Standards and SpecificationsThe Seven Wonders of Design Innovation

INTRODUCTION TO IPC & STANDARDIZATION

Minimum Standards Tool Kit

MaterialsSM-840 Solder maskFD-2231 Flex materialFD-2232 Coated materialMF-150 Copper foilCF-148 Coated copper foilCC-830 Conformal coatingSM-817 Adhesive4101 Rigid materials4104 HDI materials

WorkmanshipA-600 Printed boardA-610 Printed board assemblyR-700 Modification and repair

Quality AssessmentTM-650 Test methodsSPC 91909191 Generic9192 Base materials9193Board9194 Assembly

Design2221 Generic2222 Rigid2223 Flex2224 PCMCIA2225 MCM-L2226 HDI2227 Discrete wiring

Performance6011 Generic6012 Rigid6013 Flex6014 PCMCIA6015 MCM-L6016 HDI6017 Discrete wiring

Component Mounting7071 Generic7072 Through-hole7073 Standard SMT7074 Fine pitch7075 Array product7076 Chip scale7077 Chip wire bonding7078 Flip chip

AttachmentJ-STD-001 Soldering requirementsJ-STD-002 Solderability testing of partsJ-STD-003 Solderability of boardsJ-STD-004 Solder FluxJ-STD-005 Solder pasteJ-STD-006 Solid solder

Minimum Tool Kit

Membership Development PCB Manufacturers 382

EMS Companies 374

Suppliers 636

OEMs 753

Government/Others _198__Total 2,343

Companies

IPC Designers Council 1,100 Individuals

Major IPC Program Areas

• Management Programs• Industry Programs• Technical Programs• Education, Training & Certification• Market Research/Statistical

Programs

• Public Policy Advocacy

Technical Programs

• Standards & Specifications

• Technical Committees

• Activities with Other Organizations

• International Activities

• Current Major Initiatives

Standards & Specifications

• Standards, specifications and guidelines developed for PCB design, manufacture and assembly

• ANSI-Accredited Standards Developing Organization (SDO)

• Industry technology roadmaps

• Software Code Standards for Interoperability

Technical Programs

Technical Committees

• 21 General Committees• 160 Subcommittees and Task Groups

Consist of industry peers Started writing standards in 1959 (46 years

ago) Responsible for round robin test programs Managed by Technical Activities Executive

Committee (TAEC)

Technical Programs

Activities with Other Organizations

Membership and Active ParticipationNational Electronics Manufacturing Initiative

(NEMI) now iNEMIAmerican National Standards Institute (ANSI) Underwriters Laboratories (UL)

Technical Programs

Activities with Other Organizations

Joint Standards Activity Japan Printed Circuit Association (JPCA) Wiring and Harness Manufacturers Association

(WHMA) Electronic Industries Alliance (EIA) Joint Electron Device Engineering Council

(JEDEC) Jisso International Council (JIC)

Technical Programs

International Activities

Liaison “D” Status to IEC TC91 U.S. Technical Advisor (TA) IEC TC91 on

SMT Chairmanship of IEC TC91 on SMT Secretary, US TAG on IEC TC93 on EDA US TAG of ISO Task group on Solder

materials IPC standards internationally recognized

Technical Programs

Current Major Initiatives

• Optoelectronics • Lead-Free & Halogen Free issues• Embedded components• Wire Harness workmanship• Electronics enclosures• 2004/2005 International Technology

Roadmap• Material Declaration• Enterprise Communication Standards

Technical Programs

2002 - 2003 2004-2005

2004/2005

004/2005

A Global Membership+ 78% North America+ 11% Europe+ 9% Asia+ 2% Rest of World

Members in 47 Countries

IPC Membership Location

How Does the Standards Process Work?

Task groups develop drafts of new standards and resolve comments at IPC meetings

Participants represent their company Four stages to get comments from industry

Project Submission - TAEC approves form Working Draft - gets project started Proposal -solicits comments from industry Interim Final - resolves comments for

balloting

Standard Development Cycle

Industry Needs

Working Drafts

Proposal

Project Approval

Final Ballot

Expert review

Distribution

Terms and Definitions

Terminology is the key to good communication

IPC-T-50 initial release in 1965Next revision is “H” scheduled for 2007

Use of the Treutler Classification Code Builds on the standardization process Contains over 2000 terms Has international recognition

