PARMI CO., LTD.Daeduk Atomic Valley 461-63Jeonmin-dong, Yuseong-gu, Daejeon, 305-811, KOREA www.parmi.com parmi@parmi.comTEL. +82-42-478-9900 FAX. +82-42-478-9905

SPI HS60TM

3D solder paste inspection System

Specifications

FunctionalityHS60 HS60L

Measuring PrinciplePaste Type SupportedBoard Type SupportedOffline TeachingSPC & Process MonitoringSystem DiagnosisCamera SystemScan ResolutionLateral ResolutionHeight ResolutionMax. Paste HeightMax. Paste SizeMin. Paste SizeMin. Paste PitchInspection Type

Inspection SpeedHigh ResolutionHigh Speed

Load, Unload TimeHeight RepeatabilityArea RepeatabilityVolume RepeatabilityHeight AccuracyGage R&RMaximum Board SizeMinimum Board SizeMaximum Board WeightMaximum Board WarpBoard ThicknessBoard Edge Clearance (Top/Bottom)Underside ClearanceTopside ClearanceDimensions (W D H)WeightConveyor Speed RangeConveyor HeightFlow DirectionConveyor Reference SideConveyor SystemX-Y-Z robotComputerOperating SystemDisplayInputEnclosureSuppliesData Input TypeBoard InterfaceBarcode (option)

Laser Optical TriangulationAll (Pb or Pb Free)All colors and All pad finishesGerberWorksSPCworksSPImanagerHigh frame rate C-MOS sensor, 18x18 pixel resolution20 18 0.2 1000 20 20 mm200 200 150 Height, Area, Volume, Offset, Bridge30 sq.cm/sec60 sq.cm/sec1 sec3 Sigma < 1.5 , on a certification target3 Sigma < 3%, on a certification target3 Sigma < 3%, on a certification target3 , on a certification targetLess than 10 %390 260 mm 550 510 mm50 50 mm1.0 kg 1.3 kg

5 mm0.4 to 4 mm2.5 / 3 mm25 mm25 mm 15 mm900 1000 1450 mm 1060 1285 1450 mm750 kg 1000 kg300 - 500 mm/sec890 - 940 mmLeft Right or Right LeftSelectable when ordering1 conveyorsSensor head move in X-Y-Z AxisPentium IV 3.0GHz, 4GB MemoryMS-Windows XP Professional17" LCDMouse, KeyboardConforms to CE regulationsAC 220V, 5 kgf/sq.cmGerber (RS-274X)SMEMA1D, 2D

Measurement

Inspection Performance

Board Specification

System Dimensions

Hardware System

Interface

SPI HS60 SPI HS60

The most reliable and accurate 3D dataOur innovative 3D laser triangulation sensor, the RSCTM profilesreal shape of features and also provides highly robust 3D dataagainst considerable variations of PCB color and finishingcondition, solder material, paste shape, and warpage.

This highest quality of 3D data backs up top level performanceof SPI HS60 system concerning about the reliability andaccuracy. This high performance is due to PARMI's uniquesignal processing technology that is implemented as hardwarelogic.

The utmost inspection speedBy virtue of the affordable profiling speed of the 3D sensor, theSPI HS60 system provides 100% whole pads inspection in evenfast assembly lines.

The lateral resolution is set at 18 along the Y axis directionand the scan resolution along the X axis is set at 20 . Thisprovides the system enables to inspect an area of 60 persecond. This utmost inspection speed with best quality 3D datadifferentiates the SPI HS60 system from other systems andleads the SPI HS60 system to the top level.

Authentic inspection and measurementwith no false callOur intelligent vision algorithm applied to the high quality 3Ddata detects every kind of solder paste defects. The measurableitems are height, area, volume, and positional offset that deviatefrom tolerance limits. And also the algorithm detects bridgedpads in a very reliable manner.

The remarkable design concept such as rotating the laser sheetbeam against the scan direction and maintaining the smallangle between laser sheet beam and camera optical axis fornegligible shadow effect secure much better performance forrepeatability and accuracy.

Even for small CSPs and fine pitch QFPs, the Gage R&R is muchless than 10% for both height and volume data.

Fast job change and easy operationThe inspection job change consists of two stages. First stage ismaking a teaching file. Teaching process using GerberworksTM

takes normally less than a half hour even in the case of complexPCBs. The Gerberworks inputs the industry standard RS-274Xformat file to prepare a hierarchy of information on a pad,component, and array board level that are used during a PCBinspection. For the component level measurement and analysis,some CAD and BOM files can be imported. Teaching processusing Gerberworks is done off-line. And machine setting suchas tolerance setting, that is second stage, only requires 10minutes. This extremely short job change time save customer'svaluable time.

The user interface of inspection program SPIworksTM is based onthe voice of able field engineers, therefore it features intuitionand easiness to field engineers. And the UI also provides diverseand useful functions for printing process monitoring andanalysis.

-X-bar & Variance chart-Measured data list-3D Shape viewer-Defect Image List-Offset graph

Clear and prompt insight into printing processNot only to detect defect, but also to help customer to controlprinting process is another important role of the inspectionsystem. Besides the independent SPC program SPCworks, theSPCworks embeds very intuitive SPC functions for fieldoperator's prompt treatment on screen printer.

Coloring amplitude of measured data, sigma values, and defectfrequencies on every pad in the main viewer gives operators getprompt insight into printing process. And also the X-bar &variance chart let operator monitor and understand entireprinting process with ease. Operator's correct treatment couldprevent defect and secure quality of printing process. We knowthat it is PARMI's unique and elegant attitude to move one morestep toward valuable and useful machine for customers.

Defect verification and reviewThe detected defects are possible to be identified by DefectAnalyzer such as details of defect panels, measured data ofdefect pads, 2D and 3D images of defect pastes. Moreover,defect analysis work can be easily done by configuring defectanalysis conditions to list only wanted defect items.