solder paste aim ws483 - gotopac.com · metallic taste, abdominal cramps, headaches. overexposure...

Manufacturing & Distribution WorldwideAmericas +1-401-463-5605Europe +44-1737-222-258 Asia-Pacific +852-2649-7183 [email protected] www.aimsolder.com

WS483 is a halide-free water soluble solder paste developed to resist the effects of extreme heat and humidity levels. As a result, WS483 will not slump or dry out, thus offering exceptionally broad printing and reflow process windows. WS483 is being used successfully today in 80% RH environments.

WS483 offers excellent printing and tack characteristics, very good wetting, an exceptional post-process cleaning window and will not foam during the cleaning process.

WS483 offers non-corrosive residues and exceeds the reliability standards of IPC. Some manufacturers leave WS483 residues uncleaned for 2 weeks with no harmful effects.

Call or write to [email protected] to request additional information or a sample. You can also visit www.aimsolder.com.

4 Time SMT Vision Award Winner

Fine pitch printing without slumping, even in high-humidity environments.

Water SolubleSolder Paste

AIM WS483

Table of Contents

483 At A Glance 1 Technical Data Sheet 2 Product Development Test Report 5 SIR Qualification Report 6 Delayed Cleaning SIR Report 8 BGA Analysis 10 Fine Pitch Print Definition 11 Wetting Comparison 12 Hot Slump Resistance 13 Material Safety Data Sheet 15

483 At A Glance § Extremely Broad Printing-Process Window

o Prints Up To 8 Inches Per Second Without Slumping o 48 Hour Stencil Life o Drop-In For In-Line Or Batch-Print Operations

§ Robust Environmental Tolerance o Excellent Heat & Humidity Resistance o Will Not Slump In Humid Environments o Very Good Stencil Life, Even In Environments With 80% Rh

§ Very Wide Placement-Process Window o High Tack-Force o Suitable For High-Speed Placement o 24 Hour Tack Time

§ High Activity o Excellent Wetting o Suitable For Standard and Difficult -To-Wet Parts o May Be Reflowed In Air Or Nitrogen

§ Excellent Cleaning Characteristics o Safe To Be Left On Many Assemblies For Extended Times

Before Cleaning o Will Not Foam, Even In High-Pressure Wash Systems o Cleanable In Straight Water

§ High Reliability o Halide-Free o Passes IPC Reliability Testing

§ Virtually Odor-Free

1

Sn63 WS 483 Page: 7/7

-ALL COMPONENTS WITH SUSCEPTIBLE HAZARDS THAT ARE PRESENT IN A CONCENTRATIONGREATER THAN 1 % (GREATER THAN 0.1 % FOR CARCINOGENS) HAVE BEEN DISCLOSED IN THISSAFETY DOCUMENT.

-ACGIH, Threshold Limit Values, 1994-1995. -Canada Gazette Part II, Vol. 122, No. 2 RegistrationSOR/88-64 31 December, 1987 Hazardous Products Act "Ingredient Disclosure List". -CFR29, OSHA'sPermissible Exposure Limits, revision July, 1993. -CFR29, part 1910.1200, Hazard Communication.-CHEMTOX database -Components' manufacturer's Material Safety Data Sheet. -CRC Handbook ofchemistry and physics, 67 th edition, CRC Press inc., Boca Raton, Florida. -CSST (Comission de Santé etSécurité au Travail), document #RT-12: Classification of Certain Chemical Substances. -IATA, DangerousGoods Regulations, 37th edition (January 1, 1996) -NFPA, Fire Protection Guide to Chemical Hazards, 11thedition. -NIOSH, Pocket Guide to Chemical Hazards, revision June 1994. Sigma-Alrich handbook of finechemicals, 1998 -TSCA (Toxic Substance Contral Act), Chemical Substance Inventory List, 1985.

References

Other SpecialConsiderations

Validated by P. Diallo on 7/5/2001. Verified by P. Diallo.Printed 7/5/2001.

Notice to ReaderTo the best of our knowledge, the information contained herein is accurate. However, neither the above named supplier nor any of its subsidiaries assumes any liability whatsoeverfor the accuracy or completeness of the information contained herein.Final determination of suitability of any material is the sole responsibility of the user. All materials may present unknown hazards and should be used with caution. Althoughcertain hazards are described herein, we cannot guarantee that these are the only hazards that exist.

