specification - egloospds13.egloos.com/pds/200907/24/46/pcl-c6wwcz33sc.pdf · 2009. 7. 23. · the...

The World best semiconductor

PCL-C6WWCZ33SC KQSP-LL-3209 (Rev. 07)

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SPECIFICATION

ITEM WARM WHITE TOP VIEW LED

MODEL PCL-C6WWCZ33SC

CUSTOMER

ISSUED DATE

S U P P L I E RDrawn by Checked by Approved by

/ / /

C U S T O M E RApproved by Approved by Approved by

/ / /

POWERLIGHTEC Co., LTD.110-1 Galgot - ri, Jinwy - myun, Pyeongtaek-si, Kyunggi – do, Korea

Tel : +82-31-379-5400 Fax : +82-31-378-9759http : //www.powerlightec.com



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C O N T E N T S

1. Revision history

2. General Description

3. Electro-Optical Characteristics

4. Ranks

5. Composition of Package

6. Environmental pollution free

7. Typical Electrical

/ Optical Characteristics Curves

8. Classification by name

9. Reliability

10. Soldering Condition

11. Reel Packing Structure

12. Precaution for Use



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Title Specification for Approval

Doc. No. KQSP-LL-3209

Rev. No. Date Summary of revision Remarks

00

01

01

03

04

05

06

07

2003.07.

2004.10.

2004.12.

2006.04.

2007.11

2008.02

2008.10

2009.07.

New establishment

New Chromaticity Coordinates ranks

Appliance Pb free material

Document registration number change

Revised All Sheets

Model name, Outline Dimensions, Ranks

Model name, Chromaticity Coordinates,

Precaution for Use

Chromaticity Coordinates

1. Revision history



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2. General Description

• Package Size : 5.4 × 5.0 × 1.6mm • SMD (Top View) type • Very wide viewing angle • Diffusion lens type • Chip material based on InGaN • High luminous Intensity • Long life time • ESD protection (Level 2 under 2KV)

(2) Outline Dimensions

(1) Features

UNIT : mm



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(1) Absolute Maximum Rating

Parameter Symbol Value Unit

Forward Current IF 90 ㎃

Peak Forward Current ♦ IFP 300 ㎃

Reverse Voltage VR 5 V

Power Dissipation PD 360 ㎽

Operating Temperature Topr -40 to +85 ℃

Storage Temperature Tstg -40 to +100 ℃

Soldering temperature Tsol Reflow soldering : 260℃, 10 secHand Soldering : 350℃, 3 sec

(Ta=25℃)

♦ Duty Ratio ≤ 1/10, Pulse Width ≤ 10 msec

(2) Electrical / Optical Characteristics

Parameter Symbol Condition Min Typ Max Unit

Forward Voltage VF IF=60㎃ - 3.2 3.6 V

Reverse Current IR VR=5V - - 10 ㎂

Luminous Intensity ■ IV IF=60㎃ 3,500 5,000 - mcd

Viewing Angle ★ 2θ1/2 IF=60㎃ 100 120 140 deg.

Chromaticity coordinates - IF=60㎃ -X : 0.43Y : 0.42

-

■ Luminous intensity is measured with a light sensor and filter combination that approximatesthe CIE eye-response curve. Please refer to rank table.

★ θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

(Ta=25℃)

3. Electro-Optical Characteristics



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4. Ranks

(1) Luminous Intensity Ranks

(2) Forward Voltage Ranks

※Measurement Uncertainty of the Luminous Intensity : ± 10%

VF Rank Condition Min Typ Max Unit

A

IF=60㎃

2.8 - 3.0

VB 3.0 - 3.2

C 3.2 - 3.4

D 3.4 - 3.6

※Measurement Uncertainty of the Forward Voltage : ± 0.07V

(Ta=25℃)

(Ta=25℃)

Iv Rank Condition Min Typ Max Unit

A

IF=60㎃

3,500 - 4,000

mcd

B 4,000 - 4,500

C 4,500 - 5,000

D 5,000 - 5,500

E 5,500 - 6,000

F 6,000 - -



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4. Ranks

(3) Chromaticity Coordinates ranks : IF =60mA (Ta=25℃)

※Measurement Uncertainty of the Color Coordinates : ± 0.01

Rank name Rank table

D rank( 5,950K ~ 7,500K)

