spcb hdi manufacturing process flow - standardpcb powerpoint - spcb_hdi manufacturing process flow...
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![Page 1: SPCB HDI manufacturing Process Flow - StandardPCB PowerPoint - SPCB_HDI manufacturing Process Flow Author SPCB Created Date 9/27/2011 7:55:49 PM](https://reader031.vdocument.in/reader031/viewer/2022022510/5ad86ea87f8b9a3e578d64c5/html5/thumbnails/1.jpg)
Start
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![Page 2: SPCB HDI manufacturing Process Flow - StandardPCB PowerPoint - SPCB_HDI manufacturing Process Flow Author SPCB Created Date 9/27/2011 7:55:49 PM](https://reader031.vdocument.in/reader031/viewer/2022022510/5ad86ea87f8b9a3e578d64c5/html5/thumbnails/2.jpg)
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Pre-engineering
Pattern imaging
Etching
Laminating
Drilling
Cu plating
Hole plugging
Pattern imaging
Lamination
Laser Ablation
Mechanical drilling
Pattern imaging
Cu plating
Solder Mask
Surface Finished
Routing
Visual inspection
Electric test
Shipping
http://www.standardpcb.com
Email: [email protected]
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Pre-engineering
Pattern imaging
Etching
Laminating
Drilling
3http://www.standardpcb.com
Email: [email protected]
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Desmear
Cu plating
Hole plugging
Cu plating
Belt Sanding
http://www.standardpcb.com
Email: [email protected]
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Lamination
Laser Ablation
Mechanical drilling
Cu plating
Pattern imaging
5http://www.standardpcb.com
Email: [email protected]
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Solder Mask
Gold plating
Routing
Electrical test
Pattern imaging
http://www.standardpcb.com
Email: [email protected]
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* Raw material (Thin Core,Copper,Prepreg…...)
Raw Material Raw Material Raw Material Raw Material : : : : FRFRFRFR----4 (4 (4 (4 (Difuntional,TetrafuntionalDifuntional,TetrafuntionalDifuntional,TetrafuntionalDifuntional,Tetrafuntional))))Supplier Supplier Supplier Supplier : EMC ,Nan: EMC ,Nan: EMC ,Nan: EMC ,Nan----YaYaYaYaSheet sizeSheet sizeSheet sizeSheet size : 36: 36: 36: 36”*48*48*48*48” , 40, 40, 40, 40”*48*48*48*48” ,42,42,42,42”*48*48*48*48Core ThicknessCore ThicknessCore ThicknessCore Thickness : 0.003: 0.003: 0.003: 0.003”,0.004,0.004,0.004,0.004”,0.005,0.005,0.005,0.005”,0.006,0.006,0.006,0.006”
0.0080.0080.0080.008”,0.010,0.010,0.010,0.010”,0.012,0.012,0.012,0.012”,0.015,0.015,0.015,0.015”
0.0210.0210.0210.021”,0.031,0.031,0.031,0.031”,0.039,0.039,0.039,0.039”,0.047,0.047,0.047,0.047”
Copper Foil Copper Foil Copper Foil Copper Foil : 1/3 : 1/3 : 1/3 : 1/3 oz,1oz,1oz,1oz,1/2 /2 /2 /2 oz,1.0oz,1.0oz,1.0oz,1.0 oz,2oz,2oz,2oz,2 ozozozozPrepregPrepregPrepregPrepreg type type type type : 1080,2113,2116,1506,7628,7630: 1080,2113,2116,1506,7628,7630: 1080,2113,2116,1506,7628,7630: 1080,2113,2116,1506,7628,7630
http://www.standardpcb.com
Email: [email protected]
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1. Innerlayer (THIN CORE)
Laminate
Copper Foil
(Panel Size)
COPPER FOILCOPPER FOILCOPPER FOILCOPPER FOIL
Epoxy GlassEpoxy GlassEpoxy GlassEpoxy Glass
http://www.standardpcb.com
Email: [email protected]
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Photo ResistPhoto ResistPhoto ResistPhoto Resist
2. Dry Film Resist Coat
Etch Photoresist (D/F)
http://www.standardpcb.com
Email: [email protected]
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Photo ResistPhoto ResistPhoto ResistPhoto Resist
3. Inner Artwork Expose
Dry film
ArtworkArtworkArtworkArtwork
After ExposeBefore Expose
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4. Inner layer image Develop
Photo ResistPhoto ResistPhoto ResistPhoto Resist
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5. Inner Layer Etch
Photo ResistPhoto ResistPhoto ResistPhoto Resist
http://www.standardpcb.com
Email: [email protected]
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8. Lay-up Building
LAYER 2
LAYER 3
LAYER 4
LAYER 5
LAYER 1
LAYER 6
Layer 1
Layer 2
Layer 3
Layer 4
Copper Foil
Copper Foil
Inner Layer
Prepreg
Prepreg
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Email: [email protected]
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.