AIM25 Kenney Drive, Rhode Island, USA, 02920(401) 463-5605 (800) CALL AIM

Information/Contact

BIRTH DEFECT HAZARDCONTAINS MATERIAL WHICH CAN CAUSE BIRTH DEFECTVERY TOXIC TO AQUATIC ORGANISMS.HARMFUL IF INHALED OR SWALLOWED.CONTAINS MATERIAL WHICH CAUSES DAMAGE TO THE FOLLOWING ORGANS: BLOOD, KIDNEYS,LUNGS, NERVOUS SYSTEM, REPRODUCTIVE SYSTEM, MUCOUS MEMBRANES, SPLEEN, BRAIN,DIGESTIVE SYSTEM, GASTROINTESTINAL TRACT, RESPIRATORY TRACT, SKIN, CENTRAL NERVOUSSYSTEM, CRYSTALLINE LENS OR CORNEA.MAY CAUSE EYE IRRITATION.MAY CAUSE ALLERGIC SKIN REACTION.POSSIBLE CANCER HAZARDCONTAINS MATERIAL WHICH MAY CAUSE CANCER BASED ON ANIMAL DATA.MAY BE HARMFUL TO ENVIRONMENT IF RELEASED IN LARGE AMOUNTS.

New documentDocumentModifications

21

007.26.05

Manufacturing and Distribution Worldwide Americas +1-401-463-5605 • Europe +44-1737-222-258 • Asia-Pacific +852-2649-7183 • [email protected] • www.aimsolder.com

TECHNICAL DATA SHEET

CATEGORY: WATER SOLUBLE SOLDER PASTE NAME: WS-483 ALLOY: Sn63/Pb37 & Sn62/Pb36/Ag2

FEATURES • 48 HOUR STENCIL LIFE • 24 HOUR TACK TIME • EXCELLENT PRINTING CHARACTERISTICS • HIGH HUMIDITY RESISTANCE • EXTENDED CLEANING WINDOW • SLUMP RESISTANT • EXCELLENT ACTIVITY • GOOD FOR BATCH OR CONTINUOUS RUNS • HALIDE FREE • WILL NOT FOAM DURING WASH

DESCRIPTION WS-483 is an organically activated formulation developed to better resist the effects of increased humidity levels. WS-483 offers improved heat and humidity resistance, while maintaining high tack and resistance to slump. WS-483 also provides an exceptional post-process cleaning window and will not foam during the cleaning process, even in high pressure wash systems.

HANDLING

• WS-483 has a refrigerated shelf life of 6 months at 4°C/40°F. This product must be refrigerated. Do not freeze WS-483.

• Allow the solder paste to completely warm naturally to ambient temperature (8 hours is recommended) prior to breaking seal for use.

• Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated material resulting from storage.

• Do not store new and used paste in the same container. Re-seal any opened containers while not in use. • Replace the internal plug in conjunction with the cap of the 500 gram jar to ensure the best possible seal.

PRINTER SETUP

These are suggested starting parameters for your screen printer. Some assumptions were made as to the printer types used in today’s applications, and adjustments will vary between equipment, application and facility environment.

SNAP-OFF DISTANCE ON CONTACT (0.00”) SQUEEGEE PRESSURE 1-1.5 LBS/IN. OF BLADE PCB SEPARATION DISTANCE .030-.100” SQUEEGEE STROKE SPEED .5 - 8 IN/SEC* PCB SEPARATION SPEED SLOW - MEDIUM *DEPENDENT ON PCB AND PAD DESIGNS

2


PASTE APPLICATION

• Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle. A bead diameter of 1/2 to

5/8 inch is normally sufficient to begin. • Apply small amounts of fresh solder paste to the stencil at frequent, controlled intervals to maintain paste

chemistry and workable properties. • Cleaning of your stencil will vary according to the application; however, cleaning can be accomplished using AIM

200AX-10 or DJAW-10 Stencil Cleaners. Use these in moderation and remove any excess cleaner from stencil.

REFLOW DATA See attached Reflow Profile Supplement.

CLEANING WS-483 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A temperature of 100° - 150°F is sufficient for removing residues. An in-line or other pressurized spray cleaning system is suggested, but is not required.

SAFETY • Use with adequate ventilation and proper personal protective equipment. • Refer to the accompanying Material Safety Data Sheet for any specific emergency information. • Do not dispose of any lead-containing materials in non-approved containers.

