© 2017 - SAMPLE

From Technologies

to Market

Status of theCMOS Image Sensor

Industry 2017

© 2017

Executive summary

3

REPORT OBJECTIVES

Provide a clear understanding of applications and related technologies.

Ecosystem identification and analysis:

• Determine applications range

• Technical market segmentation

• Economic requirements by segment

• Key players by market and analysis

• Market size and market forecast in $M and Munits

Analysis and description of market and technologies involved:

• Major actors on a global basis

• Detailed applications per market segment

• Technology identification for different products and processes

• Competing technologies

• Main technical challenges

Ecosystem

Market

Techno

©2017 | www.yole.fr | Status of the CMOS image sensor industry

4

METHODOLOGIES & DEFINITIONS

Yole’s market forecast model is based on the following elementary structured blocks:

Yole’s analysis

framework

©2017 | www.yole.fr | Status of the CMOS image sensor industry

5

WHAT IS TAKEN INTO ACCOUNT BY THE ANALYSIS ?

From wafer to first packaged sensor

Analysis at the component

level

Courtesy of Omnivision

Courtesy of Valeo

Courtesy of Sony

Courtesy of Tesla

Camera

Modules

SystemsImage

Sensors

Courtesy of Xiaomi

CIS

Die

Courtesy of Sony

CIS

Wafer

Courtesy of Apple

Market report focus Market analysis only

©2017 | www.yole.fr | Status of the CMOS image sensor industry

6

TABLE OF CONTENTS (1/2)

o GLOSSARY 2

o TABLE OF CONTENTS 3

o REPORT OBJECTIVES 6

o METHODOLOGY 8

o COMPANIES CITED 13

o EXECUTIVE SUMMARY 14

1. INTRODUCTION 31

• Market segmentation

• Historical perspective

• CMOS image sensor landscape by player

• CMOS image sensor landscape by application

• CMOS image sensor technology shift CMOS vs CCD

• CMOS image sensor technology shift BSI vs FSI

• CMOS image sensor technology shift 300mm vs 200mm

2. MARKET FORECAST 47

• 2016 CIS revenue breakdown by market

• CIS volume shipment forecast 2010-2022

• CIS revenue forecast 2010-2022

• CIS average selling price forecast 2010-2022

• CIS wafer production forecast 2010-2022

3. ECOSYSTEM 61

• 2016 M&A activity in CIS

• CMOS image sensor ecosystem

• CMOS image sensor competitive landscape

• CMOS image sensor ecosystem

• Geographic mapping of CIS players

• Geographic mapping of CIS foundries

4. PLAYERS & RANKINGS 71

• 2016 CIS revenue ranking by player

• 2016 CIS production ranking by foundry

• 2016 CIS player activity breakdown

• 2016 CIS revenue mobile market breakdown by player

• 2016 CIS revenue photography market breakdown by player

• 2016 CIS revenue tablet market breakdown by player

• 2016 CIS revenue laptop PC market breakdown by player

• 2016 CIS revenue medical X-ray market breakdown byplayer

• 2016 CIS revenue security & surveillance marketbreakdown by player

• 2016 CIS revenue machine vision market breakdown byplayer

©2017 | www.yole.fr | Status of the CMOS image sensor industry

7

TABLE OF CONTENTS (2/2)

5.1. MOBILE MARKET TRENDS 88

• Consumer electronics volume forecast

• Consumer electronics revenue forecast

• Who can afford a smartphone?

• Revenue comparison

• Mobile market volume forecast by phone type

• Mobile market volume forecast by player

• Market drivers

• Mobile resolution mix forecast

• Dual camera rollout scenario

• 3D camera applications

• Mobile market trends

5.2 OTHER CONSUMER MARKET TRENDS 111

• Consumer photography volume forecast

• Action camera & drone volume forecast

• 360° camera trend

• AR/VR headset volume forecast

• AR/VR headset trend

• Wearable volume forecast

• Consumer drone volume forecast

• Consumer robotics volume forecast

• Computing volume forecast

5.3. OTHER MARKET TRENDS 132

• Light vehicle volume forecast

• Automotive imaging trend

• Automotive camera volume forecast

• Robotic vehicle trend

• Medical CIS volume forecast

• Medical CIS trend

• Security & surveillance volume forecast

• Machine vision volume forecast

6.TECHNOLOGY TRENDS 155

• Pixel / Resolution / Optical Format

• From FSI to BSI to stacked BSI

• Hybrid stack / Multi-stack

• 3D imaging & sensing

• Technology by players

7. CONCLUSION 193

8. COMPANY PROFILE 197

©2017 | www.yole.fr | Status of the CMOS image sensor industry

8

Almalence, Ambarella, Apple, Agilent, ams, Arm, Axis, Basler, Bosch, Brigates, BYD, Caeleste, Canon, Clairpixel, CMOSIS, Cognex, Continental, Core Photonics, CSEM, Dongbu HiTek, DXO, Dynamax, ESPROS Photonics, Evg, Excelitas Technologies, Fairchild Imaging, Flir, Forza Silicon, Fotonic, Foxconn, Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given Imaging, GoPro, Grace Valley, Hamamatsu, Hasselblad, Heliotis, Himax Imaging, Honeywell, Hoya, HTC, Huawei, Image Lab, IMEC, Infineon, Invisage,

InvenSense, Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LFoundry, LG, Luxima, Magna, Mantis Vision, Medigus, Melexis, Mesa Imaging, Micron, Microsoft, Mobileye, Mobotix, Movidius, New Imaging Technologies, Nikon, NXP,

