statement of work...11. inspection of connector mating on solar panels and shunt packages outside...

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Doc. No.QAG-QAED-EIQCS-SOW-0-01

Revision – 0

STATEMENT OF WORK FOR

SUBSYSTEM PACKAGE INSPECTION AND SPACECRAFT HARNESS

INSPECTION ACTIVITIES

ISRO SATELLITE CENTRE

INDIAN SPACE RESEARCH ORGANISATION

BANGALORE

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1 Introduction

Electrical Inspection & Quality Control section of Quality Assurance

Electrical Division of QAG is responsible for carrying out Quality Assurance

activities of subsystem packages and spacecraft electrical harness realization for

spacecrafts assembled, integrated and tested at ISAC. Since the management is

persuading realization of 12 spacecrafts per year it is required to outsource

various inspection, Quality control and documentation activities to a service

provider who has qualified and skilled manpower to realize onboard subsystem

packages and space craft electrical harness.

2 Scope

The different stages of electronic package fabrication and assembly and

harness fabrication are shown in flow chart-1, flow chart-2. Following

inspection stages are to be out sourced to external contract agency:

1. Card level fabrication audit 2. Package level fabrication audit 3. Package Clearance for vibration 4. Package Clearance for Assembly Integration and Testing Group 5. Harness fabrication audit at harness labs 6. Harness fabrication inspection activities at clean rooms

3 EIQCS responsibility for outsourcing QC inspection / audit work

1. Provide subsystem package / spacecraft harness for inspection. 2. Provide necessary inspection aids, equipments and tools. 3. Provide Checklists, inspection formats, work procedures and

fabrication documents. 4. Supervise & monitor the inspection and quality control activity. 5. Certification for work completion and payment on monthly basis.

4 Vendors responsibility

1. The contract agency shall recruit and sustain the technicians for the period of contract.

2. The contract agency shall Recruit Minimum Diploma (Electronics) qualified personnel.

3. All personnel shall have “Space Quality Electronics Fabrication Course” certificate conducted by PMPG, ISAC (Contractor shall produce proof regarding the qualification(s)). These personnel shall be deployed while initiating the work. For fresh candidates training & certification from PMPG ISAC is mandatory.

4. The fabrication inspection work mentioned in paragraph 5 is to be carried out under the overall supervision and guidance of EIQCS,

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QAED, QAG. In the event of unsatisfactory work performance from the contractor, the contract shall be terminated.

5. PERIOD OF CONTRACT: The contract will be initially for two years and may be extended for one more year on reviewing the performance. There should be continuity in work without break during the contract period.

6. PLACE OF WORK AND DURATION: The inspection work has to be carried out as and when the activity completes at CEFS / Clean rooms at ISAC & ISITE. The normal working hours on week days i.e Monday to Saturday is from 8.30 A.M. to 5.00 P.M (~26 Days a Month). However, during peak work load / panel closing activity in clean rooms, work has to be carried out beyond 5.00 P.M. on week days and also on holidays in shift pattern / extended working hours.

7. All security restrictions shall be strictly complied by the contract personnel.

8. The persons deputed to labs at ISAC shall not pass any data / information / test results to any outside party at any time during their contract period or thereafter.

9. The personnel shall use all equipment and tools with utmost care to ensure that there is no damage to the same.

10. The contract personnel shall inspect / audit The subsystem package / harness as per the wiring details / audit formats and checklists provided, which contains the specifications and parameters to be checked.

11. After completing the Inspection /audit, the contract personnel have to prepare inspection reports, fill audit formats and check lists.

