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© 2019

From Technologies to Markets

Sample

Status of Advanced Substrates

2019

Advanced IC substrates Substrate Like PCB &

Embedded Die

2

Biographies & contacts

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ABOUT THE AUTHORS

Mario IBRAHIM

As a Technology & Market Analyst, advanced packaging, Mario Ibrahim is a member of the Semiconductor & Software division at Yole Développement (Yole).Mario is engaged in the development of technology & market reports as well as the production of custom consulting studies. He is also deeply involved in testactivities business development within the division.

Prior to Yole, Mario was engaged in test activities development on LEDs at Aledia. He was also in charge of several R&D advanced packaging programs. During hisfive-year stay, he developed strong technical & managerial expertise in different semiconductor fields.

Mario holds an Electronics Engineering Degree from Polytech’ Grenoble (France). He apprenticed for three years in the Imaging division of STMicroelectronicsGrenoble, where he contributed to the test benches park automation within the test & validation team.

Favier SHOO

Favier Shoo is a Technology and Market Analyst in the Semiconductor & Software division at Yole Développement, part of Yole Group of Companies. Based inSingapore, Favier is engaged in the development of technology & market reports as well as the production of custom consulting.

After spending 7 years at Applied Materials as a Customer-Application-Technologist in advanced packaging marketspace, Favier had developed a deepunderstanding of the supply chain and core business values. Being knowledgeable in this field, Favier had given trainings and held numerous technical review sessionswith industry players. In addition, he had obtained 2 patents.

Prior to that, Favier had worked at REC Solar as a Manufacturing Engineer to maximize production capacity.

Favier holds a Bachelor in Materials Engineering (Hons) and a Minor in Entrepreneurship from Nanyang Technological University (NTU) (Singapore). Favier wasalso the co-founder of a startup company where he formulated business goals, revenue models and marketing plans.

[email protected]

[email protected]

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3©2019 | www.yole.fr | Status of Advanced Substrates 2019 | SAMPLE

COMPANIES CITED IN THIS REPORT

Access semiconductor, AMD, Amkor, Apple, ASE, AT&S, Audi, Avago

BMW, Bosch,

Career, CCTC, Celestica, Chin Poon, ChipBond, ChipMOS, CMK, Compeq, Continental, Cyntec

Daeduck, Daimler AG, Deca Technologies, Dyconex AG, Ericsson

Facebook, Fast Print, Flex, Flexium, Founder, Ford, Foxconn, Fujikura, Fraunhofer IZM

GaN systems, General Electric, Google,

HannStar Board, HiSilicon, Huawei,

Ibiden, Imec, Infineon, Intel

JCET, J-devices,

Kinsus, Kyocera, Korea circuit

LG Innotek

Meiko, Mflex, Microsemi

Nanium, Nantong Fujitsu, Nan Ya PCB, Nepes, Nippon Mektron, Nvidia

Omnivision, Oppo

Qdos, Qorvo, Qualcomm

Samsung, Sarda Technologies, Schweizer, SEMCO, Shennan Circuit, Shinko, Simmtech, SiPlus, SPIL, STATS ChipPAC, St Jude Medical, Starkey

Taiyo Yuden, TDK-EPCOS, Texas Instruments, TTM Technologies, Tripod, Trigence, TSMC

Unimicron, Unisem, UTAC, Valeo, Wus Group, Würth Elektronik, Wuzhou, Xiaomi,Young Poong Group, ZD Tech

… and many more

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REPORT SCOPE & OBJECTIVES

• This report is an update of the previous 2018 release “Status of advanced substrates 2018”

• The scope of this report is to present the actual trends and their impact on the substrate manufacturing. Mega trends arepushing the packaging market into more and more miniaturization and performances in order to answer their stringentrequirements (more performance, lower consumption & footprint). Substrate makers are working since few years toimprove their technology portfolio and innovate in order to follow the trends

• This report objectives are to:

• Show the impact of the global semiconductor market trend on the substrate manufacturing

• Outline three advanced substrate platforms:Advanced IC substrate, Substrate like PCB (SLP) & Embedded die (ED)

• Provide an overview of the markets trends and drivers pushing the innovation into substrate manufacturing

• Update market data & forecasts for the three advanced substrate platforms

• Describe the markets & key applications that are/will use such advanced substrate solutions

• Identify the main players & supply chain for advanced substrate manufacturing

• Predict future applications where technology such SLP and ED can be adopted

• Rank and analyze the players by revenue & net income

• Present the impact of Chinese environmental regulations on substrate & PCB houses

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TABLE OF CONTENT [1/3] NEW

• Report scope & objectives 5

• Glossary 6

• Authors 7

• Companies cited in this report 8

• The three pages report summary 9

• Comparison with 2018 report version 12

• Major trends since 2018

• What we got “right” and “wrong”

• Advanced IC substrate units comparison

• SLP units comparison

• Embedded die units comparison per market

• Executive summary 18

1. Introduction 61

• Hints for reading

• Terminology

• Segmentation & global trends

2. Advanced IC substrates 70

• What’s new & segmentation

• Trends & drivers 72

• Advanced IC substrate trends & drivers

• Forecasts 83

• Total advanced IC substrate market by revenue, units,geographical area

• Breakdown by FCBGA vs CSP by revenue, units

• FO impact on the FC revenue

• Capacity forecast by number of panels per month

• Technology & roadmaps 93

• Flip Chip IC substrate VS FO: L/S scaling

• Commercialized products: dimensions vs I/O

• Supply chain & players 108

• Semiconductor supply chain with IC substrate makers

• IC substrate players

• Business model example for some advanced IC substratemakers

• Conclusions 117

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4. Embedded die 155• What’s new & segmentation 158