IEC 60194 – identical except spelling

Classification Code

1-Administration 2-Engineering and Design for elect. pkg 3-Components for electronic packaging 4-Materials for electronic packaging 5-Interconnect board fabrication processes 6-Types/performance for Interconnections 7-Assembly processes 8-Types/performance for assemblies 9-Quality/reliability for boards/assembly

Second Digit Family 6 ID 60-General terms 61-Rigid printed boards (organic) 62-Flexible printed boards (organic) 63-Flex-rigid printed boards (organic) 64-Discrete wiring boards (organic) 65-Inorganic printed boards (ceramic etc.) 66-Molded structures (three dimensional) 67-Hybrid/Multichip module structures 68-(Reserved for future expansion) 69-Other interconnecting structure terms

CC Description Examples

22. PRINTED BOARD AND PRINTED BOARD ASSEMBLY DESIGNContains terms related to printed board and printed board assembly. Includes, but is not limited to computer aided design (CAD) equipment and software algorithms, such items as design rule checks, direct input from CAE work stations, gate assignment or gate swapping, fixed grid snap-in, force field component manipulation, heat sensitivity analysis, multi-directional conductor routing etc.

77. REWORK, REPAIR AND MODIFICATIONContains terms related to the techniques, tools, materials and equipment used to remove, replace, or add components to an interconnecting structure, or to correct/change a circuit feature in the structure itself, and terms related to restoring the assembly to its proper function.

IPC-T-50 Published

Embedded Component 30.0436

A discrete or active component that is fabricated as an integral part of a printed board. (See Figure E-1.)

IPC-T-50 Published Discrete Component

30.0392A separate part of a printed board assembly that performs a circuit function, e.g., a resistor, a capacitor, a transistor,etc.

Active Device 30.0016An electronic component whose basic character changes while operating on an applied signal. (This includes diodes, transistors, thyristors, and integrated circuits that are used for the rectification, amplification, switching, etc., of analog or digital circuits in either monolithic or hybrid form.)

Passive Component (Element) 30.1468A discrete electronic device whose basic character does not change while it processes an applied signal. (This includes components such as resistors, capacitors, and inductors.)

Terms and Definitions

Terminology Blank * 41.1339

An unprocessed or partially processed piece of base material or metal- clad base material, that has been cut from a sheet or panel, that has the rough dimensions of a printed board. (See also ‘‘Panel.’’)

Panel * 41.1463A rectangular sheet of base material or metal-clad material of predetermined size that is used for the processing of one or more printed boards and, when required, one or more test coupons. (See also ‘‘Blank.’’)

Fabrication PanelA rectangular sheet of base material or metal-clad material of predetermined size that is used by a printed board manufacturer for the processing of one or more printed boards and, when required, one or more test coupons. (See also ‘‘Blank.’’)

Board * 60.0118see ‘‘Printed Board,‘‘ and ‘‘Multilayer Printed Board.’’

Printed Board (PB) * 60.1485The general term for completely processed printed circuit and printed wiring configurations. (This includes single-sided, double-sided and multilayer boards with rigid, flexible, and rigid-flex base materials.)

Terminology Multilayer Printed Board * 60.1227

The general term for a printed board that consist of rigid or flexible insulation materials and three or more alternate printed wiring and/or printed circuit layers that have been bonded together and electrically interconnected.

Finished Boardsee “Printed Board”

Finished PanelA rectangular sheet of base material or metal-clad material of predetermined size that is used for the processing of one or more printed board designs and, when required, one or more test coupons which is extracted from the fabrication panel to deliver to the customer or to the next level of fabrication. (see Assembly Pallet)

Assembly* 80.1327A number of parts, subassemblies or combinations thereof joined together. (Note: This term can be used in conjunction with other terms listed herein, e.g., ‘‘Printed Board Assembly’’)

Printed Board Assembly* 80.0911The generic term for an assembly that uses a printed board for component mounting and interconnecting purposes.

Array* 22.0049A group of elements or circuits arranged in rows and columns on a base material.

Terminology Printed Board Assembly Array

A group of assemblies, all of the same design, arranged in rows and columns on a panel.

Assembly PalletThe generic term for the assembly that uses a finished panel, as delivered from the board fabricator, of the same or different designs, for element and circuit component mounting and attachment to the board interconnections layers. The board arrangement on the pallet may be random or in the form of an array; the pallet may also include coupons for testing.