1X 0.2923 0.2963 0.3047 0.3017

Y 0.3420 0.3263 0.3346 0.3510

2X 0.2963 0.3004 0.3077 0.3047

Y 0.3263 0.3103 0.3179 0.3346

3X 0.3004 0.3045 0.3108 0.3077

Y 0.3103 0.2942 0.3010 0.3179

4X 0.3017 0.3047 0.3131 0.3110

Y 0.3510 0.3346 0.3425 0.3595

5X 0.3047 0.3077 0.3151 0.3131

Y 0.3346 0.3179 0.3252 0.3425

6X 0.3077 0.3108 0.3173 0.3151

Y 0.3179 0.3010 0.3077 0.3252

7X 0.3110 0.3131 0.3220 0.3209

Y 0.3595 0.3425 0.3505 0.3680

8X 0.3131 0.3151 0.3231 0.3220

Y 0.3425 0.3252 0.3327 0.3505

9X 0.3151 0.3173 0.3242 0.3231

Y 0.3252 0.3077 0.3145 0.3327

E rank(4,900K ~ 5,950K)

1X 0.3209 0.3220 0.3312 0.3312

Y 0.3680 0.3505 0.3584 0.3763

2X 0.3220 0.3231 0.3313 0.3312

Y 0.3505 0.3327 0.3401 0.3584

3X 0.3231 0.3242 0.3314 0.3313

Y 0.3327 0.3145 0.3213 0.3401

4X 0.3312 0.3312 0.3406 0.3415

Y 0.3763 0.3584 0.3659 0.3841

5X 0.3312 0.3313 0.3397 0.3406

Y 0.3584 0.3401 0.3473 0.3659

6X 0.3313 0.3314 0.3388 0.3397

Y 0.3401 0.3213 0.3280 0.3473

7X 0.3415 0.3406 0.3498 0.3515

Y 0.3841 0.3659 0.3729 0.3912

8X 0.3406 0.3397 0.3480 0.3498

Y 0.3659 0.3473 0.3539 0.3729

9X 0.3397 0.3388 0.3461 0.3480

Y 0.3473 0.3280 0.3343 0.3539



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4. Ranks




E rank(4,100K ~ 4,900K)

1X 0.3515 0.3498 0.3594 0.3620

Y 0.3912 0.3729 0.3797 0.3982

2X 0.3498 0.3480 0.3567 0.3594

Y 0.3729 0.3539 0.3606 0.3797

3X 0.3480 0.3461 0.3539 0.3567

Y 0.3539 0.3343 0.3407 0.3606

4X 0.3620 0.3594 0.3699 0.3734

Y 0.3982 0.3797 0.3866 0.4052

5X 0.3594 0.3567 0.3662 0.3699

Y 0.3797 0.3606 0.3674 0.3866

6X 0.3567 0.3539 0.3625 0.3662

Y 0.3606 0.3407 0.3474 0.3674

7X 0.3734 0.3699 0.3807 0.3850

Y 0.4052 0.3866 0.3932 0.4117

8X 0.3699 0.3662 0.3761 0.3807

Y 0.3866 0.3674 0.3740 0.3932

9X 0.3662 0.3625 0.3714 0.3761

Y 0.3674 0.3474 0.3540 0.3740

F rank(3,420K ~ 4,900K)

1X 0.3850 0.3807 0.3927 0.3979

Y 0.4117 0.3932 0.4000 0.4183

2X 0.3807 0.3761 0.3873 0.3927

Y 0.3932 0.3740 0.3809 0.4000

3X 0.3761 0.3714 0.3816 0.3873

Y 0.3740 0.3540 0.3609 0.3809

4X 0.3979 0.3927 0.4045 0.4104

Y 0.4183 0.4000 0.4059 0.4239

5X 0.3927 0.3873 0.3983 0.4045

Y 0.4000 0.3809 0.3871 0.4059

6X 0.3873 0.3816 0.3917 0.3983

Y 0.3809 0.3609 0.3673 0.3871

7X 0.4104 0.4045 0.4168 0.4234

Y 0.4239 0.4059 0.4114 0.4290

8X 0.4045 0.3983 0.4096 0.4168

Y 0.4059 0.3871 0.3928 0.4114

9X 0.3983 0.3917 0.4025 0.4096

Y 0.3871 0.3673 0.3735 0.3928



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4. Ranks




H rank(2,900K ~ 3,420K)