Nvidia, Odos Imaging, Omnivision, Omron, ON Semiconductor, Panasonic, PerkinElmer, Philips, Pixart, PixelPlus, Pelco, PMD Technologies, Point Grey Research, Pyxalis, Raytrix, Rosnes, Samsung, Sanei Hytech, Sharp, SiliconFile, Sirona, SK Hynix, SMIC,

Siemens, Socionext, Softkinetics, Soitec, Sony, STMicroelectronics, SuperPix, Teledyne e2v, Teledyne DALSA, Teradyne, Tessera, Toshiba, Trixell, TSMC, Toshiba Teli, TowerJazz, Tridicam, UMC, Valeo, Videantis, Viimagic, WLCSP, Xiaomi, X-Fab,

Xintec, ZTE and more …

COMPANIES CITED IN THE REPORT

©2017 | www.yole.fr | Status of the CMOS image sensor industry

9

WHAT WE GOT RIGHT, WHAT WE GOT WRONG

Technology & market forecast challenge

What we got right

o Steady growth of CIS

o Stacked BSI introduction and impact

o Dual camera introduction and impact

o Increasing role of consumer drones & robots

o No specific “IoT” segment

What we got wrong

o Bigger than expected size of dual camera sensors

o Impact of Mobileye – Tesla issue for automotive CIS

o Lower than expected computing market

o Higher than expected security market

o Emergence of theVR segment

©2017 | www.yole.fr | Status of the CMOS image sensor industry

10

ABOUT THE AUTORS OF THIS REPORT

Biography & contact

Pierre Cambou

From 1999, Pierre Cambou has been part of the imaging industry. Pierre took several positions at Thomson TCS which became Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 he founded a start-up called Vence Innovation (now Irlynx) in order to bring to market a disruptive Man to Machine interaction technology. He has an Engineering degree from Université de Technologie de Compiègne and a Master of Science from Virginia Tech. More recently he graduated with an MBA from Grenoble Ecole de Management. He joined Yole Développement as Imaging Activity Leader in 2014.

Contact: cambou@yole.fr

Jean-Luc Jaffard

From 1966 Jean-Luc Jaffard paved the way of imaging activity at STMicroelectronics being at the forefront of the emergence and growth of this business. At STMicroelectronics Imaging Division he was successively appointed as Research Development and Innovation Director managing a large multidisciplinary and multicultural team and later on promoted to Deputy General Manager and Advanced Technology Director in charge of identifying and developing breakthrough Imaging Technologies and to transform them into innovative and profitable products. In 2010 he was appointed STMicroelectronics Intellectual Property Business Unit Director. In January 2014 he created the Technology and Innovation branch of Red Belt Conseil.

©2017 | www.yole.fr | Status of the CMOS image sensor industry

© 2017

Body sample

12

0

5 000

10 000

15 000

20 000

25 000

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022

Re

ven

ue

($

M)

Historical CIS revenue forecast (in $M)

2010 Fcst 2012 Fcst 2014 Fcst 2015 Fcst 2016 Fcst 2017 Fcst

WHAT WE GOT RIGHT, WHAT WE GOT WRONG

CIS Forecast over the years

We are raising again our forecast for CMOS Image Sensors.

Mostly driven by dual camera approaches and the introduction of new sensors in smartphones, the 2017 CIS forecast is above previous forecast releases.

Our goal is to predict the

market +/-10% in 5 years time

©2017 | www.yole.fr | Status of the CMOS image sensor industry

13

6TH CMOS IMAGE SENSOR REPORT

• The CMOS Image Sensor market has reached $11.5B in 2016 and Yole is maintaining a 10.5% CAGR forecast for the2016-2022 period mainly due to the penetration of additional cameras in smartphone supporting functionalities suchas optical zoom, biometry and 3D interactions.

• Concerning the ecosystem CIS is now heavily dominated by 3 Asian heavyweights, Sony, Samsung and Omnivision,this last company adopting Chinese nationality beginning of 2016.The US has maintained a presence in the high endsector with On Semi for Machine vision and Automotive, and Teledyne for Machine vision and Medical. In Europe therise of AMS and STM in the consumer sensing space is a notable development still in the making.

• Market wise Mobile is dominating the revenues and the technology developments. New approaches such as hybridstack and triple stack are driving new applications such as super slow motion and 3D sensing. The growth story inAutomotive encountered a big hiccup involving Tesla and Mobileye, eventually solved into the $15B Intel purchase ofMobileye. Security is the nice story of the year boosted by the end of CCD and the new capabilities of IP cameras,probably the only significant IoT story so far.

• Technology wise the domain is increasingly innovative, being at the forefront of 3D semiconductor technologies,quantum energy detection, artificial intelligence and more. It is a key part of much general trends includingautonomous vehicles and the robotic revolution in general.

CIS is a key market and a

key technology

14

Sony

Samsung

Omnivision

On Semi

Canon

Panasonic

SK Hynix

STMicro

Galaxycore

Hamamatsu

Pixelplus

AMS

Sharp

Teledyne Dalsa

Toshiba

Teledyne e2v

Himax

Brigates

Melexis

Gpixel

Excelitas

0

1

10

100

1 000

-100 100 300 500 700 900 1 100 1 300 1 500 1 700 1 900

Ave

rage

Selli

ng

Pri

ce (

$)

Volume Shipment (M units)

2016 - CIS market landscape

by player

CMOS IMAGE SENSOR LANDSCAPE

2016 CIS market landscape by player

Sony maintains its market leadership leveraging its technology rooted in digital photography and applied to mobile

It benefited from increased resolution of mobile cameras and demand for high quality pictures from the consumers.