Hierarchy of IPC Design Standards

(2220 Series)

IPC-2222RIGID

IPC-2223FLEX

IPC-2224PCMCIA

IPC-2225MCM-L

IPC-2226HDI

IPC-2221GENERIC

IPC-2220

Hierarchy of Printed Board Performance Standards

(6010 Series)

IPC-6012RIGID

IPC-6013FLEX

IPC-6014PCMCIA

IPC-6015MCM-L

IPC-6016HDI

IPC-6011GENERIC

IPC-6010

Applicable IPC Standards

-SM-782; Land Pattern Considerations -7095; BGA Process Implementation -2315; HDI & Microvia Design Guide -SM-785; SMT Reliability Testing -D-279; Design for SMT Reliability J-STD-001; Soldering Requirements -A-610; Assembly Acceptability -6010; Printed Board Series J-STD-004/005; Solder Flux/Paste

Scope Example (land patterns)

This standard provides information on land pattern geometries used for surface attachment of electronic components. The intent of the information presented is to provide the appropriate size, shape and tolerance of surface mount land patterns to insure sufficient area for the appropriate solder fillet or solder volume. Also to allow for inspection, testing, and rework of those solder joints.

Scope (continued) Land pattern geometry may be different based on the type of soldering used to attach the electronic part, however land patterns are defined in such a manner that they are transparent to the process. Standard configurations are for manual designs & for computer-aided design. Parts are mounted on one or both sides, subjected to wave, reflow, or other type of soldering

Scope (continued) Although patterns are dimensionally defined and since they are a part of the printed board circuitry geometry, they are subject to the producibility levels and tolerances associated with plating, etching, assembly or other conditions. The producibility aspects also pertain to the use of solder mask and the registration required between the solder mask and the conductor patterns.

Performance Classes Three performance classes have been established to reflect progressive increases in sophistication, functional performance requirements and testing/ inspection frequency. There may be an overlap of equipment categories in different classes. The user is responsible to specify, in the contract or purchase order, the product performance class.

Class 1 - General Electronic Products

Includes consumer products, some computer and computer peripherals suitable for applications where cosmetic imperfections are not important and the major requirement is function of the completed printed board.

Class 2 - Dedicated Service Electronic Products

Includes communications equipment, sophisticated business machines, instruments where high performance and extended life is required and for which uninterrupted service is desired but not critical. Certain cosmetic imperfections are allowed.

Class 3 - High Reliability Electronic Products

Includes the equipment and products where continued performance or performance on demand is critical. Equipment downtime cannot be tolerated and must function when required such as in life support items or flight control systems. Applications where high levels of assurance are required and service is essential.

Interpretation“Shall,” the emphatic form of the verb, is used throughout this specification whenever a requirement is intended to express a provision that is binding. Deviation from a “shall” requirement may be considered if sufficient data is supplied to justify the exception.

The words “should” and “may” are used whenever it is necessary to express non-mandatory provisions.

“Will” is used to express a declaration of purpose. To assist the reader, the word “shall” is presented in bold characters.

Complexity Levels Land pattern determination methods:

Exact details based on component specifications, board manufacturing and component placement accuracy. The land patterns are restricted to a specific component, and have an identifying land pattern number

Equations used for new components or to alter the given information to achieve a more robust solder connection, when used in particular situations

Level A: Maximum

For low-density product applications, the 'maximum' land pattern condition have been developed to accommodate wave or flow solder of leadless chip devices and leaded gull- wing devices. The geometry furnished for these devices, as well as inward and “J”-formed lead contact device families, may provide a wider process window for reflow solder processes as well.

Level B: Median Products with a moderate level of component density should consider adapting the 'median' land patterns. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes. The condition should suitable for wave or reflow soldering of leadless chip and leaded gull-wing type devices.

Level C: Minimum

High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. Selection of the minimum land pattern geometry may not be suitable for all product use categories.

Combination of Issues

Performance classes 1, 2, and 3 are combined with that of complexity and density levels A, B, and C in defining electronic assembly conditions. As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations of performance and component density to understand fabrication and assembly requirements for manufacturing and end use environment.

Test Requirements

Prior to starting a design, a testability review meeting should be held with fabrication, assembly, and testing. Testability concerns, such as circuit visibility, density, operation, circuit controllability, partitioning, and special test requirements and specifications are discussed as a part of the test strategy

Test Requirements

During the design testability review meeting, tooling concepts are established, and determinations are made as to the most effective tool cost versus board layout concept conditions. During the layout process, any circuit board changes that impact the test program, or the test tooling, should be reported to determine the best compromise.