1X 0.4234 0.4168 0.4290 0.4362

Y 0.4290 0.4114 0.4161 0.4333

2X 0.4168 0.4096 0.4214 0.4290

Y 0.4114 0.3928 0.3982 0.4161

3X 0.4096 0.4025 0.4134 0.4214

Y 0.3928 0.3735 0.3791 0.3982

4X 0.4362 0.4290 0.4408 0.4486

Y 0.4333 0.4161 0.4200 0.4367

5X 0.4290 0.4214 0.4327 0.4408

Y 0.4161 0.3982 0.4026 0.4200

6X 0.4214 0.4134 0.4241 0.4327

Y 0.3982 0.3791 0.3841 0.4026

7X 0.4486 0.4408 0.4528 0.4610

Y 0.4367 0.4200 0.4233 0.4394

8X 0.4408 0.4327 0.4442 0.4528

Y 0.4200 0.4026 0.4065 0.4233

9X 0.4327 0.4241 0.4351 0.4442

Y 0.4026 0.3841 0.3885 0.4065

I rank(2,450K ~ 2,900K)

1X 0.4610 0.4528 0.4648 0.4734

Y 0.4394 0.4233 0.4259 0.4414

2X 0.4528 0.4442 0.4558 0.4648

Y 0.4233 0.4065 0.4097 0.4259

3X 0.4442 0.4351 0.4463 0.4558

Y 0.4065 0.3885 0.3924 0.4097

4X 0.4734 0.4648 0.4776 0.4866

Y 0.4414 0.4259 0.4279 0.4428

5X 0.4648 0.4558 0.4682 0.4776

Y 0.4259 0.4097 0.4123 0.4279

6X 0.4558 0.4463 0.4583 0.4682

Y 0.4097 0.3924 0.3958 0.4123

7X 0.4866 0.4776 0.4912 0.5005

Y 0.4428 0.4279 0.4290 0.4432

8X 0.4776 0.4682 0.4815 0.4912

Y 0.4279 0.4123 0.4142 0.4290

9X 0.4682 0.4583 0.4713 0.4815

Y 0.4123 0.3958 0.3986 0.4142



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4. Ranks

(4) Chromaticity Coordinates Graph : IF = 60mA



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5. Composition of Package

Number Item Material

1 Mold Resin Silicone

2 Electrodes Ag Plating Cu Alloy

3 Die adhesive Ag Epoxy or Silicone

4 LED Chip InGaN

5 Au Wire 1.0~1.2mil

(2) Component material

(1) Composition of Package



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6. Environmental pollution free

(1) Testing institute

: Korea Environment & Merchandise Testing Institute

(2) Test material

: LED-PCB ▶① Resin, ②Metal

① Resin Test

Test item Unit Result Test method

Pb mg/kg No detection ISO 6101-2 (AAS)EN 1122 (ICP)

ISO 3856/7 (AAS)ISO 3856/5

UV-Vis. Spectrophotometer

Cd mg/kg No detection

Hg mg/kg No detection

Cr+6 mg/kg No detection

②Metal Test

Test item Unit Result Test method

Pb mg/kg No detectionISO 4749-98ISO 5960-84

JIS H 1066-93ICP analysis methodISO 3613:2000(E)

Cd mg/kg No detection

Hg mg/kg No detection

Cr+6 ㎍/kg No detection



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7. Typical Electrical / Optical Characteristics Curves

25℃ Ambient Temperature Unless Otherwise Noted

■ Relative Luminous intensity vs. Wavelength■ Directivity

0

10

20

30

40

50

60

70

80

90

100

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5Forward Voltage_Vf [V]

Forw

ard

Current_

If [

mA

]

0

5

10

15

20

25

30

35

-20 0 20 40 60 80 100

Ambient Temperature (Ta)

Forw

ard

Cur

rent

(If)

30º

60º

50º40º

10º20º

70º

80º

0º

90º080 60 40 20100

Relative Luminosity Iv(%)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

0

30

60

90

120

150

180

210

240

270

300

Forward Current_If [mA]

Rel

ativ

e Lu

min

ous

Inte

nsi

ty

[ Iv

/Iv

(60m

A)

]

■ Forward Voltage Vs. Forward Current ■ Forward Current Vs. Relative Luminosity

■ Forward Current Derating Curve (per 1 chip) ■ Relative Luminosity Vs. Ambient Temperature



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8. Classification by name

(1) POWERLIGHTEC Lamp(2) PACKAGE TYPE

(3) EMITION COLOR

(4) LENS COLORA Colored Transparency C Colored Diffusion

B Colorless Transparency D Milky Diffusion

(5) ESD PROTECTION ( Zener Diode: Z / Varistor: V / No Protection: N )(6) NUMBER OF CHIP ( 1Chip: 1 / 2Chip: 2 / 3Chip: 3 / 4Chip: 4 / 5Chip: 5 )(7) NUMBER OF ZENER ( No Zener: 0 / 1Zener: 1 / 2Zener : 2 / 3Zener : 3 )(8) MOLD RESIN ( Epoxy: E / Silicone: S )(9) POLARITY MARK ( Anode: A / Cathode: C )