Sony is nowtwice bigger than

its nextcompetitor

$4.8B

$1,9B

$0.3B

Key Players

High-End

Players

2nd Tier Players

Yole Développement © 2017

©2017 | www.yole.fr | Status of the CMOS image sensor industry

15

2016 CIS REVENUE BREAKDOWN

2016CIS Revenue breakdown

By market (in $M)

Mobile $6,666 $8,015 20%

Consumer $1,430 $1,263 -12%

Computing $869 $775 -11%

Automotive $541 $585 8%

Medical $34 $39 16%

Security $427 $624 46%

Industrial/Space/Defense $281 $297 5%

TOTAL $10,248 $11,598 13.2%

2015 2016 YoY(%)

©2017 | www.yole.fr | Status of the CMOS image sensor industry

16

Rank

(Previous)Company 2015 2016 YoY (%)

1 (1) Sony $3960 $4,858 23%

2 (2) Samsung $1,850 $2,126 15%

3 (3) Omnivision $1,250 $1,437 15%

4 (5) ON Semi $747 $717 -4%

5 (4) Panasonic $336 $387 15%

6 (7) Canon $404 $360 -11%

7 (8) SK Hynix $325 $310 -5%

8 (10) ST Micro $200 $290 45%

9 (9) Galaxycore $275 $286 4%

10 (11) Pixart $170 $181 6%

11 - Hamamatsu $96 $132 38%

12 (12) Pixelplus $93 $85 -9%

13 Other $542 $429 -21%

$10,248 $11,598

2016 CIS REVENUE RANKING

2016CIS Revenue

ranking

By player (in $M)

©2017 | www.yole.fr | Status of the CMOS image Sensor Industry

17

Foundry 2015 2016 YoY (%)

Sony 774 813 5.0%

Samsung 634 676 6.6%

Tsmc 444 459 3.4%

Smic 200 195 -2.5%

Sk Hynix 75 79 5.3%

Tpsco 50 51 3.2%

Dongbu 22 23 5.4%

Canon 5 4 -8.5%

Stm 1.7 1.7 -1.0%

Hamamatsu 1.0 1.1 4.6%

Umc 0.4 0.4 -16.3%

Other 75 64 -14.9%

TOTAL 2,281 2,367 3.8%

2016 CIS PRODUCTION RANKING

2016CIS production

ranking

By foundry (in kWPY 12”eq.)

©2017 | www.yole.fr | Status of the CMOS image Sensor Industry

18

CIS WAFER PRODUCTION FORECAST 2010–2022

By technology

CIS is predominantly

produced using “3D”

stacked technology

Since 2010 BSI technology took increasing market share.

Since 2014 the stacked and BSI approach has become dominant.

Production stagnated due to transfer to logic wafers (DIG).

Hybrid stack technique will be predominantly used for specific sensors such as 3D imagers.

19

WAFER PRODUCTION FORECAST 2010–2022

Silicon content assumption for mobile cameras

Cameras are using more

silicon

Only the upper die is using CIS

process

0

10

20

30

40

50

60

70

80

90

100

2010 2011 2012 2013 2014 2015 2016 2017e 2018e 2019e 2020e 2021e 2022e

Ave

rage

Die

Surf

ace (

mm

²)

Total silicon surface - Smartphone cameras (in mm²)

Smartphones Rear (incl dual) Smartphones Front (incl dual) Smartphones Rear Smartphones Front

Transition to stacked

BSI technology allowed

for more silicon

content with the same

camera module

footprint (roughly

10mm x 10mm x

5mm).

The dual camera

approach allows for

more silicon per

smartphone while

silicon per camera

start stagnating.

Stacked BSI allowed

for more silicon

within the same

footprint

Dual cameras

maintains growth

of silicon content

Die size typically

6.3mm x 4.7mm

30mm² x2 (stacked)

Die size typically

5.0mm x 3.8mm

19mm² x2 (stacked)

©2017 | www.yole.fr | Status of the CMOS image sensor industry

20

MOBILE TECHNOLOGY TREND

3D Stacked BSI can be performed using TSV or hybrid bonding

The choice for interconnection

depends on interconnection density required

Backside

illumination

will

enable ~

100% fill-

factor!

Stack

BSI – 1st Gen

Silicon

Bulk

TSVTSV

Interco upper

to lower wafer Backside

illumination

will

enable ~

100% fill-

factor!

Stack

BSI – 2nd Gen

Silicon

Bulk

TSV

Backside

illumination

will

enable ~

100% fill-

factor!

Hybrid Stack

BSI

Silicon Bulk

Interco

upper to

lower wafer

Connection within

pixels become

possible

©2017 | www.yole.fr | Status of the CMOS image sensor industry

21

MOBILE MARKET TREND

3D cameras are at the fifth phase in the evolution of smartphone cameras.

The majority of demand is for 10mm x

10mm x 5mmmodules.

Rear

smartphone

camera

modules

10mm x 10mm

1mm x 1mm

5mm x 5mm

© March 2017

$10

$5

$1

2000 2005 2010 2015 2020 2025

Smartphones:

The size of main camera

stops shrinking and a

front facing camera is

added.

Module size

and cost

Camera phones:

Innovation from

Sharp in June

2000.

3D sensing

module

2030

$20

20mm x 10mm

$20B

$10B

Event #1

Event #2

Event #3

Event #4

Selfies:

The size of front facing

camera increases.

Dual rear cameras:

Improved photography

thanks to a dual

camera approach.

Event #5 $5B

Front

smartphone

camera

module

3D sensing module:

The front camera

becomes a user interface.