.
.
COPPER FOIL 0.5 OZ
Thin Core ,FR-4prepreg
COMP
S0LD.
prepreg
Thin Core ,FR-4prepreg
COPPER FOIL 0.5 OZSuperimposed with the steel
10101010----12121212層疊合層疊合層疊合層疊合
The hot plate press machine
COPPER FOIL 0.5 OZ
Thin Core ,FR-4prepreg
COMP
S0LD.
prepreg
Thin Core ,FR-4prepreg
COPPER FOIL 0.5 OZ
The hot plate press machine
Superimposed with the steel
• Superimposed with the steel
Typical of the multilayer structure of stacked plates and laminated
Superimposed with the steel
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Email: [email protected]
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14. Copper Reduction → Option
15. Belt Sanding → Option
http://www.standardpcb.com
Email: [email protected]
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16. Dry Film Lamination (Outer layer)
Photo
Resist
http://www.standardpcb.com
Email: [email protected]
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21. Build-up Layer Lamination
RCCRCCRCCRCC((((RRRResin esin esin esin CCCCoated oated oated oated CCCCopper opper opper opper foil)foil)foil)foil)
http://www.standardpcb.com
Email: [email protected]
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ArtworkArtworkArtworkArtwork
ArtworkArtworkArtworkArtwork
22. Conformal Mask
Before Exposure
After Exposure
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Email: [email protected]
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Mechanical Drill(P.T.H.)
Laser Microvia(Blind Via)
27. Mechanical Drill
http://www.standardpcb.com
Email: [email protected]
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29. Outerlayer Pattern imaging)
Dry Film Lamination)
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Email: [email protected]
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SPCB94V-0
R205
31. S/M Developing
32. Legend Printing
http://www.standardpcb.com
Email: [email protected]
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33. Electroless Ni/Au , HAL_lead free and Etc.
R205
SPCB94V-0
http://www.standardpcb.com
Email: [email protected]
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R205
34. Outline Profile and Electrical Testing
• HPCB• 94V-0
SPCB94V-0
http://www.standardpcb.com
Email: [email protected]
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R205
R205
36. Final Inspection
37. O.S.P. (Entek plus Cu_106A….) →Option
• SPCB• 94V-0
• SPCB• 94V-0
http://www.standardpcb.com
Email: [email protected]
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LASER BLIND & BURIED VIA LAY-UP
A = THROUGH VIA HOLE
B = BURIED VIA HOLE
C = One Level Laser Blind Via
LASER BLIND & BURIED VIA LAY-UP
BURIED VIA AND LASER BLIND VIA OPTION
D
C
C
D = Two Level Laser Via
CD
C
BBBB----STAGESTAGESTAGESTAGE
FR-4 Core
RCC
FR-4 Core
BBBB----STAGESTAGESTAGESTAGE
RCC
A BB A
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BURIED VIA LAY-UP
A = THROUGH VIA HOLE
B = BURIED VIA HOLE
C = BLIND VIA HOLE
D = BLIND HOLE MLB VIA
BLIND VIA LAY-UP
BLIND VIA SEQUENTIAL LAY-UP
A
B
B
A
R
E
S
I
N
B-STAGE
BLIND AND BURIED VIA OPTION
D
A
C
C
E
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Conventional PCB
FR-4
Build-up
Layer
Build-up
Layer
Photo-viaPhoto-Imageable Dielectric (PID)
FR-4
Conventional PTH
Conventional PTH
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Conventional PCB
Blind Via PCBPTH
3 mil line
SVHIV
H
Chip-on-
SVH
FR-4
Conventional PTH
Conventional PTH
http://www.standardpcb.com
Email: [email protected]