12. The contract personnel have to report to Head, QAED or his authorized nominee

5 Work Details

5.1 Details of inspection procedures / activities during audit

5.1.1 Visual Inspection during audit:

During audit Visual examination / inspection of onboard assemblies and sub-assemblies

is carried out on 100% basis for processes like inspection of turret swaging,

components mounting, component solder joints, assembly cleaning, lacing, conformal

coating, potting, radiation shielding, crimping etc. These inspections will be carried out

as per the inspection standards and applicable documents specified in

1. Workmanship Standards for the Fabrication of Electronic Packages

Doc.No. ISRO-PAX-300

2. Card level audit check list :: QAG-QAED-EIQC-ASY-CHL-001

3. Package Level audit check list :: QAG-QAED-EIQC-ASY-CHL-002

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4. Card/Package Audit Certificate format :: QAG-QAED-EIQC-ASY-RPT-

001

5. Pre-certificate format :: PRE-CERT/001

6. Checklist for discrete component addition in harness :: QAG-QAED-

EIQC-HRF-CHL-020

7. Harness Audit Checklist :: QAG-QAED-EIQC-HRF-CHL-021

8. Panel Closure Checklist :: QAG-QAED-EIQC-HRF-CHL-022

5.1.2 Audit activity involves

1. Inspection with unaided / aided eye.

2. Record observations with respect to specifications

3. Perform Accept / Reject function

4. Record deviations if any.

5. Preparation of Card level / Package level / Harness fabrication

audit reports

6. QC data entry, documentation, etc,. Maintenance of

Documentation and records

5.2 Card level fabrication audit

Card level audit comprises of visual inspection of hardware,

verification of approval of fabrication documents, verification of process

history sheet, verification of inspection records & checklist, verification

of implementation of Rework Data Cards (RDC), checking the records

of Non conformances and implementation of MRB dispositions, waivers

and deviations. The card level audit stage is depicted in flow chart-1.

The card level audit shall be conducted as per card level audit checklist.

Quantum of work is depicted in Table -1.

5.2.1 Major Processes involving card level fabrication

1. Turret swagging/soldering

2. Component Mounting

3. Component Soldering

4. Card Cleaning

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5.2.2 Card level Audit for External vendors

5.2.3 Card level workmanship audit shall be carried out, for every subsystem package being fabricated.

5.2.4 The audit shall be carried out after completion of final assembly approval by vendor.

5.2.5 One card per package and all card level documentation shall be audited. Component Values, voltage, tolerance & established reliability data etc are to be checked.

5.3 Package level fabrication audit

Package level audit comprises of visual inspection of hardware,

verification of approval of fabrication documents, verification of process history

sheet, verification of inspection records & checklist, verification of implementation

of Rework Data Cards (RDC), recording of Non conformances and

implementation of MRB dispositions, recording of waivers and deviations. The

package level audit stage is depicted in the flow chart-1. The audit shall be

conducted as per checklist for package level inspection activities. Quantum of

work is depicted in Table -1.

5.3.1 Major Processes involving Package level fabrication Audit :

1. Selectable components mounting

2. Package wiring

3. Package lacing

4. Package cleaning

5. Conformal coating

6. Potting

7. Radiation shielding

The audit shall be conducted as per checklist for package level inspection.

5.3.2 Package level Audit for external vendors.

5.3.3 All Cards from Digital, controls, Power system packages are audited for workmanship.100% package documentation (including RDC’s) is to be audited.

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5.3.4 Clearance to Vibration

This stage is shown in flow chart-1 and shall be done as per QC checklist for vibration clearance. Quantum of work is depicted in Table -1.

5.3.5 Clearance to AIT

This stage is shown in flow chart-1 and shall be done as per QC checklist for AIT clearance. Quantum of work is depicted in Table -1.

5.4 Processes involving Harness fabrication inspection activities

5.4.1 Harness fabrication audit at harness lab.

Harness fabrication audit comprises of visual inspection of harness,

verification of approval of fabrication documents, verification of work sheets for

inspection records & checklist, checking the records of Non conformances and

implementation of MRB dispositions, waivers and deviations. The harness audit

stage is depicted in the flow chart-2. The harness audit shall be conducted as per

harness audit checklist. Quantum of work is depicted in Table -2.

5.4.2 Harness fabrication inspection activities

1. Inspection of modifications in harness & reworks involving

crimping of contact, Sleeve shrinking and Contact retention.