Market size

$20B

Market

$10B

Market

$5B

Market

$1B

©2017 | www.yole.fr | Status of the CMOS image sensor industry

22

STATUS OF THE CIS INDUSTRY

2016 Conclusions

• CMOS image sensor industry is maintaining its healthy growth pattern at 10.5% CAGR from 2016 to2022.

• Sony is the undisputed leader due to its role in Mobile, but competition is still open in many otherdynamic markets such as Security and Automotive

• Photography application is still at the centre of the mobile growth engine essentially due to dual cameraapproaches. The industry is on the verge of a massive transformation due to Augmented Realityapplications involving 3D perception.

• Technology innovation is taking no rest, after a period of stacked BSI introduction which is now the newnormal, new techniques such as multi-stack and hybrid stack are enabling new features such full PDAFand super slow motion.

• The key trend to use computing power to manipulate, enhance, and extract metrics from an image hasresulted into the mega purchase of Mobileye by Intel for $15B. Stakes are indeed very high for thedownstream usage of images.

Healthy growth ahead

©2017 | www.yole.fr | Status of the CMOS image sensor industry

23

IMAGE SENSORS APPLICATION: WHAT IS NEXT

A roadmap for the next 10 years

Technology shift of 2020

will be related to AI

Technology x Market

penetration

20242016 2018 2020 2022 2026

©2017 | www.yole.fr | Status of the CMOS image sensor industry

Computational

photography

Interaction

capability

ADAS Level 2

assistance

ADAS Level 3

autonomy

ADAS Level 4

& Robotic vehicles

IP cameras

Analytics

Behavioral analysis

Augmented

reality

Ambiant

intelligence

Augmentation

capability

Sensing & Computing era

Artificial Intelligence era

Cognition era

Robotic

Buttler

Drones

2014 2028

24

IMAGE SENSOR TECHNOLOGIE : WHAT IS NEXT

A roadmap for the next 20 years

From “vision for imaging”

to “vision for sensing”

1900 1980 2020 2030 2040 2045

Technology x Market Penetration

Acceleration : The speed in technology change doubles every technology shift

Era of

Photography

5 years10 years20 years40 years80 years

Era of Machine

Sensing

Main

Players

could

change

Proximity

Sensor

AutofocusSingle

Photon

Imagers

Multi

Wavelength

Imagers

Next Era

Sensor

Fusion ?

Human Vision

Enhancement ?

3D Time

of Flight

By 2030 new

technologies serving

machine sensing could

become dominant

Event based

imagers

Holographic

imagers?

©2017 | www.yole.fr | Status of the CMOS image sensor industry

25

RELATED REPORTS

Discover more related reports within our bundles here.

©2017 | www.yole.fr | Status of the CMOS image sensor industry

It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which has been totally transformed by new use cases, new devices and new technologies.

The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market is able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.

Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.

Besides the transformation of current applications, new applications such as drone photography, biometric identification, and augmented reality are relying on CIS innovation. All these new applications are part of the story told in the ‘2017 Status of the CIS Industry’ report.

STATUS OF THE CMOS IMAGE SENSOR INDUSTRY 2017Market & Technology report - June 2017

NEW APPLICATIONS ARE TRANSFORMING THE MARKET AND TECHNOLOGY PLAYING FIELD FOR CMOS IMAGE SENSORS

New use cases and applications are transforming the CMOS Image Sensor (CIS) landscape

KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• 2016 CIS revenue breakdown

by market• 2016 CIS revenue ranking by player• 2016 CIS production ranking

by foundry• CIS volume shipment forecast

by application 2010-2022• CIS revenue forecast by application

2010-2022• CIS average selling price forecast

by application 2010-2022• CIS wafer production forecast by

application 2010-2022

WHAT’S NEW• 2016-2022 forecast• 2016 M&A activity• Ecosystem update• Dual and 3D camera trends for

mobile• Automotive camera adoption

curve• Security camera trend• 3D stacking technology update

REPORT OBJECTIVESEcosystem identification and analysis:• Determination of the range of

applications• Technical market segmentation• Market trends and forecasts• Key players by market, and analysis

Analysis and description of markets and technologies involved:• Detailed applications for each

market segment• Major players worldwide• Technology trends • Main technical challenges (Yole Développement, June 2017)

Image sensor application: what is next

BEYOND $11.6B IN 2016, THE CIS ECOSYSTEM HAS NOT BECOME THE OLIGOPOLY WE WOULD HAVE EXPECTED

Sony has established itself as industry leader, market and technology wise. However, the 2016 earthquake in Japan slowed down its operation and helped maintain the growth of its close competitors. Indeed, despite Toshiba’s exit from the market, two thirds of players have seen growth in the last year. Samsung, Omnivision

and Panasonic have delivered 15% year-on-year growth. Those large players are increasing the weight Asia carries in the CIS industry.

In the US, On Semi has suffered from the public relations mess that followed a fatal crash involving Tesla’s semi-autonomous driving system, which included a Mobileye sensor. Automotive cameras

Technology x marketpenetration

20242016 2018 2020 2022 2026

Computationalphotography

Interactioncapability

ADAS Level 2assistance

ADAS level 3autonomy

ADAS level 4& Robotic vehicles

IP cameras

Analytics

Behavioral analysis

Augmented reality

Ambiantintelligence

Augmentationcapability

Sensing & computing eraArtificial intelligence era

Cognition era

Roboticbuttler

Drones

STATUS OF THE CMOS IMAGE SENSOR INDUSTRY 2017

(Yole Développement, June 2017)

2016 CIS revenue breakdown

SPEED OF TECHNOLOGY ADOPTION MIRRORS THE APPLICATION DEVELOPMENT FRENZY

(Yole Développement, June 2017)

Image sensor technology: what is next

A CMOS image sensor is an analog device using a digital process. Therefore, the industry has been following a key principle of “one application, one pixel, one process”. This probably explains the dynamism of the ecosystem and the ability of different players to coexist in different markets. On Semi, Teledyne, ams and STMicroelectronics all provide perfect examples of successful differentiating strategies.