• Trends & drivers 163• ED trends & drivers

• Forecasts 170• ED market revenue and units, breakdown

by market

• Two different scenarios: basic & optimistic

• EMIB units production

• Technology & roadmap 176• ED technology details by player and type

• ED roadmap

• ED markets, players & supply chain 206

• ED segmentation

• Different ED market and applications

• ED players by technology segment

• ED supply chain

• Conclusions 242

3. SLP 119

• What’s new & segmentation 120

• Trends & drivers 121

• SLP trends & drivers

• Apple smartphones board analysis

• Forecasts 134

• Total SLP market revenue

• SLP revenue breakdown by products

• SLP revenue and unitsVS global cell phone board market

• SLP smartphone revenue breakdown by country

• Technology & roadmaps 142

• SLP roadmap

• Supply chain & players 145

• SLP supply chain & potential business activities

• SLP manufacturing capabilities by country

• Conclusions 153

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5. Financial analysis 243

• Top 116 board makers by revenue 2017

• Top 116 board makers revenue repartition by country

• Focus on top 20 board makers, revenue, YoY growth, whois doing what

• Pushed financial analysis on top 10 board makers

• Revenue comparison 2016 to 2018

• Net income comparison 2016 to 2018

• Ranking evolution

6. China substrate regulations 256

• How China’s environmental regulations are impacting the substrate makers

7. Appendix 262

• Board

• Techniques of embedding technology

8. AboutYole Développement 274

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SUBSTRATE MARKET SEGMENTATION – GLOBAL VISION

*Low density interconnection boards. Test cards, probe cards … Not included in this report

** Few words on those technology in board chapter, but not the scope of this report

Two of the three main chapters of this report, Embedded die is the 3rd chapter

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TERMINOLOGY

• The biggest issue in the substrate manufacturing world is the use of a common terminology. Everyone knows and uses thesame words, but not everyone is using specific words to express the same things

• We can cite: PCB / Board / Substrate / laminate / SLP / mSAP / embedded die …

• In this report we will always be using:

• Board:

• It’s what everyone in the industry calls PCB. We won’t be using PCB because it’s too confusing as many players use PCB to talk about substrate sometimes. Board for us is the final “board” on which modules, packages will be plugged, no more intermediatelayers needed

• Substrate:

• In this report substrate = laminate layers stacked the one above the others forming a packaged module that will be plugged ona board. That means that we call substrate, any layer or package that will need to be plugged on a board in order to be used

• SLP, substrate like PCB:

• Some players are defining SLP as process-based technology, mSAP, which involves lithography steps from SAP. Others don’t recognize SLP term at all and are using process terms to define finer interconnection resolution at board level with just amSAP, mSAP or SAP. We are defining board as SLP with these characteristics:

• A board with mSAP or SAP processed layers, with or without subtractive processed layers

• Embedded die:

• In this report we refer to ED each time we want to talk about one or multiple dies embedded in substrate / board or mold. The die is placed between laminate layers when embedded in substrate / board, and housed in a polymer or other material when embedded in a mold

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THE MAJOR TRENDS SINCE 2018

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Wafer BEOL

Fan-In/Fan-Out WLP/PLP

Board

IC

Substrate

SUBSTRATE LANDSCAPE

100/10010/101/10.1/0.1

L/S [um/um]

0.25/0.25 5/5 30/30

Lay

er

Thic

kness

(C

u +

die

lect

ric)

, [um

]

0.1

1

10

100

2/2

Board vs. IC

substrate

2.5D / 3DIC

vs DD Fan

Out

IC Substrate

vs FO

Competition observed

between Board & IC

substrate due to L/S

scaling

Board and IC substrate

manufacturers are

adopting advanced

technology processes to

address new market

requirements for

performance & form

factor

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ADVANCED SUBSTRATE MARKET EVOLUTION

Market dynamics

Yole Développement, 2019

• SLP affects the board market and down sizing decreases both board and substrate markets

• FC substrate has a market loss due to HD FO, but with SiP, substrate usages increases

• Down sizing such as decreasing the L/S or embedding the die(s) might lower the total production of both board and IC substrates

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http://www.yole.fr/


Advanced IC

Substrate falls short in

supply due to

overwhelming

demands from 5G

base stations and

HPCs, during the end

of 2018

ADVANCED IC SUBSTRATE: WHAT’S NEW IN 2019

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ADVANCED IC SUBSTRATE: 2017 PRODUCTION UNITS BY GEOGRAPHICAL AREA

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ADVANCED IC SUBSTRATE MARKET FORECAST

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ADVANCED IC SUBSTRATE MARKET FORECAST: COMPETING TECHNOLOGY

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ADVANCED IC SUBSTRATE MARKET SHARES: TOP PLAYERS

Non-Exhaustive list of players

*Data is estimated from secondary research and adjusted through interviews.

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TECHNOLOGY ROADMAP OF FC VS FO: KEY PARAMETERS

• FC can package more dies and hence more functionality density as compared to FO.

• FC is more SiP scalable as compared to FO

Roadmap is based on an expected average of the different technologies in the market.

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SUPPLY CHAIN OF ADVANCED IC SUBSTRATE PLAYERS: GEOGRAPHICAL ANALYSIS

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SLP: WHAT’S NEW SINCE 2018?

*mSAP = modified semi-additive process

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SLP DRIVERS: BOARD-SPACE SAVIOUR

Schematic is drawn proportionally close to actual scale

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SUBSTRATE-LIKE PCB (SLP) EVOLUTION

SLP is achieving new milestones with progressive adoptions…

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SLP MARKET VALUE: BREAKDOWN BY PRODUCTS

Revenue is defined as the sales generated from SLP Packaging

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SLP PENETRATION RATE IN GLOBAL CELL PHONE BOARD MARKET: UNITS & REVENUE

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SLP TECHNOLOGY ROADMAP

≤2016: No SLP adoption in the market yet.

Dk = Dielectric Constant. Df = Dissociation Factor. Average value of the players in the market.

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SLP SUPPLY CHAIN OF TOP 15 PLAYERS – BASED ON 2017 REVENUE

SLP Manufacturers

Majority of the SLP players are

manufacturers who have Board + IC

Substrate capabilities. There is no

standalone player doing SLP independently

or SLP + IC Substrate.

IC Substrate Manufacturers

No players doing SLP + IC Substrate

independently.

No independent IC Substrate players.

Only 3 players doing Board + IC Substrate

exclusively.

Board Manufacturers

Only 3 players produce strictly board only.

1 player is doing Board + SLP exclusively.