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Sn63 WS 483 Page: 6/7

U.S. Federal Regulations

Rhode Island RTK hazardous substances: Tin; LEADPennsylvania RTK: Tin: (generic environmental hazard); LEAD;Florida: Tin; LEADMinnesota: Tin; LEADMichigan critical material: LEADMassachusetts RTK: Tin; LEAD;New Jersey: Tin; LEAD;New Jersey spill list: Tin

Class: Contains material which can cause cancer.Class: Sensitizing substance.Class: Target organ effects.Class: Reproductive toxins.

HCS Classification

Section 15. Regulatory Information

California prop. 65: This product contains LEAD for which the State of California has found to causecancer, birth defects or other reproductive harm (male, female), which would require a warning underthe statute.(no significant risk level): Lead: 0.0005 mg/day (inhalation)

TSCA inventory: ALL COMPONENTS

Clean water act (CWA) 307: LeadClean water act (CWA) 311: No products were found.Clean air act (CAA) 112 accidental release prevention: No products were found.Clean air act (CAA) 112 regulated flammable substances: No products were found.Clean air act (CAA) 112 regulated toxic substances: No products were found.

State Regulations

Australia (NICNAS): ALL COMPONENTS

Korea (TCCL): ALL COMPONENTS

Philippines (RA6969): ALL COMPONENTS

20/22- Harmful by inhalation and if swallowed.36/38- Irritating to eyes and skin.43- May cause sensitization by skin contact.R50/53- Very toxic to aquatic organisms. May cause long-term adverse effects in the aquaticenvironment.61- May cause harm to the unborn child.62- Possible risk of impaired fertility.

DSCL (EEC)

International RegulationsNot available.EINECS

International Lists

SARA 302/304/311/312 extremely hazardous substances: No products were found.SARA 302/304 emergency planning and notification: No products were found.SARA 302/304/311/312 hazardous chemicals: Tin; LEAD.SARA 311/312 MSDS distribution - chemical inventory - hazard identification: Tin: immediate healthhazard; LEAD: delayed health hazard.SARA 313 toxic chemical notification and release reporting: LEAD: 0.1%

Section 16. Other Information

Hazardous MaterialInformation System(U.S.A.)

100B

01

1

* National FireProtectionAssociation (U.S.A.) Health

Specific Hazard

Reactivity

Fire HazardHealth

Fire Hazard

Reactivity

Personal Protection

Label statements

Continued on Next Page20

Sn63 WS 483 Page: 5/7

No additional remark.

MOLTEN METAL can cause severe BURNS! Fumes may irritate eyes and respiratory tract.

Human: LEAD crosses the placental barrier. CHRONIC OVEREXPOSURE EFFECTS; Increase of LEAD LEVEL in blood, muscle soreness,metallic taste, abdominal cramps, headaches. Overexposure to tin oxide fumes may result in benigne pneumoconiosis (stannosis). Repeated and prolonged contact with bare skin may cause skin irritation or dermatitis.

Special Remarks on Toxicityto Animals

Special Remarks on ChronicEffects on Humans

Special Remarks on OtherToxic Effects on Humans

Not available.

Not available.

Possibly hazardous short term degradation products are not likely. However, long term degradationproducts may arise.

The products of degradation are more toxic.

Over melting point, toxic metallic oxide fumes may be evolved. A small amount of organic fumes willalso be emitted.

Section 12. Ecological Information

Ecotoxicity

BOD5 and COD

Biodegradable/OECD

Toxicity of the Products ofBiodegradation

Special Remarks on theProducts of Biodegradation

Not available.

Not available.

Mobility

Waste must be disposed of in accordance with federal, state and local environmental controlregulations.

Not available.

Waste Information

Waste Stream

Section 13. Disposal Considerations

Consult your local or regional authorities.

Not a DOT controlled material (United States).

Not applicable.

Not controlled under IMDG.

Not controlled under IATA.

Marine Pollutant Not available.

Not controlled under ADR (Europe).

Section 14. Transport Information

DOT Classification

Special Provisions forTransport

IMO/IMDG Classification

ICAO/IATA Classification

ADR/RID Classification

Not available.

Special Provisions forTransport


REFLOW PROFILE SUPPLEMENT

ALLOYS: Sn63/Pb37 and Sn62/Pb36/Ag2

Ramp-Soak-Spike (RSS): Recommended profile.

RSS Profile Guidelines • The typical initial rate of rise for the RSS profile is 1.4 to 1.8°C/second. • Ramp up to 150°C and then soak the assembly for 30 to 60 seconds. • The soak zone should be controlled between 150 -170°C. Above this point the paste will lose its activator. • Proceed to spike immediately once the PCB has reached thermal stability. • Peak temperature is 215ºC ± 5ºC. • Time above liquidus is 45 ± 15 seconds. • The total profile length should be between 2 3⁄4 - 3 1⁄2 minutes from ambient to peak temperature. • Cool down should be controlled within 4°C/second.