Board Test Requirements The testing concept should develop approaches that can check the board for problems, and also detect fault locations wherever possible. The test concept and requirements should economically facilitate the detection, isolation, and correction of faults of the design verification, manufacturing, and field support of the printed board assembly life cycle.

Assembly Testability The printed board assembly testability philosophy also needs to be compatible with the overall integration, testing and maintenance plans. This includes:

The factory testers to be usedHow integration and test is plannedWhen conformal coated is appliedDepot & field test equipment capabilityPersonnel skill level

Need for Automation Standards needed for design and assembly New concepts in Business process optimization

for competitiveness A need for lower operating costs in business and

Information Transfer (IT). Tight business alignment with IT is essential Development of internal and external Service Oriented

Architecture is needed in order to manage the new culture change.

Shorten product development cycles Increase product flexibility

Solutions require continuous monitoring of industry progress & infrastructure growth

IPC to IEC Deployment IPC-SM-782 provided by US to IEC Countries agree to standardize Japan found that one land pattern is

insufficient to design Sony Minicam™ assemblies

Discussions review principles of mathematical model – tighten requirements

Three geometries proposed for future IEC starts work on IEC-61188-5-1 thru -8 IPC supersedes SM-782A with IPC-7351 Computer model tested with PCB Libraries

IPC-7351 Land Pattern Variations

Density Level A: Maximum (Most) Land Protrusion - for low component density applications and products exposed to high shock or vibration. The solder pattern is the most robust and can be easily reworked if necessary.

Density Level B: Median (Nominal) Land Protrusion - for products with a moderate level of component density and providing a more robust solder attachment.

Density Level C: Minimum (Least) Land Protrusion - for miniature devices where the land pattern has the least amount of solder pattern to achieve the highest component packing density.

IPC-7351 Land Pattern Variations for Rectangular Two Terminal Devices

Density Level AVery Robust Solder Joint

Density Level BGeneral Purpose

Solder Joint

Density Level CMinimal Solder Joint

for High Density Applications

IPC-7351 Land Pattern Variations for Flat Ribbon ‘L’ and Gull Wing Leads

Density Level AVery Robust Solder Joint

Density Level BGeneral Purpose

Solder Joint

Density Level CMinimal Solder Joint

for High Density Applications

Ribbon Leads greater than

0.625

Ribbon Leads less than 0.625

J LeadedParts

RectangularSquare end

Terminations

Metal Electrical

Face

Bottom Only

Terminations

Leadless Chip Carriers

Inward L shapedLeads

Flat Lug Leads

Quad Flat No Lead

Small Outline No Lead

Design Considerations

Land pattern concepts Component selection Mounting substrate design Assembly methods Method of test Phototool generation Meeting solder joint requirements Stencil fixture requirements Providing access for inspection Access for rework and repair

Manufacturing Allowance

Manufacturing allowance must be considered in the design process The courtyard represents the starting point of the minimum area needed for the component and the land pattern Manufacturing, assembly and testing representatives should assist in determining the additional room needed to accommodate placement, testing, modification and repair

IPC-7351 Land Pattern Courtyard Determination

Component / pattern(maximum boundary)

Courtyard excess

Courtyard(minimum area)

Manufacturingallowance

Courtyard manufacturingzone

IPC-7351 Land Pattern Naming Convention

The numbering convention used in IPC-SM-782A was very basic

Fixed number range assigned to a specific component family (prone to exhaustion)

No intelligence embedded within them A new land pattern naming convention was designed for IPC-7351 to convey a number of attributes:

Component family prefix Component pin pitch Component body dimensions Component Pin Quantity Land Pattern Geometry

IPC-7351 Land Pattern Naming Convention Example

Using an 0.80 mm pitch Quad Flat Package (QFP), the IPC-7351 Land Pattern Naming Convention is as follows:

QFP80P+Lead Span L1 Nominal X Lead Span L2 Nominal – Pin Qty

where the + (plus sign) stands for “in addition to” (no space between the prefix and the body size),

the X (capital letter X) is used instead of the word “by” to separate two numbers such as height X width,

the – (dash) is used to separate the pin quantity, and the suffix letters “L”, “M” and “N” signify when the land

protrusion is at their minimum (least), maximum (most) or median (nominal) geometry variation.