Non-Exhaustive List of Players

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EMBEDDED PACKAGING TECHNOLOGY

Embedded packaging technologies with connections

fanned out of the surface

Embedded in organicEmbedded in epoxy mold compound

(Fan-Out WLP/PLP)

CHIP FIRST: CF

CHIP LAST: CL

FACE UP: FU

FACE DOWN: FD

ED in

board

ED in flexible

PCB

Interconnection type RDLFoundry

BEOL

Coreless

Substrate

Chip orientation

Encapsulator type

CF / CLCF / CL CL

FU / FD FU / FD

Chip placingFocus of the report

(Technology, players, hardware,

forecast)

ED in

SubstrateInterposer

2.5D like

Some information on the technology and players. Not included in the forecasts

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http://www.yole.fr/


EMBEDDED DIE: WHAT’S NEW SINCE 2018? [1/2]

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MARKET DRIVERS

Embedded technology

Embedded

Die

Cost-drivenForm factor

&

integration

driven

Performance-

driven

IC

Power / audio

amplifiers

DC-DC converter RF SiP

Power appsAC-DC inverter

CIS

Better electrical performance

Better signal transmission

Better heat management

Better reliability

Can Embedded die

compete with 2.5D & 3D

technology in term of

performance & cost

effectiveness?

Higher die integration

Smaller foot print

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ED FORECASTS

Optimistic scenario, units & revenue

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EMBEDDED DIE ROADMAP

Higher performances, higher dies number and thinner packages

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ALL THE PLAYERS INVOLVED IN AN EMBEDDED DIE ACTIVITY

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SOME EXTRA DETAILS ON THE TOP 10 SUBSTRATE MAKERS

Revenue (M$) comparison including 2018 numbers

* Some projections may be included in 2018 revenue as not all the companies released the 4Q results when this report was released

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IMPACT OF CHINA REGULATIONS: COASTAL VS INLAND

ANALYST’S POINT OF VIEWChina from google map

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The integrated circuit (IC) substrate and board industry has historically assumed a passive role, especially when it comes to innovation. However, in the past few years, the landscape has become increasingly competitive. Industry players are looking to differentiate from others.

The advanced substrate industry is now following the trends of advanced packaging. Miniaturization, greater integration and higher performance are becoming mainstream in this industry. Huge investments by several players are ongoing for embedded die (ED) and substrate-like printed circuit board (SLP), showing the increased interest in such technology.

The substrate and printed circuit board (PCB) global market will record a modest compound annual growth rate (CAGR) of around 4% from 2018-2024. But, if we only consider advanced substrate technology as SLP and ED technology, they exhibit

a much higher growth rate, up to 49% CAGR2018-2024 for ED.

Flip Chip (FC), SLP and ED are gaining market share from the conventional board and IC substrate markets. That’s especially true for SLP and ED, which have the capability to reduce either the board or IC substrate footprint. Undoubtedly, these technologies can address the integrational needs of applications in this new digital age, but bring complexity and demand innovation before production and adoption take place. In addition, such technology bring huge value into the market. Hence it is not surprising they are expected to fetch a higher average selling price (ASP) and better revenue. In this report, Yole Développement (Yole) will detail FC, SLP and ED trends and their usage in different markets and applications. Yole’s analsyts will provide in-depth information about the markets, applications, numbers, roadmaps, players and supply chains.

STATUS OF ADVANCED SUBSTRATES 2019 Market & Technology Report - May 2019

THE ADVANCED SUBSTRATE INDUSTRY HAS STARTED TO INNOVATE TO KEEP UP WITH ADVANCED PACKAGING TRENDS

Demands from the new digital age are waking up the sleeping substrate giants.

WHAT’S NEW• FC BGA substrate capacity is

running short in supply • FC CSP is still growing, driven by

DRAM • New SLP applications other than

smartphones• Latest adoption of embedded die

package• Substrate manufacturers are

switching to mSAP • China consolidating its substrate

manufacturing market

REPORT KEY FEATURES • Advanced IC substrate with

focus on FC CSP & BGA, and the impact of FO on these markets. Players, supply chain, roadmaps and forecasts with FC CSP/BGA and FO breakdown, market shares for each player

• SLP, with a focus on Huawei as a new user and for mobile, smartwatches and tablets. Players, supply chains, roadmaps and forecasts broken down by board type and application. New process flow overview

• Embedded die, with a focus on automotive, telecom and infrastructure markets. Players, supply chain, roadmaps and forecasts, broken down by market

• Financial analysis of top 10 substrate makers’ revenue and net income

• China’s environmental regulations and their impact on substrate manufacturing

(Yole Développement, May 2019)

Prod

uct r

ange SiP

HD FO

Board

SLP

Down sizing / ED

HD FO

IC substrate

Advanced substrate and packaging’s impact on board and substrate markets

INCREASED SLP ADOPTION BY LEADING OEMS IS DRIVING MARKET GROWTH SIGNIFICANTLY

The global SLP market is valued at $987M in 2018 and is expected to grow through to 2024, driven by the global cell-phone market.

Presently, the SLP market is still heavily dependent on high end smartphone growth, particularly

Apple iPhones and Samsung Galaxies. Moving forward, Huawei is expected to release high-end products with SLP technology in 2019. Furthermore, cell-phone-producing OEMs are planning to use SLP in other consumer electronic

Embedded die revenue forecast

Substrate-like PCB supply chain example


STATUS OF ADVANCED SUBSTRATES 2019

EXCITING GROWTH OF EMBEDDED DIE OFFERS SUBSTRATE STACKING SOLUTION

ED is the first real substrate stacking technology on the market. Its market is valued at $21M in 2018 and is expected to reach $231M by 2024, exhibiting a 49% CAGR. This is the highest growth of all the advanced substrate platforms, and can be justified by an infant technology that will boom soon.

Yole has been studying ED technology since its early stages. Based on this expertise, we will be detailing the ED markets where mobile device makers were early adopters and will remain an important source of revenue.

We foresee a bright future for ED. Firstly, this is due to extended adoption in new automotive applications. It is also due to the telecom and infrastructure market where ED is a suitable solution to increase hardware efficiency. Secondly, players are investing huge amounts in new plants where ED will be the main product. Supported by major OEMs, Yole believes that an ED market boost will occur in the next two years.

Nowadays, there are many players active in ED research and development, but only a few have jumped into high volume manufacturing (HVM). Based on the technology, markets dynamics, and investments detailed in this report, Yole believes that, in the near future, more players will enter ED HVM and contribute to the adoption of this technology.