Ramp-to-Spike (RTS)

RTS Profile Guidelines • The typical rate of rise for the RTS profile is 0.7 to 1.5°C/second. • The profile should be a straight line or concave; it should not be convex. • 2/3 of the profile should be below 150°C. • Peak temperature is 215ºC ± 5ºC. • Time above liquidus is 60 ± 15 seconds. • The total profile length should be between 3 1⁄2 - 4 minutes from ambient to peak temperature. • Cool down should be controlled within 4°C/second.

Low-Long-Spike (LSP): Designed to eliminate/reduce voiding

LSP Guidelines • The typical initial rate of rise for the LSP profile is 1.25°C/second. • Ramp up to 120°C and then soak the assembly for 120 to 180 seconds. • Proceed to spike immediately after exiting the soak zone. • Peak temperature is 215ºC ± 5ºC. • Time above liquidus is 60 ± 15 seconds. • The total profile length should be between 4 1⁄2 - 5 minutes from ambient to peak temperature. • Cool down should be controlled within 4°C/second.

4

Product Development Test Report

CATEGORY RESULTS PROCEDURES/REMARKS PHYSICAL PROPERTIES

Dark Grey Color Clear, Colorless Flux Residue

Specific Gravity 5.19 (water = 1) 63Sn/37Pb alloy

Viscosity Relative to production batch J-STD-005 Solderball Pass < 10 count IPC J-STD-005 Silver Chromate Pass IPC TM-650 2.3.33 (cleaned) Stencil Life 48 hours 50% rH, 74°F (23°C) Slump Pass IPC J-STD-005 Slump Printability Pass AIM Print Test (Details Below) Tack Pass AIM Tack Test (Details Below) Tack Force Pass IPC TM-650 2.4.44 Tack Time 24 hours 50% rH, 74°F (23°C) Reflow Pass AIM Reflow Test (Details Below) Residue Cleaning Test No Foaming Pass, AIM YY1 Test

CHEMICAL PROPERTIES IPC J-STD Classification ORMO IPC J-STD-004 Copper Mirror Test Low IPC J-STD-004 Halide Content Halide-free IPC J-STD-004 Silver Chromate Test Pass IPC J-STD-004 (cleaned)

ELECTRICAL PROPERTIES Pass, >1E9 O at 96 and 168 h IPC-TM-650 §5.5.1 Pass, >1E8 O at 96 and 168 h J-STD-004 §3.2.4.5.1

SIR (cleaned) (see data sheet page 3)

Pass, No dendrite growth or corrosion IPC-TM-650 §5.5.2 SMT PRODUCTION TESTING DESCRIPTION & RESULTS

TEST DESCRIPTION RESULTS PRINTING

Paste printed on AIM Test Board 1 in increments of 1”/sec. starting at 1”/sec. Paste printed up to 8”/second (maximum speed tested)

Paste kneaded for 100 cycles, then printed. IPC slump test used to look for slumping at room temperature. No Slump

Print test repeated at 85°F, 55rH. Results compared on the IPC slump pattern. No Slump

Paste left on the printer overnight and printed after pause time of 15 hours Required three passes to give perfect print.

Boards then printed every hour one board and paused for one hour. All prints (83) acceptable. Paste always rolled Pasted returned to the jar. The paste was printed the following week for a three hour test. All prints acceptable based upon the slump pattern.

Paste randomly checked over a period of 20 days All prints acceptable based upon the IPC slump pattern. Paste printed .010 mil dots on micro BGA.

PART ACCEPTANCE (TACK) Board printed and components placed every 6 hours; boards turned upside down. No components dropped off.

REFLOW Components placed on the board at an angle to the pads. The board was reflowed and inspected for alignment.

All components self-aligned into acceptable limits. No tombstoning observed.

Joints tested for wetting angles and smoothness. All passed AIM criteria. CLEANING

Paste residues reflowed on IPC test coupons (B24) and tested for SIR after cleaning. All boards passed.

Visual cleaning test was performed with 140°F open head tap water. Cleaning passed, some random white residue remained.

Foaming tested using AIM test YY1. Solder paste melted in an aluminum weight dish; residue into beaker containing tap water to an approximate 10% solution. A foaming stone is added and foam head is measured to see if it is self-collapsing.