The impact of 3D semiconductors is currently a key element of the competition. Samsung has finally joined Sony as a provider of stacked back-side illuminated (BSI) sensors. Omnivision and SK Hynix will also soon launch this technology. Meanwhile, SMIC and STMicroelectronics will probably be the next players to unveil their versions of stacked technology.

Increases in CIS production capacity have momentarily stopped due to this stacked trend. This is currently mainly due to Sony, which can source its logic wafers from TSMC. In coming years Sony, Samsung, STMicroelectronics, HLMC and SK Hynix will all announce extra CIS capacity in order to meet market demand, despite stacked BSI adoption.

Image sensors have become a significant semiconductor segment alongside processors and memories. They still provide a technology-driven environment that is profit-friendly despite fierce competition. The outcome of the competition depends on a combination of application pull and technology fit. To help judge that, this report is aimed at giving the best possible snapshot of the current status of the CIS industry. Purchasers can therefore use it in order to proactively benefit from the next wave of innovations.

are safety-critical and therefore the reaction is strong if performance does not match expectations. Tesla being cleared by the US National Highway Traffic Safety Administration and Intel’s $15B purchase of Mobileye should quickly put this application and affiliated players back on the growth track.

Moving along the technology ladder proved to be difficult for SK Hynix, which was not able to switch quickly enough toward >8MP image sensors requiring 300mm wafer diameter operations.

Another noticeable activity has been STMicroelectronics’ revival of its CIS business through the development of 3D ‘Time of Flight’ (ToF) devices. These devices have had the ability to move from proximity to distance rangers and then fully fledged 3D cameras. They will probably be the biggest event of the end of 2017, if they materialize in the Apple iPhone 8 as is rumored.

Sony42%

Samsung18%

Omnivision12%

On Semi6%

Panasonic3%

Canon3%

SK Hynix 3%

STMicro3%

Galaxycore2%

Pixart2%

Hamamatsu1%

Pixelplus1%

Other4%

2015$10.3B

2016$11.6B

1900 1980 2020 2030 2040 2045

Technology x Market Penetration

Acceleration : The speed in technology change doubles every technology shift

Era of Photography

5 years10 years20 years40 years80 years

Era of MachineSensing

Main Players could change

ProximitySensor

AutofocusSingle Photon Imagers

Multi WavelengthImagers

Next Era

Sensor Fusion ?

Human Vision Enhancement ?

3D Time of Flight

By 2030 new technologies serving

machine sensing could become dominant

Event basedimagers

Holographic imagers?

Find more details about

this report here:

MARKET & TECHNOLOGY REPORT

Glossary 2Table of contents 3Report objectives 6Methodology 8Companies cited 13Executive summary 14Introduction 31

> Market segmentation> Historical perspective> CMOS image sensor landscape by player> CMOS image sensor landscape by application> CMOS image sensor technology shift CMOS vs CCD> CMOS image sensor technology shift BSI vs FSI> CMOS image sensor technology shift 300mm

vs 200mmMarket forecast 47

> 2016 CIS revenue breakdown by market> CIS volume shipment forecast 2010-2022 > CIS revenue forecast 2010-2022 > CIS average selling price forecast 2010-2022> CIS wafer production forecast 2010-2022

Ecosystem 61> 2016 M&A activity in CIS> CMOS image sensor ecosystem> CMOS image sensor competitive landscape> Geographic mapping of CIS players> Geographic mapping of CIS foundries

Players and rankings 71> 2016 CIS revenue ranking by player> 2016 CIS production ranking by foundry> 2016 CIS player activity breakdown> 2016 CIS revenue mobile market breakdown by

player> 2016 CIS revenue photography market breakdown

by player > 2016 CIS revenue tablet market breakdown by

player > 2016 CIS revenue laptop PC market breakdown

by player > 2016 CIS revenue medical X-ray market

breakdown by player

> 2016 CIS revenue security and surveillance market breakdown by player

> 2016 CIS revenue machine vision market breakdown by player

Mobile market trends 88> Consumer electronics volume forecast > Consumer electronics revenue forecast > Who can afford a smartphone?> Revenue comparison> Mobile market volume forecast by phone type> Mobile market volume forecast by player> Market drivers> Mobile resolution mix forecast> Dual camera rollout scenario> 3D camera applications> Mobile market trends

Other consumer market trends 111> Consumer photography volume forecast> Action camera and drone volume forecast> 360° camera trend> AR/VR headset volume forecast> AR/VR headset trend> Wearable volume forecast> Consumer drone volume forecast> Consumer robotics volume forecast> Computing volume forecast

Other market trends 132> Light vehicle volume forecast> Automotive imaging trend> Automotive camera volume forecast> Robotic vehicle trend> Medical CIS volume forecast> Medical CIS trend> Security and surveillance volume forecast> Machine vision volume forecast

Technology trends 155> Pixel/Resolution/Optical Format> From FSI to BSI to stacked BSI> Hybrid stack/Multi-stack> 3D imaging and sensing> Technology by players

Conclusion 193Yole Développement presentation 197

TABLE OF CONTENTS (complete content on i-Micronews.com)