COMPANIES CITED IN THE REPORT (non exhaustive list)

Access semiconductor, AMD, Amkor, Apple, ASE, AT&S, Audi, Avago, BMW, Bosch, Career, CCTC, Celestica, Chin Poon, ChipBond, ChipMOS, CMK, Compeq, Continental, Cyntec, Daeduck, Daimler AG, Deca Technologies, Dyconex AG, Ericsson, Facebook, Fast Print, Flex, Flexium, Founder, Ford, Foxconn, Fujikura, Fraunhofer IZM, GaN systems, General Electric, Google, HannStar Board, HiSilicon, Huawei, Ibiden, IMEC, Infineon, Intel, JCET, J-devices, Kinsus, Kyocera, Korea circuit, LG Innotek, Meiko, Mflex, Microsemi, Nanium, Nantong Fujitsu, Nan Ya PCB, Nepes, Nippon Mektron, Nvidia, Omnivision, Oppo, Qdos, Qorvo, Qualcomm, Samsung, Sarda Technologies, Schweizer, SEMCO, Shennan Circuit, Shinko, Simmtech, SiPlus, SPIL, STATS ChipPAC, St Jude Medical, Starkey, Taiyo Yuden, TDK-EPCOS, Texas Instruments, TTM Technologies, Tripod, Trigence, TSMC, Unimicron, Unisem, UTAC, Valeo, Wus Group, Würth Elektronik, Wuzhou, Xiaomi,Young Poong Group, ZD Tech, … and many more


REPORT OBJECTIVES• Show the impact of the global semiconductor market trend on the substrate manufacturing• Outline three advanced substrate platforms: Advanced IC substrates, substrate-like PCB and

embedded die • Provide an overview of the markets trends and drivers pushing the innovation in substrate

manufacturing• Update market data and forecasts for the three advanced substrate platforms• Describe the markets and key applications that are using/will use such advanced substrate solutions• Identify the main players and supply chain for advanced substrate manufacturing• Predict future applications where technology such as SLP and ED can be adopted

products like smartwatches and tablets. SLP will become more mainstream than ever before.

Currently, SLP manufacturers from Taiwan, South Korea and Japan are dominating production activities. Players like Japan-headquartered Meiko and Taiwan-headquartered ZD Tech are expanding new SLP production lines in Vietnam and China for more than one smartphone customer. Certainly, China will gain SLP technical know-how progressively with technology transfer from the major players.

In this report, Yole will share insights on SLP technology, markets, players and the supply chain. In addition, the team will also analyse the breakthroughs in SLP manufacturing and their impact on the supply chain.

Substrate Manufacturers* Fabless*OEMs*

Entire supply-chain activities will be portrayed in full

report

*Non-exhaustive list of players - Speculated activities

CAGR2018-2024: +49% **

* Breakdown per market detailed in the report ** CAGR: Compound Annual Growth Rate

$21M

2024

$93M

$231M

Considered markets*:• Mobile• Automotive• Telecom & infrastructure• Consumer• Medical• Aerospace, defense & industry

20212018

MARKET & TECHNOLOGY REPORT

Report scope and objectives 5

Glossary 6

Authors 7

Companies cited in this report 8

The three pages report summary 9

Comparison with 2018’s report 12

> Major trends since 2018> What we got “right” and “wrong”> Advanced IC substrate unit comparison> SLP unit comparison> Embedded die unit comparison by market

Executive summary 18

Introduction 61

> Hints for reading> Terminology > Segmentation and global trends

Advanced IC substrates 70

> What’s new and segmentation > Trends and drivers

- Advanced IC substrate trends and drivers > Forecasts

- Total advanced IC substrate market by revenue, units, geographical area

- Breakdown by FCBGA vs CSP by revenue, units

- FO impact on the FC revenue- Capacity forecast by number of panels

per month> Technology and roadmaps

- Flip Chip IC substrate VS FO: L/S scaling- Commercialized products: dimensions

vs I/O> Supply chain and players

- Semiconductor supply chain with IC substrate makers

- IC substrate players - Business model example for some

advanced IC substrate makers> Conclusions

SLP 119


- SLP trends and drivers - Apple smartphones board analysis

> Forecasts - Total SLP market revenue- SLP revenue breakdown by products

- SLP revenue and units VS global cell phone board market

- SLP smartphone revenue breakdown by country

> Technology and roadmaps - SLP roadmap

> Supply chain and players - SLP supply chain and potential business

activities- SLP manufacturing capabilities by country

> Conclusions

Embedded die 155


- ED trends and drivers > Forecasts

- ED market revenue and units, breakdown by market

- Two different scenarios: basic and optimistic

- EMIB units production> Technology and roadmap

- ED technology details by player and type

- ED roadmap> ED markets, players and supply chain

- ED segmentation- Different ED market and applications- ED players by technology segment- ED supply chain

> Conclusions

Financial analysis 243

> Top 116 board makers by revenue 2017 > Top 116 board makers revenue repartition

by country> Focus on top 20 board makers, revenue,

YoY growth, who is doing what> Pushed financial analysis on top 10 board

makers- Revenue comparison 2016 to 2018- Net income comparison 2016 to 2018- Ranking evolution

China substrate regulations 256

> How China’s environmental regulations are impacting the substrate makers

Appendix 262

> Board> Techniques of embedding technology

About Yole Développement 274

TABLE OF CONTENTS (complete content on i-Micronews.com)

RELATED REPORTS

AUTHORSMario Ibrahim as a Technology and Market Analyst, advanced packaging, Mario Ibrahim is a member of the Semiconductor and Software division at Yole Développement (Yole). Mario is engaged in the development of technology and market reports as well as the production of custom consulting studies. He is also deeply involved in test activities business development within the division. Prior to Yole, Mario was engaged in test activities development on LEDs at Aledia. He was also in charge of several R&D advanced packaging programs. During his five-year stay, he developed strong technical and managerial expertise in different semiconductor fields.Mario holds an Electronics Engineering Degree from Polytech’ Grenoble, France. He apprenticed for three years in the Imaging division of STMicroelectronics Grenoble, where he contributed to test bench park automation within the test and validation team.

Favier Shoo is a Technology and Market Analyst in the Semiconductor and Software division at Yole Développement, part of Yole Group of Companies. Based in Singapore, Favier is engaged in the development of technology and market reports as well as the production of custom consulting. After spending 7 years at Applied Materials as a Customer-Application-Technologist in advanced packaging marketspace, Favier had developed a deep understanding of the supply chain and core business values. Being knowledgeable in this field, Favier had given trainings and held numerous technical review sessions with industry players. In addition, he had obtained 2 patents. Prior to that, Favier had worked at REC Solar as a Manufacturing Engineer to maximize production capacity. Favier holds a Bachelor in Materials Engineering (Hons) and a Minor in Entrepreneurship from Nanyang Technological University (NTU) (Singapore).Benef i t from our Bundle & Annual Subscription offers and access our analyses at the best available

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• Status of the Advanced Packaging Industry 2018

• 2.5D 3D TSV & Wafer-Level Stacking

Technology & Market Updates 2019

• Fan-Out Packaging 2019

• TDK SESUB Bluetooth Module

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and Image Sensors, Compound Semiconductors, RF Electronics, Solid-State Lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.