Pass- foam head collapsed.

Boards reflowed and lef t uncleaned for 2 weeks. No observation of discoloring or corrosion. Cleaning time frame after reflow not critical with this product.

The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of proper handling and operating conditions. All information pertains to solder paste produced with 45-micron powder. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.

05.06.03


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Sn63 WS 483 Page: 4/7

Not available.

Not available

Not available

The product is insoluble in water and oil.

Non-ionic.

Is not dispersed in hot water, diethyl ether, n-octanol, acetone.See solubility in methanol.

Soluble in methanol.Very slightly soluble in cold water.Insoluble in hot water, diethyl ether, n-octanol, acetone.

Not available.

not available

350 to 1200 KcPs (see certificate for specific value)

Not available.

Vapor Pressure

Vapor Density

Volatility

Odor Threshold

Evaporation Rate

Viscosity

LogKow

Ionicity (in Water)

Dispersion Properties

Solubility

Physical Chemical Comments

Not available.VOC

The product is stable.

Reactive with oxidizing agents.

Will not occur.

Not available.

Over melting point, toxic metallic oxides may be evolved. A small amount of organic fumes may alsobe evolved.

Section 10. Stability and Reactivity

Stability and Reactivity

Conditions of Instability

Incompatibility with VariousSubstances

Hazardous DecompositionProducts

Hazardous Polymerization

Corrosivity Not available.

Special Remarks onCorrosivity


No specific information is available in our data base regarding the toxicity to animals.

Fumes and/or dusts produced by this product may be hazardous in case of ingestion, of inhalation.This product may be hazardous in case of skin contact (irritant, sensitizer), of eye contact (irritant).CARCINOGENIC EFFECTS: [LEAD] - Classified A3 (Proven for animal) by ACGIH, 2B (Possible forhuman) by IARC.MUTAGENIC EFFECTS: Not available.TERATOGENIC EFFECTS: [LEAD] - Classified 1 by European Union.DEVELOPMENTAL TOXICITY: [LEAD] - Classified Reproductive system/toxin/female, Reproductivesystem/toxin/male [PROVEN].The product may be toxic to blood, kidneys, lungs, the nervous system, the reproductive system,mucous membranes, spleen, brain, digestive system, gastrointestinal tract, upper respiratory tract,skin, central nervous system (CNS), eye, lens or cornea.Repeated or prolonged exposure to the substance can produce target organs damage. Repeatedexposure to toxic material may produce general deterioration of health by an accumulation in one ormany human organs.

Section 11. Toxicological Information

Toxicity to Animals

Toxic and Chronic Effects onHumans


Sn63 WS 483 Page: 3/7

MOLTEN METAL: Let cool before picking up and returning to process or recycling. OTHER: Useappropriate tools to put the spilled solid in a container reserved to that effect.

Our data base contains no additional information in case of a large spill and/or a leak of the product.

Section 6. Accidental Release Measures

Small Spill and Leak

Large Spill and Leak

Keep container dry. Keep in a cool place. . Suspected carcinogenic, teratogenic or mutagenicmaterials should be stored in a separate locked safety storage cabinet or room. Follow specialinstructions on container and analysis reports for additional storage information.

Wear suitable protective clothing. Use in a well ventilated area. When using do not eat, drink orsmoke. Avoid contact with skin and eyes. After handling, always wash hands thoroughly with soapand water.

Section 7. Handling and Storage

Handling

Storage

Use process enclosures, local exhaust ventilation, or other engineering controls to keep airbornelevels below recommended exposure limits. If user operations generate dust, fume or mist, useventilation to keep exposure to airborne contaminants below the exposure limit.

No additional information

No hazardous ingredients.

Section 8. Exposure Controls, Personal Protection

Engineering Controls

Personal Protection in Caseof a Large Spill

Product Name Exposure Limits

Dust respirator. Be sure to use an approved/certified respirator or equivalent. Wear appropriaterespirator when ventilation is inadequate.

Splash goggles.

Lab coat.

Gloves (disposable, vinyl).

Not applicable.

Personal ProtectionEyes

Body

Respiratory

Hands

Feet

Consult local authorities for acceptable exposure limits.

* Note:Suggested protective clothing may not be adequate for a specific process. Consult a specialist before using.

Not available.

Solid. (Paste.)

Neutral.

Weighted average: 262.05°C (503.7°F)

Not available.

Not applicable.

Amine like.

Not applicable.

Dark grey.

