Page 1

    PACKAGING INFORMATION

    Orderable Device Status(1)

    Package Type PackageDrawing

    Pins PackageQty

    Eco Plan(2)

    Lead/Ball Finish(6)

    MSL Peak Temp(3)

    Op Temp (C) Device Marking(4/5)

    Samples

    5962-9557501QEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9557501QEASNJ5476J

    5962-9557501QFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9557501QFASNJ5476W

    5962-9557501QFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9557501QFASNJ5476W

    7601301EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601301EASNJ54LS76AJ

    7601301EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601301EASNJ54LS76AJ

    JM38510/00204BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/00204BEA

    JM38510/00204BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/00204BEA

    M38510/00204BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/00204BEA

    M38510/00204BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/00204BEA

    SN5476J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN5476J

    SN5476J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN5476J

    SN54LS76AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS76AJ

    SN54LS76AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS76AJ

    SN7476N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70SN7476N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70

    SN7476N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70SN7476N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70

    SN74LS76AD OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70SN74LS76AD OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70

  • PACKAGE OPTION ADDENDUM

    www.ti.com 31-May-2014

    Addendum-Page 2

    Orderable Device Status(1)

    Package Type PackageDrawing

    Pins PackageQty

    Eco Plan(2)

    Lead/Ball Finish(6)

    MSL Peak Temp(3)

    Op Temp (C) Device Marking(4/5)

    Samples

    SN74LS76ADR OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70SN74LS76ADR OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70SN74LS76AN OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70SN74LS76AN OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70SN74LS76AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70SN74LS76AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70

    SNJ5476J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9557501QEASNJ5476J

    SNJ5476J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9557501QEASNJ5476J

    SNJ5476W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9557501QFASNJ5476W

    SNJ5476W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9557501QFASNJ5476W

    SNJ54LS76AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601301EASNJ54LS76AJ

    SNJ54LS76AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601301EASNJ54LS76AJ

    SNJ54LS76AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601301FASNJ54LS76AW

    SNJ54LS76AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601301FASNJ54LS76AW

    (1) The marketing status values are defined as follows:

    ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

    (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

    information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.

  • PACKAGE OPTION ADDENDUM

    www.ti.com 31-May-2014

    Addendum-Page 3

    Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

    (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

    (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

    (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

    of the previous line and the two combined represent the entire Device Marking for that device.

    (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

    value exceeds the maximum column width.

    Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

    In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

    OTHER QUALIFIED VERSIONS OF SN5476, SN54LS76A, SN7476, SN74LS76A :

    Catalog: SN7476, SN74LS76A

    Military: SN5476, SN54LS76A

    NOTE: Qualified Version Definitions:

    Catalog - TI's standard catalog product

    Military - QML certified for Military and Defense Applications

  • IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity

    Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright 2014, Texas Instruments Incorporated