COMPANIES CITED IN THE REPORT (non exhaustive list)Almalence, Ambarella, Apple, Agilent, Arm, Axis, ams Basler, Bosch, Brigates, BYD, Caeleste, Canon, Clairpixel, CMOSIS, Cognex, Continental, Core Photonics, CSEM, Dongbu HiTek, DXO, Dynamax, ESPROS Photonics, Evg, Excelitas Technologies, Fairchild Imaging, Flir, Forza Silicon, Fotonic, Foxconn, Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given Imaging, GoPro, Grace Valley, Hamamatsu, Hasselblad, Heliotis, Himax Imaging, Honeywell, Hoya, HTC, Huawei, Image Lab, IMEC, Infineon, Invisage, InvenSense, Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LFoundry, LG, Luxima, Magna, Mantis Vision, Medigus, Melexis, Mesa Imaging, Micron, Microsoft, Mobileye, Mobotix, Movidius, New Imaging Technologies, Nikon, NXP, Nvidia, Odos Imaging, Omnivision, Omron, ON Semiconductor, Panasonic, PerkinElmer, Philips, Pixart, PixelPlus, Pelco, PMD Technologies, Point Grey Research, Pyxalis, Raytrix, Rosnes, Samsung, Sanei Hytech, Sharp, SiliconFile, Sirona, Soft Kinetic, SK Hynix, SMIC, Siemens, Socionext, Soitec, Sony, STMicroelectronics, SuperPix, Teledyne e2v, Teledyne DALSA, Teradyne, Tessera, Toshiba, Trixell, TSMC, Toshiba Teli, TowerJazz, Tridicam, UMC, Valeo, Videantis, Viimagic, WLCSP, Xiaomi, X-Fab, Xintec, ZTE and more…

• Imaging Technologies for Automotive 2016 • STMicroelectronics Time of Flight Proximity

Sensor in the Apple iPhone 7 Plus• 3D TSV and 2.5D Business Update - Market

and Technology Trends 2017 • Solid-State Medical Imaging 2017 • Mobileye EyeQ3® Automotive Vision-Based

SoC Find all our reports on www.i-micronews.com

RELATED REPORTSBenef it from our Bundle & Annual Subscription offers and access our analyses at the best available price and with great advantages

AUTHORSFrom 1999, Pierre Cambou has been part of the imaging industry. Pierre took several positions at Thomson TCS which became Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 he founded a start-up called Vence Innovation (now Irlynx) in order to bring to market a disruptive infrared interaction technology. He has an Engineer ing degree from Université de Technologie de Compiègne Tech. More recently he graduated from Grenoble Ecole de Management’s MBA. He joined Yole Développement as Imaging Activity Leader in 2014.

From 1996 to 1999 Jean-Luc Jaffard paved the way of imaging activity at STMicroelectronics being at the forefront of the emergence and growth of this business. At STMicroelectronics Imaging division he has been appointed Research Development and Innovation Director managing a large multidisciplinary and multicultural team and was later on promoted Deputy General Manager and Advanced Technology Director in charge of identifying, sourcing or developing the breakthrough Imaging Technologies and Applications to transform them into innovative and profitable products. In 2010 he was appointed STMicroelectronics Intellectual Property Business Unit Director. In 2014 he created the Technology and Innovation branch of Red Belt Conseil, to support High Tech actors like SME, Research Institutes, Start-ups, Analysts, Investors and public authorities. Jean-Luc Jaffard owns multiple patents in semiconductor and Imaging domains and has been invited speaker in many conferences worldwide. He studied Electronic and Microelectronic and has been graduated from Ecole Supérieure d’Electricité of Paris in 1979.

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(1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: June 29, 2017

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

MEDIA & EVENTS• i-Micronews.com, online disruptive technologies website• @Micronews, weekly e-newsletter• Communication & webcasts services• Events: Yole Seminars, Market Briefings…More information on www.i-micronews.com

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TERMS AND CONDITIONS OF SALES

© 2017

Yole Développement

FromTechnologies to Market

Source: Wikimedia Commons

27©2017 | www.yole.fr | About Yole Développement

FIELDS OF EXPERTISE

Yole Développement’s 35+ analysts operate in the following areas

MEMS & Sensors

Compound

Semi.

Imaging

Photonics

MedTech

Manufacturing

Advanced

Packaging

Batteries / Energy Management

Power Electronics

Displays

RF

Devices &

Techno.

Advanced

Substrates

Solid State

Lighting(LED, OLED, …)

28©2017 | www.yole.fr | About Yole Développement

4 BUSINESS MODELS

o Consulting and Analysis

• Market data & research, marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

www.yole.fr

o Reports

• Market & technology reports

• Patent investigation and patent infringement risk analysis

• Teardowns & reverse costing analysis

• Cost simulation tool

www.i-Micronews.com/reports

o Financial services

• Due diligence

• Fundraising

• Maturation of companies

• IP portfolio management & optimization

www.yole.fr

www.bmorpho.com

o Media

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• @Micronews e-newsletter

• Communication & webcast services

• Events

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A GROUP OF COMPANIES

Market, technology

and strategy

consulting

www.yole.fr

Due diligences

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Test lab

Expertise

Research & innovationwww.piseo.fr

30©2017 | www.yole.fr | About Yole Développement

OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Yole Inc.