C0 P 1608 C/LED Package, T=0.3mm



C3 P 4014 Side View LED, T=0.8mm



C4 P 3528 Top View LED, T=1.9mm

C41 P 3528 TOP LED Transfer T=1.2mm

C42 P 3528 TOP LED Transfer T=0.9mm

C5 P 3020 Top View LED, T=1.3mm

C6 P 5450 Flash LED Package T=1.6mm

C61 P 5450 Flash LED Package T=0.9mm

C7 P 1615 Seven Color Package

C71 P 1612 Dual Color Package

C8 P Power LED Package (HB)

P1 P 1608 C/LED PCB Package T=0.4mm

S11 D 3810 Side View LED, T=0.8mm


S21 N 4011 Side View LED, T=0.8mm

S22 N 4011 Side View LED, T=0.6mm



T2 D 5450 Flat Type LED, T=0.9mm

T3 D 5450 Flat Type LED, T=1.3mm

T4 D 5450 Flat Type LED, T=1.3mm (2nd Ver.)

PM80 D 8080 Metal Power Package

PD13 D 1314 Dragon EYE Power Package

N : New ProductP : ProductD : Develop Product

PART NO. : PCL - □XX X□ □ □ □ □ □ □

(1) (2) (3) (4) (5) (6) (7) (8) (9)

B C SB G Y O A R

Blue Cyan Sky Blue Green Yellow Orange Amber Red

CW WW PW YG D RGB I

Cool White Warm White Pink White Y-Green Dual R, G, B Infrared



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9. Reliability

(1) Test items and results

(2) Criteria for judging the damage

Item Symbol Test ConditionsCriteria for Judgment

Min. Max.

Forward VoltageReverse Current

Luminous Intensity

VFIRIV

IF=60mAVR=5V

IF=60mA

--

L.S.L.**) × 0.7

U.S.L.*) × 1.1U.S.L.*) × 2.0

-

*) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level

Test Item StandardTest Method Test Conditions NoteNumber

of Damaged

Resistanceto Soldering Heat

(Reflow Soldering)MIL-STD-105D Tsol=260℃, 10sec.(Pre treatment 30℃, 70%, 168hrs.) 2 times 0/20

Solderability(Reflow Soldering) MIL-STD-105D Tsol=215±5℃, 3sec.

1 timeover 95% 0/20

Temperature Cycle MIL-STD-105D -40℃ ~ 25℃ ~ 100℃ ~ 25℃30min. 5min. 30min. 5min.100

cycles 0/20

High TemperatureStorage MIL-STD-105D Ta=100℃ 1000 hrs. 0/20

Humidity HeatLoad MIL-STD-105D Ta=60℃, RH=90% 1000 hrs. 0/20

Low TemperatureStorage MIL-STD-105D Ta=-40℃ 1000 hrs. 0/20

Life TestCondition 1 MIL-STD-105D Ta=25℃, IF=60mA 1000 hrs. 0/20

Life TestCondition 2 MIL-STD-105D Ta=25℃, IF=90mA 500 hrs. 0/20

High TemperatureLife Test Ta=85℃, IF=15mA 1000 hrs. 0/20

High HumidityHeat Life Test 60℃, RH=90%, IF=45mA 500 hrs. 0/20

Low TemperatureLife Test Ta=-40℃, IF=60mA 1000 hrs. 0/20



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10. Soldering Condition

(2) Recommended Reflow Soldering profile

(1) Soldering condition

Reflow soldering Hand soldering

Step Lead solder Lead free Solder Condition Spec.

Pre heating 120~150 ℃ 180~220 ℃Soldering Temp. Max 300℃

Pre heating time Max 120 sec. Max 120 sec.

Peak temp. Max 240 ℃ Max 260 ℃Soldering Time Max 3sec.

Soldering time Max 10 sec. Max 10 sec.

◈ Lead Solder ◈ Lead Free Solder

(3) Recommended Soldering pattern

(4) Soldering Cautions • Modifications should not be done after the LEDs have been soldered.

• If modifications cannot be avoided, a double-head soldering iron should be used after

checking whether the characteristics of the LEDs will not be damaged by modificationafter soldering.

• Reflow soldering, do not apply force to the package during heating.