CONSULTING AND ANALYSIS• Market data & research, marketing analysis• Technology analysis• Strategy consulting• Reverse engineering & costing• Patent analysis• Design and characterization of innovative optical systems• Financial services (due diligence, M&A with our partner)More information on www.yole.fr

MEDIA & EVENTS• i-Micronews.com website & related @Micronews e-newsletter• Communication & webcast services• Events: TechDays, forums…More information on www.i-Micronews.com

REPORTS• Market & technology reports• Patent investigation and patent infringement risk analysis• Structure, process and cost analysis• Cost simulation toolMore information on www.i-micronews.com/reports

CONTACTSFor more information about :• Consulting & Financial Services: Jean-Christophe Eloy ([email protected])• Reports: David Jourdan ([email protected]) Yole Group of Companies• Press Relations & Corporate Communication: Sandrine Leroy ([email protected])

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Yole Développement

From Technologies to Market

Source: Wikimedia Commons

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37©2019 | www.yole.fr | About Yole Développement

YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE

Life Sciences

& Healthcare o Microfluidics

o BioMEMS & Medical Microsystems

o Inkjet and accurate dispensing

o Solid-State Medical Imaging & BioPhotonics

o BioTechnologies

Power

& Wireless

o RF Devices & Technologies

o Compound Semiconductors & Emerging Materials

o Power Electronics

o Batteries & Energy Management

Semiconductor

& Software o Package,Assembly & Substrates

o Semiconductor Manufacturing

o Memory

o Software & Computing

Photonics,

Sensing & Display

o Solid-State Lighting

o Display

o MEMS, Sensors & Actuators

o Imaging

o Photonics & Optoelectronics

Semiconductor

& Software

Power & Wireless

Photonics,

Sensing

& Display

Life

Sciences &

Healthcare

About Yole Développement | www.yole.fr | ©2019

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4 BUSINESS MODELS

o Consulting and Analysis

• Market data & research,

marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

• Design and characterization

of innovative optical systems

• Financial services (due

diligence, M&A with our

partner)

www.yole.fr

o Syndicated reports

• Market & technology reports

• Patent investigation and patent

infringement risk analysis

• Teardowns & reverse costing

analysis

• Cost simulation tool

www.i-Micronews.com/reports o Media

• i-Micronews.com website

• i-Micronews e-newsletter

• Communication & webcast

services

• Events: TechDays, forums,…

www.i-Micronews.com

o Monitors

• Monthly and quarterly update

• Excel database covering supply,

demand, and technology

• Price, market, demand and

production forecasts

• Supplier market shares

www.i-Micronews.com/reports


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6 COMPANIES TO SERVE YOUR BUSINESS

Due diligence

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

Yole Group of Companies


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OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Yole Deutschland

Frankfurt

Hsinchu

Tokyo

Yole Korea

Seoul

Palo Alto

Yole Inc.

Cornelius


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ANALYSIS SERVICES - CONTENT COMPARISON

High

Technology

and Market

Report

Leadership

Meeting

Q&A

Service

Depth of the analysis

Bre

adth

of th

e a

nal

ysis

Meet the

Analyst

Custom

Analysis

High

Low


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SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plans along the entire

supply chain

Integrators, end-

users and software

developers

Device manufacturers

Suppliers: material,

equipment, OSAT, foundries…

Financial investors, R&D centers


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SERVING MULTIPLE INDUSTRIAL FIELDS

We workacross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and

consumer

electronics

Automotive

Medical

systems

Industrial

and defense

Energy

management


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o Over the course of more than 20 years, Yole Développement has grown to become a group of companies. Together with System Plus Consulting and KnowMade, we now

provide marketing, technology and strategy consulting, media and corporate finance services, reverse costing, structure, process and cost analysis services and well as

intellectual property (IP) and patent analysis. Together, our group of companies is collaborating ever closer and therefore will offer, in 2019, a collection of over 125 reports,

10 new monitors and 120 teardowns. Combining respective expertise and methodologies from the three companies, they cover:

o If you are looking for:

• An analysis of your product market and technology

• A review of how your competitors are evolving

• An understanding of your manufacturing and production costs

• An understanding of your industry’s technology roadmap and related IPs

• A clear view supply chain evolution

Our reports and monitors are for you!

o Our team of over 70 analysts, including PhD and MBA qualified industry veterans from Yole Développement, System Plus Consulting and KnowMade, collect information,identify trends, challenges, emerging markets, and competitive environments. They turn that information into results and give you a complete picture of your industry’slandscape. In the past 20 years, we have worked on more than 2,000 projects, interacting with technology professionals and high-level opinion makers from the mainplayers of their industries and realized more than 5,000 interviews per year.

WHAT TO EXPECT IN 2019?In 2019 we will extend our offering with a new ‘monitor’ product which provides more updates on your industry during the year. The Yole Group of Companies is also buildingon and expanding its investigations of the memory industry. Moreover, in parallel, the Yole Group reaffirms its commitment to a new collection of reports mixing software andhardware and is increasing its involvement in displays, radio-frequency (RF) technology, advanced substrates, batteries and compound semiconductors. Last but not least,System Plus Consulting is developing its teardowns service providing 120+ offers related to phones, smart home, wearables and connected devices. Discover our 2019program right now, and ensure you get a true vision of the industry. Stay tuned!

REPORTS COLLECTION

www.i-Micronews.com

• MEMS & Sensors

• RF devices & technologies

• Medical technologies

• Semiconductor Manufacturing

• Advanced packaging

• Memory

• Batteries and energy management

• Power electronics

• Compound semiconductors

• Solid state lighting

• Displays

• Software

• Imaging

• Photonics


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45

OUR 2019 REPORTS COLLECTION (1/4)

18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

Market –Technology – Strategy – by Yole DéveloppementYole Développement (Yole) offers market reports including quantitative market forecasts,

technology trends, company strategy evaluation and indepth application analyses. Yole will

publish more than 55 reports in 2019, with our partner PISEO contributing to some of

the lighting reports.