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Phoenix

Yole Korea

Seoul

31©2017 | www.yole.fr | About Yole Développement

ANALYSIS SERVICES - CONTENT COMPARISON

Multi-

Customers

Action

Technology

and Market

Report

Leadership

Meeting

Q&A

Service

Depth of the analysis

Bre

adth

of th

e a

nal

ysis

Meet the

Analyst

Custom

Analysis

High

High

Low

32©2017 | www.yole.fr | About Yole Développement

SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plan along the entire

supply chain

Integrators and

end-users

Device

makers

Suppliers: material,

equipment, OSAT,

foundries…

Financial investors,

R&D centers

33©2017 | www.yole.fr | About Yole Développement

SERVING MULTIPLE INDUSTRIAL FIELDS

We are workingacross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and consumer

electronics

Automotive

Medical

systemsIndustrial and

defense

Energy

34©2017 | www.yole.fr | About Yole Développement

o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:

• MEMS & Sensors

• RF devices & technologies

• Imaging

• Medical technologies (MedTech)

• Photonics

• Advanced packaging

• Manufacturing

• Advanced substrates

• Power electronics

• Batteries and energy management

• Compound semiconductors

• Solid state lighting

• Displays

o You are looking for:

• An analysis of your product market

• A review of your competitors evolution

• An understanding of your manufacturing and production costs

• An understanding of your industry technology roadmap and related IPs

• A clear view on the evolution of the supply chain

The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identifythe trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.

In the past 19 years, we worked on more than 2 000 projects, interacting with technology professional and high level opinion makers from the main players of theindustry.

o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.

REPORTS COLLECTION

www.i-Micronews.com

35©2017 | www.yole.fr | About Yole Développement

OUR 2017 REPORTS PLANNING (1/2)

MARKET AND TECHNOLOGY REPORTS by Yole Développement

o MEMS & SENSORS

− Acoustic MEMS and Audio Solutions 2017

− 3D Imaging & Sensing 2017

− Microspectrometers Markets and Applications 2017

− Status of the MEMS Industry 2017*

− MEMS & Sensors for Automotive 2017

− High End Inertial Sensors for Defense and Industrial Applications 2017*

− Magnetic Sensors Market and Technologies 2017

− Sensors and Sensing Modules for Smart Homes and Buildings 2017

− Sensing and Display for AR/VR/MR 2017

− MEMS Packaging 2017

− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017

o RF DEVICES AND TECHNOLOGIES

− RF Front End Modules and Components for Cellphones 2017

− Advanced RF SiP for Cellphones 2017

− 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals

2017

− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals

2017

− RF Technologies for Automotive Applications 2017

− GaN and Si LDMOS Market and Technology Trends for RF Power 2017

o MANUFACTURING

− Glass Substrate Manufacturing 2017

− Equipment & Materials for Fan Out Technology 2017

− Equipment and Materials for 3D TSV Applications 2017

− Emerging Non Volatile Memories 2017*

o MEDTECH

− Status of the Microfluidics Industry 2017

− Solid State Medical Imaging 2017

− Connected Medical Devices: the Internet of Medical Things 2017

− Sensors for Medical Robotics 2017

− Artificial Organs: Market & Technology Analysis 2017

− Organs-on-a Chip 2017

o ADVANCED PACKAGING

− Advanced Substrates Overview 2017

− Status of the Advanced Packaging Industry 2017

− Fan Out Packaging: Market & Technology Trends 2017*

− 3D Business Update: Market & Technology Trends 2017*

− Advanced QFN: Market & Technology Trends 2017**

− Inspection and Metrology for Advanced Packaging Platform 2017**

− MEMS Packaging 2017

− Advanced Packaging for Memories 2017

− Advanced RF SiP for Cellphones 2017

− Power Packaging Market and Technology Trends 2017

− Embedded Die Packaging: Technologies and Markets Trends 2017

o IMAGING & OPTOELECTRONICS

− 3D Imaging & Sensing 2017

− Status of the CMOS Image Sensor Industry 2017*

− Camera Module for Consumer and Automotive Applications 2017*

− Uncooled Infrared Imaging Technology & Market Trends 2017*

− Solid State Medical Imaging 2017

o BATTERY AND ENERGY MANAGEMENT

− Status of Battery Industry for Stationary, Automotive and Consumer Applications

*2016 version still available / **To be confirmed

36©2017 | www.yole.fr | About Yole Développement

OUR 2017 REPORTS PLANNING (2/2)o POWER ELECTRONICS

− Status of Power Electronics Industry 2017*

− Silicon Power Mosfet: Market and Technology Trends 2017

− IGBT Market and Technology Trends 2017

− Power Packaging Market and Technology Trends 2017

− Power SiC 2017: Materials, Devices, and Applications*

− Power GaN 2017: Materials, Devices, and Applications*

− Materials Market Opportunities for Cellphone Thermal Management (Battery

Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017

− Gate Driver Market and Technology Trends 2017

− Power Management ICs Market Quarterly Update 2017

− Power Electronics for Electrical Aircraft, Rail and Buses 2017**

− Thermal Management for LED and Power 2017

o COMPOUND SEMICONDUCTORS

− Power SiC 2017: Materials, Devices, and Applications*

− Power GaN 2017: Materials, Devices, and Applications*

− GaN and Si LDMOS Market and Technology Trends for RF Power 2017

− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals

2017

− Bulk GaN Substrate Market 2017

o DISPLAYS

− MicroLED Displays 2017

− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017

− Quantum Dots for Display Applications 2017

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications

− Automotive Lighting 2017 - Technology, Industry and Market Trends

o SOLID STATE LIGHTING

− UV LEDs 2017 - Technology, Manufacturing and Application Trends*

− Horticultural Lighting 2017 - Technology, Industry and Market Trends

− Automotive Lighting 2017 - Technology, Industry and Market Trends*

− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**

− LED Lighting Module 2017 - Technology, Industry and Market Trends

− IR LEDs and Lasers - Technology Applications and Industry Trends 2017

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− MicroLED Displays 2017

− CSP LED Lighting Module 2017

− LED Packaging 2017

− Thermal Management for LED and Power 2017

PATENT ANALYSIS by Knowmade

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation

− Risk and Potential Targets 2017

− MEMS Microphone: Patent Landscape Analysis 2017

− MEMS Microphone: Knowles’ Patent Portfolio Analysis 2017

− Microbolometer: Patents Used in Products 2017

− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017

− Micropumps: Patent Landscape Analysis 2017

− GaN Technology: Top-100 IP Profiles 2017

− MicroLEDs: Patent Landscape Analysis 2017

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017

− Uncooled Infrared Imaging: Patent Landscape Analysis 2017

− 3D Monolithic Memory: Patent Landscape Analysis 2017

TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be

published in 2017.*2016 version still available / **To be confirmed

37©2017 | www.yole.fr | About Yole Développement

OUR 2016 PUBLISHED REPORTS LIST (1/2)