Boiling/Condensation Point

Melting/Freezing Point

Section 9. Physical and Chemical Properties

Physical State andAppearance

Molecular Weight

pH (1% Soln/Water)

Critical Temperature

Specific Gravity

Odor

Taste

ColorNot applicable.Chemical formula

Weighted average: 5.19 (Water = 1)

Acid Value (IPC TM-650,2.3.13)

Not available.


AIM-SIR WS 483 SOLDER PASTE page 1 of 2

SIR Qualification Test Report for AIM WS 483 Solder Paste

GENERAL REFERENCES Surface insulation test (SIR) for solder paste was carried out according to J-STD-004 and IPC-TM-650 method 2.6.3.3.

SAMPLES AND INSTRUMENTATION Solder Paste Sample: WS 483 lot WS 483Test Coupons: IPC-B-24 coupons Environmental Chamber: Thermotron SE-300 Electrical Testing Equipment: ASR SIR tester

SAMPLE PREPARATION IPC-B-24 coupons were cleaned according to IPC-TM-650 §5.2.3. Solder paste was stencil printed onto the coupons and reflowed in a convection oven using the standard AIM thermal profile WS-J for water-soluble paste. After 5-10 minutes of reflowing the coupons were cleaned under tap water at 55-58oC for 60-70 seconds and then rinsed under flow of deionized water for 40-50 seconds. The coupons were then dried for 90 minutes at room temperature.

TEST METHOD The test was carried out according IPC-TM-650 from §5.3.3 through §5.4.1.

PASS-FAIL CRITERIA # Reference Property Pass-Fail Criteria Result 1 IPC-TM-650 §5.5.1 Quality of control coupons >1E9 O at 96 and 168 h PASS 2 J-STD-004 §3.2.4.5.1 SIR of test coupons >1E8 O at 96 and 168 h PASS 3 IPC-TM-650 §5.5.2 Post-test visual inspection No dendrite growth or corrosion PASS CONCLUSIONS The results of the qualification tests indicate that the AIM WS 483 solder paste complies with the requirements of IPC TM-650, Method 2.6.3.3 for Surface Insulation Resistance (SIR). DATE: July 14, 2000 LAB TESTING BY: Anh Nguyen R&D Department

6

AIM-SIR WS 483 SOLDER PASTE page 2 of 2

TEST DATA

Control Initial 24 hours 96 hours 168 hours #1 A 2.51E+13 8.98E+11 9.15E+11 1.09E+12 B 5.03E+13 7.13E+11 7.29E+11 8.11E+11 C 1.00E+14 7.62E+11 7.62E+11 7.86E+11 D 5.03E+13 7.29E+11 6.17E+11 6.49E+11

#2 A 1.00E+14 8.38E+11 7.80E+11 8.75E+11 B 1.10E+14 6.45E+11 6.06E+11 6.29E+11 C 1.10E+14 5.95E+11 5.62E+11 5.65E+11 D 1.00E+14 5.35E+11 5.08E+11 4.86E+11


WS 483




End of File

7

Sn63 WS 483 Page: 2/7

Overexposure/Signs/Symptoms

Not available.

See Toxicological Information (section 11)

Remove dentures if any. Have conscious person drink several glasses of water or milk. INDUCEVOMITING by sticking finger in throat. Lower the head so that the vomit will not reenter the mouth andthroat. NEVER give an unconscious person anything to ingest. Seek medical attention.

Check for and remove any contact lenses. In case of contact, immediately flush eyes with plenty ofwater for at least 15 minutes. Get medical attention.

Prolonged and repeated contact with bare skin may cause irritation. Wash gently and thoroughly thecontaminated skin with running water and non-abrasive soap.

Allow the victim to rest in a well ventilated area. Seek medical attention.

Section 4. First Aid Measures

Eye Contact

Skin Contact

Inhalation

Ingestion

Hazardous Skin Contact MOLTEN METAL can cause SEVERE BURNS! In case of BURNS: DO NOT USE WATER. Cover withantiseptic ointment and steril gauze. Seek IMMEDIATE medical attention.

Hazardous Inhalation Fumes in high concentrations: May be harmful if inhaled. If the victim is not breathing, performmouth-to-mouth resuscitation. SEEK IMMEDIATE MEDICAL ATTENTION.

Not available.

Notes to Physician Not available.

Hazardous Ingestion

Not available

Combustible. (organic medium)

These products are carbon oxides (CO, CO2), nitrogen oxides (NO, NO2...). Some metallic oxides.

Not available.

Not available.