Reverse Costing® – Structure, Process and Cost Analysis – by

System Plus ConsultingThe Reverse Costing® report developed by System Plus Consulting provides full

teardowns, including detailed photos, precise measurements, material analyses,

manufacturing process flows, supply chain evaluations, manufacturing cost analyses and

selling price estimations. The reports listed below are comparisons of several analyzed

components from System Plus Consulting. More reports are however available, and over

60 reports will be released in 2019.The complete list is available at www.systemplus.fr.

Patent Reports – by KnowMadeMore than describing the status of the IP situation, these analyses provide a missing link

between patented technologies and market, technological and business trends. They offer

an understanding of the competitive landscape and technology developments from a

patent perspective. They include key insights into key IP players, key patents and future

technology trends. For 2019 KnowMade will release over 15 reports.

The markets targeted are :

• Mobile & Consumer

• Automotive & Transportation

• Medical

• Industrial

• Telecom & Infrastructure

• Defense & Aerospace

• Linked reports are dealing with the same topic to provide

• a more detailed analysis.


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http://www.yole.fr/

http://www.systemplus.fr/

46

OUR 2019 REPORTS COLLECTION (1/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT

• Status of the MEMS Industry 2019 - Update

• Status of the Audio Industry 2019 - New

• Uncooled Infrared Imagers and Detectors 2019 – Update

• Consumer Biometrics:Technologies and Market Trends 2018

• MEMS Pressure Sensor Market and Technologies 2018

• Gas & Particle Sensors 2018

o STRUCTURE, PROCESS & COST REPORT

• MEMS & Sensors Comparison 2019

• MEMS Pressure Sensor Comparison 2018

• Particle Sensors Comparison 2019

• Miniaturized Gas Sensors Comparison 2018

o PATENT REPORT

• MEMS Foundry Business Portfolio 2019 - New

• Miniaturized Gas Sensors 2019 - New

PHOTONIC AND OPTOELECTRONICS

o MARKET ANDTECHNOLOGY REPORT

• Photonic Integrated Circuit 2019 - New

• LiDARs for Automotive and Industrial Applications 2019 - Update

• Silicon Photonics 2018

o PATENT REPORT

• Silicon Photonics for Data Centers: Optical Transceiver 2019 - New

• LiDAR for Automotive 2018

RF DEVICES AND TECHNOLOGIES


• RF GaN Market: Applications, Players, Technology,

and Substrates 2019 - Update

• 5G’s Impact on RF Front-End Module and Connectivity

for Cell Phones 2019 – Update

• 5G Impact on Wireless Infrastructure 2019

• Radar and Wireless for Automotive: Market and Technology

Trends 2019 - Update

• Advanced RF Antenna Market & Technology 2019 - New

• RF Standards and Technologies for Connected Objects 2018


• RF Front-End Module Comparison 2019 - Update

• Automotive Radar RF Chipset Comparison 2018

o PATENT REPORT

• Antenna for 5G Wireless Communications 2019 - New

• RF Front End Modules for Cellphones 2018

• RF Filter for 5G Wireless Communications: Materials and Technologies 2019

• RF GaN : Materials, Devices and Modules 2018

Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019

http://www.yole.fr/

http://www.yole.fr/

47


IMAGING


• Status of the CIS Industry 2019: Technology

and Foundry Business - Update

• Imaging for Automotive 2019 - Update

• Neuromorphic Technologies for Sensing 2019 - Update

• Status of the CCM and WLO Industry 2019 – Update

• 3D Imaging & Sensing 2018

• MachineVision for Industry and Automation 2018

• Sensors for Robotic Vehicles 2018


• Compact Camera Modules Comparison 2019

• CMOS Image Sensors Comparison 2019

o PATENT REPORT

• Facial & Gesture Recognition Technlogies in Mobile Devices 2019 - New

• Apple iPhone X Proximity Sensor & Flood Illuminator 2018

MEDICAL IMAGING AND BIOPHOTONICS


• X-Ray Detectors for Medical, Industrial

and Security Applications 2019- New

• Microscopy Life Science Cameras: Market and Technology Analysis 2019

• Ultrasound technologies for Medical, Industrial

and Consumer Applications 2018

o PATENT REPORT

• Optical Coherence Tomography Medical Imaging 2018

MICROFLUIDICS


• Status of the Microfluidics Industry 2019 - Update

• Next Generation Sequencing & DNA Synthesis - Technology,

Consumables Manufacturing and Market Trends 2019 - New

• Organ-on-a-Chip Market & Technology Landscape 2019 - Update

• Point-of-Need Testing Application of Microfluidic Technologies 2018

• Liquid Biopsy: from Isolation to Downstream Applications 2018

• Chinese Microfluidics Industry 2018

o PATENT REPORT

• Microfluidic Manufacturing Technologies 2019 – New

INKJET AND ACCURATE DISPENSING


• Inkjet Printheads - Dispensing Technologies

& Market Landscape 2019 - Update

• Emerging Printing Technologies

for Microsystem Manufacturing 2019 - New

• Piezoelectric Materials from Bulk to Thin Film 2019 - New

• Inkjet Functional and Additive Manufacturing for Electronics 2018


• Piezoelectric Materials from Bulk to Thin Film Comparison 2019


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48


BIOTECHNOLOGIES


• CRISPR-Cas9 Technology: From Lab to Industries 2018

o PATENT REPORT

• Personalized Medicine 2019 – New

BIOMEMS & MEDICAL MICROSYSTEMS


• Medical Wearables: Market & Technology Analysis 2019 - New

• Neurotechnologies and Brain Computer Interface 2018

• BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences

& Healthcare 2018

o PATENT REPORT

• 3D Cell Printing 2019 - New

• Circulating Tumor Cells Isolation 2019 - New

• Nanopore Sequencing 2019 - New

SOFTWARE AND COMPUTING


• Artificial Intelligence Computing For Automotive 2019 - New

• Hardware and Software for Artificial Intelligence (AI)