• After soldering, do not warp the circuit board.

2.5 2.51.9

0.2

1.4

1.4

4.6

6.9



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(1) Carrier tape & Reel dimensions




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(2) Packing & Packaging

• Reel • Label

• Aluminum bag(in a Reel)

DVD : PCL-XXXXXIV : OO ~ OO mcdVf : OO ~ OO VColor Code : XXX rankLot No. : XXXXX Q’ty : OOOO eaWD : 2007 . 11 . 11

DVD : PCL-XXXXXIV : OO ~ OO mcdVf : OO ~ OO VColor Code : XXX rankQ’ty : OOOO eaLot No. : XXXXXXXXXXXX

• Inner Box • Outer Box ( in 8ea inner boxes)

DVD : PCL-XXXXXIV : OO ~ OO mcdVf : OO ~ OO VColor Code : XXX rankQ’ty : OOOO eaLot No. : XXXXXXXXXXXX




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(1) Moisture-proof Package

(3) Heat Generation

• Heat generation must be taken into design consideration when using the LEDs. The coefficient of temperature increase per input electric power is about 0.62℃/mW at the LED’s active layer.This coefficient will be affected by the heat resistance of the circuit board and by dense mounting of the LEDs.At the same time, precautions must be taken into the design of circuitry to avoid intense heat generation. Properdesigns which allow radiation of heat, etc. may be needed.

• The operating current should be decided after considering the ambient maximum temperature when the LEDs

are illuminating.

(4) Static Electricity• Static Electricity and surge damages the LEDs.

It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs.

• All devices, equipment and machinery must be properly grounded.

• When inspecting own final products on which LEDs were mounted, it is recommended to check also whether

the mounted LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by lightemission test at lower current (below 1 mA is recommended).

• Damaged LEDs will show some unusual characteristics such as leak current remarkably increases, starting

forward voltage becomes lower, or the LEDs get unlighted at the low current.

• Storage Condition- Before opening the package : The LEDs should be kept at 5~30℃, 65%RH or less.- After opening the package : The LEDs should be kept at 5~30℃, 30%RH or less.

• The LEDs should be soldered within 168 hours(7days) after opening the package.

• If unused LEDs remain, they should be stored in moisture proof package, such as sealed containers with package

of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moistureproof bag and to reseal the moisture proof bag again

• If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time ,

baking treatment should be performed using the following conditions- Baking treatment : more than 24 hours at 65 ± 5℃


• When moisture is absorbed into the LEDs it may vaporize and expand during soldering.There is a possibility that this can cause the exfoliation of the contacts and the damage the optical characteristics

of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package.

• The Moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent

material (Silica gel) is inserted into the aluminum moisture proof bag.

(2) Storage



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(5) Cleaning

• Use Isopropyl Alcohol as a solvent for cleaning the LEDs. Using other solvents may dissolve the LED package and the epoxy. Caution is needed.Ultrasonic cleaning of the LEDs should not be done.

(6) Others

• Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using LEDs with matrix drive.

• The electrode sections are plated with silver. Those will become discolored by contact with corroded gas etc.

Precautions must be taken to maintain a clean storing atmosphere.

• The LEDs light output is strong enough to injure human eyes. Precautions must be taken to prevent looking

directly at the LEDs with unaided eyes for more than a few seconds.

• These LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as

office equipment, communications equipment, measurement instruments and household appliance). Consult POWERLIGHTEC’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health.(such as airplanes, aerospace, automobiles, traffic control equipment, life support systems and safety devices)

• User shall not reverse engineer by disassembling or analysis of the LEDs without having the prior written

consent of POWERLIGHTEC. When defective LEDs are found, User shall inform to POWERLIGHTEC directly before disassembling or analysis.

• The formal specifications must be exchanged and signed by both parties before large volume purchase begins.

• The appearance and specifications of the product may be modified for improvement without notice.


슬라이드 번호 1슬라이드 번호 2슬라이드 번호 3슬라이드 번호 4슬라이드 번호 5슬라이드 번호 6슬라이드 번호 7슬라이드 번호 8슬라이드 번호 9슬라이드 번호 10슬라이드 번호 11슬라이드 번호 12슬라이드 번호 13슬라이드 번호 14슬라이드 번호 15슬라이드 번호 16슬라이드 번호 17슬라이드 번호 18슬라이드 번호 19슬라이드 번호 20

specification - egloospds13.egloos.com/pds/200907/24/46/pcl-c6wwcz33sc.pdf · 2009. 7. 23. · the...

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