2. Inspection of heaters wiring with butt splice contact crimping /

soldering, sleeve shrinking.

3. Inspection of thrusters wiring.

4. Participation in wet probe test.

5. Harness routing inspection.

6. Inspection of clearance between packages and harness running

around the packages.

7. Inter panel wire harness inspection.

8. Wire routing inspection of heater wires, temperature sensors,

RCS, semi rigid cables, antenna, sensors heads, etc.

9. Routing of electrical ground wires from the shield splice formed on

the wire harness.

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10. Inspection of connector identification and mating to the

concerned packages.

11. Inspection of connector mating on solar panels and shunt

packages outside spacecraft.

12. Inspection of Harness Lacing, EMI taping, Teflon tapeing of the

wire harness.

13. Inspection of ESD grounding for harness.

14. Inspection and clearance of all panels before closure.

15. Online inspection of patch connector mating between panels and

spacecraft deck.

16. Inspection of MLI (Multi Layer Insulation over plumb lines,

battery, satellite, etc.) ground soldering.

17. Inspection of satellite ground reference plane (SGRP) grounding

(Wire routing, soldering, lacing, conformal coating).

18. Inspection of sun sensors wiring on solar panels.

19. D' Sub Connector and feed through potting inspection.

20. Potting of connectors that are fabricated after the closure of the

spacecraft panels.

21. Inspection of Eccobond of mechanical fasteners.

23. Others (as specified by the project).

Due care shall also be exercised during such inspection to avoid ESD

damage to electronic packages. All inspections shall be performed as per QC

checklist for harness fabrication. Quantum of work is depicted in Table -2.

6 Skill and educational qualification

Sl.No. Inspection Activity Qualification No. of personnel

1. Inspection / Audit of subsystem Package fabrication

Diploma in electronics

3

2. Spacecraft Harness fabrication Inspection/ Audit

Diploma in electronics

4

Total 7

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All personnel planed to be deployed shall have space quality electronic

fabrication training certificate issued by SRG, ISAC. Fresh candidates shall

undergo training program conducted by PMPG, RQA and can be deployed for

the activities only after successful completion of training and certification.

Mandatory educational qualifications / skills / Experience required.

1. Name of the person who will be deployed. If personnel are already deployed in other contractual work, No Objection Letter (to relieving them from current activity) from that contract manager should be attached along with the quote.

2. At least three personnel to be deployed should have already passed Space Quality Electronic Fabrication (SQEF) training course conducted by PMPG, ISAC. These names shall be submitted along with the offer which be verified using the internal records.

3. Educational Qualifications ( Minimum Diploma in Electronics Engineering). Proof which will be verified during selection of candidates.

4. Vendor shall have minimum of one year experience in execution of satellite electronic assembly fabrication / inspection activities. Proof of which should be submitted along with the offer.

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Table-1 Quantum of work for Subsystem Package Fabrication Inspection Activities

Sl.

no

Inspection activity Approx. work

quantity per annum

Number of

units per

annum

1. Card Level audit Activities

Verification of hardware (sample basis)

Verification of documents / reports for the following processes 100% o PCB cleaning / PCB baking o Turret Swagging & soldering o PTH filling o Component Mounting o Component soldering o Card cleaning o Clearance for F/T o Approval for final Assembly

360 cards

1800 Documents

2160

7200

2. Package Level audit Activities

100% Verification of hardware

100% Verification of documents / reports for the following processes o Selectable & on-box component

mounting o Selectable & on-box component

soldering o Package wiring o Package cleaning o Lacing o Conformal coating o Potting, doubler bonding, staking o Radiation shielding o Rework

360 Packages

360 Documents

1800

1800

3. Clearance for Vibration test

100% Verification of hardware for o Package number o Package connectors

100% Verification of documents / Package history for o RDC implementation o MRB recommendation

implementation o Clearance from RAED, RAMD &

Vendor

360 Packages

360 Documents

360

360

4. Clearance for AIT

100% Verification of hardware for o Package number identification

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Sl.