SMALL FIRE: Use DRY chemical powder.LARGE FIRE: Use water spray, fog or foam. NO water jet.

Combustible in presence of open flames and sparks.

Metallic part of product is nonflammable. The organic medium may burn if exposed to direct flame.

Non-explosive in presence of open flames and sparks, of shocks, of heat.


Section 5. Fire Fighting Measures

Flammability of the Product

Auto-Ignition Temperature

Flash Points

Flammable Limits

Products of Combustion

Fire Hazards in Presence ofVarious Substances

Explosion Hazards inPresence of VariousSubstances

Fire Fighting Mediaand Instructions

Special Remarks on FireHazards

Special Remarks onExplosion Hazards

Be sure to use an approved/certified respirator or equivalent.Protective Clothing (Fire)


Sn63 WS 483

Sn63/Pb37 WS 483

Not available.

Industrial applications: Electronics industry. Soldering

AIM INFOTRAC(North America): (800) 535-5053(International): (352) 323-3500AIM

9100 Henri-Bourassa eastMont rea l , Quebec, Canada, H1E 2S4, (514)494-2000

7/5/2001

Material Safety Data Sheet

Common Name

Supplier

Synonym

Material Uses

Manufacturer

Code

Validation Date

In Case ofEmergency

Section 1. Product and Company Identification

Product type Solder paste (Water Soluble) Version Number 4

1) Tin 7440-31-5 54-60 TWA: 2 (mg/m3) from OSHA (PEL) [United States][1997] INHALATION Respirable.TWA: 2 (mg/m3) from ACGIH (TLV) [United States][1994] INHALATION Respirable.

2) LEAD 7439-92-1 32-35 TWA: 0.05 (mg/m3) from ACGIH (TLV) [United States][1995] INHALATIONTWA: <0.1 (ppm) from NIOSH INHALATIONRespirable.

3) organic amine 102-60-3 1-5 ORAL (LD50): Acute: 3000 mg/kg [Rat].

Section 2. Hazardous Components

Name CAS # % by Weight Toxicity Data ( LC50/LD50, TLV)

Inhalation. Ingestion.

Emergency Overview

Section 3. Hazards Identification

Routes of Entry

Potential Acute Health Effects

Potential Chronic HealthEffects

Fumes and/or dusts produced by this product may be hazardous in case of inhalation.

This product may be hazardous in case of eye contact (irritant).

Fumes and/or dusts produced by this product may be hazardous in case of ingestion.

This product may be hazardous in case of skin contact (irritant, sensitizer). Skin inflammation ischaracterized by itching, scaling, reddening, or, occasionally, blistering.

Eyes

Skin

Inhalation

Ingestion

Physical State andAppearance

Solid. (Paste.)

WARNING!

Risk of cancer depends on duration and level of exposure. Do not get in eyes. Do not get in eyes, onskin or on clothing. Avoid contact with eyes. DO NOT ingest. Avoid breathing dust. Avoid prolongedor repeated contact with skin. Keep container closed. Use only with adequate ventilation. Avoidexposure during pregnancy. Wash thoroughly after handling.

Repeated exposure to toxic material may produce general deterioration of health by an accumulation inone or many human organs.

Medical ConditionsAggravated by Overexposure:

Fumes and/or dusts produced by this product may be hazardous in case of ingestion, of inhalation.This product may be hazardous in case of skin contact (irritant, sensitizer), of eye contact (irritant).


AIM-SIR. WS 483 SOLDER PASTE (DELAYED CLEANING) page 1 of 2

SIR Qualification Test Report for AIM WS 483 Solder Paste (Delayed Cleaning)

GENERAL REFERENCES Surface insulation test (SIR) for solder paste was carried out according to J-STD-004 and IPC-TM-650 method 2.6.3.3.

SAMPLES AND INSTRUMENTATION Solder Paste Sample: WS 483 Test Coupons: IPC-B-24 coupons Environmental Chamber: Thermotron SE-300 Electrical Testing Equipment: ASR SIR tester

SAMPLE PREPARATION IPC-B-24 coupons were cleaned according to IPC-TM-650 §5.2.3. Solder paste was stencil printed onto the coupons and reflowed in convection oven using standard AIM thermo-profile WS-J for water-soluble paste. After reflow, the coupons were left for 2 weeks at ambient conditions before cleaning under tap water at 55-58oC for 120 seconds. The coupons were then dried for 30 minutes at room temperature.

TEST METHOD The test was carried out according IPC-TM-650 from §5.3.3 through §5.4.1.