in Consumer Applications 2019 - Update

• From Image Processing to Deep Learning 2019 - Update

• xPU (Processing Units) for Cryptocurrency, Blockchain, HPC

and Gaming 2019 – New

MEMORY


• Status of the Memory Business 2019 - New

• MRAM Technology and Business 2019 - New

• Emerging NonVolatile Memory 2018


• Memory Comparison 2019

o PATENT REPORT

• Magnetoresistive Random-Access Memory (MRAM) 2019 - New

• 3D Non-Volatile Memory 2018

ADVANCED PACKAGING


• Fan Out Packaging Technologies and Market Trends 2019 - Update

• 3D TSV Integration and Monolithic Business Update 2019 - Update

• Advanced RF SiP for Cellphones 2019 - Update

• Status of Advanced Packaging 2019 - Update

• Status of Advanced Substrates 2019 - Update

• Panel Level Packaging Trends 2019 - Update

• System in Package (SiP) Technology and Market Trends 2019 - New

• Trends in Automotive Packaging 2018

• Thin-Film Integrated Passive Devices 2018


• Advanced RF SiP for Cellphones Comparison 2019


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49


SEMICONDUCTOR MANUFACTURING


• Nano Imprint Lithography 2019 - New

• Equipment and Materials for Fan Out Packaging 2019 - Update

• Equipment for More than Moore: Thin Film Deposition

& Etching 2019 - New

• Wafer Starts for More Than Moore Applications 2018

• Polymeric Materials at Wafer-Level

for Advanced Packaging 2018

• Bonding and Lithography Equipment Market

for More than Moore Devices 2018


• Wafer Bonding Comparison 2018

o PATENT REPORT

• Hybrid Bonding for 3D Stack 2019 – New

SOLID STATE LIGHTING


• Status of the Solid State Light Source Industry 2019 - New

• Edge Emitting Lasers (EELS) 2019 - New

• Light Shaping Technologies 2019 - New

• Automotive Advanced Front Lighting Systems 2019 - New

• VCSELs - Technology, Industry and Market Trends 2019 - Update

• IR LEDs and Laser Diodes – Technology, Applications,

and Industry Trends 2018

• Automotive Lighting 2018: Technology, Industry and Market Trends

• UV LEDs - Technology, Manufacturing and Application Trends 2018

• LiFi: Technology, Industry and Market Trends 2018


• VCSEL Comparison 2019

o PATENT REPORT

• VCSELs 2018

DISPLAY


• Next Generation 3D Display 2019 - New

• Next Generation Human Machine Interaction (HMI)in Displays 2019 - New

• Micro-and Mini-LED Displays 2019 - Update

• Technologies And Markets for Next Generation Televisions

• Displays & Optical Vision Systems for VR, AR & MR 2018

o PATENT REPORT

• MicroLED Displays : Intellectual Property Landscape 2018


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50


POWER ELECTRONICS


• Power SiC: Materials, Devices and Applications 2019 - Update

• Power Electronics for EV/HEV and e-mobility:

Market, Innovations and Trends 2019 - Update

• Status of the Power Electronics Industry 2019 - Update

• Discrete Power Packaging : Material Market

and Technology Trends 2019 - New

• Status of the Power ICs Industry 2019 - Update

• Status of the Passive Components for the Power Electronics

Industry 2019 - Update

• Status of the Inverter Industry 2019 - Update

• Status of the Power Module Packaging Industry 2019 - Update

• Wireless Charging Market Expectations

and Technology Trends 2018

• Power GaN 2018: Epitaxy, Devices, Applications

and Technology Trends


• Automotive Power Module Packaging Comparison 2018

• GaN-on-Silicon Transistor Comparison 2019

• SiC Transistor Comparison 2019

o PATENT REPORT

• Power SiC : Materials, Devices and Modules 2019 - New

• Power GaN : Materials, Devices and Modules 2019 – Update

BATTERY & ENERGY MANAGEMENT


• Status of the Rechargeable Li-ion Battery Industry 2019 - New

• Li-ion Battery Packs for Automotive and Stationary Storage

Applications 2019 - Update

o PATENT REPORT

• Battery Energy Density Increase: Materials

and Emerging Technologies 2019 - New

• Solid-State Batteries 2019 - New

• Status of the Battery Patents 2018

COMPOUND SEMI.


• Emerging Compound Semiconductor

Market & Technology Trends 2019 - New

• Status of the Compound Semiconductor Industry 2019 - New

• InP Materials, Devices and Applications 2019 - New

• GaAs Wafer and Epiwafer Market: RF, Photonics,

LED and PV Applications 2018

o PATENT REPORT

• GaN-on-Silicon Substrate: Materials, Devices

and Applications 2019 - Update


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51

OUR 2019 MONITORS COLLECTION (1/2)

Get the most updated overview of your market to monitor your strategy

Yole Développement, System Plus Consulting and KnowMade, all part of the Yole Group of Companies, are launching a collection of 10 monitors in 2019. The monitors aim to

provide updated market, technology and patent data as well dedicated quarterly analyses of the evolution in your industry over the previous 12 months. Furthermore, you can

benefit from direct access to the analyst for an on-demand Q&A and discussion session regarding trend analyses, forecasts and breaking news.

Topics covered will be compact camera modules (CCMs), advanced packaging, compound semiconductors, microfluidics, batteries, RF and memory.

MARKET MONITOR byYole Développement

A FULL PACKAGE:The monitors will provide the evolution of the market in units, wafer area and revenues.They will also offer insights into what is driving the business and a close look at what ishappening will also be covered in it.

The following deliverables will be included in the monitors:

• An Excel database with all historical and forecast data

• A PDF slide deck with graphs and comments/analyses covering the expected

evolutions

o ADVANCED PACKAGING – NEWThis monitor will provide the evolution of the advanced packaging platforms. It willcover Fan-Out Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (PLP),Wafer-Level Chip Scale Packaging (WLCSP), Flip Chip packaging platforms, and 2.5Dand 3D Through Silicon Via (TSV) integration. Frequency: Quarterly, starting from Q32019

o COMPOUND SEMI. – NEWThis monitor will describe how the compound semiconductor industry is evolving. Itwill offer a close look at GaAs, InP, SiC, GaN and other compounds of interestproviding wafer volumes, revenues, application breakdowns and momentum.Frequency: Quarterly, starting from Q3 2019

o CAMERA MODULE – NEWThis monitor will provide the evolution of the imaging industry, with a close look atimage sensor, camera module, lens and VCM. Volumes, revenues and momentum ofcompanies like Sony, Samsung, Omnivision and OnSemi will thus be analysed.Frequency: Quarterly, starting from Q3 2019

o MEMORY – UPDATEFor the memory industry you can have access to a quaterly monitor, as well as anadditional service, a monthly pricing. Both services can be bought seprately:

• DRAM Service: Including a quarterly monitor and monthly pricing.