no

Inspection activity Approx. work

quantity per annum

Number of

units per

annum

o Connector identification o Package damages due to

handling

100% Verification of documents / for Package history clearance

o Clearance from RAED o Clearance from RAMD o Clearance from VENDOR

360 packages

360 Documents

1800

1800

5. Others (Miscellaneous) Pre-certificate preparation

- 720

Total Units 18,000

Total assembly area work units for two years = 36,000

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Table -2 Quantum of work for Harness Fabrication Inspection Activity

Sl.no. Inspection activity Approximate Quantity

of work per annum

Number of units

Per annum

1. Inspection of Contact Crimping, Contact Sleeve Shrinking & Contact Retention Test

24,000 Contacts 8000

2. Inspection of Ground Lug Shield Soldering & Sleeve Shrinking/ Hook soldering & sleeve shrinking/ SGRP / ESD / MLI ground / ground links soldering

1700 Joints 1700

3. Inspection of Rework / modifications inspection

3000 joints 1500

4. Ecco bonding & Potting(Selective)

600 connectors 600

5. Inspection of lacing, anchoring, tying, sleeving, protection of harness

2500 branches 5000

6. Butt splice, heaters, Temperature sensors wiring , extension of lines etc.

2500 Joints 2500

7. Semirigid cable inspection 1600 joints 1600

8. Audit of worksheets & hardware

200 cables 200

9. Panel clearance/ DOR verification

2000 sheets 2000

10. Others (miscellaneous) Quality Appraisal report

32 panels 900

11. Total Units 24000

Total harness area work units for two years = 48,000

Total work units for two years: 36,000 + 48,000 = 84,000

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Flow chart-1 :: Electronic assembly audit / inspection work flow

Electronic assembly wiring by External vendor and online QC inspection by the vendor

Card level Audit by EIQCS & Clearance

Package wiring by the vendor and online QC inspection by vendor

Package level audit by EIQCS

Vibration preparation by the vendor ; OLQC Vendor Inspn.

Vibration clearance by EIQCS

AIT clearance preparation by vendor ; OLQC Vendor Inspn.

AIT clearance and precertificate by EIQCS

Electronic assembly wiring by CEFS, ISAC or ISITE Online Inspection by OLQC, CEFS

Card level audit by EIQCS on selected hardware

Semirigid cable assembly wiring at CMG

Inspection & clearance by

EIQCS

Note : Grey colour boxes are EIQCS activities

Necessary checklists and work instructions will be provided by EIQCS staff.

Draft audit report shall be prepared by the inspector

Audit report is reviewed by the engineer in-charge (EIQCS staff) prior to release

Audit certificate & Pre-certificate shall be prepared by EIQCS staff only.

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Flow chart-2 :: Spacecraft harness inspection / Clean room support work flow

First end Harness wiring at CEFS / Harness lab by CEFS /Vendor, Online inspection by OLQC CEFS / Vendor QC

Wet probe test and witness by OLQC

Second end Harness wiring at CEFS / Harness lab by CEFS /Vendor, Online inspection by OLQC CEFS / Vendor QC

Wet probe test of panel harness and witness by EIQCS , followed by baking

Harness audit by EIQCS Work sheet verification & Harness inspection clearance by EIQCS

Harness final wiring in clean room by CEFS / Vendor

Online inspection and clearance by EIQCS

Thermal and propulsion elements related wiring , Micro switch, PRT wiring at clean room


Copper taping , potting,

eccobonding etc,


Panel closure preparation by Integration / CEFS

DOR /Connector worksheet verification & Committee mode panel closure clearance by EIQCS

Note : Grey colour boxes are EIQCS activities

Necessary checklists and work instructions will be provided by EIQCSstaff.

Draft audit report shall be prepared by the inspector

Audit report is reviewed by the engineer in-charge (EIQCS staff) prior to release