MARKET AND TECHNOLOGY REPORTS by Yole Développement

o MEMS & SENSORS

− Gas Sensors Technology and Market 2016

− Status of the MEMs Industry 2016

− Sensors for Cellphones and Tablets 2016

− Market and Technology Trends of Inkjet Printheads 2016

− Sensors for Biometry and Recognition 2016

− Silicon Photonics 2016

o IMAGING & OPTOELECTRONICS

− Status of the CMOS Image Sensor Industry 2016

− Uncooled Infrared Imaging Technology & Market Trends 2016

− Imaging Technologies for Automotive 2016

− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016

o MEDTECH

− BioMEMS 2016

− Point of Care Testing 2016: Application of Microfluidic Technologies

o ADVANCED PACKAGING

− Embedded Die Packaging: Technology and Market Trends 2017

− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016

− Fan-Out: Technologies and Market Trends 2016

− Fan-In Packaging: Business update 2016

− Status and Prospects for the Advanced Packaging Industry in China 2016

o MANUFACTURING

− Thin Wafer Processing and Dicing Equipment Market 2016

− Emerging Non Volatile Memories 2016

o COMPOUND SEMICONDUCTORS

− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− Power SiC 2016: Materials, Devices, Modules, and Applications

o LED

− UV LED Technology, Manufacturing and Applications Trends 2016

− OLED for Lighting 2016 – Technology, Industry and Market Trends

− Automotive Lighting: Technology, Industry and Market Trends 2016

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− LED Packaging 2017: Market, Technology and Industry Landscape

o POWER ELECTRONICS

− Power Electronics for EV/HEV 2016: Market, Innovations and Trends

− Status of Power Electronics Industry 2016

− Passive Components Technologies and Market Trends for Power Electronics 2016

− Power SiC 2016: Materials, Devices, Modules, and Applications

− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends

− Inverter Technologies Trends & Market Expectations 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

o BATTERY AND ENERGY MANAGEMENT

− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016

− Stationary Storage and Automotive Li-ion Battery Packs 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

38©2017 | www.yole.fr | About Yole Développement

OUR 2016 PUBLISHED REPORTS LIST (2/2)

PATENT ANALYSIS by Knowmade

− Microbattery Patent Landscape Analysis

− Miniaturized Gas Sensors Patent Landscape Analysis

− 3D Cell Culture Technologies Patent Landscape

− Phosphors and QDs for LED Applications Patent Landscape

− TSV Stacked Memory Patent Landscape

− Fan-Out Wafer Level Packaging Patent Landscape Analysis

TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published

in 2016.

MORE INFORMATION

o All the published reports from the Yole Group of Companies are available on our website

www.i-Micronews.com.

o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the

number of reports you are interested in and select the related offer. You then have up to 12

months to select the required reports from the Yole Développement, System Plus Consulting

and KnowMade offering. Pay once and receive the reports automatically (multi-user format).

Contact your sales team according to your location (see the last slide).

39©2017 | www.yole.fr | About Yole Développement

MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ONLINE ONSITE INPERSON

@Micronews e-newsletter

i-Micronews.com

i-Micronewsjp.com

FreeFullPDF.com

Events Webcasts

Unique, cost-effective ways

to reach global audiences.

Online display advertising

campaigns are great strategies

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product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

for meeting in-person. Events

are the best way to exchange

ideas with your customers,

partners, prospects while

increasing your brand/product

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involvement equals clear,

concise perception of your

company’s message.

Webcasts are a smart,

innovative way of

communicating to a wider

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Benefit from the i-Micronews.com

traffic generated by the 8,500+

monthly visitors, the 11,500+

weekly readers of @Micronews

e-newsletter

Seven main events planned for

2017 on different topics to

attract 140 attendees on average

Gain new leads for your business

from an average of 300

registrants per webcast

Contacts: Camille Veyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr), Marketing & Communication Project Managers.

40©2017 | www.yole.fr | About Yole Développement

CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: laferriere@yole.fr – +1 31 06 008 267

• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: onozawa@yole.fr - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: wang@yole.fr - +886 979 336 809

• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail eloy@yole.fr - +33 4 72 83 01 80

o REPORT BUSINESS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: laferriere@yole.fr – +1 31 06 008 267

• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: levenez@yole.fr - +49 15 123 544 182

• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: onozawa@yole.fr - +81 3 4405 9204

• Japan & Asia: Miho Othake, Account ManagerEmail: ohtake@yole.fr - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: wang@yole.fr - +886 979 336 809

o FINANCIAL SERVICES

• Jean-Christophe Eloy, CEO & PresidentEmail: eloy@yole.fr - +33 4 72 83 01 80

o GENERAL

• Public Relations: leroy@yole.fr - +33 4 72 83 01 89

• Email: info@yole.fr - +33 4 72 83 01 80

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