PASS-FAIL CRITERIA # Reference Property Pass-Fail Criteria Result 1 IPC-TM-650 §5.5.1 Quality of control

coupons >1E9 Ω at 96 and 168 h PASS

2 J-STD-004 §3.2.4.5.1 SIR of test coupons >1E8 Ω at 96 and 168 h PASS 3 IPC-TM-650 §5.5.2 Post-test visual inspection No dendrite growth or corrosion PASS CONCLUSIONS The results of the qualification tests indicate that the AIM WS 483 solder paste complies with the requirements of IPC TM-650, Method 2.6.3.3 for Surface Insulation Resistance (SIR).

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AIM-SIR. WS 483 SOLDER PASTE (DELAYED CLEANING) page 2 of 2

DATE: December 20, 2001 LAB TESTING BY: Anh Nguyen R&D TEST DATA

Control Initial 24 hours 96 hours 168 hours #1 A 1.10E+14 3.43E+10 2.27E+10 1.76E+10

B 1.10E+14 3.38E+10 2.30E+10 1.71E+10 C 1.00E+14 2.91E+10 2.17E+10 1.68E+10 D 1.00E+14 2.97E+10 2.26E+10 1.73E+10



WS 483-245 ( 2 weeks standing before cleaning) #1 A 5.03E+13 1.23E+09 2.82E+09 4.12E+09

B 1.00E+14 9.92E+08 3.63E+09 4.59E+09 C 1.10E+14 9.18E+08 3.63E+09 4.40E+09 D 1.10E+14 1.52E+09 3.48E+09 4.61E+09



End of File

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Hot Slump Resistance

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Wetting Comparison Dots of solder paste printed on copper traces and reflowed.

greater spread = better wetting

WS483

Competitive Water Soluble Solder Paste

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Figure 2. 1.27 mm package l

AIM Solder BGA Analysis The purpose of this analysis was to characterize and evaluate the ball structure of AIM Sn63 WS 483 solder paste on two different sized ball grid array packages. First, two devices were located which exhibited a 0.8 mm and 1.27 mm ball pitch. Next, corresponding Sn/Pb circuit boards were procured. As requested, the low soak spike profile seen below was utilized in the reflow of the populated circuit board. To ensure the correct reflow profile was being applied to the circuit board, an unpopulated test board was fitted with thermocouples and run through the reflow oven several times to optimize oven parameters.

Once the components were procured and the reflow profile achieved, the solder paste was applied to the circuit board via screen-printing. Stencil thickness for the 0.8 mm and 1.27 mm package was 6 mil and 4 mil respectively. Upon completion of screen-printing, the components were placed using an ERSA PL500A manual vision placement system. Finally, the samples were loaded into the Heller 1700W and reflow of the packages was achieved. Once the samples were produced, real time x-ray images were captured to evaluate the placement of the devices. Upon x-ray inspection, both devices correct placement was confirmed. Furthermore, both devices exhibited very minimal voiding as seen in Figure 2. Additionally, isometric images were capture to verify the collapse, first and second stage, of the BGA balls, and can be found in the comprehensive data portion of this report. Once x-ray analysis was completed, the samples were cut out of the board and mounted in encapsulating material for scanning electron microscopic (SEM) cross sectional analysis. Upon final curing of the encapsulant, the samples were polished to a plane corresponding to a row of BGA balls and etched in a diluted fluoroboric acid bath. The purpose of the etching process was to enhance the grain structure of the solder intermetallic interface and allow for easier visual identification.

Figure 1. Thermal Reflow Profile

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Upon etching in the fluoroboric acid bath, the samples were carbon coated in order to analyze with the SEM. Upon SEM inspection, the ball composition and physical characteristics were assessed and found to be of good quality. The intermetallic interface was also evaluated under high magnification, and while the thickness of the intermetallic regions differed in size between the two devices, the integrity of the zone was intact on both. The ball integrity, as illustrated in the image below, was excellent. Additional testing included elemental identification of the materials in and surrounding the intermetallic region using energy dispersive spectroscopy (EDS). The results of that analysis indicated no problems and can be found in the comprehensive data portion of this report.

In conclusion, the visual and elemental characteristics of the ball grid array interfaces on both packages were very near optimal. Validation of the thermal profile was provided by the lack of any significant voiding in either package, while cross sectional images of both packages show initial and final collapse of the solder balls.

Figure 3. Overall BGA Cross Sectional Image

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Fine Pitch Printing Without Slumping

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