• NAND Service: Including a quarterly monitor and monthly pricing.

REVERSETECHNOLOGY MONITOR by System Plus Consulting

o SMARTPHONES – NEWTo stay updated on the latest components, packaging and silicon chip choices of the smartphone makers, System Plus Consulting has created its first Smartphone ReverseTechnology monitor. This year, get access to the packaging and silicon content database of at least 20 different flagship smartphones – more than five per quarter. Starting at thebeginning of 2019, the monitor will include an Excel database report for each phone and a quarterly comparison.


http://www.yole.fr/

http://www.yole.fr/

52

OUR 2019 MONITORS COLLECTION (2/2)

Get the most updated overview of your market to monitor your strategy

PATENT MONITOR by KnowMade

A FULL PACKAGE:Starting at the beginning of the year, the KnowMade monitors include the following deliverables:

• An Excel file including the monthly IP database of:

• New patent applications

• Newly granted patents

• Expired or abandoned patents

• Transfer of IP rights through re-assignment and licensing

• Patent litigation and opposition

• Quarterly report including a PDF slide deck with the key facts & figures of thequarter: IP trends over the three last months, with a close look to key IP players andkey patented technologies.

o GaN for Power & RF ElectronicsWafers and epiwafers, GaN-on-SiC, silicon, sapphire or diamond, semiconductordevices such as transistors, and diodes, devices and applications including converters,rectifiers, switches, amplifiers, filters, and Monolothic Microwave Integrated Circuits(MMICs), packaging, modules and systems.

o GaN for Optoelectronics & PhotonicsWafers and epiwafers, GaN-on-sapphire, SiC or silicon; semiconductor devices suchas LEDs and lasers; and applications including lighting, display, visible communication,photonics, packaging, modules and systems.

o Li-ion BatteriesAnodes made of lithium metal, silicon, and lithium titanate (LTO); cathodes made ofLithium Iron Phosphate (LFP), Nickel-Manganese-Cobalt (NMC), Lithium NickelCobalt Aluminium Oxide (NCA), Lithium Nickel Metal Dioxide (LiNiMO2), LithiumMetal Phosphate (LiMPO4), and Lithium Metal Tetroxide (LiMO4); electrolytesincluding liquid, polymer/gel, and solid inorganics; ceramic and other separators;battery cells including thin film/microbattery, flexible, cylindrical and prismatic; andbattery packs and systems.

o Post Li-ion BatteriesBattery technologies including redox-flow batteries, sodium-ion, lithiumsulfur, lithium-air, and magnesium-ion, and their supply chains, including electrodes, electrolytes,battery cells and battery packs/systems.

o Solid-State BatteriesSupply chain including electrodes, battery cells, battery packs/systems andelectrolytes, including polymer, inorganic and inorganic/polymer, inorganic materials,including argyrodites, LIthium Super Ionic CONductor, (LISICONs), Thio-LISICONs,sulfide glasses, oxide glasses, perovskites, anti-perovskites and garnets.

o RF Acoustic Wave FiltersIncluding Surface Acoustic Wave (SAW), Temperature Compensated (TC)- SAW, BulkAcoustic Wave- Free-standing Bulk Acoustic Resonator (BAWFBAR), BAW-Solidly-Mounted Resonator (BAW-SMR), and Packaging.

o RF Power AmplifiersIncluding Low Noise Amplifiers, Doherty Amplifiers, Packaging, and Millimeter-Wavetechnology.

o RF Front-End Modules

o MicrofluidicsFrom components to chips and systems, including all applications.


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53

I-MICRONEWS MEDIA

To meet the growing demand for market,

technological and business information,

i-Micronews Media integrates several tools

able to reach each individual contact within its

network.

We will ensure your company benefits from

this

ONL INE ONS ITE INPERSON

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FreeFullPDF.com

Events Webcasts

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Online display advertising

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adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

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Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

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partners, prospects while

increasing your brand/product

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Targeted audience

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Webcasts are a smart,

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#15,800+ monthly unique visitors

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#380 registrants per webcast on

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Contact: Camille Veyrier ([email protected]), Marketing & Communication Director


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CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS, REPORT BUSINESS

• North America:

• Steve LaFerriere, Senior Sales Director for Western US & Canada

Email: [email protected] – + 1 310 600-8267

• Chris Youman, Senior Sales Director for Eastern US & Canada

Email: [email protected] – +1 919 607 9839

• Japan & Rest of Asia:

• Takashi Onozawa, General Manager, Asia Business Development

(India & ROA)

Email: [email protected] - +81 34405-9204

• Miho Othake, Account Manager (Japan)

Email: [email protected] - +81 3 4405 9204

• Itsuyo Oshiba, Account Manager (Japan & Singapore)

Email: [email protected] - +81-80-3577-3042

• Korea: Peter Ok, Business Development Director


• Greater China: Mavis Wang, Director of Greater China Business

Development


• Europe: Lizzie Levenez, EMEA Business Development Manager

Email: [email protected] - +49 15 123 544 182

• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement

Email [email protected] - +33 4 72 83 01 80

o FINANCIAL SERVICES (in partnership with Woodside Capital

Partners)

• Jean-Christophe Eloy, CEO & President

Email: [email protected] - +33 4 72 83 01 80

• Ivan Donaldson, VP of Financial Market Development


o CUSTOM PROJECT SERVICES

• Jérome Azémar, Technical Project Development Director

Email: [email protected] - +33 6 27 68 69 33

o GENERAL

• Camille Veyrier, Director, Marketing & Communication

Email: [email protected] - +33 472 83 01 01

• Sandrine Leroy, Director, Public Relations

Email: [email protected] - +33 4 72 83 01 89 / +33 6 33 11 61 55

• Email: [email protected] - +33 4 72 83 01 80

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http://www.yole.fr/















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https://twitter.com/Yole_Dev

https://twitter.com/Yole_Dev

http://fr.slideshare.net/Yole_Developpement

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https://www.youtube.com/channel/UCxcAmfnGJgYXZn46VFs6ozQ

https://www.youtube.com/channel/UCxcAmfnGJgYXZn46VFs6ozQ

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