IPC-7351 Land Pattern Naming Convention Example (cont’d)

QFP80P+1720 X 2320-80NTherefore, the above land pattern name conveys the following information:

The component family prefix of QFPThe component pin pitch of 0.80 mmThe component lead span nominal X = 17.20 mm for “1720”The component lead span nominal Y = 23.20 mm for “2320”The total component pin quantity of 80 pinsDensity Level B (Nominal) land pattern geometry

IPC-7351 Zero Component Rotations

IPC-7351 provides zero component rotations that are defined in terms of the standard CAD component library with respect to a given PCB design

Acknowledges that a single land pattern may be used for the same component part from different suppliers, all of whom may provide different orientations for tape or reel

Eliminates scenarios where a PCB designer loses the ability to reference a single land pattern when the zero component rotation is according to the method the component is delivered to the assembly machine

IPC-7351 Zero Component Rotations

IPC-7351 Land Pattern Software Suite

Part Selection

Nominal Library Search

Component Descriptions

Land Patterns

Land Patterns and Courtyards

Density Level A

Density Level B

Density Level C

Land Patterns and Courtyards

Density Level A

Density Level B

Density Level C

IPC-7351 Land Pattern Viewer

Shareware program included with IPC-7351 standard and available at www.ipc.org under “PCB Tools and Caculators”

Portability – doesn’t require a Web browser

Enhanced searching capabilities 1:1 relationship for components/graphics Easily updated through free download

of .p library files and program revisions

Building on the Standards

IPC website and listservs will provide feedback point for new land pattern generation

Developing CAD interfaces Incorporating the Concepts into

OffSpring (the child of GenCAM and ODB++) IPC-2581 (IEC 61182-2)

Beta testing to start end of 2005 Many CAD CAM companies

committed

IPC-2581 Beta Testing

Data extraction from CAD CAM step and repeat plus process

tolerance inclusion Design file review (Pad Stacks)

versus layered data Assembly information tied to CAD

libraries Provide updated viewer to industry Provide Gerber to 2581 converter

Function ModeName Full Design Fabrication Assembly Test

1 2 3 1 2 3 1 2 3 1 2 3

Hierarchical layer/stack instance files Y N Y N N N N N N N N N N

Hierarchical conductor routing files Y N Y N N N N N N N N N N

BOM (Components and Materials) Y Y Y Y Y Y Y Y Y Y N Y Y

AVL (Components and Materials) Y N Y Y N Y Y Y Y Y N N Y

Component Packages Y Y Y Y N N Y Y Y Y N Y Y

Land Patterns Y N Y Y N N Y N Y Y N Y Y

Device Descriptions Y Y Y Y N N N N N Y N N Y

Component Descriptions Y Y Y Y N N N Y Y Y N Y Y

Soldermask; Solder Paste Legend Layers

Y N N Y Y Y Y Y Y Y Y Y Y

Drilling and Routing Layers Y N N Y Y Y Y Y Y Y Y Y Y

Documentation Layers Y Y Y Y Y Y Y Y Y Y Y Y Y

Net List Y Y Y Y N Y Y N Y Y Y N Y

Outer Copper Layers Y N N Y Y Y Y Y Y Y Y Y Y

Inner Layers Y N N Y Y Y Y N Y Y N N Y

Miscellaneous Image Layers Y N Y Y N Y Y N Y Y N Y Y

DFX Analysis Y Y Y Y Y Y Y Y Y Y Y Y Y

Logistic Header

Indicates file owner as well as Approved Vendors

History Record

Configuration Management Section

Bill of Materials

One to many BOMs including one for Board Material

Approve Vendor List

One master list referenced to BOM item & enterprise

The Heart and Stamina

The Information Vessels

Step Description

Mandatory Requirements

The step functionsdefine the details of the electronicassembly. This includes the parts, conductors, net list, and DFX analysis.

The individual features

CAD

Library

Home for Land

Patterns

Detail Descriptions

LayerDesc includes:

BOARD BOARDPANEL ASSEMBLY ASSEMBLYARRAY COUPON DOCUMENTATION TOOLING MISCELLANEOUS

NIST Viewer

Gerber Conversion EvaluationOriginal File NIST Viewer

Next is conversion of Gerber Macros in “read me” file

IPC-25XX Certification Develop concept for matrix Examine D-350 and GenCAM test

plans Keep it simple Build on self declaration principles Establish legal documents for details Ask NIST software engineering for help

with portal development Examine using 3rd party consultants

Conclusions The standard is Alive and Well The cooperative efforts are winning New parts require continuous

monitoring The IPC/PCB Libraries

arrangement is a major benefit to the design community

The IPC list servers are a way to keep in touch