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Preliminary Specification Sheet Viavi Optical Security and Performance Products (OSP) and ESPROS Photonics Corp (EPC) have collaborated to provide customers with a development kit for a family of novel, high performance spectral sensors and imagers currently in early market test and development. The kit includes the spectral sensor, various illumination sources, a computer interface, and user software to control the sensor and collect data. Two versions of the kit are available: VIS – Broadband visible: 400 – 900 nm, 64 channels NIR – Silicon-NIR: 775 – 1075 nm, 64 channels The kit is intended for customers interested in developing applications for multispectral sensing, or customers who want to evaluate this new sensor technology for applications they have already developed on other platforms. Key Benefits USB dongle configuration with various light sources and snap-off sensor board GUI (graphical user interface) software for control, configuration, and data capture Two versions available—Broadband visible and Silicon-NIR Applications Color measurement Multispectral imaging Biometrics, health and fitness Ambient light analysis Characterization of food, feed, agricultural products, and pharmaceuticals Printing and photography Oil and fuel quality analysis Process control Factory automation Graphics SPM64 Multispectral Sensor Developer Kit Developer kit for the Viavi-ESPROS Multispectral Sensor Multispectral Filter Array Multispectral Sensor Chip

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Page 1: SPM˜˚ Multispectral Sensor Developer Kit - VIAVI Solutions · Americas ˜˚ ˛˝˝ ˙ˆˇ ˘ ˛ˇ Europe ˜˘˘ ˚ ˘˝ ˛˚ ˆ˝ ˇ˚ Asia Pacific ˜˛ ˆ˚˙ ˆ ˛ ˆ E-mail msdeveloper@viavisolutions.com

Preliminary Specification Sheet

Viavi Optical Security and Performance Products (OSP) and ESPROS Photonics Corp (EPC) have collaborated to provide customers with a development kit for a family of novel, high performance spectral sensors and imagers currently in early market test and development.

The kit includes the spectral sensor, various illumination sources, a computer interface, and user software to control the sensor and collect data. Two versions of the kit are available:

VIS – Broadband visible: 400 – 900 nm, 64 channels

NIR – Silicon-NIR: 775 – 1075 nm, 64 channels

The kit is intended for customers interested in developing applications for multispectral sensing, or customers who want to evaluate this new sensor technology for applications they have already developed on other platforms.

Key Benefits

USB dongle configuration with various light sources and snap-off sensor board

GUI (graphical user interface) software for control, configuration, and data capture

Two versions available—Broadband visible and Silicon-NIR

Applications

Color measurement

Multispectral imaging

Biometrics, health and fitness

Ambient light analysis

Characterization of food, feed, agricultural products, and pharmaceuticals

Printing and photography

Oil and fuel quality analysis

Process control

Factory automation

Graphics

SPM64 Multispectral Sensor Developer KitDeveloper kit for the Viavi-ESPROS Multispectral Sensor

Multispectral Filter Array Multispectral Sensor Chip

Page 2: SPM˜˚ Multispectral Sensor Developer Kit - VIAVI Solutions · Americas ˜˚ ˛˝˝ ˙ˆˇ ˘ ˛ˇ Europe ˜˘˘ ˚ ˘˝ ˛˚ ˆ˝ ˇ˚ Asia Pacific ˜˛ ˆ˚˙ ˆ ˛ ˆ E-mail msdeveloper@viavisolutions.com

Americas +1 800 254 3684Europe +33 1 30 81 50 41Asia Pacific +86 512 6956 7895E-mail [email protected]

Americas +1 612 444 3600Europe +41 5 84 11 03 00Asia Pacific +86 150 2112 2587E-mail [email protected]

© 2017 Viavi Solutions Inc.msevaluationkit-ss-osp-ae-30179804 000 011317

Product specifications and descriptions in this document are subject to change without notice.

osp.viavisolutions.com

SpecificationsOptical Specification—VIS Specification—NIRWavelength range 387 – 903 nm 776 – 1064 nmNumber of channels 64 64FWHM (typical, normal incidence) 30 nm @ 400 nm; 17 nm @ 800 nm 1.5 nm @ 775 nm; 4nm @ 1054 nmMaximum recommended angle of incidence f/# of cone (min.)NA of cone (max.)

42 degreesf/0.750.67

20 degreesf/1.50.33

Filter configuration 8x8 8x8Filter pitch 110x110 microns 110x110 micronsActive sensor area 870x870 microns 870x870 micronsLight sources LEDs 1 each UV, blue, green, red, 850nm, 940nm, white, broadband NIRElectrical Specification—VIS Specification—NIRComputer interface USB Type A 2.0Detector CCD array 80x70 pixel, backside illuminated, 100% fill factorPower USB powered, 5V, 500mA maxIncluded remote cable 500 mm ribbon cableRemote trigger YesRemote light sources Up to 4 (in parallel)Mechanical Specification—VIS Specification—NIRDimensions – main board Approx. 40 x 69 x 6 mmDimensions – sensor board Approx. 17 x 8 x 3 mmDetachable sensor board Snap off and connect with included 500 mm ribbon cable

Software & User Interface Specification—VIS Specification—NIR

Bit depth 8 bits per channelOutput file format .csv data set with header containing event informationOutput file header content Sample ID, integration time, number of scans, timestamp, device IDOutput file data Wavelength, measured counts (0-255)Software API For automation and real-time analysis

Overview of Developer Kit Sensor BoardOverview of Developer Kit Sensor BoardOverview of Developer Kit Sensor BoardOverview of Developer Kit Sensor Board

USB

Snap-offSensor Board

Sensor

~40 mm

~69 mm

{ On-boardlight sources

Connector forexternal lightsources

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